I think that one of the most popular Intel new platforms should be “LGA 1156” in Q4 in 2009. Finally, the new product between middle-end and high-end levels entered the market. Many consumers have been eager to have one since it was released on 9/8. In two years, I think that LGA 1366 platform is still the highest standard in IT industry. Intel will launch the highest model, 32nm 6 cores Core i9. The main differences of LGA1156 are that DDR3 is changed to Dual channel mode, and two PCIE x16 lanes bandwidth down to x8/ x8. The CPU technology is still based on Core i7 for development, and 32nm dual-core Core i3 will support P55 in the near future. X58 will support the highest level, Core i9, from Core i7. Besides, the P55 will support from Core i7 to Core i3 with an available price. Also Intel roadmaps of the two products, X58 and P55, are not the same. Thus, I think that consumers need more time to choose them when buying the two products. The first model supporting LGA 1156 is P55. Also, it’s a very special chipset. Intel originally planned to launch P57. However, lots of news on the internet said they won’t launch the new chipset. As a result, P55 becomes the unique chipset of LGA 1156. It’s also the latest MB which many companies are eager to release. MSI also launched 4 models for P55 in this trend. Now I have one of their highest products, MSI P55-GD80. First we take a look at the carton. MSI packs their latest MB products with this kind of package. Hmm… what could I say? The pattern is not bad but it’s a little difficult to impress consumers. I think it is fine if MSI uses simple pattern on the low-end and middle-end packages. Maybe some people like this kind of easy pattern in design; everyone has different thought. MSI P55-GD80 first look MB’s bottom left side 3 X PCIE X16(Support ATI CrossFireX and Nvidia SLI，the bandwidth is X8+X8+X4) 2 X PCI-E X1 2 X PCI RealtekR 8111DL Dual ethernet chip Audio chipset is Realtek ALC889, Blu-ray specifications, Flexible 8-channel audio with jack sensing MB’s bottom right side 6 X SATAII(P55 provide, support RAID 0/1/5/10) 2 X SATAII(JMicronR 322 provide，support SATA RAID 0/1/JBOD) 1 X IDE Touch model Power/Reset/Green Power; Special button, MSI’s Easy Button 2 OC GENIE Turbo Button, +/-button to reach instant overclocking goal. Debug LED, clr CMOS Button MB’s top right side 4 X DIMM DDR3，support dual channel DDR3 1066/1333/1600/1800*/2000*/2133* (OC) memory and it has 1600 speed when using Core i7，it could be over 1800 speed only under overclocking condition. 24PIN power in, DDR3 utilizes 2 phase energy-offering. V Switch can tune voltage by JUMP, you can add more 0.2V to the highest voltage value in BIOS. The blue area near V Switch is V-Check Points, and users can directly detect voltage values through a multimeter. MB’s top left side CPU utilizes 8 phases, VTT 2 phases, both support DrMOS technology. IO 7 X USB 2.0 1 X eSATA / USB combo port 1 X IEEE1394 2 X RJ45 LAN jacks In the middle of the heatsink is designed to dissipate the heat of MOSFET and P55. The LED above the heatsink can present the phases of energy-offering when system is running. This position is P55 chipset, PCH 2 phases energy-offering MSI’s new heatsink looks impressive, and its quality is also excellent.