Monday, August 3rd 2015

Today's Reviews

Accessories
Cooling
Graphics Cards
Headphones
Keyboards
Memory
Monitors
Notebooks
Processors
PSUs
SSD
Storage

Apple Readies New iMac Desktops for Q3-2015

Apple is readying a new generation of iMac desktops, which it plans to launch in Q3-2015, likely at its September press event. The new Macs are expected to come with faster processors (likely Intel "Skylake,") faster DDR4 memory, and an increase in display resolutions across the board, including a 21.5-inch model with 4K Ultra HD (3840 x 2160 pixels) resolution, besides its 27-inch 5K (5120 x 2880 pixels) model. The display panels in these macs will feature a new LED phosphor material called KSF (K2SiF6:Mn), which improves color saturation. The displays will offer 30-bit (10 bpc) color depth, with the ability to produce 1.07 billion colors.

Unigen Announces 1TB SATA III 2.5-inch SSD Solutions

Unigen Corporation has announced an MLC NAND flash based 2.5" SATA III SSD solution in densities up to 1TB. This SSD solution is intended for high density storage, cloud storage, industrial, and networking applications. The products are designed around a Multi-Format Flash Media controller, which allows read/write capability to MLC, eMLC or SLC NAND Flash, providing performance and high reliability density media to store code and data.

The solutions are based on the standard 2.5" form factor (7mm and 9mm heights), which operates on a 5V power supply. It is fully compliant with SATA III and backward compatible with SATA II. The solutions feature a performance throughput of up to 530MB/s Read, and 500MB/s write, with typical latency lower than 100uS, and low power consumption of less than 6W active.

Unigen Announces DDR4 Modules

Unigen Corporation, a Leading Integrated Solutions Provider and Manufacturer of Enterprise Class Flash Storage SSDs and DRAM Modules, today announced the availability of its latest lineup of DDR4 memory modules for embedded, networking, and enterprise applications.

Using the latest 4-/8-gigabit (Gb) DDR4 devices, Unigen's DDR4 Registered Dual In-line Modules (RDIMM) and Load-reduced RDIMM (LRDIMM) are fully operable at DDR4-2133 1.2V in densities up to 32GB. Likewise, Small Out-line DIMM, Mini-DIMM, and unbuffered DIMM are fully operable at DDR4-2400 1.2V in densities up to 16GB. All Unigen DDR4 modules are 100% stress tested using Unigen's proprietary DRAM test software and platform to ensure full compliance of Unigen's interoperability, reliability and quality specifications.

Toshiba Unveils 256 Gigabit 48-layer 3D TLC NAND Chip

Toshiba Corporation today unveiled the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory. The new device is the world's first 256-gigabit (32gigabytes) 48-layer BiCS device and also deploys industry-leading 3-bit-per-cell (triple-level cell, TLC) technology. Sample shipments will start in September.

BiCS FLASH is based on a leading-edge 48-layer stacking process that surpasses the capacity of mainstream two dimensional NAND Flash memory while enhancing write/erase reliability endurance and boosting write speeds. The new 256 Gb device is suited for diverse applications, including consumer SSD, smartphones, tablets and memory cards, and enterprise SSD for data centers.

Samsung U32E850R 32-inch Ultra HD Monitor with AMD FreeSync Now Available

Samsung made its premium 32-inch Ultra HD monitor with AMD FreeSync support (model: U32E850R) available in retail stores. It is priced around US $1,199. The U32E850R features a 32-inch PLS panel, with 4K Ultra HD (3840 x 2160 pixels) native resolution, 60 Hz refresh rate, 350 cd/m² maximum brightness, 4 ms response time, and dynamic mega-contrast. The panel also offers 30-bit color (1.07 billion colors). Inputs include DisplayPort 1.2a (needed for FreeSync to work), mini-DisplayPort 1.2a, and two HDMI. Samsung appears to have finally learned from feedback for its flimsy T-shaped stand, and gave this monitor a conventional rectangle-base stand that offers swivel, tilt, and height adjustments. Paraphernalia include a USB 3.0 hub.

HighPoint Unveils USB 3.1 Product Line

For the past 20 years, HighPoint has been a professional RAID Storage and Management solutions provider, constantly striving to bring quality Storage technology to market and deliver the industry's best Price-Performance value. We are pleased announce the launch of our next generation USB Host to Device storage and connectivity product lines, featuring 10Gb/s transfer speeds. Our latest RocketU PCIe host adapter is the ideal USB 3.1 upgrade solution for any Mac or PC platform with PCIe support. Our performance oriented dual-bay USB 3.1 RocketStor 3100 Series Drive Docks support any industry standard 3.5"/2.5" SATA hard drive or SSD, including the latest 8TB models, and provide USB 3.1 connectivity via USB Type-B and Type-C ports.

The RocketStor 3122Bis the industry's fastest USB 3.1 dual-bay storage dock, and is an ideal high-performance external storage solution for any USB 3.1 capable PC or Mac. The two 2.5"/3.5" drive bays can support disks up to 8TB in size, and are powered by dedicated USB 3.1 controllers and 6Gb/s SATA channels. Simultaneous Access to Both 6Gb/s SATA Drive Bays: The RocketStor 3122B was designed to ensure maximum performance for each SATA SSD or hard drive. Each drive bay is powered by an independent SATA Channel to optimize the throughput of each USB 3.1 port. This ensures seamless transfers and no wait time - you are free to access both drive slots simultaneously with no loss in speed, anytime you need them.

Crucial to Showcase New Ballistix Sport LT DDR4 White Modules at Gamescom

Crucial, a leading global brand of memory and storage upgrades, today announced it is unveiling a complimentary white digital camo heat spreader and unique white printed circuit board (PCB) option as part of its Crucial Ballistix Sport LT DDR4 memory offering. The modules, which will be showcased in conjunction with gamescom in Cologne, August 5th - 9th, offer the same DDR4 performance and proven reliability that gamers have come to expect from Crucial.

Designed for mainstream users who simply want to get more performance out of their systems, Crucial Ballistix Sport LT DDR4 memory delivers fast speeds and increased bandwidth. A new addition to the current Ballistix Sport DDR4 lineup, Sport LT modules feature a covert digital camo design, which will be available in both white and gray, and an integrated heat spreader. Whether gamers want plug-and-play installation or Intel XMP 2.0 profiles to achieve DDR4 speeds of 2400 MT/s, Ballistix Sport LT memory delivers seamless, affordable performance.

Noctua Provides Free Mounting Upgrade for Upcoming Intel "Skylake" Platform

Noctua today announced that it will continue its tradition of supplying customers with its premium-class SecuFirm2 mounting kits for novel platforms free of charge. While most Noctua heatsinks support Skylake's LGA1151 socket out of the box, older models can be upgraded with the NM-i115x kit at no additional cost.

"We're determined to provide the best possible support to our customers and over the years, we've sent many thousands of mounting kits free of charge to users who wanted to upgrade to new platforms", says Mag. Roland Mossig (Noctua CEO). "With Skylake just around the corner, we're pleased to announce that we'll extend this offer for LGA1151. Owners of older Noctua retail heatsinks that don't support LGA1151 out of the box will be able to upgrade to the new socket free of charge!"

Due to the spacing of the mounting holes being identical on LGA1150, LGA1151, LGA1155 and LGA1156, Noctua's previous SecuFirm2 mounting systems for LGA115x also support Intel's upcoming 'Skylake' platform. All current Noctua coolers already include SecuFirm2 mounting systems for LGA115x and can thus be used on LGA1150 mainboards without any upgrades or modifications.

Intel Core "Skylake" Retail Boxes Surprisingly Colorful

The retail packaging of Intel's 6th generation Core "Skylake" processors in the LGA1151 package, will be surprisingly colorful, and a throwback to the pre-Pentium 4 era, according to spy-shots of the retail boxes of the upcoming Core i7-6700K and Core i5-6600K. What's even more surprising, is that packages of the i7-6700K and i5-6600K, which feature unlocked base-clock multipliers, making them primed for overclocking, do not include stock cooling solutions. Their retail packages resemble those of Intel's Core i7 HEDT processors. In the box, you'll find just the processor, its case-badge, and basic documentation.

Both the Core i7-6700K and Core i5-6600K feature the same integrated graphics SKU - HD Graphics 530. Both feature integrated memory controllers that support both DDR3L and DDR4 memory types. The Core i5 predictably lacks HyperThreading, and only features 6 MB of L3 cache, while the Core i7 features HyperThreading, and the full 8 MB present on the chip. The "Skylake" silicon will be built on the 14 nm process.

AMD Details Exascale Heterogenous Processor (EHP) for Supercomputers

AMD published a paper with the IEEE for a new high-density computing device concept, which it calls the Exascale Heterogenous Processor or (EHP). It may be a similar acronym to APU (accelerated processing unit), but is both similar and different to it in many ways, which make it suitable for high-density supercomputing nodes. The EHP is a chip that has quite a bit in common with the recently launched "Fiji" GPU, that drives the company's flagship Radeon R9 Fury X graphics card.

The EHP is a combination of a main die, housing a large number of CPU cores, a large GPGPU unit, and an interposer, which connects the main die to 32 GB of HBM2 memory that's on-package, and is used as both main-memory and memory for the integrated GPGPU unit, without memory partitioning, using hUMA (heterogeneous unified memory access). The CPU component consists of 32 cores likely based on the "Zen" micro-architecture, using eight "Zen" quad-core subunits. There's no word on the CU (compute unit) count of the GPGPU core. The EHP in itself will be highly scalable. AMD hopes to get a working sample of this chip out by 2016-17.


Source: Bitsandchips.it

IBASE Announces ASB200-908 IPC

IBASE Technology, a leading provider of embedded board and systems, announced the release of its new fanless box system with 12V~24V wide range power input - ASB200-908. The system is built with the IBASE IB908 3.5-inch SBC designed with the 4th Generation Intel Core i7-4650U and i5-4300U processors. ASB200-908 is ideal for industrial automation, transportation, security and retail POS applications that can take advantage of the system's four serial ports as well as the DC-in power input. It supports IBASE's iSMART green technology featuring EuP/ErP power saving and intelligent scheduler.

Measuring only 180x150x66mm, ASB200-908 operates silently and reliably in a small footprint. It has two 1600MHz DDR3L slots that accept up to 16GB of system memory. External I/Os include 5x USB, 4x COM, 2x GbE, DVI-I, CFAST socket, HDD LED and power button. All models are available with 4GB memory and 320GB HDD. A 60W power adaptor and VESA bracket are optional.

Corsair Memory, PSUs, and CPU Coolers Pave the Way for Next Gen PC Processors

Corsair, a leader in high-performance PC hardware, today announced the availability of a comprehensive product line-up supporting the upcoming 6th Gen Intel Core desktop processors and motherboards based on the Intel Z170 chipsets. All of Corsair's current liquid CPU coolers and PC power supplies will be compatible with the new Intel desktop platform, along with a full line of validated DDR4 and DDR3L memory kits.

Corsair has long been a leader in high-performance PC memory, playing a decisive part in dozens of current overclocking world records. Now the company brings this expertise and experience to support Intel's upcoming new enthusiast desktop platform, delivering higher clock frequencies, increased memory bandwidth and lower power usage with Dominator Platinum and Vengeance LPX DDR4, and Vengeance LP and Vengeance Pro DDR3L memory lines. All memory kits are extensively validated with leading motherboard manufacturers to ensure maximum compatibility and easy configuration and overclocking with XMP 2.0 profiles. All of the Corsair memory kits are supplied with a limited lifetime warranty.
Saturday, August 1st 2015

Seagate Reports Fiscal Third Quarter 2015 Results

Seagate Technology plc today reported financial results for the third quarter of fiscal year 2015 ended April 3, 2015. For the third quarter, the Company reported revenue of approximately $3.3 billion, gross margin of 28.7%, net income of $291 million and diluted earnings per share of $0.88. On a non-GAAP basis, which excludes the net impact of certain items, Seagate reported gross margin of 28.9%, net income of $357 million and diluted earnings per share of $1.08. For a detailed reconciliation of GAAP to non-GAAP results, see the accompanying financial tables.

During the third quarter, the Company generated approximately $374 million in operating cash flow, paid cash dividends of $176 million and repurchased approximately 12 million ordinary shares for $706 million. Year to date, the Company has returned approximately $1.4 billion to shareholders in dividend and stock redemptions. Cash, cash equivalents, restricted cash, and short-term investments totaled approximately $2.6 billion at the end of the quarter.
Friday, July 31st 2015

Today's Reviews

Accessories
Cases
Graphics Cards
Headphones
Keyboards
Memory
Motherboards
Mousepads
Networking
Processors
PSUs
Speakers

NVIDIA Recalls Select Shield Tablets over Fire Hazard

NVIDIA today announced a voluntary recall of its SHIELD 8-inch tablets that were sold between July 2014 and July 2015, which the company will replace. NVIDIA has determined that the battery in these tablets can overheat, posing a fire hazard. The recall does not affect any other NVIDIA products.

NVIDIA is asking customers to visit this page for information on how to obtain a replacement device. NVIDIA is also asking consumers to stop using the recalled tablet, except as needed to participate in the recall and back up data. Consumers will receive a replacement tablet after registering to participate in the recall. NVIDIA is coordinating with appropriate governmental agencies to ensure that the recall follows established industry practices.

Thermaltake Unveils the Core V51 Riing Edition Window Green PC Chassis

Thermaltake, an industry leader in computer chassis, thermal solutions, and power supply units, unveils the new Core V51 Riing Edition Window Green Mid-Tower Chassis, a marriage of Thermaltake's two star products: the Red Dot Award Product Design 2015 winner Core V51 Mid-Tower Chassis and the Riing 14 Patented LED High Static Pressure Radiator Fan.

The Core V51 Riing is designed in a green color theme with three preinstalled 140 mm green Riing fans to aesthetically match other green components while delivering an outstanding cooling performance with the extensive DIY/AIO LCS compatibility. Core V51 Riing Edition is an enthusiast's grade mid-tower chassis that creates unprecedented space for high-end hardware and liquid cooling expansion, supporting the latest E-ATX, ATX, Micro ATX motherboards, and all high-end GPU cards.

MSI to Fuse OC and Gaming Lines with Z170 Family

MSI is set to fuse its two premium motherboard lines - OC Series and Gaming, with its upcoming Z170 family. The company's upcoming Z170 XPower Gaming Titanium Edition is the first such product. This stunning looking board features a silvery-white PCB, with the frosty-silver scheme continuing on to the chipset and VRM heatsinks. Its main PCI-Express 3.0 x16 slots (which are wired to the CPU), feature a chrome tipped slot brace. Built in the ATX form-factor, the Z170 XPower Gaming Titanium Edition draws power from a combination of 24-pin ATX, 8-pin EPS, 4-pin ATX, and 6-pin PCIe power connectors. It uses a 16-phase VRM with tantalum capacitors, to condition power for the CPU. The CPU is wired to four DDR4 DIMM slots, supporting up to 64 GB of dual-channel memory.

Expansion slots include four PCI-Express 3.0 x16, from which three are wired to the CPU (electrical x16/NC/NC or x8/NC/x8 or x8/x4/x4); the fourth is electrical PCIe 3.0 x4 and wired to the PCH. Three PCIe 3.0 x1 slots make for the rest of the expansion area. Storage connectivity includes two M.2 32 Gb/s slots, two SATA-Express 16 Gb/s, and eight SATA 6 Gb/s ports. Display outputs include one each of DisplayPort and HDMI. USB connectivity includes 4 USB 3.1 slots, which include a mixture of type-A and type-C, with a physical type-A port pointing "forwards." MSI AudioBoost 3 audio solution, and Killer E2200 NIC make for the rest of its connectivity. The board features a detachable module with OC controls, called the OC Dashboard. This plugs into headers around the voltage measurement points. You also get automatic overclocking via a rotary knob. MSI will launch this board in its first wave of socket LGA1151 motherboards.

EVGA Announces the X99 Micro2 Motherboard

The EVGA X99 Micro2 takes all the great features from the EVGA X99 Micro motherboard, and upgrades it with USB 3.1 Type-C, increased SATA ports, improved layout design + BIOS and refreshed look. The EVGA X99 Micro2 offers a stunning set of features and overclocking support, along with EVGA's new GUI BIOS that focuses on the best overclocking support, functionality, and usability.

Get your PC future proof ready with the EVGA X99 Micro2 motherboard. This motherboard features the next generation USB 3.1 Type-C connector that delivers transfer speeds of up to 10Gb/s for unbelievable performance. Compact mATX form factor at 9.6in x 9.6in, yet still allows for enthusiast features such as SLI, robust SATA 6G expandability, M.2 support, incredible overclocking and more.
Thursday, July 30th 2015

Today's Files

Today's Reviews

Cases
Cooling
Gaming PC
Graphics Cards
Headphones
Keyboards
Memory
Motherboards
Notebooks
SSD

Toshiba to Offer Full Line of Windows 10 Business Devices

Toshiba's Business Solutions Division (BSD), a division of Toshiba America Information Systems, Inc., today announced that their full line of business devices, including laptops, detachable Ultrabooks, and tablets will be available with Windows 101. With this new platform, business users will enjoy an improved user experience as well as features designed specifically for work, providing a better experience for the increasingly mobile professions. To foster adoption of these features, Toshiba is investing in new deployment and management capabilities to ensure that enterprises and small businesses alike can realize enhanced productivity and innovation, while maintaining ease of management.

"As one of the first PC providers to deliver a complete line of Windows 10 ready business devices, we are always looking for ways to bring our customers the features they need," said Carl Pinto, vice president of marketing and engineering, Toshiba America Information Systems, Inc., Business Solutions Division. "Our line of business products not only delivers powerful, secure devices, but are now Windows 10-ready, enabling businesses and IT departments to take advantage of the new platform as soon as they are ready."

Toshiba Expands SMB Offering with New Windows 10 Ready Laptop

Toshiba's Business Solutions Division (BSD), a division of Toshiba America Information Systems, Inc., today announced a new laptop designed to meet the varying needs of small to mid-sized businesses. Designed, engineered and manufactured by Toshiba, the Tecra A50 represents the expansion of Toshiba's SMB lineup. The Tecra A50 is Windows 10-ready and offers the performance of an enterprise-class PC and the essential productivity and security features business users need at an affordable price point.

"Small and mid-sized business need more enterprise-class features and performance than ever before, but for a low total cost of ownership," said Carl Pinto, vice president of marketing and engineering, Toshiba America Information Systems, Inc., Business Solutions Division. "Our line of SMB products not only delivers powerful, secure devices that each meet the varying needs of this segment, but are now Windows 10-ready, enabling businesses and IT departments to take advantage of the new platform as soon as they are ready."
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