Tuesday, August 4th 2015

Today's Reviews

Cases
Cooling
Graphics Cards
Harddisks
Headphones
Motherboards
Mouse
NAS
Notebooks
Processors
Speakers

WD Delivers Ultra HD Movie Content For New Generation Of Samsung TVs

WD, a Western Digital company, and world leader in storage solutions, today announced the new My Passport Cinema 4K Ultra HD (UHD) movie storage device, an easier and faster way to organize, store and enjoy high-definition digital movies and TV shows - including new releases in up to full 4K UHD resolution with high dynamic range (HDR) - on Samsung SUHD TVs and other VIDITY-enabled devices.

The new My Passport Cinema drive utilizes VIDITY technology to allow users to experience movies in crystal-clear, true 4K UHD picture and immersive audio. Users are able to enjoy 8.3 million pixels of stunning entertainment in minutes by simply plugging in the My Passport Cinema drive into a VIDITY-compatible UHD TV or device and purchasing preloaded1 movies from Twentieth Century Fox Home Entertainment. Once purchased on the My Passport Cinema drive, the movie can be accessed immediately online or offline on any VIDITY-enabled device such as Samsung's 2014 HU series 4K UHD TVs and 2015 JU and JS series 4K UHD and SUHD TVs. Users also can download additional titles via M-GO or other VIDITY retailers.

SanDisk and SK Hynix Settle IP Litigation

SanDisk Corporation, a global leader in flash storage solutions, today announced it has reached agreement with SK Hynix, Inc. to modify and extend their intellectual property licensing relationship and enter into a multi-year commercial relationship under which SK Hynix will supply its leading-edge DRAM products to SanDisk. These agreements include a settlement of the trade secret misappropriation suit filed by SanDisk in 2014.

Under these agreements, which will expire on March 31, 2023, SanDisk will release SK Hynix of its liability pertaining to the trade secret litigation and license certain intellectual property rights to SK Hynix in exchange for license and royalty payments to be made over the duration of the agreement. In addition, SK Hynix has agreed to supply SanDisk with certain volumes of its DRAM products for MCP and SSD applications. The specific terms and conditions of the agreements, including with respect to economic consideration, are confidential.

Seagate-Micron Alliance Announces 1200.2 SAS 12G SSD

Seagate Technology plc, a world leader in storage solutions, today announced the availability of the 1200.2 Serial Attached SCSI (SAS) Solid State Drive (SSD). The Seagate 1200.2 SAS SSD is the first product to result from a strategic alliance between Seagate and Micron Technology, Inc., announced in February 2015.

"Enterprise and cloud users face record growing storage demands challenging the performance of their IT systems to churn through mass amounts of data, while being restricted by opex/capex expenditure limits," said Brett Pemble, vice president of flash products, Seagate cloud systems and electronics solutions. "As our partners and customers depend on Seagate flash technologies to meet these challenges, we are leveraging our collaboration and innovation with Micron to exceed their expectations."

The framework established between Seagate and Micron has led to the development and production of this next-generation, high-capacity SAS SSD platform. It is the first 12 gigabits-per-second (Gb/s) SAS device to optimize dual channel throughput with up to 1800 megabytes-per-second (MB/s) sequential reads and offer multiple endurance choices within a single hardware and firmware design. These advantages engineered for the 1200.2 SAS SSD ensure it will deliver ultra-fast performance to match the needs of specific enterprise applications and workloads.

MSI Intros GeForce GTX 980 Ti Armor2X Graphics Card

MSI released the GeForce GTX 980 Ti Armor2X OC graphics card (model: V323). This is MSI's second cost-effective GTX 980 Ti offering, besides the GTX 980 Ti OC V1, which the company plans to offer at near-reference prices, despite a factory-overclock. Unlike the OC V1, this card features a cost-effective dual-fan cooling solution that sticks to the "Krait" color scheme of contrasting black and white; with a black PCB that lacks a back-plate. On offer, is a factory overclock of 1178 MHz core, 1279 MHz GPU Boost, and an untouched 7010 MHz (GDDR5-effective) memory. The card features the usual 6 GB of GDDR5 memory across a 384-bit wide memory bus, draws power from a combination of 8-pin and 6-pin PCIe power connectors, and offers display outputs of one each DVI, HDMI 2.0, and DisplayPort 1.2 connectors.

Creative Also Announces Sound BlasterX P5 Gaming Headset

Creative Technology Ltd today announced at gamescom 2015, as part of the Sound BlasterX Gaming Series, the Sound BlasterX P5, a High-performance In-ear Gaming Headset. As a smaller and lighter headset solution with far superior noise isolation, the Sound BlasterX P5 is built with two custom-tuned, high-sensitivity 7 mm FullSpectrum drivers with port tubes for deep clean bass and clear highs, and a high-performance omni-directional inline microphone optimized for vocal capture.

Unlike other bass heavy in-ear gaming headsets, its well balanced audio signature offers a wide, layered soundstage with rapid response, giving gamers tactical advantage through the distinct ability to perceive cues, depth and location accurately. It is tuned to enhance the listening experience and not to overwhelm, allowing gamers to experience an amazing level of detail while being immersed in the gaming experience for extended hours without listening fatigue. The Sound BlasterX P5 sets the new audiophile in-ear standard for gaming while delivering powerful sound even at low volumes.

Creative Announces Sound Blaster Roar 2 Wireless Speaker

Creative Technology Ltd today announced the availability in the United States of a brand new variant of the critically acclaimed Sound Blaster Roar portable Bluetooth wireless speaker -- the smaller, lighter, sexier, sweeter Sound Blaster Roar 2. The all new Sound Blaster Roar 2 portable Bluetoothwireless speaker retains the same 5 speaker drivers, electrical design, and 8-hour battery life as the Classic Sound Blaster Roar -- but is now 20% smaller and 10% lighter. And it is available in black or white.

Encased in a stylish sleek metallic housing that exudes the understated sophistication of a well-designed audio instrument, the smaller-lighter-sexier-sweeter Sound Blaster Roar 2 is sure to impress, whether it is used at the office, in a designer home, or at a party.

Creative Also Announces Sound BlasterX G5: 7.1 External Sound Card and Amplifier

Creative Technology Ltd today announced at gamescom 2015 , as part of the Sound BlasterX Gaming Series, the Sound BlasterX G5, a 7.1 HD audio external sound card with built-in headphone amplifier. The Sound BlasterX G5 is an external sound card that comes with the built-in SB-Axx1 multi-core chipset for hardware accelerated SBX Pro Studio enhanced audio and transforms even basic stereo into 3D positional surround sound on your headset. The Sound BlasterX G5 also supports multi-channel content, delivering true 7.1 audio for ultra-realistic surround sound.

Built with precision audiophile components, the Sound BlasterX G5 is also a 24-bit/192kHz, 120dB USB DAC and headphone amplifier with 2.2 ohm output impedance for high fidelity playback -- driving studio-grade headphones up to 600 ohms and sensitive in-ear monitors. The illuminated volume control knob and dedicated SBX and Scout Mode buttons also allow for quick volume or audio adjustments during gaming sessions.

Creative Announces Sound BlasterX H7: Professional HD 7.1 Headset

Creative Technology Ltd today announced at Gamescom 2015, as part of the Sound BlasterX Gaming Series, the Sound BlasterX H7, a premium ultra high-performance high definition 7.1 Surround USB Gaming Headset. Made for the discerning gamer, the flagship product in the new Sound BlasterX line, the Sound BlasterX H7, combines comfort and durability with the best audio performance available. The headset supports USB connectivity for high definition lossless digital audio which includes 7.1 surrround sound for immersive gaming.

Every detail of the product design was scrutinized based on feedback from pro-gamers as well as features that are in demand in the market. Two of the most important features for a gaming headset are durability and comfort. At its core, the Sound BlasterX H7 features a simplified design: less parts means less weight, and the highly flexible, single-piece reinforced steel band bends all the way around the head for a precise, comfortable fit. The earcups are lined with plush, replaceable protein leather/memory foam cushions to ensure lasting comfort and a perfect seal against unwanted ambient noise, and are connected to the headband with lightweight flexible aluminium brackets.

Toshiba Announces Third Generation of Enterprise SAS SSDs

Toshiba Corporation's Semiconductor & Storage Products Company today announced its next generation of enterprise solid state drives (eSSDs) for the PX Series. The new PX04S line features four serial-attached small computer system interface (SCSI) SAS eSSD models well-suited for enterprise applications including: mail servers; database servers; virtualized enterprise file servers; and primary storage in read, write or mixed workload environments. Continuing Toshiba's legacy of quality and reliability, the dual-ported 12 Gbit/s SAS PX04S line offers random 4K performance with read IOPS up to 270K and write IOPS up to 145K. This is Toshiba's first 12Gbit/s SAS SSD to deliver 3.84 TB of operating capacity. Sample shipment starts from today.

The PX04S line features four eSSD models - PX04SHB, PX04SMB, PX04SVB and PX04SRB - each offering a range of capacities and optimized for different applications and workloads; High-Endurance: Targeted at applications requiring the highest levels of eSSD performance, reliability and endurance, the PX04SHB supports 25 complete drive writes per day (DWPD) with a one hundred percent random workload and is available in a range of capacities from 200 GB to 1.6 TB. Write-intensive virtualized data centers, big data analytics and high performance computing (HPC) workloads will benefit from the impressive performance and data integrity afforded by the PX04SHB.

Xilence Introduces New CPU Cooler Series

Xilence, specialist in cooling, power supply and noise reduction for PCs and laptops, presents the Performance C series, a new line-up of coolers. The three new models are clearly positioned in the market's value segment. In addition to an affordable price, the new Xilence coolers also distinguish themselves through a sophisticated and flexible design as well as a very silent operation.

The cooler series has been split into two models: Performance C 402 and Performance C M403. Xilence offers the former in two versions, with Intel or AMD mounting kits, while the M403 model is a multi-socket cooler. With their compact yet very efficient design, Performance C coolers prove to be an outstanding choice. With a capacity of up to 130 Watt (Performance C 402) or 150 Watt (Performance C M403), even powerful multicore processors can be cooled reliably.
Monday, August 3rd 2015

Today's Reviews

Accessories
Cooling
Graphics Cards
Headphones
Keyboards
Memory
Monitors
Notebooks
Processors
PSUs
SSD
Storage

Apple Readies New iMac Desktops for Q3-2015

Apple is readying a new generation of iMac desktops, which it plans to launch in Q3-2015, likely at its September press event. The new Macs are expected to come with faster processors (likely Intel "Skylake,") faster DDR4 memory, and an increase in display resolutions across the board, including a 21.5-inch model with 4K Ultra HD (3840 x 2160 pixels) resolution, besides its 27-inch 5K (5120 x 2880 pixels) model. The display panels in these macs will feature a new LED phosphor material called KSF (K2SiF6:Mn), which improves color saturation. The displays will offer 30-bit (10 bpc) color depth, with the ability to produce 1.07 billion colors.

Unigen Announces 1TB SATA III 2.5-inch SSD Solutions

Unigen Corporation has announced an MLC NAND flash based 2.5" SATA III SSD solution in densities up to 1TB. This SSD solution is intended for high density storage, cloud storage, industrial, and networking applications. The products are designed around a Multi-Format Flash Media controller, which allows read/write capability to MLC, eMLC or SLC NAND Flash, providing performance and high reliability density media to store code and data.

The solutions are based on the standard 2.5" form factor (7mm and 9mm heights), which operates on a 5V power supply. It is fully compliant with SATA III and backward compatible with SATA II. The solutions feature a performance throughput of up to 530MB/s Read, and 500MB/s write, with typical latency lower than 100uS, and low power consumption of less than 6W active.

Unigen Announces DDR4 Modules

Unigen Corporation, a Leading Integrated Solutions Provider and Manufacturer of Enterprise Class Flash Storage SSDs and DRAM Modules, today announced the availability of its latest lineup of DDR4 memory modules for embedded, networking, and enterprise applications.

Using the latest 4-/8-gigabit (Gb) DDR4 devices, Unigen's DDR4 Registered Dual In-line Modules (RDIMM) and Load-reduced RDIMM (LRDIMM) are fully operable at DDR4-2133 1.2V in densities up to 32GB. Likewise, Small Out-line DIMM, Mini-DIMM, and unbuffered DIMM are fully operable at DDR4-2400 1.2V in densities up to 16GB. All Unigen DDR4 modules are 100% stress tested using Unigen's proprietary DRAM test software and platform to ensure full compliance of Unigen's interoperability, reliability and quality specifications.

Toshiba Unveils 256 Gigabit 48-layer 3D TLC NAND Chip

Toshiba Corporation today unveiled the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory. The new device is the world's first 256-gigabit (32gigabytes) 48-layer BiCS device and also deploys industry-leading 3-bit-per-cell (triple-level cell, TLC) technology. Sample shipments will start in September.

BiCS FLASH is based on a leading-edge 48-layer stacking process that surpasses the capacity of mainstream two dimensional NAND Flash memory while enhancing write/erase reliability endurance and boosting write speeds. The new 256 Gb device is suited for diverse applications, including consumer SSD, smartphones, tablets and memory cards, and enterprise SSD for data centers.

Samsung U32E850R 32-inch Ultra HD Monitor with AMD FreeSync Now Available

Samsung made its premium 32-inch Ultra HD monitor with AMD FreeSync support (model: U32E850R) available in retail stores. It is priced around US $1,199. The U32E850R features a 32-inch PLS panel, with 4K Ultra HD (3840 x 2160 pixels) native resolution, 60 Hz refresh rate, 350 cd/m² maximum brightness, 4 ms response time, and dynamic mega-contrast. The panel also offers 30-bit color (1.07 billion colors). Inputs include DisplayPort 1.2a (needed for FreeSync to work), mini-DisplayPort 1.2a, and two HDMI. Samsung appears to have finally learned from feedback for its flimsy T-shaped stand, and gave this monitor a conventional rectangle-base stand that offers swivel, tilt, and height adjustments. Paraphernalia include a USB 3.0 hub.

HighPoint Unveils USB 3.1 Product Line

For the past 20 years, HighPoint has been a professional RAID Storage and Management solutions provider, constantly striving to bring quality Storage technology to market and deliver the industry's best Price-Performance value. We are pleased announce the launch of our next generation USB Host to Device storage and connectivity product lines, featuring 10Gb/s transfer speeds. Our latest RocketU PCIe host adapter is the ideal USB 3.1 upgrade solution for any Mac or PC platform with PCIe support. Our performance oriented dual-bay USB 3.1 RocketStor 3100 Series Drive Docks support any industry standard 3.5"/2.5" SATA hard drive or SSD, including the latest 8TB models, and provide USB 3.1 connectivity via USB Type-B and Type-C ports.

The RocketStor 3122Bis the industry's fastest USB 3.1 dual-bay storage dock, and is an ideal high-performance external storage solution for any USB 3.1 capable PC or Mac. The two 2.5"/3.5" drive bays can support disks up to 8TB in size, and are powered by dedicated USB 3.1 controllers and 6Gb/s SATA channels. Simultaneous Access to Both 6Gb/s SATA Drive Bays: The RocketStor 3122B was designed to ensure maximum performance for each SATA SSD or hard drive. Each drive bay is powered by an independent SATA Channel to optimize the throughput of each USB 3.1 port. This ensures seamless transfers and no wait time - you are free to access both drive slots simultaneously with no loss in speed, anytime you need them.

Crucial to Showcase New Ballistix Sport LT DDR4 White Modules at Gamescom

Crucial, a leading global brand of memory and storage upgrades, today announced it is unveiling a complimentary white digital camo heat spreader and unique white printed circuit board (PCB) option as part of its Crucial Ballistix Sport LT DDR4 memory offering. The modules, which will be showcased in conjunction with gamescom in Cologne, August 5th - 9th, offer the same DDR4 performance and proven reliability that gamers have come to expect from Crucial.

Designed for mainstream users who simply want to get more performance out of their systems, Crucial Ballistix Sport LT DDR4 memory delivers fast speeds and increased bandwidth. A new addition to the current Ballistix Sport DDR4 lineup, Sport LT modules feature a covert digital camo design, which will be available in both white and gray, and an integrated heat spreader. Whether gamers want plug-and-play installation or Intel XMP 2.0 profiles to achieve DDR4 speeds of 2400 MT/s, Ballistix Sport LT memory delivers seamless, affordable performance.

Noctua Provides Free Mounting Upgrade for Upcoming Intel "Skylake" Platform

Noctua today announced that it will continue its tradition of supplying customers with its premium-class SecuFirm2 mounting kits for novel platforms free of charge. While most Noctua heatsinks support Skylake's LGA1151 socket out of the box, older models can be upgraded with the NM-i115x kit at no additional cost.

"We're determined to provide the best possible support to our customers and over the years, we've sent many thousands of mounting kits free of charge to users who wanted to upgrade to new platforms", says Mag. Roland Mossig (Noctua CEO). "With Skylake just around the corner, we're pleased to announce that we'll extend this offer for LGA1151. Owners of older Noctua retail heatsinks that don't support LGA1151 out of the box will be able to upgrade to the new socket free of charge!"

Due to the spacing of the mounting holes being identical on LGA1150, LGA1151, LGA1155 and LGA1156, Noctua's previous SecuFirm2 mounting systems for LGA115x also support Intel's upcoming 'Skylake' platform. All current Noctua coolers already include SecuFirm2 mounting systems for LGA115x and can thus be used on LGA1150 mainboards without any upgrades or modifications.

Intel Core "Skylake" Retail Boxes Surprisingly Colorful

The retail packaging of Intel's 6th generation Core "Skylake" processors in the LGA1151 package, will be surprisingly colorful, and a throwback to the pre-Pentium 4 era, according to spy-shots of the retail boxes of the upcoming Core i7-6700K and Core i5-6600K. What's even more surprising, is that packages of the i7-6700K and i5-6600K, which feature unlocked base-clock multipliers, making them primed for overclocking, do not include stock cooling solutions. Their retail packages resemble those of Intel's Core i7 HEDT processors. In the box, you'll find just the processor, its case-badge, and basic documentation.

Both the Core i7-6700K and Core i5-6600K feature the same integrated graphics SKU - HD Graphics 530. Both feature integrated memory controllers that support both DDR3L and DDR4 memory types. The Core i5 predictably lacks HyperThreading, and only features 6 MB of L3 cache, while the Core i7 features HyperThreading, and the full 8 MB present on the chip. The "Skylake" silicon will be built on the 14 nm process.

AMD Details Exascale Heterogenous Processor (EHP) for Supercomputers

AMD published a paper with the IEEE for a new high-density computing device concept, which it calls the Exascale Heterogenous Processor or (EHP). It may be a similar acronym to APU (accelerated processing unit), but is both similar and different to it in many ways, which make it suitable for high-density supercomputing nodes. The EHP is a chip that has quite a bit in common with the recently launched "Fiji" GPU, that drives the company's flagship Radeon R9 Fury X graphics card.

The EHP is a combination of a main die, housing a large number of CPU cores, a large GPGPU unit, and an interposer, which connects the main die to 32 GB of HBM2 memory that's on-package, and is used as both main-memory and memory for the integrated GPGPU unit, without memory partitioning, using hUMA (heterogeneous unified memory access). The CPU component consists of 32 cores likely based on the "Zen" micro-architecture, using eight "Zen" quad-core subunits. There's no word on the CU (compute unit) count of the GPGPU core. The EHP in itself will be highly scalable. AMD hopes to get a working sample of this chip out by 2016-17.


Source: Bitsandchips.it

IBASE Announces ASB200-908 IPC

IBASE Technology, a leading provider of embedded board and systems, announced the release of its new fanless box system with 12V~24V wide range power input - ASB200-908. The system is built with the IBASE IB908 3.5-inch SBC designed with the 4th Generation Intel Core i7-4650U and i5-4300U processors. ASB200-908 is ideal for industrial automation, transportation, security and retail POS applications that can take advantage of the system's four serial ports as well as the DC-in power input. It supports IBASE's iSMART green technology featuring EuP/ErP power saving and intelligent scheduler.

Measuring only 180x150x66mm, ASB200-908 operates silently and reliably in a small footprint. It has two 1600MHz DDR3L slots that accept up to 16GB of system memory. External I/Os include 5x USB, 4x COM, 2x GbE, DVI-I, CFAST socket, HDD LED and power button. All models are available with 4GB memory and 320GB HDD. A 60W power adaptor and VESA bracket are optional.

Corsair Memory, PSUs, and CPU Coolers Pave the Way for Next Gen PC Processors

Corsair, a leader in high-performance PC hardware, today announced the availability of a comprehensive product line-up supporting the upcoming 6th Gen Intel Core desktop processors and motherboards based on the Intel Z170 chipsets. All of Corsair's current liquid CPU coolers and PC power supplies will be compatible with the new Intel desktop platform, along with a full line of validated DDR4 and DDR3L memory kits.

Corsair has long been a leader in high-performance PC memory, playing a decisive part in dozens of current overclocking world records. Now the company brings this expertise and experience to support Intel's upcoming new enthusiast desktop platform, delivering higher clock frequencies, increased memory bandwidth and lower power usage with Dominator Platinum and Vengeance LPX DDR4, and Vengeance LP and Vengeance Pro DDR3L memory lines. All memory kits are extensively validated with leading motherboard manufacturers to ensure maximum compatibility and easy configuration and overclocking with XMP 2.0 profiles. All of the Corsair memory kits are supplied with a limited lifetime warranty.
Saturday, August 1st 2015

Seagate Reports Fiscal Third Quarter 2015 Results

Seagate Technology plc today reported financial results for the third quarter of fiscal year 2015 ended April 3, 2015. For the third quarter, the Company reported revenue of approximately $3.3 billion, gross margin of 28.7%, net income of $291 million and diluted earnings per share of $0.88. On a non-GAAP basis, which excludes the net impact of certain items, Seagate reported gross margin of 28.9%, net income of $357 million and diluted earnings per share of $1.08. For a detailed reconciliation of GAAP to non-GAAP results, see the accompanying financial tables.

During the third quarter, the Company generated approximately $374 million in operating cash flow, paid cash dividends of $176 million and repurchased approximately 12 million ordinary shares for $706 million. Year to date, the Company has returned approximately $1.4 billion to shareholders in dividend and stock redemptions. Cash, cash equivalents, restricted cash, and short-term investments totaled approximately $2.6 billion at the end of the quarter.
Friday, July 31st 2015

Today's Reviews

Accessories
Cases
Graphics Cards
Headphones
Keyboards
Memory
Motherboards
Mousepads
Networking
Processors
PSUs
Speakers

NVIDIA Recalls Select Shield Tablets over Fire Hazard

NVIDIA today announced a voluntary recall of its SHIELD 8-inch tablets that were sold between July 2014 and July 2015, which the company will replace. NVIDIA has determined that the battery in these tablets can overheat, posing a fire hazard. The recall does not affect any other NVIDIA products.

NVIDIA is asking customers to visit this page for information on how to obtain a replacement device. NVIDIA is also asking consumers to stop using the recalled tablet, except as needed to participate in the recall and back up data. Consumers will receive a replacement tablet after registering to participate in the recall. NVIDIA is coordinating with appropriate governmental agencies to ensure that the recall follows established industry practices.

Thermaltake Unveils the Core V51 Riing Edition Window Green PC Chassis

Thermaltake, an industry leader in computer chassis, thermal solutions, and power supply units, unveils the new Core V51 Riing Edition Window Green Mid-Tower Chassis, a marriage of Thermaltake's two star products: the Red Dot Award Product Design 2015 winner Core V51 Mid-Tower Chassis and the Riing 14 Patented LED High Static Pressure Radiator Fan.

The Core V51 Riing is designed in a green color theme with three preinstalled 140 mm green Riing fans to aesthetically match other green components while delivering an outstanding cooling performance with the extensive DIY/AIO LCS compatibility. Core V51 Riing Edition is an enthusiast's grade mid-tower chassis that creates unprecedented space for high-end hardware and liquid cooling expansion, supporting the latest E-ATX, ATX, Micro ATX motherboards, and all high-end GPU cards.

MSI to Fuse OC and Gaming Lines with Z170 Family

MSI is set to fuse its two premium motherboard lines - OC Series and Gaming, with its upcoming Z170 family. The company's upcoming Z170 XPower Gaming Titanium Edition is the first such product. This stunning looking board features a silvery-white PCB, with the frosty-silver scheme continuing on to the chipset and VRM heatsinks. Its main PCI-Express 3.0 x16 slots (which are wired to the CPU), feature a chrome tipped slot brace. Built in the ATX form-factor, the Z170 XPower Gaming Titanium Edition draws power from a combination of 24-pin ATX, 8-pin EPS, 4-pin ATX, and 6-pin PCIe power connectors. It uses a 16-phase VRM with tantalum capacitors, to condition power for the CPU. The CPU is wired to four DDR4 DIMM slots, supporting up to 64 GB of dual-channel memory.

Expansion slots include four PCI-Express 3.0 x16, from which three are wired to the CPU (electrical x16/NC/NC or x8/NC/x8 or x8/x4/x4); the fourth is electrical PCIe 3.0 x4 and wired to the PCH. Three PCIe 3.0 x1 slots make for the rest of the expansion area. Storage connectivity includes two M.2 32 Gb/s slots, two SATA-Express 16 Gb/s, and eight SATA 6 Gb/s ports. Display outputs include one each of DisplayPort and HDMI. USB connectivity includes 4 USB 3.1 slots, which include a mixture of type-A and type-C, with a physical type-A port pointing "forwards." MSI AudioBoost 3 audio solution, and Killer E2200 NIC make for the rest of its connectivity. The board features a detachable module with OC controls, called the OC Dashboard. This plugs into headers around the voltage measurement points. You also get automatic overclocking via a rotary knob. MSI will launch this board in its first wave of socket LGA1151 motherboards.

EVGA Announces the X99 Micro2 Motherboard

The EVGA X99 Micro2 takes all the great features from the EVGA X99 Micro motherboard, and upgrades it with USB 3.1 Type-C, increased SATA ports, improved layout design + BIOS and refreshed look. The EVGA X99 Micro2 offers a stunning set of features and overclocking support, along with EVGA's new GUI BIOS that focuses on the best overclocking support, functionality, and usability.

Get your PC future proof ready with the EVGA X99 Micro2 motherboard. This motherboard features the next generation USB 3.1 Type-C connector that delivers transfer speeds of up to 10Gb/s for unbelievable performance. Compact mATX form factor at 9.6in x 9.6in, yet still allows for enthusiast features such as SLI, robust SATA 6G expandability, M.2 support, incredible overclocking and more.
Thursday, July 30th 2015

Today's Files

Today's Reviews

Cases
Cooling
Gaming PC
Graphics Cards
Headphones
Keyboards
Memory
Motherboards
Notebooks
SSD

Toshiba to Offer Full Line of Windows 10 Business Devices

Toshiba's Business Solutions Division (BSD), a division of Toshiba America Information Systems, Inc., today announced that their full line of business devices, including laptops, detachable Ultrabooks, and tablets will be available with Windows 101. With this new platform, business users will enjoy an improved user experience as well as features designed specifically for work, providing a better experience for the increasingly mobile professions. To foster adoption of these features, Toshiba is investing in new deployment and management capabilities to ensure that enterprises and small businesses alike can realize enhanced productivity and innovation, while maintaining ease of management.

"As one of the first PC providers to deliver a complete line of Windows 10 ready business devices, we are always looking for ways to bring our customers the features they need," said Carl Pinto, vice president of marketing and engineering, Toshiba America Information Systems, Inc., Business Solutions Division. "Our line of business products not only delivers powerful, secure devices, but are now Windows 10-ready, enabling businesses and IT departments to take advantage of the new platform as soon as they are ready."

Toshiba Expands SMB Offering with New Windows 10 Ready Laptop

Toshiba's Business Solutions Division (BSD), a division of Toshiba America Information Systems, Inc., today announced a new laptop designed to meet the varying needs of small to mid-sized businesses. Designed, engineered and manufactured by Toshiba, the Tecra A50 represents the expansion of Toshiba's SMB lineup. The Tecra A50 is Windows 10-ready and offers the performance of an enterprise-class PC and the essential productivity and security features business users need at an affordable price point.

"Small and mid-sized business need more enterprise-class features and performance than ever before, but for a low total cost of ownership," said Carl Pinto, vice president of marketing and engineering, Toshiba America Information Systems, Inc., Business Solutions Division. "Our line of SMB products not only delivers powerful, secure devices that each meet the varying needs of this segment, but are now Windows 10-ready, enabling businesses and IT departments to take advantage of the new platform as soon as they are ready."
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