Besides the sensational Ryzen 7000X3D processors taking the fight to Intel's "Raptor Lake," AMD expanded the desktop Ryzen 7000 even downwards, with the introduction of three new 65 W processor SKUs that include boxed stock coolers. These include the Ryzen 5 7600 6-core/12-thread, the Ryzen 7 7700 8-core/16-thread, and the Ryzen 9 7900 12-core/24-thread. There's no 16-core part in this segment. These processors come with TDP values set at just 65 W, and PPT values in the range of 90 W to 120 W, and so their clock speeds and maximum boost speeds are lower compared to the 7000X series, with more aggressive power-management.

The 7600 boosts up to 5.10 GHz, and packs a 65 W-capable Wraith Stealth boxed cooling solution. The 7700 boosts up to 5.30 GHz, and the 7900 up to 5.40 GHz. Both the 7700 and 7900 include a Wraith Prism RGB cooler that can handle thermal loads of up to 140 W. The three chips are priced lower than their 7000X series cousins, with the 7600 going for USD $229, the 7700 at $329, and the 7900 at $429. The three chips are drop-in compatible with existing Socket AM5 motherboards without needing any BIOS update.

Today, HYPER, the #1 Docking Station Brand in the USA, announced the immediate availability of the HyperJuice 245 W GaN Desktop Charger and 245 W USB-C Battery Pack after a successful crowdfunding campaign that garnered 5,000+ backers and generated over $1M in funding. The world's first and smallest HyperJuice 245 W GaN Desktop Charger is designed for the "work from home" professional or enterprise looking to maximize power connectivity when outlet space may be sparse. With four 100 W (max) USB-C Power Delivery ports powered by industry-leading GaN technology, users will be able to power four mid-size 60 W laptops (like the 13" MacBook Pro/Air) or quick charge two large 100 W laptops (16" MacBook Pro), tablet (iPad Pro) and smartphone (iPhone 13) all at the same time from a pocket-sized charger.

Need power on the go? The world's first HyperJuice 245 W USB-C Battery Pack takes the same 245 W of USB-C power on the road for the traveling professional. It boasts a whopping 100Wh/27000mAh airline-safe battery capacity, two 100 W (max) and two 65 W (max) USB-C Power Delivery ports, giving you the ability to charge four USB-C devices like laptops, tablets, DSLR cameras, smartphones, drones, gaming consoles all at the same time. It features an illuminated OLED screen to inform users about the remaining battery capacity and charging power of each port and comes with a 100 W input so that you can quickly recharge the battery in 1 hour using the HyperJuice 245 W GaN Charger or any 100 W USB-C charger.

Belkin, a global consumer electronics leader, today unveils the Works With Chromebook certified USB-C 14-Port Docking Station at InfoComm 2021. The docking station joins four power and connectivity solutions in Belkin's family of certified Works With Chromebook products. Each product is tested to meet Google's compatibility standards and equips any organization with the solutions that make adapting to evolving technology simple and seamless.

Engineered with the growing number of Chrome OS users in mind, the USB-C 14-Port Docking Station is capable of automatic firmware updates through Chrome OS and offers wide compatibility with all Chromebooks for an enhanced and seamless connectivity experience. It is designed to house multiple ports for extreme productivity - HDMI 2.0, DP 1.4, USB-C, USB 3.1 Gen 2, 65 W PD 3.0, Gigabit Ethernet, Audio In/Out - providing users with the option to display, connect and charge with one simple and modern solution.

Elitegroup Computer Systems (ECS) has recently unveiled the thin H410H6-TI2 motherboard for Intel 10th Generation Core Processors up to 65W TDP. The H410H6-TI2 is powered via a single 19V DC jack which eliminates the need for a dedicated PC power supply while also severely limiting upgrade options. The thin Mini-ITX motherboard measures just 170x170mm which makes it a good option for system integrators.

The motherboard comes with x2 DDR4 SO-DIMM slots which supports up to 32GB ram at 2933Mhz, x2 SATA3.0 6Gbps connectors, x1 M.2 SATA/PCIe slot, and x1 M.2 wireless adapter slot. The board features Gigabit LAN powered by the Realtek 8111H while six-channel HD audio is provided by the Realtek ALC662. The motherboard rear I/O includes x2 USB3.2 Gen1, x2 USB2.0, x2 audio connectors, x1 Gigabit LAN, x1 HDMI, and x1 D-Sub. Pricing and availability for the board are currently unknown.

Intel rolled out its first Pentium-branded processor with 4.00 GHz clock-speed, the Pentium Gold G5620 (retail SKU: BX80684G5620). The chip replaces the G5600 on top of the entry-level product stack. Based on the 14 nm "Coffee Lake" microarchitecture, it packs a 2-core/4-thread CPU clocked at 4.00 GHz without Turbo Boost. 256 KB of L2 cache per core and 4 MB of shared L3 cache are also offered. The integrated graphics solution is Intel's workhorse UHD Graphics 630, with 24 execution units. The dual-channel DDR4 integrated memory controller supports up to 64 GB of DDR4-2400 memory. The chip's TDP is rated at 65W. Pricing is up in the air, with retail channel shortages expected to swing the chip on both sides of the $100-mark. Availability is slated for early-March, 2019.

AMD today announced its Ryzen 3 series value desktop processors in the socket AM4 package. The lineup consists of the Ryzen 3 1200 priced at $109, and the faster Ryzen 3 1300X priced at $129; and compete with Intel Core i3 dual-core SKUs, such as the i3-7100 and the i3-7300, respectively. What AMD has going for these chips is that they are quad-core, even if they lack SMT featured on Ryzen 5 series quad-core parts. Both are endowed with 8 MB of shared L3 cache, and unlocked base-clock multipliers.

The Ryzen 3 1200 is clocked at 3.10 GHz, with 3.40 GHz boost, and XFR (extended frequency range) adding another 50 MHz; while the Ryzen 3 1300X is clocked at 3.40 GHz, with 3.70 GHz boost, and XFR adding a further 200 MHz. In most scenarios, the chip should boost up to 3.90 GHz. AMD carved the two Ryzen 3 series parts out of its 14 nm "Summit Ridge" silicon, by disabling two cores and 4 MB L3 cache per CCX, resulting in 4 cores and 8 MB of total L3 cache. Both chips feature TDP ratings of 65W, and include AMD Wraith Stealth cooling solutions.

Here are some of the first pictures of Streacom DB6, the company's upcoming fanless cube-shaped case. The case features a somewhat tower-like appearance, with its side-panels bulging out slightly outwards, which double up as heatsinks for the CPU and GPU. The top and front panels feature classy black-tinted tempered glass panels. The case can handle thermal loads of around 120W for the CPU and 120W for the GPU. With a little planning, you could squeeze in a 65W AMD Ryzen 5 1600 and a ZOTAC GeForce GTX 1080 Mini into this thing.

The case can hold on to micro-ATX and mini-ITX motherboards, and has room for up to six 3.5-inch HDDs (or up to twelve 2.5-inch drives). An elaborate copper heat-pipe based cooling system conveys heat from the CPU and GPU to the case's body, made of chunky aluminium, which dissipates it. It can hold on to a standard ATX power supply. Measuring 340 mm x 360 mm x 245 mm (D x H x W), the case weighs a staggering 14.5 kg (29 lbs). We expect it to be priced around the $350 mark.

Following its launch of the Ryzen 5 series performance-segment six-core and quad-core processors later this month, AMD could launch entry-level quad-core chips based on the 14 nm "Summit Ridge" silicon in the second half of 2017. This lineup will be called the Ryzen 3 series, and will occupy several sub-$150 price points.

The Ryzen 3 series parts will compete with Intel's Core i3 dual-core "Kaby Lake" processors, and will offer four cores, even if lacking SMT (that's 4 cores, 4 threads), and up to 8 MB of L3 cache, making for a compelling deal against Core i3 "Kaby Lake" dual-core parts that have 2 cores and 4 threads enabled through HyperThreading, and just 3-4 MB of L3 cache. What's more, the Ryzen 3 series chips will come with unlocked base-clock multipliers. One of the prominent Ryzen 3 series SKUs revealed by leaky taps among the motherboard industry is the Ryzen 3 1200.

At a press event by AMD, company CEO Lisa Su unveiled the first three AMD Ryzen desktop processor models, the top-dog Ryzen 7-1800X, the Ryzen 7-1700X, and the Ryzen 7-1700. The R7-1800X is priced at USD $499, followed by the R7-1700X at $399, and the R7-1700 at $329. The three chips will be available for purchase on the 2nd of March, 2017. The R7-1800X is clocked at 3.60 GHz, with a TurboCore frequency of 4.00 GHz, and the XFR (extended frequency range) feature, which further overclocks the chip, depending on the effectiveness of your CPU cooler.

The Ryzen 7-1700X ships with 3.40 GHz clocks, with 3.80 GHz TurboCore frequency, and the XFR feature. The Ryzen 7-1700 lacks XFR, and comes with slightly lower clocks, at 3.00 GHz core, and 3.70 GHz TurboCore. All three are true 8-core chips, with 512 KB of dedicated L2 cache per core, and 16 MB of shared L3 cache. Also featured are dual-channel DDR4 integrated memory controllers, and an integrated PCI-Express gen 3.0 root complex. The Ryzen 7-1700 has a TDP of just 65W (for a performance 8-core chip that's a kick in the butts of Intel's engineers), and will include an AMD Wraith Max cooling solution, while the 1700X and 1800X have TDP rated at 95W, and will come without coolers. At its media event, CEO Lisa Su stated that at $499, the Ryzen 7-1800X "smokes" the Intel Core i7-6900K eight-core processor. The company also unveiled the branding of its Radeon Vega enthusiast graphics family. Lastly, feast your eyes on the beautiful, 14 nm, Made-in-USA die-shot of Ryzen.

AMD is expected to package its upcoming Ryzen desktop processors in five ways - OEM trays (for system integrators and big pre-built PC manufacturers), PIB (processor in a box) with its basic fan-heatsink cooling solution, PIB with the new Wraith Spire cooling solution; PIB with the new Wraith Max cooling solution, and WOF (without fan-heatsink consumer). You can find the various models of Ryzen processors listed in our older article.

AMD's first wave of Ryzen processors consist of 65W and 95W TDP chips. Some of the more cost-effective models, such as the quad-core Ryzen R3 and SMT-equipped quad-core Ryzen R5, and certain variants of the six-core Ryzen R5, which have their TDP rated at 65W, could include AMD's basic cooling solution. According to XFastest, this cooler will look identical to the ones AMD used to bundle with its FX-series processors, before it innovated its Wraith cooling solution (representative image below). These coolers were being bundled with 125W TDP FX-series chips, and will now be re-tuned for low noise for the 65W TDP Ryzen chips, and will feature AM4 compatibility. Given this, we expect them to do a good job.

In what could be a sign of Intel being stuck with "undigested" Core "Haswell" inventories, BGA chips becoming commonplace for desktop platforms that don't see CPU upgrades, or even "Broadwell" being too short a stopgap between "Haswell" and "Skylake," the company has reportedly decided to launch just two socket LGA1150 Core "Broadwell" parts, when the silicon hits the market towards June.

Built in the 14 nm silicon fab process, "Broadwell" will bring about performance/Watt increments, and Intel doesn't appear to be in the mood to trade those in for higher clock speeds (higher performance out of the box). It's relevant to note here, that the "Broadwell" core is essentially an optical shrink of the "Haswell" CPU architecture to 14 nm, much like "Ivy Bridge" was to "Sandy Bridge," even if the silicon seating the cores itself is much different (meatier iGPU). Intel will be going in with just two parts, both of which are unlocked, for PC enthusiasts to chew on. These include the Core i7-5775C and the Core i5-5675C.

Along the sidelines of GDC 2015, Intel offered a few details on how the year could look for its desktop processor lineup. The company is preparing to launch socketed Core "Broadwell" processors in mid-2015 (late Q2 or early Q3), likely in the sidelines of Computex 2015. Broadwell is an optical shrink of "Haswell" to the new 14-nanometer silicon fab process, with a minor feature-set update, much in the same way as "Ivy Bridge" was an optical shrink of "Sandy Bridge" to the 22 nm process.

The socketed Core "Broadwell" chips could come in the LGA1150 package, running on existing 8-series and 9-series chipset motherboards, with BIOS updates. The optical shrink seems to be working wonders for the silicon. Quad-core chips based on "Broadwell" could come with TDP rated as low as 65W (and we're not talking about the energy-efficient "S" or "T" brand extensions here). Some dual-core variants in the series may even be based on the smaller Core M "Broadwell" silicon, which physically features just 2 cores (and isn't a bigger quad-core silicon with two cores disabled in what's a colossal waste of rare-earth metals on a production scale). Some of those dual-core parts could come with TDP rated as low as 28W.

It's not retirement time for AMD's 45 nm "Regor" silicon just yet, with the company announcing the Athlon II X2 280 value dual-core processor. Built in the socket AM3 package (compatible with AM2/AM2+/AM3/AM3+ motherboards), and based on the company's K10.5 micro-architecture, the chip features two x86-64 cores clocked at 3.60 GHz, 1 MB of L2 cache per core (2 MB total), an instruction set that includes SSE3 and SSE4A, and a dual-channel integrated memory controller that supports both DDR2 and DDR3 memory types. The chip can take advantage of HyperTransport 3.0 interface, with a maximum data-rate of 4.0 GT/s. It features a rated TDP of 65W, and is designed for entry-level desktops. It is priced at US $49.99.

Eurocom, is shipping its new Uno 3.0 All-One-PC with 21.5" FHD Optional Multi Touch Display, TPM 1.2 and an integrated battery pack that is fully optimized for enterprise computing. "The EUROCOM Uno 3.0 All in One Desktop computer is ideal for a wide range of commercial applications," Mark Bialic, Eurocom President "with the plethora of connectivity ports, Multi Touch interface, internal battery, TPM 1.2 and VESA mount the Uno 3.0 will fit perfectly into any workspace."

The EUROCOM Uno 3.0 is designed primarily for corporate customers, the Eco-Friendly 120 Watts, 7.5kg (16.5lbs) easy to move around All in One PC allows companies to improve overall productivity, reduce downtime caused by power interruptions and greatly reduce energy costs.

2013 promises to be another year, with another new line of processors by Intel, and like every alternate year, the company will introduce a new client desktop CPU socket. With its 4th generation Core "Haswell" processor family, Intel will introduce a brand new CPU architecture that steps up IPC over current Core "Ivy Bridge," hence, Intel's Core desktop processor lineup will not ship with higher clock speeds, yet higher performance. The new chips will be built in the LGA1150 package, and will be accompanied by Intel's 8-series "Lynx Point" chipset.

By Q2-2013, Intel will have launched as many as 14 Core desktop CPU models, including six in the mainline, and eight power-optimized ones. Its nomenclature is somewhat similar to that of current Core "Ivy Bridge" lineup, except the 4000-series numbering. Leading the pack is the Core i7-4770K (unlocked) and i7-4770, clocked at 3.50 GHz with 3.90 GHz Turbo Boost, featuring eight threads with HyperThreading, 8 MB of L3 cache, Intel HD Graphics 4600 iGPU clocked up to 1250 MHz, with 84W TDP; followed by Core i5-4670K (unlocked) and i5-4670 clocked at 3.40 GHz with 3.80 GHz Turbo Boost, and 6 MB L3 cache. The Core i5-4570 and i5-4430 are clocked at 3.20 GHz (3.60 GHz Turbo) and 3.00 GHz (3.20 Turbo).

Intel's first Pentium processors based on the 22 nm "Ivy Bridge" silicon will arrive in Q4, 2012. One of the first models in the series, is the Pentium G2120. Specifications reveal that the chip will be quite generously designed as far as specifications go. To begin with, it is a dual-core processor, with a clock speed of 3.10 GHz. It lacks HyperThreading, so 2 logical CPUs is all that the OS will see; as well as Turbo Boost, so the clock speed won't normally scale beyond 3.10 GHz. Interestingly, the chip has 3 MB of L3 cache, on par with some Core i3 dual-core chips. The instruction-set has SIMD instructions up to SSE 4.2, but lacks AVX. Further, the PCI-Express root hub only supports PCI-Express 2.0, lacking PCI-Express 3.0 support. Its TDP is rated at 65W.

Japanese company ASKTech introduced its latest ultra-compact, fan-less mini-ITX case, the NT-TX3000BK. Measuring 295 (W) x 270 (D) x 76 (H) mm, this case is designed for your living room shelf. It can hold mini-ITX motherboards that feature Intel LGA775 or LGA1155/LGA1156 sockets, specifically these sockets, because its bundled ZENO (zero-noise) fan-less CPU cooler. The sides of the case double up as a heatsink. Due to power supply limitations it only supports CPUs with TDP under 65W.

The ZENO cooler consists of a base with retention module, from it, two sets of heat pipes arise, that lead to the two sides of the case, where heat is dissipated to the air passively. The location of the base can be adjusted, as also the points where the heat pipes make contact with the sides of the case, so you don't have to worry about where the CPU socket of the board is located.

AMD released its first triple-core accelerated processing unit (APU), the A6-3500. Armed with three x86-64 cores, the A6-3500 socket FM1 APU is positioned to offer superior performance and performance per dollar compared to Intel's Sandy Bridge-based Pentium Dual Core processors. The A6-3500 features Radeon HD 6530D graphics, which is DirectX 11 compliant, and makes use of 320 stream processors. The CPU component of the A6-3500 is clocked at 2.10 GHz with 2.40 GHz in TurboCore mode, while the GPU component runs at 443 MHz.

There is 3 MB of L2 cache on the chip (1 MB per core), the dual-channel DDR3 memory controller natively supports DDR3-1866 MHz memory. The TDP of the chip is rated at 65W. AMD's A6-3500 triple-core APU is priced at US $95 in the PIB (processor in box) retail package, which includes the certified heatsink, while in 1000-unit tray quantities, it is priced at $89 a piece.

The first Intel Pentium branded processor based on the Sandy Bridge architecture surfaced in China. The Pentium Dual-Core G840 as it's identified, is said to be based on the 32 nm dual-core silicon. It differs from Core i3 dual-core processors in having no HyperThreading technology (one thread per core), and 3 MB of L3 cache enabled. The AVX instruction set also seems to be lacking according to the CPU-Z screenshot.

The Pentium G840 is clocked at 2.80 GHz, with a base clock of 100 MHz, and 28x multiplier. The embedded Intel HD Graphics GPU is clocked at 850 MHz, with 1100 MHz GPU Turbo Boost frequency. The processor cores lack Turbo Boost. The chip has a TDP of 65W. Pricing and availability details are awaited, though expect this LGA1155 chip to cost under $100.

AMD released six new desktop processor models to the market, these include new SKUs in both Phenom II and Athlon II lines. Older SKUs may have been displaced from their price-points by some of the new models. To begin with, AMD introduced a new value dual-core model, the Athlon II X2 265 (3.30 GHz); triple-core Athlon II X3 450 (3.20 GHz); quad-core Athlon II X4 645 (3.10 GHz). The X2 265 is based on the 45 nm Regor die, it features 2 MB of L2 cache, rated TDP of 65W, and is priced at US $76. The X3 450 is based on the 45 nm Rana die, and is essentially a Propus die with one core disabled. It has TDP rated at 95W, this one goes for $87. The X4 645 makes use of the full Propus die, rated TDP at 95W, priced at $122.

Next up, AMD introduced a new "high-end" six-core model, probably in response to lowering of prices on some Intel Core i7 models such as the i7-860. The new Phenom II X6 1075T Black Edition is essentially the same as the Phenom II X6 1090T, except that it's clocked at 3.00 GHz (200 MHz lower). It is priced at $245. Next, a quad-core model that seems to be in response to Intel's release of the Core i5 760. The Phenom II X4 970 Black Edition is clocked at 3.50 GHz (highest AMD default clock speed till date), and is based on the older Deneb die instead of derivation from Thuban. So there's no Turbo Core feature, but thanks to its Black Edition marker, it has an upwards unlocked BClk multiplier. This SKU displaces the X4 965 BE, and is priced at $185. The speed-bump didn't affect the TDP, which is still at 125W.

Intel introduced two new dual-core processors, the high-end Core i5 680, and the value-segment Pentium Dual-Core E5500. The former is an LGA1156 chip that runs on Intel P55, H55, H57, Q55, Q57 chipsets, while the latter is an LGA775 chip that works on most recent LGA775 motherboards. The Core i5 680 uses the 32 nm based Clarkdale core. At 3.60 GHz (27 x 133 MHz) with a Turbo Boost speed of 3.86 GHz, the i5 680 is expected to be the fastest dual-core processor ever made. Its embedded Intel HD Graphics controller is clocked at 733 MHz. It has L2 caches of 256 KB per core, and a shared L3 cache of 4 MB. It supports two channels of DDR3 memory. With HyperThreading enabled, the chip gives the OS four logical CPUs to deal with. It has a TDP of 73W.

The Pentium Dual-Core E5500 is based on the 45 nm Wolfdale-2M core, it has a clock speed of 2.80 GHz (14 x 200 MHz), and FSB speed of 800 MHz. It has a shared L2 cache of 2 MB, and TDP of 65W. While the Core i5 680 is priced at US $294, the E5500 goes for $75. All prices are per-piece in 1000 unit tray quantities.

Renowned overclocker Chew* set a speed record for AMD's new value dual-core processor, the Athlon II X2 255. Based on the Regor core, the X2 255 is a monolithic dual-core chip, with just two physical cores on die, and additional L2 cache, with no L3 cache. This cuts the TDP of the chip to 65W. On the bench built by Chew*, the X2 255 reached 4800.1 MHz, with a BClk of 320.01 MHz, multiplied by 15.0. The chip's natural multiplier value is 15.5x, its stock speed is 3.10 GHz. A VCore of 1.696 Volts was set.

The processor was cooled using a Mach 1 phase cooler. The bench consisted of an Athlon II X2 255, Gigabyte GA-MA785GPMT-UD2H motherboard - another mainstream component which proved its mettle, OCZ DDR3 1600 MHz Black Edition certified memory, PC Power & Cooling 1200W PSU, and ATI Radeon HD 4890 graphics. The CPU-Z validation for this feat can be found here. In the same occasion, Chew* could overclock the chip to 4050 MHz using a reference AMD CPU cooler (which comes bundled with higher-end AMD chips). More pictures at the source.

Thermal Solutions specialist GELID Solutions adds a 28mm high 1U Slim ITX heatpipe CPU Cooler with PWM fan to its popular line of Silent CPU coolers.

With a compact heatsink design for Mini ITX, Micro ATX, ATX, HTPC, Panel PC, Car PC and 1U server the "Slim Silence" is equipped with a high performance heatpipe and a silent fan. The high performance heatpipe ensures a fast and efficient heat transfer from core to aluminium fins. The frameless silent fan includes a ball bearing and a GELID intelligent PWM (Pulse Width Modulation) control which ensures a silent operation at low CPU temperature and accelerates the fan speed when necessary.

The guys over at Hexus.net, have got hold of information that shows details of three new quad core processors with a thermal design power (TDP) of only 65W. The interesting thing is that it seems Intel have still not yet given up the LGA775 socket despite it being superceded. These are the lowest TDP quad cores from Intel to date, based on a 45nm manufacturing process, and in theory using up to 30W less power than current quad core processors, it shows a step in the right direction. Unfortunately it cannot be all good news, as it seems that the expected prices for these are approximatly $100 more than the similarly clocked 95W counterparts.