QNAP Systems, Inc., a leading computing, networking and storage solution innovator, today unveiled the new-generation AI NAS TS-AI642. Adopting an ARM 8-core processor with 6 TOPS NPU, the TS-AI642 is perfect for AI image recognition and smart surveillance applications. Achieving both high performance and power-efficiency with 2.5 GbE connectivity, 10GbE expandability via PCIe and dual 4K HDMI output, the TS-AI642 fulfills the image storage, backup, and video surveillance demands of SMBs.

"According to professional technology media and global technology firms, 2023 is the year of Edge AI. Research shows that companies and organizations are leveraging more efficient and budget-friendly Edge AI solutions due to the market and economic uncertainty." said Jerry Deng, Product Manager of QNAP. "The QNAP TS-AI642 is the first ARM-based AI NAS on the market. Incorporating NPU for boosting AI image recognition performance with a low power design, the TS-AI642 is a cost-optimized entry-level ARM-based AI image storage and Surveillance NAS for SMBs."

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem and is the first in the industry to be built with an advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node, offering powerful yet efficient performance demanded by next-generation wearable devices.

"Wearables like smartwatches are no longer just a cool gadget to have. They're now a growing part of our lifestyles to keep you fit, safe and alert," said Harry Cho, vice president of System LSI marketing at Samsung Electronics. "With the Exynos W920, future wearables will be able to run applications with visually appealing user interfaces and more responsive user experiences while keeping you connected on the go with fast LTE."

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the Exynos 2100 through its first virtual event, Exynos On 2021. The new mobile processor is the company's first premium 5G-integrated mobile processor built on the most advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node.

The chip's computation and graphic processing performance have been improved and refined to surpass the power user's performance expectations. As Samsung's first 5G-integrated flagship mobile processor, the Exynos 2100 is built on an advanced 5 nm EUV process technology that allows up to 20-percent lower power consumption or 10-percent higher overall performance than the 7 nm predecessor. For further enhancement, the chip offers improved cache memory utilization and a stronger scheduler. The octa-core CPU comes in an improved tri-cluster structure made up of a single powerful Arm Cortex -X1 core that runs at up to 2.9 GHz, three high-performing Cortex-A78 cores and four power-efficient Cortex-A55 cores delivering more than 30-percent enhancement in multi-core performance than the predecessor.

MediaTek today announced its T750 5G chipset to power next generation 5G CPE wireless products, like fixed wireless access routers (FWA) and mobile hotspots, to bring fast 5G connectivity into homes, businesses and anyone on the go. The highly integrated, 7 nm compact chip design comes with an integrated 5G radio and quad-core Arm CPU. It's full-featured with all the essential functions and peripherals for device makers to build high performance consumer premise equipment products in the smallest form factors possible. The T750 is sampling now with potential customers.

"Pervasive high-speed broadband connectivity is becoming more important with the increase in connected devices and the surge of people working from home, taking online classes and using services like tele-health and video calling," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit. "We are extending our 5G leadership beyond the smartphone segment with the T750 chipset, opening up new markets for broadband operators and device makers, and helping consumers - no matter where they live - to experience all the advantages of 5G connectivity."

MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek's Dimensity series family. The 7 nm Dimensity 800U chipset is designed for multi-core high performance and leading 5G+5G Dual Sim Dual Standby (DSDS) technology. With Dimensity 800U MediaTek continues to accelerate the rollout of 5G technology and deliver premium experiences on mid-tier 5G smartphones.

"MediaTek has always focused on enhancing the user experience with our leading semiconductor technology, whether consumers are streaming, gaming or taking photos," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business Unit. "MediaTek's Dimensity 800U brings cutting-edge, next-gen technology to the Dimensity SoC series, bringing MediaTek's advanced 5G, imaging and multimedia technologies to high-performance 5G smartphones that deliver incredible 5G experiences."

Last year Samsung and AMD announced their collaboration which promises to deliver smartphone chips with AMD RDNA 2 graphics at its heart. This collaboration is set to deliver first products sometime at the beginning of 2021 when Samsung will likely utilize new SoCs in their smartphones. In previous leaks, we have found that the GPU inside this processor is reportedly beating the competition form Qualcomm, where the AMD GPU was compared to Adreno 650. However, today we have obtained more information about the new SoC which is reportedly called "Ryzen C7" smartphone SoC. A new submission to a mobile phone leaks website called Slash Leaks has revealed a lot of new details to us.

The SoC looks like a beast. Manufactured on TSMC 5 nm process, it features two Gaugin Pro cores based on recently announced Arm Cortex-X1, two Gaugin cores based on Arm Cortex-A78, and four cores based on Arm Cortex-A55. This configuration represents a standard big.LITTLE CPU typical for smartphones. Two of the Cortex-X1 cores run at 3 GHz, two of Cortex-A78 run at 2.6 GHz, while four little cores are clocked at 2 GHz frequency. The GPU inside this piece of silicon is what is amazing. It features four cores of custom RDNA 2 based designs that are clocked at 700 MHz. These are reported to beat the Adreno 650 by 45% in performance measurements.

UNISOC, a leading global supplier of mobile communication and IoT chipsets, today officially launched its new-generation 5G SoC mobile platform - T7520. Using cutting-edge process technology, T7520 enables an optimized 5G experience with substantially enhanced AI computing and multimedia imaging processing capabilities while lowering power consumption.

T7520 is UNISOC's second-generation 5G smartphone platform. Built on a 6 nm EUV process technology and empowered by some of the latest design techniques, it offers substantially enhanced performance at a lower level of power consumption than ever.

ECS (Elitegroup Computer Systems) today announced the whole new AMD FM2+ Platform motherboards - A78F2P-M2, A58F2P-M4, and A55F2P-M2 , featuring the new AMD FM2+ APU socket, transcending the already strong performance FM2 motherboards by adding a host of powerful new features from the Kaveri Technology platform. ECS AMD FM2+ motherboards offer native support for PCI Express Gen 3.0 as well as DirectX 11.1 support integrating the high performance "Steamroller" core. In addition, ECS AMD FM2+ motherboards provide native 4K resolution for ultimate visual experience.

ECS FM2+ Motherboards with AMD Radeon Graphics
AMD A-Series APUs with AMD Radeon R7 graphics are designed with game-changing new features that deliver superior computing and heart-pounding gaming performance. AMD Radeon graphics is based on the new intelligent computing architecture to optimize users' visual experience with the most advanced graphical technology.

MSI is pleased to announce a full line-up of FM2+ Military Class 4 motherboards featuring the new AMD A88X/A78/A55 chipset and FM2+ socket. These motherboards not only support the current FM2 Trinity and Richland APUs but are also ready for AMD's upcoming 4th generation Kaveri APU. AMD APUs are known for their excellent gaming and multi-media experience and support a wide range of display solutions.

4K UHD Output
Thanks to the AMD Kaveri APU and the MSI FM2+ motherboard native HDMI 1.4 connector it supports 4K resolutions (3840x2160) which provide much sharper and life-like images in combination with a 4K monitor.

AMD today announced its 2013 Elite A-Series Accelerated Processing Unit (APU) for desktops, codenamed "Richland", which delivers a superior PC solution with increased computational performance, discrete-level graphics and an easy upgrade infrastructure. At COMPUTEX TAIPEI 2013, AMD showcased the complete breadth of its 2013 APU portfolio with the launch of the new Elite A-Series APU for desktops which power a diverse range of OEM systems and feature new generations of software and applications that harness the unrivaled compute power of the 2013 AMD APU product lineup: the fastest AMD APUs ever.

"The new AMD A-Series APU is ideal for desktop PC builders and mainstream gamers wanting outstanding performance for their money, and today AMD delivers an excellent new follow-on to the recently announced mobile lineup," said Bernd Lienhard, corporate vice president and general manager, Client Products Division at AMD. "The combination of high-performance, third-generation desktop APUs with our existing portfolio of low-power, mobile APUs gives us our strongest-ever lineup of products for our customers and our technology partners."

ACROSSER launches a new All-in-One Gaming Board, the AMB-A55EG1. AMB-A55EG1 features AMD Embedded G-Series T56N 1.65GHz dual-core APU, two DDR3-1333 SO-DIMM, which provides great computing and graphic performance is suitable for casino gaming and amusement applications. It is designed to comply with the most gaming regulations including GLI, BMM, and Comma 6A. AMB-A55EG1 is specifically designed to be a cost competitive solution for the entry-level gaming market.

AMB-A55EG1 utilizes the functions of an X86 platform, 72-pin Gaming I/O interface, intrusion detection and also various security options, and a complete line of Application Programming Interfaces to create smoother gaming development.

AMD's A-series "Trinity" line of APUs may have helped make the APU outsell CPUs in 2013, but it won't be long before they're replaced by the new "Richland" A-series APUs for desktops and mainstream notebooks. "Richland" is a tweaked version of "Trinity" which sees AMD stick to the 32 nm process, and retain the "Piledriver" CPU micro-architecture, but increase CPU clock speeds, add a faster DDR3-2133 MHz dual-channel IMC, and integrate a Radeon HD 8000 series Graphics CoreNext iGPU into the silicon. Desktop APU models will take up with A##-6000 series numbering scheme.

The series will be led by AMD A10-6800K, which features every component on the "Richland" silicon unlocked, which includes two "Piledriver" CPU modules amounting to four x86-64 cores, and all stream processors on the iGPU unlocked, with the highest CPU and iGPU clock speeds enabled in the lineup. The iGPU model for this chip is Radeon HD 8670D. The A10-6800K features unlocked multipliers, making overclocking a breeze. Trailing it is the A10-6700, which features all physical components unlocked, but with slightly lower clock speeds, and locked BClk multipler. It features the same iGPU as its bigger sibling, the HD 8670D.

ASRock will soon be adding a new budget board to its portfolio, the A55 Pro model which is powered by AMD's A55 chipset and supports AMD FM1 processors. Seen below, this ATX board has a 4+1 power design, two DDR3-1866 memory slots, six SATA 3.0 Gbps ports, and two PCIe x16 and three PCIe x1 slots.

The A55 Pro includes 5.1-channel onboard audio, Gigabit Ethernet, UEFI BIOS, six USB 2.0 ports, plus D-Sub and DVI outputs and comes with support for multiple ASRock features like Instant Boot, Instant Flash, APP Charger, XFast USB, XFast LAN and XFast RAM. The board's price tag has not been announced.

ZOTAC International, a global innovator and manufacturer of graphics cards, mainboards and mini-PCs, today launches the new A75-ITX WiFi B-series and A55-ITX WiFi B-series mini-ITX platforms for 2nd Generation AMD A-series APUs. The new socket FM2 platforms enable users to harness the power of the latest AMD Trinity APU architecture featuring AMD Radeon HD 7000 series graphics processors for perfect CPU and GPU synergy in a compact mini-ITX form factor.

"The 2nd Generation AMD A-series APUs paired with our ZOTAC A75-ITX WiFi B-series or A55-ITX WiFi B-series are perfect together. The mini-ITX form factor enables compact systems while the 2nd Generation AMD A-series APU delivers a performance punch and provide adequate gaming capabilities from the integrated AMD Radeon HD 7000 series graphics processor," says Carsten Berger, marketing director, ZOTAC International. "The high-definition video processing capabilities from the AMD Radeon HD 7000 series graphics processor makes the ZOTAC A75-ITX WiFi B-series and A55-ITX WiFi B-series perfect for home theater PC use as well."

Biostar is currently preparing the release of two more motherboards supporting AMD's FM2 (codename Trinity) APUs, the Hi-Fi A85S2 powered by the A85X chipset and the Hi-Fi A55S2 equipped with an A55 chip. Since they are part of the Hi-Fi Series, both models feature an integrated independent audio power design and built-in amplifier, as well as a noise-blocking multi-layer PCB layout, the goal being to deliver a higher quality sound.

Both boards have an ATX form factor and pack 100% X.D.C solid capacitors, two DDR3-1866 memory slots, one PCIe x16 and two PCIe x1 slots, three PCI slots, Gigabit Ethernet, 5.1-channel audio, plus D-Sub and DVI outputs. The A55S2 also includes six SATA 3.0 Gbps ports and four USB 2.0 connectors, while the A85S2 comes with eight SATA 6.0 Gbps ports, two USB 3.0 and two USB 2.0 plugs, and an HDMI output. No word yet on pricing.

Taiwan-based Biostar Microtech has this week released a new motherboard supporting AMD's FM1 APUs (A8, A6, A4 and E2 Series). Dubbed A55MLV, the board is powered by the AMD A55 chipset, has a micro ATX for factor, and features two DDR3-1866 memory slots, four SATA 3.0 Gbps ports, plus one PCI-Express x16 and one PCI slot.

The A55MLV also has 10/100 Ethernet, 5.1-channel audio, and a D-Sub output, and is selling for 40 Euro.

ASRock unveiled a new line of motherboards for socket FM2 AMD A-Series "Trinity" accelerated processors. Spread across three chipsets - AMD A55, AMD A75, and AMD A85X; and three form-factors - ATX, micro-ATX, and mini-ITX; ASRock's lineup includes a total of six models. Leading the pack is the FM2A85X Extreme6 (ATX, A85X), followed by the FM2A75 Pro4 (ATX, A75), FM2A75 Pro4-M (micro-ATX, A75), FM2A75M-DGS (micro-ATX, A75), FM2A55M-DGS (micro-ATX, A55), and FM2A75M-ITX (mini-ITX, A75).

The FM2A85X Extreme6 comes fully-loaded with a 10-phase CPU VRM, 3-way multi-GPU support (x16/NC/NC; x8/x8/NC; x8/x4/x4), DDR3-2600+ memory support, seven SATA 6 Gb/s + one eSATA 6 Gb/s ports, and a suite of ASRock XFast technologies. The board eyes a price tag around US $149. The only other ATX socket FM2 model in ASRock's lineup, the FM2A75 Pro4, features a simpler 6-phase CPU VRM, single PCI-Express 2.0 x16 (the other long slot being electrical x4), with just about all the features accommodated by the AMD A75 chipset. The FM2A75 Pro4-M is a slightly miniaturized version of this board, which retains most of its features, with fewer PCI-Express x1 and legacy PCI slots.

With the availability of AMD's new lineup of APUs MSI, the world leader in extreme performance mainboards and graphics cards, is pleased to announce the availability of a new lineup of Socket FM2 mainboards. Amongst the models available are the full-fledged FM2-A85X-G65 Gaming mainboard, compact MicroATX models and a brilliant miniITX model with Wi-Fi and Bluetooth.

Aiming to deliver the best gaming performance you will find the FM2-A85XA-G65 equipped with an amazing feature set to deliver an unprecedented gaming experience for the AMD platform. OC Genie II boosts the APUs CPU & GPU performance, Memory performance is enhanced with support for both AMP and XMP memory overclocking profiles. And MSI clock generator allows for much faster bus speeds which increases the performance of Dual Graphics and CrossFire even further! This is topped off with the first DigitALL PWM with Military Class III on a MSI mainboard.

According to an OCWorkbench report, AMD will officially launch its second generation A-series desktop APUs on the very first day of Q4 2012, October 1. The launch will include a contingent of socket FM2 motherboards from various manufacturers, based on AMD A55, A75, and A85X chipsets. Among the A-series socket FM2 models launched on October 1, are A10-5800K, A10-5700, A8-5600K, A8-5500, Athlon X4 750K/740, A6-5400K and A4-5300. Built on the 32 nm HKMG process by Globalfoundries, AMD A-series "Trinity" APUs combine up to four x86-64 CPU cores based on the "Piledriver" micro-architecture, with a Radeon HD 7000 series GPU core, with up to 384 stream processors based on the VLIW4 architecture.

To provide the best user experience on the AMD platform, ASUS has refreshed a variety of motherboards, including mainstream channel models, dedicated products from ROG and the TUF Series, plus FM1 socket-compatible and power-efficient APU-based models. Each product offers a variety of new ASUS exclusive technologies such as digital power control, Remote GO!, and Network iControl, alongside innovative Fast Boot, ASUS Boot Setting, and DirectKey, all specifically leveraging upcoming Windows 8 capabilities. Both new and existing features have been tailored and tested to comply with the Windows 8 architecture for total stability and maximized utility, while all motherboards have gone through a full series of compatibility assurance tests in getting ready for the move to Windows 8.

Apart from the premium A85XA-G65, and mini-ITX A85IA-E53, MSI has two other mainstream socket FM2 motherboards, the A85MA-E35, and A55M-P33 (F2).

The A85MA-E35, like its mini-ITX cousin, has a misleading name. It is actually based on the AMD A75 FCH chipset. The socket FM2 APU is powered by a simple 5-phase VRM, it is wired to just the two DDR3 DIMM slots, and a PCI-Express 2.0 x16 slot. Other slots include two PCI-Express 2.0 x1 and a legacy PCI. Display outputs include DVI, D-Sub, and HDMI. All six SATA 6 Gb/s ports from the FCH are wired out as internal ones, the board features a total of four USB 3.0 ports.

Among GIGABYTE's new motherboard extravaganza, are some of its first socket FM2 motherboards, which based on the new AMD A85 FCH chipset (higher price-points) and previous-generation A55 FCH (lower price-points) and support next-generation "Trinity" APUs. Among these are the high-end F2A85X-UP4 with Ultra Durable 5 construction, mainstream F2A55-DS3, and entry-level F2A55M-DS2 Ultra Durable 1 motherboards.

The F2A85X-UP4 is loaded with top-tier VRM components, including high-current ferrite core chokes, IR3550 PowIRstage driver-MOSFETs, which make up an 8-phase CPU VRM. The FM2 socket is wired to four DDR3 memory slots, with support for dual-channel DDR3-2400 MHz by overclocking; and two PCI-Express 2.0 x16 slots (x8/x8, when both are populated). Other expansion slots include three PCI-Express 2.0 x1, a PCI-Express 2.0 x16 (electrical x4), and a legacy PCI, all of which are wired to the A85 FCH.

Elitegroup Computer Systems (ECS) has announced the A85F2-A Deluxe, a new motherboard built around the AMD A85X chipset with support for the latest socket FM2 CPUs.

The A85F2-A Deluxe is one of the most powerful and reliable motherboards currently available. In the ATX format, this ECS motherboard features two 2nd generation PCIe x16 slots for graphics card upgrades and CrossFireX support, as well as three 2nd generation PCIe x1 and 2 PCI slots for other cards. Up to 64 GB of dual channel DDR3 memory can be installed in 4 sockets, with a maximum speed of 1866, or up to 2300 for overclockers. There are seven 6 Gb/s SATA sockets, with support for RAID 0, 1, 5, & 10.

Sapphire released the new Pure Platinum A55V motherboard to the market. The board offers a value socket FM1 platform based on AMD A55 FCH chipset, in the ATX form-factor. The motherboard supports AMD A4, A6, A8, and Athlon II "Llano" APU/CPUs in the FM1 package. This model is not exactly designed to be "no-frills", as it does pack an interesting mix of features that could help it grab a comfy price-point in the market.

The FM1 socket is powered by a 6-phase VRM, which uses a simple whine-free choke + DPAK MOSFET design, but throws in a heatsink to cool the MOSFETs. The socket is wired to four DDR3 DIMM slots, supporting up to 16 GB of dual-channel DDR3 memory, with speeds of over DDR3-1600 MHz with overclocking. The APU is also wired to a PCI-Express 2.0 x16 slot, and two PCI-Express 2.0 x1 slots. Apart from these, you get three legacy PCI slots, wired to the FCH.