Intel on their latest Microcode Revision Guidance Guide has apparently stopped development of mitigations for some of its processor families that still haven't been updated to combat the threat of Spectre. The odyssey for the return to form of security on Intel products has been a steep, and a slow one, as the company has struggled to deploy mitigations for speculative code execution on its processor families that run it. Updates for some families of products, however - such as Penryn, Wolfdale, Bloomfield and Yorkfield, among others - are apparently not going to get an update at all.

Intel's next high-end desktop (HEDT) platform, codenamed "Ivy Bridge-E," is slated for Q3-2013, according to the latest platform road-map slide sourced by VR-Zone. According to the leaked slide, launch of Ivy Bridge-E Core i7 processors follows that of Core "Haswell" socket LGA1150 processors (Q2-2013). What's more, the upcoming Ivy Bridge-E chips will be compatible with existing socket LGA2011 motherboards, based on Intel X79 Express chipset.

Intel's next-generation Ivy Bridge-E chips are up-scaled versions of today's Core "Ivy Bridge" chips, built on the same 22 nm process, with more processing cores, memory channels, cache, and PCI-Express 3.0 certified system interfaces. It remains to be seen if Intel launches a new chipset to go with the new processor, or retains the X79 chipset with a few minor updates in the form of steppings. The company retained its X58 Express chipset over the first two HEDT processor generations (45 nm Core i7 "Bloomfield" and 32 nm Core i7 "Westmere").

The much talked about 'value' addition to Intel's Core i7 series in the LGA-1366 package, the Core i7 930, has begun being listed on online stores. The quad-core upper-performance segment chip is listed on popular European retailer, Home of Hardware (HOH.de), for 254.82 €, around 25 € higher than the price of Core i7 920 (D0 stepping) on the same store. Company roadmaps suggest two things about the positioning of this SKU: 1. that it will displace the Core i7 920 from its price-point, and eventually replace it; and 2. that February 28 could be the date when this SKU becomes official to markets worldwide.

The Core i7 930 is based on Intel's 45 nm Bloomfield D0 core. The quad-core chip comes in LGA-1366 package, and operates at 2.80 GHz (133 MHz x 21), with a Turbo Boost speed of 3.06 GHz (133 MHz x 23). It has HyperThreading technology enabled, to provide the operating system with 8 logical CPUs to deal with. It has 256 KB of L2 cache per core, and 8 MB of shared L3 cache. The QuickPath Interconnect between the chip and the X58 chipset operates at 4.80 GT/s. It features a triple-channel on-die memory controller. Most existing LGA-1366 motherboards should support it, some requiring BIOS updates.

Intel is poised to release new performance and high-end processors across its various Core family brands, within Q1 2010 and later. OCWorkbench, citing sources in Japan, released tentative release dates and information of new Core family processors. Among a few known names such as the six-core Core i7 980X, there are a few new ones. Details and dates are as follows:

• Core i7 980X "Gulftown": six-core, LGA-1366, 3.33 GHz (turbo: 3.60 GHz), March 16
• Core i7 970 "Bloomfield": quad-core, LGA-1366, 3.33 GHz (turbo: 3.46 GHz), Q3, 2010
• Core i7 930 "Bloomfield": quad-core, LGA-1366, 2.80 GHz (turbo: 3.06 GHz), February 28
• Core i7 880 "Lynnfield": quad-core, LGA-1156, 3.06 GHz (turbo: 3.73 GHz), Q2, 2010
• Core i5 680 "Clarkdale": dual-core, LGA-1156, 3.60 GHz (turbo: 3.80 GHz), Mid-May
• Core i3 550 "Clarkdale": dual-core, LGA-1156, 3.20 GHz, Q2, 2010
• Pentium E6700 "Wolfdale-2M": dual-core, LGA-775, 3.43 GHz, Q2, 2010

Although the Core i7 960 is available in its OEM form, the company doesn't plan to retail it with its retail packaging.

After releasing a wave of socket LGA-1156 motherboards under the P7P55D series, ASUS is ready with its newest socket LGA-1366 offering, based on the Intel X58 Express chipset, supporting Core i7 "Bloomfield" processors. The P6X58D Premium first surfaced back in July, but hit development roadblocks due to industry-wide issues with the SATA 6 Gb/s controller it used, which now seem to have been ironed-out. It brings to the table support for new technologies such as USB 3.0, and SATA 6 Gb/s, along with making use of the company's Xtreme Phase motherboard component design. The two SATA 6 Gb/s ports are color-coded white, and placed next to the SATA 3 Gb/s ports color-coded blue, provided by the ICH10R southbridge. The white ports are driven by a Marvell SATA 6 Gb/s controller. The two USB 3.0 ports on the other hand, are color-coded blue, and are placed next to the PS/2 connectors on the rear-panel. They are driven by an NEC-made controller.

The LGA-1366 socket is powered by a 16-phase circuit. The six DDR3 memory slots support up to 24 GB of DDR3 memory across a triple-channel (192-bit) memory interface. Components, heatsinks, and slots on the board stick to the blue/white/black color-scheme. Heatsinks over the VRM, northbridge, and southbridge are connected by heatpipes. Expansion slots include three PCI-Express 2.0 x16 (electrically x16, x8, x8, or x16, x16, NC, depending on how they're populated), two PCI, and one PCI-Express x1. Connectivity includes two gigabit Ethernet interfaces, USB 3.0, FireWire, and a number of USB 2.0 ports. ASUS-exclusive features include Precision Tweaker 2 (that provides voltage control with a fine-resolution), Stepless Frequency Selection, and ASUS CPU Parameter Recall. The new motherboard should reach markets this November.

Intel recently detailed its strategy with the Core brand, and its various brand-modifiers (namely i3, i5, i7, and i9). The move to give some LGA-1156 processors the Core i7 modifier, based on the performance level they offer, particularly sparked off several debates about if the move actually benefits the consumers as much as it does to Intel. Back then, Intel did not divulge much about a number scheme that characterizes LGA-1156 Core i7 processors from their LGA-1366 counterparts. Fresh information suggests that Intel may have one such number-scheme in place that will demystify its lineup.

The LGA-1156 socket lineup will be spearheaded by quad-core desktop chips that will start selling from September 8, tentatively. These consist of a 2.66 GHz part, a 2.80 GHz part, and another 2.93 GHz one. Sources revealed much earlier that these could be priced US $194, $284, and $562, respectively. Among these three, the 2.66 GHz part lacks HyperThreading technology in its feature-set, and hence, will be placed in the Core i5 series. To further clarify the lineup, the following model numbers have been suggested:

While the bulk of Intel's upcoming Nehalem and Westmere derived products include quad-core processors, the company hasn't left out dual-core processors just as yet. The dual-core Core i5 desktop processor will be based on the new Clarkdale core, built on the 32 nm Westmere architecture. Originally slated for a Q1 2010 launch, the new chip seems to have been pulled into the Q4 2009 launch schedule, deep enough to make for a significant amount of projected sales, according to sources in the Taiwanese motherboard industry.

The sales projections for Q4 look particularly interesting. Core i5 "Clarkdale" dual-core is projected to amount for 10% of Intel's sales, while Core i7 "Bloomfield" at 1%, Core i5 "Lynnfield" at 2% (Core i7 "Lynnfield" is slated for Q1 2010), Core 2 Quad at 9%, Core 2 Duo E7000/E8000 at 35%, Pentium E5000/E6000 at 31%, Celeron E3000 and Atom together at 9%, Pentium E2000 and Celeron 400 together at 4%. In the following quarter, Clarkdale's sales share is expected to rise to 20%. The numbers prove just how large the market for dual-core processors is, even four years into the introduction of quad-core chips.

Last week, Intel sketched out its strategy in dealing with its client processor brand Core, and placing its different kinds of processors in series of markers (such as "i3", "i5", and "i7"), on the merit of performance and features they offer, and not necessarily a segregation based on core type and socket type. This raised a big debate in our forums, on who is really going to benefit from this kind of branding.

Chinese website INPAI.com.cn sourced information which explains what factors go into determining which brand marker a processor gets. The table elaborates on how different kinds of Intel processors (determined by core and socket types) cross different lines, with a few features toggled or enhanced. It is sure to throw up some surprises.

A notable inclusion of perhaps every processor-in-box product, apart from the processor, cooler and documentation, is the case-badge for the processor. The case-badge is a small sticker that shows the company logo for the processor installed in the PC. Intel is reportedly designing new logos (in effect case-badges) for at least 14 of its products. The logos, most of which are rounded-rectangle shaped seem to have been designed to give the processor box a new look, also indicating perhaps that the company is designing new packaging material as well, that use the new logos.

Intel has large volumes of Core 2 Duo, Core 2 Quad and Xeon processors in the making, that Intel feels need new clothing. Core 2 Duo and Core 2 Quad, get the distinct chrome-blue colour that one can find in the Core i7 (non-XE) logo. Core 2 and Core i7 logos look similar at the first glance. Core 2 Extreme gets the chrome-black colour the Core i7 XE logo has. All Centrino series badges stick to the silver-white colour scheme. The logo designs have small inlets on the top-right corner that have small portions of the die-shot. Core 2 and Centrino logos have die-shots of a portion of the Penryn core, while the Core i7 logos use those of the Bloomfield core. Interestingly, Xeon keeps its current logo, as well as a new one with chrome-slate colour, and design of the current Core i7 logo, perhaps making it clear the Xeon processor is based on the Nehalem architecture. The new logos will be effective from Q2 2009.

Earlier this month, news surfaced of Intel working on a new Extreme Edition (XE) Core i7 chip, model 975, that displaces the existing Core i7 965 XE from its existing price-point to grab the $999 in 1,000 unit tray quantities price-point. The 975 XE is to be accompanied by another new SKU in the making: the Core i7 950.

The new chip is bound to displace the Core i7 940 from its existing price point of $562. It features higher clock speed, bus multiplier value and is built on the newer D0 revision of the Bloomfield core. The chip will feature a clock speed of 3.06 GHz. It achieves this speed using a multiplier value of 23X. The new chip is expected to be introduced sometime in Q2, 2009.

Intel is planning on a newer flagship desktop CPU to lead the Core i7 Extreme Edition pack: the Core i7 975 Extreme Edition (XE). The model surfaced at an XtremeSystems forum thread where overclockers FUGGER and Mikeguava took a shot at the 3DMark05 world record of 45,474 3DMarks, set by AMD at its presentation of the Phenom II X4 processor running at speeds of around 6.30 GHz. The overclockers used a bench consisting of the new Core i7 975 XE, Gigabyte GA-EX58 Extreme motherboard, two Radeon HD 4870 X2 accelerators in a CrossFireX setup, powered by a PC Power & Cooling Silencer 750W PSU. The CPU was cooled by a custom-made copper cooling pot. At a clock speed of 5,239 MHz and the graphics cards running at reference speeds, the bench cracked the world record to reach 47,026.

During the course of this feat however, we get to know more about the Core i7 975 XE. The new premium offering by Intel comes with a clock speed of 3.33 GHz. It achieves this frequency using a bus multiplier of 25X. Intel built this chip on the new D0 revision of the Bloomfield core, on which the company also plans to release fresh batches of the Core i7 920. Apart from the unlocked bus multiplier and the broader QuickPath Interconnect bandwidth of 6.4 GT/s, other features remain standard: 4 processing cores supporting 8 threads with HyperThreading enabled, 256 KB of L2 cache per core, 8 MB of shared L3 cache, and a triple-channel DDR3 memory interface.

Intel will be releasing its newest processor: the Core i7, in the days to come. The first releases of the i7 are based on the Bloomfield core, which happens to be the poster-boy for the Intel Nehalem CPU architecture. The processor uses Intel's new LGA-1366 socket, it is a quad-core processor with HyperThreading enabled.

Expreview pictured the Core i7 (non Extreme) package, which reveals a largely standard pack that's seen on Intel's processors these days. Also pictured is Intel's stock cooler for the non-Extreme i7 processors, which largely resembles the stock-coolers of most Intel processors. It consists of a central block made of copper, which makes contact with the CPU. The thermal interface material is pre-applied to it. Aluminum fins project radially from the block, which fork into thinner fins, to increase surface-area. Also included in the package is the related documentation, warranty declaration and bezel sticker. The CPU pictured by Expreview is the i7 920, clocked at 2.66 GHz, with 8 MB L3 cache. The processor has a QuickPath Interconnect speed of 4800 MT/s.

NVIDIA Corporation today announced that the world's preeminent motherboard manufacturers, ASUS, EVGA, MSI, Gigabyte, and DFI, have all licensed NVIDIA SLI technology for their new lineup of motherboards designed to work with Intel Bloomfield CPUs and X58 chipsets. The addition of SLI to these motherboards and adoption by major OEMs including Dell and others means consumers will be able to harness the power of award-winning GeForce GPUs in single, SLI, or 3-way SLI configurations for the fastest visual computing experience on upcoming Intel Bloomfield platforms.

"Dell Gaming is known for industry-leading graphics and unparalleled performance," said Patrick Cooper, Director of Product Planning for Dell Gaming. "With the marriage of NVIDIA SLI and the latest generation of Intel chipsets, we will continue to offer hardcore gamers the opportunity to push their Alienware systems beyond the limits of today's hottest titles."

The tier-one partners of NVIDIA, namely EVGA, XFX and BFG, sell motherboards based on NVIDIA nForce chipsets, with motherboards designed by NVIDIA itself, with a few exceptions where EVGA improvised their designs. With NVIDIA licensing SLI to Intel, allowing their upcoming Bloomfield-supportive X58 chipset to support the SLI multi-GPU technology, and for $5 per supportive board, it took less than guess work to think NVIDIA's partners would start using Intel X58 chipsets to grab their share of Core i7 motherboard market as quickly as they can.

In a recent press release, NVIDIA counted EVGA in the partial list of motherboard vendors who are working on motherboards based on the X58 platform, and offer SLI support. In the same press release, Joe Darwin, Director of Technical Marketing at EVGA was quoted saying "By licensing NVIDIA SLI technology, the EVGA X58 motherboard will deliver the ultimate 2-way and 3-way SLI platform to, once again, meet the enthusiast's demand." So we beg to ask: Will NVIDIA actually work on a LGA-1366 chipset, or will the new found love with selling high performance chipsets for the mainstream, such as MCP7A, replace it? Only time will tell. In the mean time, and on a rather comic note, get ready for the first EVGA motherboard to support ATI Crossfire X.

As the computer enthusiast community gears up for Nehalem November, with reports suggesting a series of product launches for both Intel's Core i7 processors and compatible motherboards, Industry observer PC Online.cn have already published an in-depth review of the Core i7 940 2.93 GHz processor. The processor is based on the Bloomfield core, and essentially the Nehalem architecture that has been making news for over an year now. PC Online went right to the heart of the matter, evaluating the 192-bit wide (tri-channel) memory interface, and the advantage of HyperThreading on four physical cores. In the tests, the 2.93 GHz Bloomfield chip was pitted against a Core 2 Extreme QX9770 operating at both its reference speed of 3.20 GHz, and underclocked to 2.93 GHz, so a clock to clock comparison could be brought about.

The evaluation found that the performance increments tri-channel offers over dual-channel memory, in real world applications and games, are just about insignificant. Super Pi Mod 1.4 shows only a fractional lead for tri-channel over dual-channel, and the trend continued with Everest Memory Benchmark. On the brighter side, the integrated memory controller does offer improvements over the previous generation setup, with the northbridge handling memory. Even in games such as Call of Duty 4 and Crysis, tri-channel memory did not shine.

After flaunting the P6T Series motherboards, and the monstrous Rampage II Extreme, ASUS decided to expand its Bloomfield CPU-supportive motherboard lineup with its workstation-class offerings. ASUS is known for bringing in workstation boards on desktop platforms. They have had Intel 975P based workstation boards, just as they had nForce 590 SLI boards. These desktop-thru-worksation platforms are usually single CPU socket platforms, with certain workstation features, such as PCI-X interface, enterprise-grade storage controllers, among other features that make them durable and suitable for mission-critical environments. They don't sport enterprise chipsets, and hence carry batch-leading desktop chipsets.

With Nehalem and the new Socket 1366, ASUS did just that, with the inclusion of two single-socket workstation boards. These motherboards, at the outset support the upcoming Core i7 processors, and have the potential to support Xeon processors that use the same socket, or even the same core. There are two models lined-up: P6T6 WS Revolution and P6T6 WS Pro. The P6T6 WS Revolution is the flagship board. It features six full-length PCI-Express slots, which might have variable number of available PCI-Express lanes, depending on the number of PCI-E cards connected. It features a 16+2 phase CPU power circuit. The board features the Tylersburg X58 chipset, along with an ICH10 series southbridge. There is passive cooling for the VRM area, northbridge, and a large southbridge block, that could be possibly cooling a supplementary PCI-Express switch chip. Storage options include Serial-attached SCSI (SAS), SATA II and e-SATA ports.

Pictures of the mainstream Nehalem chips otherwise known as Lynnfield have emerged in the asian forum XFastest. Unlike the Bloomfield that has 1366 pins, Lynnfield has only 1160 pins and lacks the QPI link that the Bloomfield uses for triple channel DDR3. Instead Lynnfield uses DMI which only supports dual channel DDR3. Check out the link below for even more comparison images.

Nehalem does promise to be a processor to look out for, it would be Intel's next installment, post the successful Core 2 series processors. This time however, Intel made a core modification with the way the system handles memory. The Bloomfield processors house a massive 192-bit wide memory controller for supporting tri-channel DDR3 memory. It however was found that the controller could bring in limitations to the DIMM voltages that the system could support.

The retail version of ASUS P6T Deluxe OC Palm Edition motherboard was unboxed by XFastest. Being the retail product, as usually, it comes with precautionary labels attached to parts of the motherboard. The one that covers the 6 DDR3 DIMM slots reads:

According to Intel CPU SPEC, DIMMs with voltage setting over 1.65V may damage the CPU permanently. We recommend you to install DIMMs with voltage setting below 1.65V.

Intel would be rolling out an elite fleet of desktop processors based on the new Nehalem architecture soon. The first derivative, the Bloomfield core, is supposed to be the architecture's flagship for the desktop PC market. And for it, Core i7 Extreme 965 is supposed to be the leading processor. Priced at US $999, the processor is clocked at 3.20 GHz and features four cores and eight logical processors thanks to HyperThreading Technology (encore). Details of it are covered here.

Mobile01, unboxed the i7 965 before launch. The contents show a massive stock cooler and the processor itself. The stock cooler is composed of the same fins projecting radially, just that they are much thinner, and more in number (to boost surface area of dissipation). The cooler uses 50% of fins made of copper and the rest 50% made of aluminum. The large CPU contact base is made of copper and pre-applied TIM. The box pictured is the "white-box" part, expect the retail box to be of that exact size.

Later this year, Intel will launch three models of processors based on a newer socket, a newer architecture. The processors are based on the Nehalem-derived Bloomfield core, and require a compatible motherboard with the 1366-pin land grid array (LGA) socket. There are three models lined up, one in each category of extreme, performance and mainstream. They carry the Core i7 brand name and here are its model numbers:

• Core i7 Extreme 965 (PIB model: BX80601965)
• Core i7 940 (PIB model: BX80601940)
• Core i7 920 (PIB model: BX80601920)

The 965 is a Extreme series product that sits on the top of the pile, it should be the fastest desktop processor ever made. The 940 falls into the performance category, given its price. It is trailed by the 920 which seems to have the best price to clock speed, it falls into the mainstream category. A table explaining parameters in detail and model prices is provided.

Without doubt, Nehalem is what the computing world is raving about. Intel's next generation PC processors will arrive at stores sometime September thru October. Intel has put in a nice set of incentives to woo the enthusiast community, perhaps some of whom are sitting tight on US $3000 worth of CPUs in the form of dual QX9775 installations. Incentives include the Turbo Mode dynamic speed adjustment feature, projecting the processors as powerhouse chips that also have the potential for extreme computing or overclocking. NordicHardware captured such an installation which features a Core i7 Bloomfield processor seated on a ASUS P6T Deluxe motherboard with a liquid-nitrogen copper pot installed (a cooling device which consists of a copper cavity in contact with the CPU, in which liquid nitrogen is poured for rapid cooling). It's noted that the CPU temperatures plummeted to -120° C (or -184° F). It was noted that the Core i7 held on pretty well at those deep-space temperatures. There however, are no stability tests to back those observations as yet. Enjoy the pictures for now.For more pictures, visit this page.

With the entry of the Core i7 Bloomfield series processors this September thru October, the computing world will witness the entry of a new motherboard processor socket, the 1366-pin Land Grid Array (LGA-1366). FrostyTech demystified the new socket in respect to the way coolers are to be designed to be compatible with it, which will have implications on a vast segment of DIY consumers since LGA-1366 is meant to be a high-performance flagship computing platform. There are two key factors at play:

• The layout and cooler-retention mechanism of the socket
• The area of contact between the cooler and the processor's integrated heatspreader (IHS).

Intel is readying its first wave of processors based on the Nehalem-derived Bloomfield core which should hit shelves sometime this autumn. Meanwhile motherboard manufacturers seem to be in a rush to bring in supportive LGA 1366 motherboards based on the spanking-new Intel X58 chipset around that time. Intel had reportedly preponed launch of the Bloomfield processors till September. It was then known that motherboard manufacturers wouldn't be able to keep up and would take a little later (as in late October) to deck their shelves with supportive motherboards.

Bit-Tech interviewed Richard Liu of ASUS (read here). It can be read that ASUS would be out with not only Intel X58 based motherboards by the (new) launch date of these Intel processors, but also have NVIDIA SLI-supportive motherboards with BR-04 chips ready by that time.

According to the guys over at Expreview, Intel is naming its new Nehalem range of processors "Core i7".

There will be 3 Bloomfield to enter PC market later this year, and the 999USD top-of-the-line Bloomfield is the only Core i7 Extreme Edition processor current revealed.

All i7 processors and i7 Extreme Edition processor will be officially announced in Aug 11st, launch date set to Q4 this year.

Intel Prepones Nehalem Launch

Although the introduction of Intel Bloomfield, the next-generation processor from Intel was slated for November later this year, sources at motherboard companies report that Intel could prepone its launch to September along with the X58 system chipset platform. However it is known that motherboard vendors will not be in a position to bring LGA-1366 socket based motherboard into retail channels until early October. This might not cause internal-competition between Intel's products.