Wi-Fi CERTIFIED 7 is here, introducing powerful new features that boost Wi-Fi performance and improve connectivity across a variety of environments. Cutting-edge capabilities in Wi-Fi CERTIFIED 7 enable innovations that rely on high throughput, deterministic latency, and greater reliability for critical traffic. New use cases - including multi-user AR/VR/XR, immersive 3-D training, electronic gaming, hybrid work, industrial IoT, and automotive - will advance as a result of the latest Wi-Fi generation. Wi-Fi CERTIFIED 7 represents the culmination of extensive collaboration and innovation within Wi-Fi Alliance, facilitating worldwide product interoperability and a robust, sophisticated device ecosystem.

Wi-Fi 7 will see rapid adoption across a broad ecosystem with more than 233 million devices expected to enter the market in 2024, growing to 2.1 billion devices by 2028. Smartphones, PCs, tablets, and access points (APs) will be the earliest adopters of Wi-Fi 7, and customer premises equipment (CPE) and augmented and virtual reality (AR/VR) equipment will continue to gain early market traction. Wi-Fi CERTIFIED 7 pushes the boundaries of today's wireless connectivity, and Wi-Fi CERTIFIED helps ensure advanced features are deployed in a consistent way to deliver high-quality user experiences.

TrendForce reports that 3Q23 has been a historic quarter for the world's leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.

NVIDIA's revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.

Today at the "Advancing AI" event, AMD was joined by industry leaders including Microsoft, Meta, Oracle, Dell Technologies, HPE, Lenovo, Supermicro, Arista, Broadcom and Cisco to showcase how these companies are working with AMD to deliver advanced AI solutions spanning from cloud to enterprise and PCs. AMD launched multiple new products at the event, including the AMD Instinct MI300 Series data center AI accelerators, ROCm 6 open software stack with significant optimizations and new features supporting Large Language Models (LLMs) and Ryzen 8040 Series processors with Ryzen AI.

"AI is the future of computing and AMD is uniquely positioned to power the end-to-end infrastructure that will define this AI era, from massive cloud installations to enterprise clusters and AI-enabled intelligent embedded devices and PCs," said AMD Chair and CEO Dr. Lisa Su. "We are seeing very strong demand for our new Instinct MI300 GPUs, which are the highest-performance accelerators in the world for generative AI. We are also building significant momentum for our data center AI solutions with the largest cloud companies, the industry's top server providers, and the most innovative AI startups ꟷ who we are working closely with to rapidly bring Instinct MI300 solutions to market that will dramatically accelerate the pace of innovation across the entire AI ecosystem."

Artificial intelligence has been a hot topic this year, and everything is now an AI processor, from CPUs to GPUs, NPUs, and many others. However, it was only a matter of time before we saw an integration of AI processing elements into the networking chips. Today, Broadcom announced its new Ethernet switching silicon called Trident 5-X12. The Trident 5-X12 delivers 16 Tb/s of bandwidth, double that of the previous Trident generation while adding support for fast 800G ports for connection to Tomahawk 5 spine switch chips. The 5-X12 is software-upgradable and optimized for dense 1RU top-of-rack designs, enabling configurations with up to 48x200G downstream server ports and 8x800G upstream fabric ports. The 800G support is added using 100G-PAM4 SerDes, which enables up to 4 m DAC and linear optics.

However, this is not only a switch chip on its own. Broadcom has added AI processing elements in an inference engine called NetGNT (Networking General-purpose Neural-network Traffic-analyzer). It can detect common traffic patterns and optimize data movement across the chip. Specifically, the company has listed an example of the system doing AI/ML workloads. In that case, NetGNT performs intelligent traffic analysis to avoid network congestion in these workloads. For example, it can detect the so-called "incast" patterns in real-time, where many flows converge simultaneously on the same port. By recognizing the start of incast early, NetGNT can invoke hardware-based congestion control techniques to prevent performance degradation without added latency.

Broadcom is thrilled to announce Broadcom's successful acquisition of VMware, and the start of a new and exciting era for all of us at the company. VMware joins our engineering-first, innovation-centric team, which is another important step forward in building the world's leading infrastructure technology company.

While an important moment for Broadcom, it's also an exciting milestone for our customers around the world. And as I said when we first announced the acquisition, we can now come together and have the scale to help global enterprises address their complex IT infrastructure challenges by enabling private and hybrid cloud environments and helping them deploy an "apps anywhere" strategy. Our goal is to help customers optimize their private, hybrid and multi-cloud environments, allowing them to run applications and services anywhere.

Comcast and Broadcom today announced joint efforts to develop the world's first AI-powered access network with a new chipset that embeds artificial intelligence (AI) and machine learning (ML) within the nodes, amps and modems that comprise the last few miles of Comcast's network. With these new capabilities broadly deployed throughout the network, Comcast will be able to transform its operations by automating more network functions and deliver an improved customer experience through better and more actionable intelligence.

Additionally, the new chipset will be the first in the world to incorporate DOCSIS 4.0 Full Duplex (FDX), Extended Spectrum (ESD) and the ability to run both simultaneously, enabling Internet service providers across the globe to deliver DOCSIS 4.0 services using a toolkit with technology options to meet their business needs. DOCSIS 4.0 is the next-generation network technology that will introduce symmetrical multi-gigabit Internet speeds, lower latency, and even better security and reliability to hundreds of millions of people and businesses over their existing connections without the need for major construction of new network infrastructure.

ASUS, a global infrastructure solution provider, is excited to announce its participation in the 2023 OCP Global Summit, which is taking place from October 17-19, 2023, at the San Jose McEnery Convention Center. The prestigious annual event brings together industry leaders, innovators and decision-makers from around the world to explore and discuss the latest advancements in open infrastructure and cloud technologies, providing a perfect stage for ASUS to unveil its latest cutting-edge products.

The ASUS theme for the OCP Global Summit is Solutions beyond limits—ASUS empowers AI, cloud, telco and more. We will showcase an array of products:

It has been over four years since the release of the Raspberry Pi 4, and in that time a lot has changed in the maker board and single-board computer landscape. For the Raspberry Pi Foundation there were struggles with worldwide demand and production capacity brought on by the global pandemic starting in 2020, and plenty of new competitors came to the scene to offer ready to order alternatives to the venerable RPi 4. Today however the production woes have been assuaged and a new generation of Raspberry Pi is here; the Raspberry Pi 5.

Raspberry Pi 5 is being announced in advance of availability unlike every prior RPi device launch. Pre-orders are open with many of the listed Approved Resellers on RPi's website starting today but unit shipments aren't expected until near the end of October 2023. As part of this pre-order scheme, RPi Foundation is withholding pre-orders from bulk customers and will be dealing in single-unit sales for individuals until at least the end of the year, as well as running some promotions with The MagPi and HackSpace magazines to give priority access to their subscribers. Genuinely nice to see, considering how hard it was to obtain a Pi 4 for the average Joe over the last couple years. The two announced prices for the RPi 5 are $60 USD for the 4 GB variant, and $80 USD for the 8 GB variant; or about $5 USD more than current reseller pricing on comparable configurations of the Raspberry Pi 4.

Symantec, a division of Broadcom Inc., is partnering with Google Cloud to embed generative AI (gen AI) into the Symantec Security platform in a phased rollout that will give customers a significant technical edge for detecting, understanding, and remediating sophisticated cyber attacks.

Symantec is leveraging the Google Cloud Security AI Workbench and security-specific large language model (LLM)--Sec-PaLM 2-across its portfolio to enable natural language interfaces and generate more comprehensive and easy-to-understand threat analyses. With Security AI Workbench-powered summarization of complex incidents and alignment to MITRE ATT&CK context, security operations center (SOC) analysts of all levels can better understand threats and be able to respond faster. That, in turn, translates into greater security and higher SOC productivity.

The burgeoning AI market is significantly impacting TSMC's CoWoS (Chip on Wafer on Substrate) advanced packaging production capacity, causing it to overflow due to high demand from major companies like NVIDIA, AMD, and Amazon. To accommodate this, TSMC is in the process of expanding its production capacity by acquiring additional CoWoS machines from equipment manufacturers like Xinyun, Wanrun, Hongsu, Titanium, and Qunyi. These expansions are expected to be operational in the first half of the next year, leading to an increased monthly production capacity, potentially close to 30,000 pieces, enabling TSMC to cater to more AI-related orders. These endeavors to increase capacity are in response to the amplified demand for AI chips from their applications in various domains, including autonomous vehicles and smart factories.

Despite TSMC's active steps to enlarge its CoWoS advanced packaging production, the overwhelming client demand is driving the company to place additional orders with equipment suppliers. It has been indicated that NVIDIA is currently TSMC's largest CoWoS advanced packaging customer, accounting for 60% of its production capacity. Due to the surge in demand, companies like AMD, Amazon, and Broadcom are also placing urgent orders, leading to a substantial increase in TSMC's advanced process capacity utilization. The overall situation indicates a thriving scenario for equipment manufacturers with clear visibility of orders extending into the following year, even as they navigate the challenges of fulfilling the rapidly growing and immediate demand in the AI market.

Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to US $38.1 billion, marking a 12.5% quarterly increase. In this rising tide, NVIDIA seized the crown, officially dethroning Qualcomm as the world's premier IC design house, while the remainder of the leaderboard remained stable.

AI charges ahead, buoying IC design performance amid a seasonal stocking slump
NVIDIA is reaping the rewards of a global transformation. Bolstered by the global demand from CSPs, internet behemoths, and enterprises diving into generative AI and large language models, NVIDIA's data center revenue skyrocketed by a whopping 105%. A deluge of shipments, including the likes of their advanced Hopper and Ampere architecture HGX systems and the high-performing InfinBand, played a pivotal role. Beyond that, both gaming and professional visualization sectors thrived under the allure of fresh product launches. Clocking a Q2 revenue of US$11.33 billion (a 68.3% surge), NVIDIA has vaulted over both Qualcomm and Broadcom to seize the IC design throne.

Taiwan's Economic Daily reckons that a freshly formed partnership between TSMC, Broadcom, and NVIDIA will result in the development of cutting-edge silicon photonics. The likes of IBM, Intel and various academic institutes are already deep into their own research and development processes, but the alleged new alliance is said to focus on advancing AI computer hardware. The report cites a significant allocation of—roughly 200—TSMC staffers onto R&D involving the integration of silicon photonic technologies into high performance computing (HPC) solutions. They are very likely hoping that the usage of optical interconnects (on a silicon medium) will result in greater data transfer rates between and within microchips. Other benefits include longer transmission distances and a lower consumption of power.

TSMC vice president Yu Zhenhua has placed emphasis on innovation, in a similar fashion to his boss, within the development process (industry-wide): "If we can provide a good silicon photonics integrated system, we can solve the two key issues of energy efficiency and AI computing power. This will be a new one...Paradigm shift. We may be at the beginning of a new era." The firm is facing unprecedented demand from its clients—it hopes to further expand its advanced chip packaging capacity to address these issues by late 2024. A shift away from the limitations of "conventional electric" data transmissions could bring next generation AI compute GPUs onto the market by 2025.

Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today affirmed its expectation that its acquisition of VMware, Inc. (NYSE: VMW) will close on October 30, 2023, and provided an update on its progress with various regulatory agencies.

On August 21, 2023, Broadcom received final transaction approval from the United Kingdom's Competition and Markets Authority. This follows legal merger clearance in the European Union, as well as in Australia, Brazil, Canada, Israel, South Africa, and Taiwan, and foreign investment control clearance in all necessary jurisdictions. In the U.S., the Hart-Scott-Rodino pre-merger waiting periods have expired, and there is no legal impediment to closing under U.S. merger regulations.

Announced today, Ultra Ethernet Consortium (UEC) is bringing together leading companies for industry-wide cooperation to build a complete Ethernet-based communication stack architecture for high-performance networking. Artificial Intelligence (AI) and High-Performance Computing (HPC) workloads are rapidly evolving and require best-in-class functionality, performance, interoperability and total cost of ownership, without sacrificing developer and end-user friendliness. The Ultra Ethernet solution stack will capitalize on Ethernet's ubiquity and flexibility for handling a wide variety of workloads while being scalable and cost-effective.

Ultra Ethernet Consortium is founded by companies with long-standing history and experience in high-performance solutions. Each member is contributing significantly to the broader ecosystem of high-performance in an egalitarian manner. The founding members include AMD, Arista, Broadcom, Cisco, Eviden (an Atos Business), HPE, Intel, Meta and Microsoft, who collectively have decades of networking, AI, cloud and high-performance computing-at-scale deployments.

The European Commission has today announced that it has granted conditional approval—under EU Merger Regulation—for the $61 billion acquisition of VMware by Broadcom: "The approval is conditional upon full compliance with the commitments offered by Broadcom. Today's decision follows an in-depth investigation of the proposed acquisition. Broadcom is a hardware company that offers, among other products, Fibre Channel Host-Bus Adapters ('FC HBAs'), storage adapters and Network Interface Cards ('NICs'), which are hardware components that connect servers to storage or network. Broadcom has recently started expanding into software markets, mainly for security and mainframe applications. VMware is a software supplier offering mainly virtualization software that interoperates with a wide range of hardware, including FC HBAs, storage adapters and NICs.

A company spokesperson commented on the EU administration's conditional approval of the deal: "Broadcom provided the European Commission with a technology access remedy that preserves interoperability, a core principle that would not have changed as a result of this transaction...Broadcom did this to fully address the concerns expressed by the European Commission, and Broadcom welcomes the Commission's decision to accept this access remedy." The aforementioned "concerns" relate to the acquisition resulting in a possible restriction of "competition in the market for certain hardware components which interoperate with VMware's software." Broadcom is aiming to finalize their purchase of VMware by November 1, but they have to contend with forthcoming judgements from US and UK regulators prior to that date.

New research from Omdia reveals that the semiconductor market declined in revenue for a fifth straight quarter in the first quarter of 2023. This is the longest recorded period of decline since Omdia began tracking the market in 2002. Revenue in 1Q23 settled at $120.5B, down 9% from 4Q22. The semiconductor market is cyclical, and this prolonged decline follows the upsurge as the market grew to record revenues in each quarter between 4Q20 through 4Q21 following increased demand from the global pandemic.

The memory and MPU market are major areas of the semiconductor market that are contributing to the decline. The MPU market in 1Q23 was $13.1B, just 65% of its size in 1Q22 when it was $20B. The memory market fared worse, with 1Q23 coming in at $19.3B, just 44% of the market in 1Q22 when it was $43.6B. The combined MPU and memory markets declined 19% in 1Q23, dragging the market down to the 9% quarter-over-quarter (QoQ) decline.

If you own one of several recent ASUS router models, then you're being urged by ASUS to upgrade your firmware to the latest release as soon as possible, due to a few serious security flaws. The two most severe being CVE-2022-26376 and CVE-2018-1160, both of which are rated 9.8 on a scale of 10 in terms of severity. However, if you're running the third party Asuswrt-Merlin firmware, you're apparently safe, as the author of the third party firmware has already patched all the known security issues that ASUS has announced patches for.

The affected models are the GT6, GT-AXE16000, GT-AX11000 PRO, GT-AX6000, GT-AX11000, GS-AX5400, GS-AX3000, XT9, XT8, XT8 V2, RT-AX86U PRO, RT-AX86U, RT-AX86S, RT-AX82U, RT-AX58U, RT-AX3000, TUF-AX6000, and TUF-AX5400. That's 18 different models in total, all of which should be built around Broadcom hardware. It's unclear if more models are affected or not, but these are the ones ASUS has issued updates for. The security flaws in question could allow someone to take over an unpatched router and make it a part of a botnet or similar. ASUS has suggested turning off features like DDNS and VPN servers, as well as more obvious things like WAN access, port forwarding, port triggers and DMZ until the firmware has been updated on the affected models.

TrendForce reports that explosive growth in generative AI applications like chatbots has spurred significant expansion in AI server development in 2023. Major CSPs including Microsoft, Google, AWS, as well as Chinese enterprises like Baidu and ByteDance, have invested heavily in high-end AI servers to continuously train and optimize their AI models. This reliance on high-end AI servers necessitates the use of high-end AI chips, which in turn will not only drive up demand for HBM during 2023~2024, but is also expected to boost growth in advanced packaging capacity by 30~40% in 2024.

TrendForce highlights that to augment the computational efficiency of AI servers and enhance memory transmission bandwidth, leading AI chip makers such as Nvidia, AMD, and Intel have opted to incorporate HBM. Presently, Nvidia's A100 and H100 chips each boast up to 80 GB of HBM2e and HBM3. In its latest integrated CPU and GPU, the Grace Hopper Superchip, Nvidia expanded a single chip's HBM capacity by 20%, hitting a mark of 96 GB. AMD's MI300 also uses HBM3, with the MI300A capacity remaining at 128 GB like its predecessor, while the more advanced MI300X has ramped up to 192 GB, marking a 50% increase. Google is expected to broaden its partnership with Broadcom in late 2023 to produce the AISC AI accelerator chip TPU, which will also incorporate HBM memory, in order to extend AI infrastructure.

Broadcom Inc. today announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways, enterprise access points, and client devices. The new chips build on the ecosystem of products with Broadcom's first-generation Wi-Fi 7 chips while delivering additional functionality to a wider market.

The first chip, the BCM6765, is a highly-optimized residential access point chip that supports 320 MHz 2-stream Wi-Fi operation. This new platform system-on-chip (SoC) allows the productization of Wi-Fi 7 mass-market access points and smart repeater solutions which span the spectrum of cost, form factor, and performance. The second chip, the BCM47722, is an enterprise access point chip that also supports 320 MHz 2-stream operation along with dual IoT radios that support simultaneous operation for Bluetooth Low Energy (BLE), Zigbee, Thread, and Matter protocols. This SoC addresses the growing needs of Internet of things (IoT) applications in the enterprise Wi-Fi market. The third chip, the BCM4390, is a low-power Wi-Fi, Bluetooth, and 802.15.4 combo chip designed for use in mobile devices such as handsets and tablets. It supports 160 MHz 2-stream Wi-Fi operation, dual Bluetooth, and Zigbee, Thread, and Matter protocols to service a broad set of mobile markets.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

Today Apple announced a new multiyear, multibillion-dollar agreement with Broadcom, a leading U.S. technology and advanced manufacturing company. Through this collaboration, Broadcom will develop 5G radio frequency components - including FBAR filters - and cutting-edge wireless connectivity components. The FBAR filters will be designed and built in several key American manufacturing and technology hubs, including Fort Collins, Colorado, where Broadcom has a major facility.

"We're thrilled to make commitments that harness the ingenuity, creativity, and innovative spirit of American manufacturing," said Tim Cook, Apple's CEO. "All of Apple's products depend on technology engineered and built here in the United States, and we'll continue to deepen our investments in the U.S. economy because we have an unshakable belief in America's future."

The global economy has faced increased inflation risks and downstream inventory corrections in 2H22, which have affected IC design houses faster than wafer foundries, as they are far more sensitive and responsive to market reversals. TrendForce reports that adverse factors such as weak overall consumption, restrictions from China, and the slowdown of corporate IT spending and CSP demand have impacted the revenue performance of the world's top 10 IC design houses in 4Q22, leading to a QoQ decline of 9.2%, or approximately US$33.96 billion.

TrendForce predicts that the revenue of these top 10 companies keep declining—though with a slight convergence—into 1Q23, owing to ongoing inventory corrections across the entire supply chain as well as Q1 being the traditional off-season for consumer demand. Demand will continue to be weak despite new product launches and inventory replenishment in the supply chain.

Giga Computing, a subsidiary of GIGABTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced a new generation of GIGABYTE enterprise products that follow the Open Compute Project (OCP) Open Rack Version 3 (ORV3) standards. Supporting the latest CPU advancements on both x86 and ARM platforms, these new solutions have been designed for open, scalable, and efficient designs that are used in a wide range of deployments from small data centers to hyperscalers. The new generation of GIGABYTE enterprise products will begin with compute and storage nodes based on ORV3 standards, in addition to a new rack and multi-node tray. Some notable modifications to the new version of open rack standards include supporting greater power density that is up to 30kW/rack with a new single 48 V busbar and advanced cooling options such as direct liquid cooling (DLC). Data centers have greater options thanks to the expanding GIGABYTE server portfolio for next gen processor technology.

Evolving with modern demands, the new OCP standard reduces current draw and conduction losses. Power distribution in ORV1 relied on three 12 V busbars, but that design was superseded by ORV2 with a single 12 V busbar. However, as rack power density has the grabbed attention of data centers, a new single 48 V busbar solution has become the latest standard. Incorporating the 48 V busbar and greater rack compatibility and integration, the new GIGABYTE DO22-ST0 is a 42OU rack that has up to both 18OU and 20OU of usable rack space above and below the included 1U power shelf, which supports up to 15kW from a 5+1 power supply configuration, and three sets of switch trays.

Global market intelligence firm TrendForce reports that the revenue generation momentum of the global IC design industry slowed down in 3Q22. The main factors behind this development were the Russia-Ukraine military conflict, the recent COVID-19 lockdowns in China, the ongoing inflation, and clients undergoing inventory corrections. The total revenue of the global top 10 IC design houses came to US$37.38 billion for 3Q22, showing a QoQ decline of 5.3%. Qualcomm remained first place in the ranking of the global top 10 IC design houses by revenue for 3Q22. Broadcom returned to second place by overtaking NVIDIA and AMD, who slipped to third and fourth respectively due to weakening demand for PCs and cryptocurrency mining machines.

Regarding US-based IC design houses that were in the top 10 group for 3Q22, Qualcomm recorded a QoQ increase for the sales of smartphone SoCs and 5G modem chips. It also made gains in the automotive electronics market by expanding its collaborations with partners in the automotive industry. As a result, Qualcomm's 3Q22 revenue figures for mobile and automotive offerings reflected QoQ increases of 6.8% and 22.0% respectively. The revenue growth of these two major product categories offset the marginal decline in the revenue for RF front-end chips. Qualcomm's IC design revenue as a whole climbed up by 5.6% QoQ to US$9.90 billion for 3Q22. The company sat firmly at the top of the ranking.

ASUS today announced the availability of RT-AXE7800, a WiFi 6E router offering up to 7800 Mbps of bandwidth and robust network security. Geared up with the new 6 GHz band, it's designed to scale to the connectivity demands of those who need to deal with a large number of devices, such as hybrid workers and professional studios. WiFi 6E has up to seven additional high-speed 160 MHz channels, enabling multi-gigabit speeds with stable and consistent connections. It dramatically increases network capacity while reducing congestion, delivering higher performance for every WiFi 6E device.

ASUS RT-AXE7800, powered by a 1.7 GHz quad-core 64-bit Broadcom CPU, leverages the new 6 GHz band to deliver ultrafast data throughput for a seamless user experiences, especially for increasing needs of hybrid workers and small businesses. RT-AXE7800 is also fully compatible with ASUS AiMesh. Users can easily expand their wireless network with AiMesh-compatible routers and enjoy powerful, flexible and seamless whole-home WiFi.