Mobile tech tipster, Revegnus, has highlighted an interesting Samsung presentation slide—according to machine translation, the company's electronics division is already responding to an anticipated growth of "client-side large language model" service development. This market trend will demand improved Universal Flash Storage (UFS) interface speeds—Samsung engineers are currently engaged in: "developing a new product that uses UFS 4.0 technology, but increases the number of channels from the current 2 to 4." The upcoming "more advanced" UFS 4.0 storage chips could be beefy enough to be utilized alongside next-gen mobile processors in 2025. For example; ARM is gearing up "Blackhawk," the Cortex-X4's successor—industry watchdogs reckon that the semiconductor firm's new core is designed to deliver "great Large Language Model (LLM) performance" on future smartphones. Samsung's roadmap outlines another major R&D goal, but this prospect is far off from finalization—their chart reveals an anticipated 2027 rollout. The slide's body of text included a brief teaser: "at the same time, we are also actively participating in discussions on the UFS 5.0 standard."

Qualcomm Technologies, Inc. today announced the Snapdragon 8s Gen 3 Mobile Platform, delivering the most sought-after 8 series capabilities to more Android flagship smartphones, for extraordinary, premium experiences. Marquee features of the latest premium-tier platforms include support for powerful on-device generative AI features, an always-sensing ISP, hyper-realistic mobile gaming, breakthrough connectivity and lossless high-definition sound. The platform supports a broad array of AI models including popular large language models (LLM) such as Baichuan-7B, Llama 2, Gemini Nano and Zhipu ChatGLM.

"With capabilities including on-device generative AI and advanced photography features, Snapdragon 8s Gen 3 is designed to enhance user experiences, fostering creativity and productivity in their daily lives." said Chris Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "We're elated to introduce the latest addition to our premium Snapdragon 8-series, our most premium mobile offering, bringing a host of exceptional specially selected capabilities to more consumers."

Qualcomm's Weibo social media account has teased an upcoming new product launch: "the spring dragon raises its head, and everything is reborn! The new Snapdragon flagship is about to be released. Let's welcome the New Year and the new era. On March 18, please stay tuned for the Snapdragon flagship new product launch conference." News outlets believe that a variant of the current top-of-the-line Snapdragon 8 Gen 3 (SM8650-AB) chipset will be introduced next week. Smartphone tech tipster, Digital Chat Station, revealed that a mysterious Qualcomm Snapdragon "SM8635" model was in the pipeline. Early February speculation pointed to a possible "Snapdragon 8s Gen 3" moniker—the added "s" implies that this mobile processor could emerge as a cheaper "sub-flagship" model.

Geekbench 6.2.2 results—posted by a trio of Realme "RMX3851" android smartphones—revealed speculated "8s Gen 3" specifications, including a 3.01 GHz "Big" Core clock, an Adreno 735 integrated GPU, and a 1+3+4 cluster configuration. The pre-release samples could not keep up with finalized Snapdragon 8 Gen 3 hardware in performance gauntlets. A mid-range "Snapdragon 7+ Gen 3" SoC could make an appearance on March 18, but tipsters believe that the event will be dedicated to a single new product. Digital Chat Station reckons that Qualcomm will market the Snapdragon 8s Gen 3 "as a Little 8G3."

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS 3.1 controller to broaden its portfolio of controllers now supporting UFS 4.0 to UFS 2.2 standards. Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

The new SM2756 UFS 4.0 controller solution is the world's most advanced controller, built on leading 6 nm EUV technology and using MIPI M-PHY low-power architecture, providing the right balance of high performance and power efficiency to enable the all day computing needs of today's premium and AI mobile devices. The SM2756 achieves sequential read performance exceeding 4,300 MB/s and sequential write speeds of over 4,000 MB/s and supports the broadest range of 3D TLC and QLC NAND flash with densities of up to 2 TB.

In a world where challenges meet innovation, 8849, a leading innovator in mobile technology, is thrilled to announce the launch of its latest innovation, the TANK 3 Pro, designed to revolutionize the way you experience technology. With a perfect blend of cutting-edge features, unparalleled performance, and futuristic design, the TANK 3 Pro is set to redefine the standards of excellence in the tech industry.

Ultimate Projection Experience
Elevate user's viewing experience with TANK 3 Pro's 120 Hz, 100 lumens DLP Laser Projector, delivering unparalleled clarity and immersive visuals. Whether it's for work presentations or entertainment, take user's projections to the next level with exceptional precision and brightness.

Qualcomm Technologies, Inc. unveiled its latest advancements in artificial intelligence (AI) at Mobile World Congress (MWC) Barcelona. From the new Qualcomm AI Hub, to cutting-edge research breakthroughs and a display of commercial AI-enabled devices, Qualcomm Technologies is empowering developers and revolutionizing user experiences across a wide range of devices powered by Snapdragon and Qualcomm platforms.

"With Snapdragon 8 Gen 3 for smartphones and Snapdragon X Elite for PCs, we sparked commercialization of on-device AI at scale. Now with the Qualcomm AI Hub, we will empower developers to fully harness the potential of these cutting-edge technologies and create captivating AI-enabled apps," said Durga Malladi, senior vice president and general manager, technology planning and edge solutions, Qualcomm Technologies, Inc. "The Qualcomm AI Hub provides developers with a comprehensive AI model library to quickly and easily integrate pre-optimized AI models into their applications, leading to faster, more reliable and private user experiences."

A mysterious Qualcomm Snapdragon "SM8635" model emerged earlier this month—courtesy of ever reliable smartphone tech tipster Digital Chat Station. They claimed that the unnamed mobile chipset had posted an AnTuTu score of roughly 1.7 million, with specifications including one Cortex-X4 core clocked at 2.9 GHz and an integrated Adreno 735 GPU. TSMC's 4 nm process node was also mentioned—not a particularly big revelation since the latest Snapdragon flagship is a 4 nm part. Early guess work pointed to possible Snapdragon 8s Gen 2 or Snapdragon 8 Gen 3 Lite guises, but a Geekbench Browser leak indicates that SM8635 is destined to become "Snapdragon 8s Gen 3," in Digital Chat Station's opinion.

A Realme "RMX3851" android device was tested in Geekbench 6.2.2—stated specifications include a 3.01 GHz "Big" Core clock, Adreno 735 GPU, and a 1+3+4 cluster configuration. Many believe that the SM8635 is positioned as a cut-down alternative to Snapdragon 8 Gen 3 (SM8650-AB), given that Realme specializes in producing value-oriented "near flagship" specced smartphones. Wccftech has spent hands-on time with various Qualcomm Snapdragon 8 Gen 3-powered devices: "You can see in (Realme's Geekbench entry) that the alleged Snapdragon 8s Gen 3 does not perform on the same level as its elder brother, which scores higher in both single and multi-core. For the sake of reference, I have seen the elder sibling going as high as 2,329 in single-core tests and 7,501 in multi-core tests. So, this chipset is performing at half the speed, but of course, this seems like a device that is not completely ready, so the final scores might improve." Further (insider) leaks or an official Qualcomm announcement will confirm whether the posited "Snapdragon 8s Gen 3" moniker is a good guess, although another leaked chip suggests another path. Roland Quandt reckons that a similarly configured "SM7675" SoC will be joining the Snapdragon 7 Gen family.

Qualcomm and its smartphone manufacturer partners are reported to be in a rush to get the Snapdragon 8 Gen 4 chipset released later this year—Digital Chat Station believes that a pioneering mobile device could enter a mass production phase around September of this year. Prototype devices are allegedly up and running—the tipster's insider sources have alluded to engineering samples being capable of reaching 4.0 GHz clocks on a high-powered Big Core (Nuvia's Oryon or Phoenix). Qualcomm's Snapdragon 8 Gen 3 SoC was revealed last October, and working hardware is slowly trickling out via retail avenues in early 2024—Digital Chat Station does not provide any reasoning behind the race to get the successor across the finish line within the same year.

An unnamed smartphone manufacturer is said to have outfitted a "dual-curved screen" model with a Snapdragon 8 Gen 4 chipset—Wccftech's report suggests that Xiaomi usually gets first dibs on cutting edge Qualcomm processor tech. The Nuvia engineering team has likely got their custom Oryon cores running to more than satisfactory levels—the article points out that: "a previous Geekbench 6 single-core and multi-core leak revealed that the (3 nm) Snapdragon 8 Gen 4 competes with Apple's M3 and is 46 percent faster than the Snapdragon 8 Gen 3 in multi-threaded workloads." Qualcomm is facing fierce flagship chip competition in 2024—MediaTek's Dimensity 9400 SoC could arrive at a cheaper price point, while offering comparable performance and efficiency.

Digital Chat Station has seemingly received insider information regarding the performance of Qualcomm's Snapdragon 8 Gen 4 mobile chipset—their source reports that a probable engineering sample is already exceeding its predecessor's Big core (Cortex-X4) maximum limit of 3.3 GHz. The rumor mill has Nuvia's custom Oryon cores linked to the next generation mobile processor, although some experts think that the Phoenix design was selected for Gen 4. Qualcomm's Snapdragon X Elite notebook SoC was unveiled last October—this ARM-based solution is set to deliver "a dramatic leap in innovation for computing" thanks to Nuvia's custom Oryon technology. Kedar Kondap, Senior Vice President & General Manager of Compute & Gaming stated that the Snapdragon X Elite offers: "super-charged performance that will delight consumers with incredible power efficiency and take their creativity and productivity to the next level."

Digital Chat Station's brief assessment of the prototype Snapdragon 8 Gen 4's Big core prowess is also glowing: "4.0 GHz is no longer a dream" on smartphones. Past reports have Qualcomm signed up with TSMC for an unspecified 3 nm production process—next generation silicon will benefit greatly in terms of power efficiency, with custom Oryon or Phoenix cores (allegedly) achieving greater clock speeds thanks to some extra headroom. As mentioned above, the previous-gen Kryo Prime core—using TSMC's advanced 4 nm node—is factory restricted to 3.3 GHz. Tipsters reckon that efficiency cores are not part of the Snapdragon 8 Gen 4 design, due to the innate benefits of 3 nm—according to Digital Chat Station, MediaTek is taking similar steps with its upcoming Dimensity 9400 SoC.

MediaTek revealed its (now current generation) flagship Dimensity 9300 flagship mobile processor last November, but we are already hearing about its successor's foundation. Digital Chat Station published some early insights on their Weibo micro-blog—the tipster appears to have an inside track at MediaTek's system-on-chip R&D department. The imaginatively named "Dimensity 9400" chipset is reportedly earmarked for mass production chez TSMC, with the foundry's second generation 3 Nm process being the favored node—this information aligns with official announcements as well as industry rumors from last autumn. MediaTek's Dimensity 9300 sports a "one-of-a-kind All Big Core design," with no provision for puny efficiency units—built on TSMC's third generation 4 nm process with four ARM Cortex-X4 cores (going up to 3.25 GHz) and four Cortex-A720 cores (maximum 2.0 GHz).

Digital Chat Station reckons that the 9300's All Big Core configuration will carryover to its next generation sibling, albeit with some major upgrades. MediaTek hardware engineers are alleged to have selected ARM's latest and greatest CPU and Mali GPU designs—the Cortex-X5 core could be a prime candidate in the first category. The rumor mill has the next batch of flagship Exynos SoCs utilizing ARM's fifth generation design. Digital Chat Station proposes that more smartphone manufacturers could adopt a top-flight Dimensity 2024 chip, if its performance can match the closest rivals. Industry experts posit both MediaTek and Qualcomm choosing TSMC's N3E process for their upcoming flagship chipsets—this node apparently "offers improved cost-effectiveness and superior yields" when compared to the first generation N3B process (as ordered by Apple for its latest M and B-series SoCs). Dimensity 9400 is expected to take on Snapdragon 8 Gen 4—this could be a tough fight, given that Qualcomm's offering is set to debut with custom Oryon cores.

Worldwide semiconductor revenue in 2023 totaled $533 billion, a decrease of 11.1% from 2022, according to preliminary results by Gartner, Inc.

"While the cyclicality in the semiconductor industry was present again in 2023, the market suffered a difficult year with memory revenue recording one of its worst declines in history," said Alan Priestley, VP Analyst at Gartner. "The underperforming market also negatively impacted several semiconductor vendors. Only 9 of the top 25 semiconductor vendors posted revenue growth in 2023, with 10 experiencing double-digit declines."

The combined semiconductor revenue of the top 25 semiconductor vendors declined 14.1% in 2023, accounting for 74.4% of the market, down from 77.2% in 2022.

Apple has been experimenting with Large Language Models (LLMs) that power most of today's AI applications. The company wants these LLMs to serve the users best and deliver them efficiently, which is a difficult task as they require a lot of resources, including compute and memory. Traditionally, LLMs have required AI accelerators in combination with large DRAM capacity to store model weights. However, Apple has published a paper that aims to bring LLMs to devices with limited memory capacity. By storing LLMs on NAND flash memory (regular storage), the method involves constructing an inference cost model that harmonizes with the flash memory behavior, guiding optimization in two critical areas: reducing the volume of data transferred from flash and reading data in larger, more contiguous chunks. Instead of storing the model weights on DRAM, Apple wants to utilize flash memory to store weights and only pull them on-demand to DRAM once it is needed.

Two principal techniques are introduced within this flash memory-informed framework: "windowing" and "row-column bundling." These methods collectively enable running models up to twice the size of the available DRAM, with a 4-5x and 20-25x increase in inference speed compared to native loading approaches on CPU and GPU, respectively. Integrating sparsity awareness, context-adaptive loading, and a hardware-oriented design pave the way for practical inference of LLMs on devices with limited memory, such as SoCs with 8/16/32 GB of available DRAM. Especially with DRAM prices outweighing NAND Flash, setups such as smartphone configurations could easily store and inference LLMs with multi-billion parameters, even if the DRAM available isn't sufficient. For a more technical deep dive, read the paper on arXiv here.

TrendForce predicts a significant rise in mobile DRAM and NAND Flash (eMMC/UFS) prices for the first quarter of 2024, with an expected seasonal increase of 18-23%. This surge could be further amplified in a market dominated by a few major players or if brand clients resort to panic buying under pressure.

Observations for 1Q24 indicate steady production planning by Chinese smartphone OEMs. A clear rise in memory prices is driving buyers to actively increase their purchasing efforts as they aim to establish secure and competitively priced inventory levels.

International Data Corporation (IDC) has upgraded its Semiconductor Market Outlook by calling a bottom and return to growth that accelerates next year. IDC raised its September 2023 revenue outlook from $518.8 billion to $526.5 billion in a new forecast. Revenue expectations for 2024 were also raised from $625.9 billion to $632.8 billion as IDC believes the U.S. market will remain resilient from a demand standpoint and China will begin recovering by the second half of 2024 (2H24).

IDC sees better semiconductor growth visibility as the long inventory correction subsides in two of the largest market segments: PCs and smartphones. Automotive and Industrials elevated inventory levels are expected to return to normal levels in 2H24 as electrification continues to drive semiconductor content over the next decade. Technology and large flagship product introductions will drive more semiconductor content and value across market segments in 2024 through 2026, including the introduction of AI PCs and AI Smartphones next year and a much-needed improvement in memory ASPs and DRAM bit volume.

At Snapdragon Summit, Qualcomm Technologies, Inc. today announced its latest premium mobile platform, the Snapdragon 8 Gen 3—a true titan of on-device intelligence, premium-tier performance, and power efficiency. As the premium Android smartphone SoC leader, Qualcomm Technologies' latest processor will be adopted for flagship devices by global OEMs and smartphone brands including ASUS, Honor, iQOO, MEIZU, NIO, Nubia, OnePlus, OPPO, realme, Redmi, RedMagic, Sony, vivo, Xiaomi, and ZTE.

"Snapdragon 8 Gen 3 infuses high-performance AI across the entire system to deliver premium-level performance and extraordinary experiences to consumers. This platform unlocks a new era of generative AI enabling users to generate unique content, help with productivity, and other breakthrough use cases." said Chris Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "Each year, we set out to design leading features and technologies that will power our latest Snapdragon 8-series mobile platform and the next generation of flagship Android devices. The Snapdragon 8 Gen 3 delivers."

Pixelworks, Inc., a leading provider of innovative visual processing solutions, today announced the official launch of its new IRX gaming experience brand. As a brand targeted at smartphone users, IRX is grounded on Pixelworks' mobile visual processing solutions and coupled with in-depth game tuning services. This combination leverages Pixelworks' expertise to achieve ultra-smooth gaming experience and the highest picture quality for different types of games on mobile devices. In addition, it exercises effective control of power consumption, latency and other performance variables to ensure stable and long-lasting gaming with optimal visual performance, providing end users with unparalleled mobile gaming experiences.

The IRX gaming experience is enabled by a portfolio of technology advantages and product application experiences based on the Company's innovative distributed rendering architecture. More specifically, Pixelworks' ultra-low latency MotionEngine technology, low power super-resolution technology, AI Always-on HDR and other technologies bring optimized rendering capabilities to smartphones that exceed what can be achieved by a traditional chipset. Together with Pixelworks' profound tuning experience for different games on various mobile devices the result is a meaningfully enriched visual experience for smartphone users, which is the core foundation for the IRX gaming experience.

Qualcomm Technologies, Inc. has announced the new Snapdragon 4 Gen 2 Mobile Platform, which has been creatively engineered to make incredible mobile experiences accessible to more consumers globally. Snapdragon 4 Gen 2 provides effortless, all-day use with fast CPU speeds, sharp photography and videography, plus speedy 5G and Wi-Fi for reliable connections.

"Snapdragon - at its core - is driving innovation while meeting the demands of OEMs and the broader industry," said Matthew Lopatka, director of product management, Qualcomm Technologies, Inc. "With this generational advancement in the Snapdragon 4-series, consumers will have greater access to the most popular and relevant mobile features and capabilities. We optimized every aspect of the platform in order to maximize the experiences for users."

The European Parliament has greenlit new rules relating to battery technologies that are likely to cause headaches for smartphone manufacturers (in particular). The organization published their summary of this environmentally conscious and sustainable strategy on June 14: "Parliament approved new rules for the design (on Wednesday), production and waste management of all types of batteries (including non-replaceable types) sold in the EU. With 587 votes in favor, nine against and 20 abstentions, MEPs endorsed a deal reached with the Council to overhaul EU rules on batteries and waste batteries. The new law takes into account technological developments and future challenges in the sector and will cover the entire battery life cycle, from design to end-of-life."

The section for portable device batteries (for smartphones, tablets and cameras) outlines new consumer rights, with a demand for easily removable and replaceable (DIY) cells. Smartphone manufacturers including market leaders Apple and Samsung will have to go back to the drawing board and figure out ways to reformat how their batteries are mounted and connected internally. Plenty of devices have their units sealed behind protective layers, requiring specialist tools and varying levels of user expertise to access and remove in a safe manner. The European Council has more work to do following their starter announcement: "(We) will now have to formally endorse the text before its publication in the EU Official Journal shortly after and its entry into force." News outlets have interpreted that these provisional rulings will go into effect by early 2027, but they also anticipate that big time players could appeal for extensions beyond that window.

Mobile devices touch every aspect of our digital lives. In the palm of your hand is the ability to both create and consume increasingly immersive, AI-accelerated experiences that continue to drive the need for more compute. Arm is at the heart of many of these, bringing unlimited delight, productivity and success to more people than ever. Every year we build foundational platforms designed to meet these increasing compute demands, with a relentless focus on high performance and efficiency. Working closely with our broader ecosystem, we're delivering the performance, efficiency and intelligence needed on every generation of consumer device to expand our digital lifestyles.

Today we are announcing Arm Total Compute Solutions 2023 (TCS23), which will be the platform for mobile computing, offering our best ever premium solution for smartphones. TCS23 delivers a complete package of the latest IP designed and optimized for specific workloads to work seamlessly together as a complete system. This includes a new world-class Arm Immortalis GPU based on our brand-new 5th Generation GPU architecture for ultimate visual experiences, a new cluster of Armv9 CPUs that continue our performance leadership for next-gen artificial intelligence (AI), and new enhancements to deliver more accessible software for the millions of Arm developers.

There are strong indications that Oppo is winding down its operations in France according to a report published by Frandroid last weekend, which goes against the company's denial that it was exiting several markets across the European Union, including France. Frandroid's investigative piece states that French retail workers had provided enough evidence, back in late March, for the publication to make the claim that Oppo was withdrawing from that region. The news outlet has gathered more insider information since then and now claims that a promotions company - Atmospheres - has not been contracted to help market Oppo's lastest smartphone models, including the Find N2 Flip. The agreement between the two firms was already set to end on June 30, but the promo team was expecting a renewal or extension - their boss finally admitted that it was all over and done with.

Frandroid has observed that Oppo is not updating its display material at big box stores, in particular Fnac Darty, and a salesperson confirmed that that they were only obligated to clear existing smartphone stock and related accessories. A former Oppo regional sales manager told the publication about a cessation of product training - under normal circumstances the team gets briefed about the latest products in advance, but the insider confides (under an alias): "We understood that they were leaving...We see the Find X coming out in China, oh no, it's not coming out in France. We see the new Reno phones arriving, will they be released in France? Neither. When the Find N2 Flip arrives, we are told of a store release, and then finally no, it is only available on the web store."

MediaTek has been unveiling some new mobile chipsets this week, but keen-eyed news outlets have noticed that the Taiwanese fabless semiconductor company is simply renaming and relaunching hardware from last year, with some tweaks here and there. Today's announcement of the Dimensity 8050 SoC was almost immediately questioned - GSMArena noticed that this "new" model was a near dead ringer, in terms of specifications, for last year's mid-range Dimensity 1300 and 1200 smartphone chipsets. There are some upgrades in terms of memory bandwidth, and MediaTek boasts that the 8050 has been updated with its sixth generation HyperEngine technology.

Alarm bells were ringing when folks realized that the much older Dimensity 8000 SoC was built on a 5 nm process - the supposedly superior (in terms of model number hierarchy) 8005 is a 6 nm chip. Last week the mobile specialist site also spotted that MediaTek's Dimensity 7050 chipset was yet another example of the smartphone tech company rolling out a "rebranding phase." The news outlet pointed out that this newly revealed mobile CPU was just a renamed Dimensity 1080 - with the original model having hit the market in November 2022. MediaTek seems to renaming several older chipsets based on TSMC's 6 nm process - it is possible that this effort is part of a company drive to clear surplus silicon.

TrendForce's latest research indicates that, as production cuts to DRAM and NAND Flash have not kept pace with weakening demand, the ASP of some products is expected to decline further in 2Q23. DRAM prices are projected to fall 13~18%; NAND Flash is expected to fall between 8~13%.

TrendForce reports that the significant drop in DRAM prices was mostly attributed to high inventory levels of DDR4 and LPDDR5 as PC DRAM, server DRAM, and mobile DRAM collectively account for over 85% of DRAM consumption. Meanwhile, the market share for DDR5 remains relatively low.

Samsung's unannounced Exynos 2400 mobile chipset has been linked to the upcoming Galaxy S24 smartphone family, but internet tipsters have speculated that the in-house SoC will be reserved for the baseline model only. The more expensive Plus and Ultra variants could be the main targets for flagship smartphone fetishists - it is possible that Qualcomm's upper echelon Snapdragon 8 Gen 3 chipset is set to feature within these premium devices. Samsung's Exynos processors are not considered to be fan favorites, but industry insiders reckon that the latest performance figures indicate that Samsung's up-and-comer has the potential to turn some heads. Exact specifications for the Exynos 2400 are not public knowledge - one of the tipsters suggests that a 10-core layout has been settled on by Samsung, as well as a recent bump up in GPU core count - from 6 to 12. The company's own 4 nm SF4P process is the apparent choice set for production line.

A leaker has posted benchmark scores generated by an unknown device that was running an Exynos 2400 SoC - the Geekbench 5 results indicate an average single-core score of 1530 with a peak of 1711. The multi-core average score is shown to be 6210, and the highest number achieved is 6967. Therefore the Exynos 2400 is 31% percent faster (in multi-core performance) than the refreshed Snapdragon 8 Gen 2 variant currently found in Galaxy S23 Ultra smartphones, but the divide between the two in terms of single-core performance is not so great. The 2400 manages to outpace (by 30%) Apple's present generation Bionic A16's average multi-core score, although the latter beats the presumed engineering sample's single-core result by 20%. The Exynos 2400 will face a new lineup of rival mobile processors in 2024 - namely Apple's next generation Bionic A17 and Qualcomm's Snapdragon 8 Gen 3, so it is difficult to extrapolate today's leaked figures into a future scenario.

A technology tipster has been dropping multiple tidbits this week about Qualcomm's upcoming Snapdragon 8 Gen 3 mobile chipset - this follows a leak (from a different source, going back to mid-April) about the next generation Adreno 750 GPU getting tuned up for a battle against Apple's Bionic A17 in terms of graphics benchmarks. The latest leak points to the GPU being clocked at 900 MHz, rather than the rumored higher figure of 1.0 GHz speed (garnered from tests at Qualcomm's labs). The focus has now turned to the next generation flagship Snapdragon's CPU aspect, with information emerging about core clock speeds and multiple cluster configurations.

Revegnus suggests that the Snapdragon 8 Gen 3 (SD8G3) chipset will be packing a large primary core in the shape of Arm's Cortex-X4 CPU with a reported maximum clock speed of 3.40 GHz. Leaks from the past have posited that the SD8G3 would feature a fairly standard 1x Large + 5x Big + 2x Small CPU core layout (with clocks predicted to be: large Cortex X4 at 3.2 GHz, big Cortex-A720 at 3.0 GHz, and small Cortex-A520 at 2.0 GHz). An insider source has provided Revegnus with additional information about two different CPU core configurations - 1+5+2 and 2+4+2 - it is theorized that smartphone manufacturers will be offered the latter layout as an exclusive option for special edition flagship phones. The more powerful 2+4+2 variant is said to sacrifice a big core (A720) in favor of a dual Cortex X4 headliner, although the resultant thermal output of twin large cores could prove to be problematic.

Early details of MediaTek's next generation mobile chipset have emerged this week, courtesy of renowned leaker Digital Chat Station via their blog on Weibo. The successor to MediaTek's current flagship Dimensity 9200 mobile chipset will likely be called "Dimensity 9300" - a very imaginative bump up in numbering - with smartphone brand Vivo involved as a collaborator. The tipster thinks that the fabless semiconductor company has contracted with TSMC for fabrication of the Dimensity 9300 chipset - and the foundry's N4P process has been selected by MediaTek, which could provide a bump in generational performance when compared to the older 4 nm and 5 nm standards used for past Dimensity SoC ranges. It should be noted that the current generation Dimensity 9200 chipset is presently manufactured via TSMC's N4P process.

MediaTek is seeking to turnaround its fortunes in the area of flagship mobile chipsets - industry watchdogs have cited a limited uptake of the Taiwanese company's Dimensity 9200 SoC as a motivating factor in the creation of a very powerful successor. Digital Chat Station suggests that the upcoming 9300 model will pack enough of a hardware punch to rival Qualcomm's forthcoming Snapdragon 8 Gen 3 SoC - both chipsets are touted to release within the same time period of late 2023. According to previous speculation, Qualcomm has also contracted with TSMC's factory to pump out the Snapdragon 8 Gen 3 via the N4P (4 nm) process.