News Posts matching "20 nm"

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AMD to Give 20 nm Optical Shrinks to Console SoCs First

AMD has the unique distinction of supplying SoCs to all three leading game console vendors simultaneously - Microsoft, Sony, and Nintendo. The company, like NVIDIA, is looking forward with perched eyes for manufacturing partner TSMC to get its 20 nanometer silicon fabrication node running full-cylinders. Unlike NVIDIA, which may use the new process to shrink its GPUs, or launch bigger chips based on its "Maxwell" architecture, AMD will treat its console SoCs with optical-shrinks to the new nodes first, so the company could immediately eke out better margins, as console gamers upgrade to Xbox One or the PlayStation 4.

AMD's SoC for the Xbox One, could be the first in line for this optical shrink to 20 nm. This chip features a transistor count of 5 billion, and houses eight 64-bit x86 CPU cores, and a 768 SP GPU based on the Graphics CoreNext architecture; 48 MB of on-die cache, and a quad-channel DDR3 IMC. The chip also features an integrated core logic. AMD's chip for the PlayStation 4 features design inputs from Sony. The chip features the same CPU component, but a 1152 SP GPU, and a 256-bit wide GDDR5 memory interface, wired to 8 GB of memory that's virtualized for both system- and graphics-memory. The 20 nm shrinks of both chips are expected to lower not just manufacturing costs, but also step up energy-efficiency, which could then let Microsoft and Sony save additional costs on other components, such as power and cooling.


Source: Expreview

SK Hynix Developed the World's Highest Density 16 GB NVDIMM

SK Hynix Inc. announced that it has developed the world's highest density 16 GB (Gigabytes) of NVDIMM (Non Volatile DIMM) based on 4 Gb (Gigabit) DDR4 using its advanced 20 nm class technology.

This NVDIMM is able to send DRAM data to NAND Flash whose density is two times bigger than the DRAM in a unanticipated power loss by combining DRAM, NAND Flash and the module controller in a single module. Therefore, it is feasible to save and restore data safely as well as performing on the same level with general DDR4 modules. This new product works at 2133 Mbps and with a 64-bit I/O it processes up to 17 GB of data per second running at 1.2V.

Samsung Starts Production of 8-Gigabit DDR4 Based on 20 Nanometer Technology

Samsung Electronics announced that it is mass producing the industry's most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

"Our new 20 nm 8 Gb DDR4 DRAM more than meets the high performance, high density and energy efficiency needs that are driving the proliferation of next-generation enterprise servers," said Jeeho Baek, Vice President of Memory Marketing at Samsung Electronics. "By expanding the production of our 20 nm DRAM line-ups, we will provide premium, high-density DRAM products, while handling increasing demand from customers in the global premium enterprise market."

TSMC May Lose 16 nm and 14 nm Market Share to Competitors in 2015: Chairman

TSMC may lose out on orders to competing fabs on the 16 nanometer (nm) and 14 nm nodes, in terms of market share, in 2015, according to company chairman Morris Chang. Chips built on the 16 nm node will amount to single-digit percentages of the company's output in the year. Samsung Electronics is expected to take the lead on these processes, as it just netted orders from Qualcomm, a major mobile baseband chip and SoC designer.

Chang stressed that 20 nm and 16 nm will drive revenue for the next three years for major fabs. 20 nm products will account for 10 percent of TSMC's revenues in Q3 2014, will expand to 20 percent in Q4, and contribute over 20 percent of TSMC's revenues in 2015. TSMC's 16 nm node will be competitive for products such as mobile baseband chips, ICs, GPUs, NICs, and server chips. Despite these setbacks in the company's competitive outlook, it expects its revenues to grow by 12.6 to 14.2 percent sequentially in Q3 2014, year over year.Source: DigiTimes

NVIDIA GeForce GTX 880 and GTX 870 to Launch This Q4

NVIDIA is planning to launch its next high performance single-GPU graphics cards, the GeForce GTX 880 and GTX 870, no later than Q4-2014, in the neighborhood of October and November, according to a SweClockers report. The two will be based on the brand new "GM204" silicon, which most reports suggest, is based on the existing 28 nm silicon fab process. Delays by NVIDIA's principal foundry partner TSMC to implement its next-generation 20 nm process has reportedly forced the company to design a new breed of "Maxwell" based GPUs on the existing 28 nm process. The architecture's good showing with efficiency on the GeForce GTX 750 series probably gave NVIDIA hope. When 20 nm is finally smooth, it wouldn't surprise us if NVIDIA optically shrinks these chips to the new process, like it did to the G92 (from 65 nm to 55 nm). The GM204 chip is rumored to feature 3,200 CUDA cores, 200 TMUs, 32 ROPs, and a 256-bit wide GDDR5 memory interface. It succeeds the company's current workhorse chip, the GK104.

Source: SweClockers

Crucial MX100 SSD Specifications Appear Online

We're still a few days away from the official unveiling of MX100 solid state drive but thanks to a distributor jumping the gun we already have the full scoop on Crucial's latest creation. As previously revealed, the MX100 is set to be the first SSD equipped with Micron's 16 nm MLC NAND flash memory but not all models will have the 16 nm NAND - the 128 GB drive will pack 20 nm chips, while the 256 GB and 512 GB versions will have 16 nm flash.

All three MX100 drives come in a 7 mm-thick 2.5-inch chassis (a 9.5 mm adapter is included), and have a SATA 6.0 Gbps interface, a Marvell 88SS9189 controller, and are backed by a three-year warranty.

SK Hynix Developed the World's First Highest Density 128 GB DDR4 Module

SK Hynix Inc. announced that it has developed the world's first highest density of 128 GB (Gigabytes) module based on 8 Gb(Gigabit) DDR4 using its advanced 20 nm class technology.

This module has double density compared to existing 64 GB by taking advantage of TSV(Through Silicon Via) technology. This new product works at 2133 Mbps and with a 64-bit I/O it processes up to 17 GB of data per second. It also runs at ultra low-voltage of 1.2V which does at lower voltage than 1.35V of existing DDR3.

Samsung Mass Producing Industry's Most Advanced 4 Gb DDR3, Using 20 nm Process

Samsung Electronics Co., Ltd., the world leader in memory technology, today announced that it is mass producing the most advanced DDR3 memory, based on a new 20 nanometer process technology, for use in a wide range of computing applications. Samsung has pushed the envelope of DRAM scaling, while utilizing currently available immersion ArF lithography, in its roll-out of the industry's most advanced 20-nanometer (nm) 4-gigabit (Gb) DDR3 DRAM.

With DRAM memory, where each cell consists of a capacitor and a transistor linked to one another, scaling is more difficult than with NAND Flash memory in which a cell only needs a transistor. To continue scaling for more advanced DRAM, Samsung refined its design and manufacturing technologies and came up with a modified double patterning and atomic layer deposition.

GM107 Features 128 CUDA Cores Per Streaming Multiprocessor

NVIDIA's upcoming GM107 GPU, the first to be based on its next-generation "Maxwell" GPU architecture, reportedly features a different arrangement of CUDA cores and streaming multiprocessors to those typically associated with "Kepler," although the component hierarchy is similar. The chip reportedly features five streaming multiprocessors, highly integrated computation subunits of the GPU. NVIDIA is referring to these parts as "streaming multiprocessor (Maxwell)," or SMMs.

Further, each streaming multiprocessor features 128 CUDA cores, and not the 192 CUDA cores found in SMX units of "Kepler" GPUs. If true, GM107 features 640 CUDA cores, all of which will be enabled on the GeForce GTX 750 Ti. If NVIDIA is carving out the GTX 750 by disabling one of those streaming multiprocessors, its CUDA core count works out to be 512. NVIDIA will apparently build two GPUs on the existing 28 nm process, the GM107, and the smaller GM108; and three higher performing chips on the next-generation 20 nm process, the GM206, the GM204, and the GM200. The three, as you might have figured out, succeed the GK106, GK104, and GK110, respectively.


Source: VideoCardz

GeForce GTX 750 Ti "Maxwell" First Performance Numbers Out

Ahead of its rumored mid-February launch, members of Taiwanese tech forum Coolaler.com posted the first performance benchmark numbers of the card. Originally thought to be positioned between the previous-generation GeForce GTX 660 and current GTX 760, the GTX 750 Ti, according to these numbers is on average 10 to 15 percent slower than the GTX 660, which should put its performance somewhere in between the GTX 650 Ti Boost and the GTX 660.

Then again, the testers must be using some very early drivers, and performance figures of the GTX 750 Ti should get clearer as its mid-February launch date approaches. The GeForce GTX 750 Ti is an important GPU for NVIDIA, as it's the first to be based on its next-generation "Maxwell" GPU micro-architecture. NVIDIA is trying the architecture out on current 28 nm process, before launching bigger chips based on the next-generation 20 nm fab process.


Source: Coolaler

SK Hynix Develops 8 Gb LPDDR4 Memory

SK Hynix Inc. announced that it has developed the world's first 8 Gb (Gigabit) LPDDR4 (Low Power DDR4) using its advanced 20 nm class technology. LPDDR4 is the next generation mobile DRAM interface on the process of standardization which features ultrahigh speed and low power consumption.

This new product works at 3200 Mbps and ultra low-voltage of 1.1V which runs two times faster than 1600 Mbps and does at lower voltage than 1.2V of existing LPDDR3. The Company has been strengthening its cooperation with the customers for the standardization of this new mobile DRAM by providing the samples of LPDDR4 to major customers and SoC(System on Chip) companies.

2014 Intel Solid State Drives Detailed in Leaked Slides

According to some newly-leaked slides, Intel is planning quite a solid state drive release spree for the second quarter of 2014, one that will see the introduction of three storage solutions - the SSD Pro 2500 Series (codename Temple Star), SSD DC P3500 Series (Pleasantdale) and SSD DC P3700 Series (Fultondale). All three SSD families are going to utilize 20 nm MLC NAND Flash memory, will be available in two form factors and will be backed by a five-year warranty.

SK Hynix Develops Industry-Leading 6 Gb LPDDR3 Memory

SK Hynix Inc. announced that it has developed 6 Gb (Gigabit) LPDDR3 (Low Power DDR3) using its 20 nm class process technology. This product is a high-performance mobile memory solution that features low power consumption and high-density, which is ideal for next generation premium mobile devices.

Four 6 Gb LPDDR3 products can be stacked up and realize a high density of maximum 3 GB (Gigabytes, 24 Gb) solution in a single package. In consequence, this package reduces the operating power as well as the standby current by 30% and the height of the package becomes thin compared to the Company's 4 Gb-based one. In addition, it works at ultra low-voltage of 1.2V thus it satisfies low power consumption which mobile applications demand.

New AMD GPU Family Codenames "Volcanic Islands" and "Pirate Islands"

AMD's next generation GPU family that leverages upcoming silicon fab technologies to increase transistor counts, while maintaining or lowering thermal envelopes, is codenamed "Volcanic Islands," and we've known about that for some time now.

The centerpiece of "Volcanic Islands" family is "Hawaii," a high-end GPU that makes up top single- and dual-GPU SKUs; followed by "Maui" and "Tonga." Not much is known about these two. A dual-GPU product with two "Hawaii" chips is confusingly codenamed "New Zealand," which is already used to designate certain Radeon HD 7990 graphics cards. AMD is expected to debut its first "Volcanic Islands" GPUs in Q4-2013, when foundry partner TSMC's swanky new 20 nm node is expected to take flight.

Intel SSD 530 Series Arrives Next Week

According to a leaked SSD product stack roadmap by Intel, scored by VR-Zone, the company is close to launching its next-generation performance-segment consumer SSDs, the SSD 530 series. The line succeeds Intel's SSD 520 and SSD 525 series, features the latest 20 nm MLC NAND flash, but the same LSI-SandForce SF-2281 controller (probably the latest revision, backed by a better firmware). According to the roadmap, the series should have debuted back in June, which never happened. Apparently, it's off by a month, and Intel moved its launch window to some time between the 8th and 12th of this month.

Intel's SSD 530 series will be available in three form-factors, including the familiar 2.5-inch SATA (7 mm-thick), NGFF M2, and mSATA. The drives will be available in 80 GB, 180 GB, 240 GB, and 360 GB for the M2 and mSATA form-factors; and 180 GB, 240 GB, 360 GB, and 480 GB for the 2.5-inch form-factor. At this point, nothing is known about their rated performance or pricing. Elsewhere in the lineup, SSD 335 series will continue throughout the year, going into Q1 2014, as Intel's mid-range SSD offering.

Source: VR-Zone

Intel SSD Data Center S3500 Series Gives Cloud Computing Major Boost

Intel Corporation today announced the Intel Solid-State Drive DC S3500 Series, its latest solid-state drive (SSD) for data centers and cloud computing. Designed for read-intensive applications such as Web hosting, cloud computing and data center virtualization, the Intel DC S3500 Series is an ideal replacement for traditional hard disk drives (HDD), allowing data centers to save significant costs by moving toward an all-SSD storage model.

Intel SSDs, including the Intel SSD DC S3500 Series, enable transformational improvements in cloud infrastructure, fostering new and enriching Web experiences. End customers experience quicker Web page loads and improved response times as a result of dramatically improved data access times and reduced latency. IT managers and cloud developers are rewarded with improved total cost of ownership as a result of reduced power consumption, more consistent performance and smaller space requirements. More than half of U.S. businesses now employ cloud computing applications, and IDC predicts that worldwide spending on cloud services will reach $44.2 billion this year. Data centers powering these cloud applications need to quickly, efficiently and reliably scale to handle the tremendous growth of connected users and data traffic.

OCZ Launches the Vertex 450 Series Solid State Drives

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced the release of the Vertex 450 SATA III SSD Series featuring the company's proprietary Indilinx Barefoot 3 M10 Series controller. As part of the leading-edge Vertex series, Vertex 450 lives up to its name and bridges the gap between high performance and mainstream solid-state storage. With advanced storage performance, reliability, and quality, the Vertex 450 utilizes 20 nm process geometry NAND flash to meet the needs of today's high-end consumer and client applications.

"As one of the industry's most highly awarded SSD Series to date, the Vertex name has become synonymous with the latest and greatest in flash-based storage providing an exceptional balance of performance and cost efficiency," said Daryl Lang, Senior Vice President of Product Management for OCZ Technology. "The Vertex 450 marks the first time this popular OCZ series utilizes in-house ASIC technology delivering an even greater level of speed, reliability and value for our customers."

AMD's Answer to GeForce GTX 700 Series: Volcanic Islands

GPU buyers can breathe a huge sigh of relief that AMD isn't fixated with next-generation game consoles, and that its late-2013 launch of its next GPU generation is with good reason. The company is building a new GPU micro-architecture from the ground up. Codenamed "Volcanic Islands," with members codenamed after famous islands along the Pacific Ring of Fire, the new GPU family sees AMD rearranging component-hierarchy within the GPU, in a big way.

Over the past three GPU generations that used VLIW5, VLIW4, and Graphics CoreNext SIMD architectures, the component hierarchy was essentially untouched. According to an early block-diagram of one of the GPUs in the series, codenamed "Hawaii," AMD will designate parallel and serial computing units. Serial cores based on either of the two architectures AMD is licensed to use (x86 and ARM), could handle part of the graphics processing load. The stream processors of today make up the GPU's parallel processing machinery.

Samsung Mass Producing 10 nm Class High-Performance 128-Gbit 3-bit MLC NAND Flash

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing a 128-gigabit (Gb), 3-bit multi-level-cell (MLC) NAND memory chip using 10 nanometer (nm)-class process technology this month. The highly advanced chip will enable high-density memory solutions such as embedded NAND storage and solid state drives (SSDs).

"By introducing next-generation memory storage products like the 128Gb NAND chip, Samsung is extremely well situated to meet growing global customer needs," said Young-Hyun Jun, executive vice president, memory sales & marketing, Device Solutions Division, Samsung Electronics. "The new chip is a critical product in the evolution of NAND flash, one whose timely production will enable us to increase our competitiveness in the high density memory storage market."

OCZ Vertex 5 SSD Series Detailed

OCZ is reportedly readying the 5th generation of its Vertex line of high-performance consumer SSDs. Vertex 5, as it's being called, could retake market positioning of being the company's flagship product, from its Vector series. The new lineup, which could consist of 128 GB, 256 GB, and 512 GB models, could be launched towards the end of May, 2013.

OCZ could use Vertex 5 to strengthen its lineup against Samsung, which appears to have captured the performance segment with its 840 and 840 Pro series, using aggressive pricing, particularly with 840 (non-Pro). Vertex 5 could be based on the same Barefoot 3 platform as Vector, with a few tweaks. It could integrate 20 nm MLC NAND flash. With the company engaged in legal tussles with some of its former investors, it could be interesting to see how the company competes with Samsung's pricing.

Source: NordicHardware

Crucial M500 SSD Series Now Available

Crucial started shipping its M500 line of consumer SSDs. Available in 2.5-inch SATA (7 mm-thick), mSATA, and NGFF M.2 form-factors, the drives combine Micron 20 nm MLC NAND flash with a Marvell-made processor. All three form-factors take advantage of 6 Gb/s SATA. The drive is available in 120 GB, 240 GB, and 480 GB capacities for all three form-factors, while the 2.5-inch gets a 960 GB "terabyte-class" capacity option, as well.

Sequential read speeds on all capacities are as high as 500 MB/s, while sequential write speeds cap out at 130 MB/s and 250 MB/s for the 120 GB and 240 GB variants, respectively; and reach 400 MB/s on the 480 GB and 960 GB variants. The drives are backed by 3-year limited warranties, 1.2 million hours MTBF, and 72 TB total bytes written (TBW) write endurance (that's 40 GB per day). TRIM, NCQ, and SMART are standard issue. The 120 GB, 240 GB, 480 GB, and 960 GB variants are priced at US $129.99, $219.99, $399.99, and $599.99, respectively.

OCZ Technology Delivers Vertex 3 With 20 Nanometer Flash

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced a new 20 nanometer (nm) NAND flash version of its award-winning Vertex 3 SSD Series. The new Vertex 3.20 SSD is a 2.5-inch, 6 Gbps SATA III-based Multi-Level Cell (MLC) drive that implements the feature-set of the Vertex 3 Series but is built around smaller, state-of-the-art NAND flash process geometry.

Being that the Vertex 3 Series is one of OCZ's most popular SSDs to date, and has received numerous accolades from media reviewers globally, the implementation of 20 nm NAND flash will extend its availability and enable mainstream users of mobile and desktop platforms to improve gaming, multimedia, and the overall computing experience over traditional hard disk drives (HDDs) and other competing SSDs. The Vertex 3.20 SSD will be available in 120 GB and 240 GB storage capacities, with 480 GB capacities to follow soon.

Intel SSD 335 Series Expanded with New 180 GB Model

Intel made an addition to its SSD 335 line of performance-segment consumer SSDs, which is currently available in just one capacity, 240 GB. The new 180 GB variant (SKU: SSDSC2CT180A4K5) retains the feature-set and rated speeds of its older sibling, boasting of up to 500 MB/s reads, up to 450 MB/s writes, and up to 52,000 IOPS 4K random write throughput. Based on the LSI-SandForce SF-2281 processor, the drive features 20 nm MLC NAND flash chips by IMFlash Technologies (Intel, Micron JV).

In addition, Intel updated the drive body design, which will also apply to newer batches of the 240 GB variant. The new design consists of a brace running the perimeter of the drive (without affecting its 2.5-inch 9 mm-thick size compliance), and a "circuit board" print art. Backed by a 3-year warranty, the Intel SSD 335 180 GB is priced at US $179.99.

Synopsys and TSMC Enable Lithography Compliance Checking for 20 nm

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the delivery of lithography compliance checking technology for the TSMC 20-nanometer (nm) DFM Data Kit (DDK) encapsulated with Synopsys Proteus mask synthesis technologies. As a result of the design-for-manufacturing collaboration between TSMC and Synopsys, the compliance checking engine in the DDK helps designers identify lithography-related problems early in the design development phase, avoid litho-related manufacturing issues and late-stage schedule slips resulting from re-design.

The TSMC 20-nm DDK complements traditional physical verification rules with a highly accurate simulation-based solution to identify design non-compliance using a direct simulation of the manufacturing process. Lithography correction and verification tools used in the manufacturing mask synthesis flow are embedded in the DDK, resulting in accurate hotspot detection to avoid litho-related manufacturing issues.

Samsung Announces Its Fourth Generation Green Memory Solution

Samsung Electronics Co., Ltd, a global leader in advanced semiconductor technology solutions, today announced its fourth generation green memory solution at the annual Memory Solution CIO Forum at the Shilla hotel, Seoul, Korea. Designed to achieve superior system level performances, the new solution introduces a combination of its advanced 20 nanometer (nm) class DDR3 and 20 nm-class SSDs based on high-performance SATA 6.0 Gb/s and SAS interfaces respectively.

The new green memory solution addresses the benefits of green memory for next-generation enterprise servers, server storage solutions and personal computing solutions, broadening the benefits of green memory solutions even further throughout the IT industry. The reduced costs and optimized IT expenditure efficiencies are well in-line with the creating shared value (CSV) framework.

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