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Intel Custom Foundry Demos Industry-Leading 32 Gbps SerDes on 14 nm Process

Intel Corporation today unveiled silicon characterization results for its 1 to 32 Gbps high-speed SerDes on the 14nm process. This 32 Gbps SerDes is the second SerDes offering and adds to the previously announced 1 to 16 Gbps GP 14nm SerDes. It will be available by end of this year.

Intel's 14nm SerDes family is the second generation of SerDes offering and is built on the success of Intel's 12 and 28 Gbps SerDes, which is currently in production on Intel's 22nm Tri-gate process technology. Intel's 14nm SerDes extends the operating range while reducing power by 20 percent and area by more than 40 percent as compared to Intel's 22nm SerDes offering. This announcement marks the first time that a 32 Gbps, multiprotocol SerDes has been validated on any sub-20nm foundry process.

Silicon Mechanics Announces New Products Based on Intel's E5-2600v2 Xeon Family

Silicon Mechanics, Inc., announces availability of a range of products built with the newly launched Intel Xeon processor E5-2600v2 product family. Compared to the previous generation Intel Xeon processor, the new Intel Xeon processor E5-2600v2 (formerly known as Ivy Bridge-EP) features improved performance, energy efficiency, and security. Ideal for compute-intensive applications, the versatile new processor has been designed to serve as the heart of an efficient data center.

The new processor family promises to be up to 40 percent more energy efficient than a previous generation Intel Xeon processor-based server and up to 250 percent more energy efficient than a typical 4-year-old server. The Intel Xeon E5-2600v2 family can serve as a drop-in replacement for existing E5-2600 (Sandy Bridge-EP) CPUs. The Intel Xeon processor E5-2600v2 replaces Sandy Bridge 32nm lithography with 22nm 3-D Tri-Gate transistors, for improved performance and energy efficiency. Major performance improvements include higher core count, with up to 12 cores/24 threads, and up to 30 MB third-level cache - all in the same thermal design points (TDP) as previous generation Xeon processors. The new architecture offers higher clock speed, up to 3.5 GHz, as well as higher memory speed support, up to 1866 MHz.

Intel Aims to "Re-Architect" Datacenters to Meet Demand for New Services

As the massive growth of information technology services places increasing demand on the datacenter, Intel Corporation today outlined its strategy to re-architect the underlying infrastructure, allowing companies and end-users to benefit from an increasingly services-oriented, mobile world. The company also announced additional details about its next-generation Intel Atom processor C2000 product family (codenamed "Avoton" and "Rangeley"), as well as outlined its roadmap of next-generation 14nm products for 2014 and beyond. This robust pipeline of current and future products and technologies will allow Intel to expand into new segments of the datacenter that look to transition from proprietary designs to more open, standards-based compute models.

"Datacenters are entering a new era of rapid service delivery," said Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel. "Across network, storage and servers we continue to see significant opportunities for growth. In many cases, it requires a new approach to deliver the scale and efficiency required, and today we are unveiling the near and long-term actions to enable this transformation."

Intel Powers the World's Fastest Supercomputer, Reveals New HPC Technologies

A system built with thousands of Intel processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers. The system, known as "Milky Way 2," includes 48,000 Intel Xeon Phi coprocessors and 32,000 Intel Xeon processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

Intel Readies 'Bay Trail' for Holiday 2013 Tablets and 2-in-1 Devices

At an industry event in Taipei today, Hermann Eul, general manager of Intel's Mobile and Communications Group, unveiled new details about the company's forthcoming Intel Atom processor-based SoC for tablets ("Bay Trail-T") due in market for holiday this year. Based on the new Silvermont microarchitecture, the next generation 22nm Intel technology for tablets and ultra-mobile devices will enable sleek designs with 8 or more hours of battery life2 and weeks of standby, as well as support Android* and Windows 8.1*.

Eul also spoke to recent momentum and announcements around the smartphone business and demonstrated the Intel XMM 7160 multimode 4G LTE solution, now in final interoperability testing (IOT) with Tier 1 service providers across North America, Europe and Asia. "The mobile category is undergoing a tremendous amount of innovation and constant change," said Eul. "As we look at growing it, we continue to invest in and accelerate our efforts across all aspects of mobility with a focus on smartphones, tablets and wireless communications. Intel's unique assets will enable more compelling and differentiated products and experiences, while at the same time helping to shape and lead markets in the future."

New Intel Xeon Processors Accelerate Media Processing in the Cloud

Today Intel introduced the new Intel Xeon processor E3-1200 v3 product family based on Haswell microarchitecture and the company's 22nm manufacturing process. When deployed in cloud data center environments, the new Intel Xeon processors will help reduce costs and increase media processing capabilities for cloud-based media service providers to better support customers wanting to upload and share videos with friends across different mobile devices. In addition to a better offering for cloud media workloads than discrete graphic-based servers, new Intel Xeon processors offer exceptional energy efficiency and lowest TDP ever at 13 Watts for highly dense environments like microservers. Get the Intel Xeon processor E3-1200 v3 product family fact sheet.

GIGABYTE Introduces Motherboards for Intel Xeon E3-1200 V3 Processors

GIGABYTE Technology introduces today, in coordination with Intel's official launch, two initial models of single socket server/workstation motherboards designed for the brand new Intel Xeon processor E3-1200 V3 product family (former codename Haswell). Suitable for both rack and desktop tower integration, GIGABYTE introduces here ultra-flexible products featuring the latest technologies and built to deliver all the benefits and new features of this new CPU line in many professional application scenarios.

Still based on the 22 nm tri-gate lithography, this new generation of Xeon processors is built on Intel's latest microarchitecture and brings up to 15% computing power improvement and increased L3 cache across the line. In addition, this new generation also brings to the Xeon E3 family the support of 1600MHz ECC memory, Intel Trusted Execution and Virtualization technologies, as well as AVX 2.0 and TSX instructions. Last but not least, the Xeon E3-1200 V3 processors will include the latest Intel integrated graphics, which will bring the support of OGL3.2+, DirectX 11.1, and higher frequencies over the previous generation.

Intel Launches Low-Power, High-Performance Silvermont Microarchitecture

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont. The technology is aimed squarely at low-power requirements in market segments from smartphones to the data center. Silvermont will be the foundation for a range of innovative products beginning to come to market later this year, and will also be manufactured using the company's leading-edge, 22nm Tri-Gate SoC manufacturing process, which brings significant performance increases and improved energy efficiency.

"Silvermont is a leap forward and an entirely new technology foundation for the future that will address a broad range of products and market segments," said Dadi Perlmutter, Intel executive vice president and chief product officer. "Early sampling of our 22nm SoCs, including "Bay Trail" and "Avoton" is already garnering positive feedback from our customers. Going forward, we will accelerate future generations of this low-power microarchitecture on a yearly cadence."

IDF 2013 Transforming Computing Experiences from the Device to the Cloud

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

ASUS Launches MicroATX Motherboards for Superior HTPC Performance

ASUS today announced a new range of microATX motherboards with onboard HDMI and DVI ports for Intel and AMD processors with integrated graphics, and USB 3.0 ports with performance-enhancing ASUS USB 3.0 Boost technology. By removing the need for a discrete graphics card, the new motherboards provide a more affordable option for home entertainment PCs that can fully exploit high-performance USB 3.0 storage.

The latest Intel 22nm CPUs feature Intel HD 4000 integrated graphics, while AMD Socket FM2Athlon and A-Series APUshave integrated AMD HD 7000 Series discrete-level Radeon GPUs.The processors provide excellent 2D and 3D graphics performance, without the need for a separate graphics card, which in turn results in lower PC build costs.

Intel Labs Tunes Into a Wireless Future Where Everything That Computes is Connected

In his keynote today at the Intel Developer Forum, Intel Chief Technology Officer Justin Rattner said, “In the future, if it computes, it connects. From the simplest embedded sensors to the most advanced cloud datacenters, we’re looking at techniques to allow all of them to connect without wires.”

Rattner demonstrated for the first time a working, all-digital WiFi radio, dubbed a “Moore’s Law Radio.” The CTO explained that an all-digital radio follows Moore’s Law by scaling in area and energy efficiency with such digital chip processes as Intel’s latest 22nm tri-gate technology. System-on-chip designs for smartphones and tablet computers would be the most likely spot for the all digital radios to be integrated. The small size and lower cost of integrated digital radios will enable a host of new applications from wearable devices to “The Internet of Things” where devices such as home appliances with sensors can communicate with each other, exchange data and can be operated remotely.

Despite Estimates Cuts, Analyst Bets on Haswell Success

Following last Friday's Q3 outlook lowering by Intel, market punters such as Merrill Lynch cut estimates. Vivek Arya, an analyst with the firm, cut its Q3 and Q4 estimates for Intel, while remaining optimistic about upcoming processes in the company's pitched battle with ARM in the lightweight SoC segment. Arya believes that with upcoming technologies, Intel has a fighting chance against ARM heavyweights. Said Arya in his report:
Next-gen chip manufacturing has become a 3-horse race between Intel, TSMC and Samsung, with Intel holding a 1 to 4 year lead, in our view. As we saw in 1H12, foundries were unable to ramp 28nm capacity, leading to product delays. Rising costs/ complexity (tri-gate) could further widen this gap. We believe this could enable Intel to gain a foothold (vs. zero today) in mobile over the next 2 years, as smartphone/tablet vendors look to Intel as a second or even primary source […] We firmly believe in Intel’s ability to reliably produce the lowest cost and highest performance silicon can help it maintain a dominant position in servers/data centers (20% of sales, 10-15% CAGR), and transition from legacy PCs to next-gen smartphones, tablets, Ultrabooks and other converged devices in the next 1-2 years. Investors, meanwhile, benefit from a 3.6% div yield, $7.5bn in available buybacks (6% of mkt cap) and <10x PE.

Intel Xeon Processors and Xeon Phi Powers World's Most Efficient HPC Data Center

Signaling its commitment to energy-efficient high- performance computing, Intel Corporation today announced that it will work with HP to help design and provide the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) with a supercomputing system that will drive research across a number of energy-related initiatives, including renewable energy and energy-efficient technologies. The new High Performance Computer (HPC) data center promises to become one of the world's most efficient installations.

The system is scheduled to deliver full compute capacity in the summer of 2013 and will feature approximately 3,200 Intel Xeon processors including current-generation Intel Xeon processor E5-2670, future 22nm Ivy Bridge based processors and approximately 600 new Intel Xeon Phi co-processors. The total peak performance of the system is expected to exceed 1 Petaflop (equivalent to a thousand trillion floating point operations per second) and it will be the largest supercomputer dedicated solely to renewable energy and energy efficiency research. Leading energy-efficient capabilities of Intel Xeon processors and Intel Xeon Phi co-processors combined with the new HP warm water cooling solution and innovative data center design will result in this facility likely being the world's most efficient data center with a power usage effectiveness (PUE) rating of 1.06 or better.

Eurocom Monster 11.6-inch Notebook Capable of Running 8 VMs with 16 GB RAM, 1 TB HDD

Eurocom Corporation, a developer of long lifespan, high performance, fully upgradable Notebooks and Mobile Workstations is shipping a small form factor ultraportable notebook capable of running multiple virtual machines and multiple operating systems with up to 16GB memory and 1 TB storage while weighing under 4 lbs.

“The EUROCOM Monster is capable of running up to 8 virtual machines due to its high performance hardware; Intel Core i7 3920XM processor, NVIDIA GeForce GT 650M graphics combined with 16GB DDR3-1600 memory and up to 1 terabyte of storage with up to 410 minutes of battery life. This is the perfect system for mobile professionals who need exceptionally capable hardware for such things as mobile server applications, technical presale, CUDA and OpenCL development on the go” Mark Bialic, Eurocom President.

Intel Reveals 22nm "Avoton" SoC for Micro Servers in 2013

Today during the Structure Conference in San Francisco, Jason Waxman, GM of the Cloud Infrastructure Group outlined Intel’s vision and roadmap for microservers and discussed how they best suited to handle emerging “scale-out” applications. Waxman provided an update on Intel's roadmap for microservers including new generations of Intel Xeon processors and Intel Atom architecture based 22nm SoC chips codenamed "Avoton", both scheduled for 2013. In his blog Jason also talks about why within the new segment of servers it is the application that will decide which core – Intel Atom or Xeon - will be the optimal solution. Waxman's presentation can be found here.

Intel Xeon Processors E5 Achieve Fastest Adoption, Announcing Xeon Phi Co-Processors

The Intel Xeon processor E5-2600 product family reached a new supercomputing milestone as the fastest adopted new processing technology to power 44 systems, including 3 Petascale-class supercomputers on the 39th edition of the Top500 list announced today.

The "SuperMUC" supercomputer at LRZ in Germany, which ranked fourth on the list, delivers 2.9 PetaFLOPs of performance, making it the most powerful in Europe, as well as the largest installation based on the new Intel Xeon processors E5 family.

Supermicro's New Compact Embedded Server Appliance Supports 3rd Gen. Intel Core CPUs

Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server technology and green computing, releases its next generation, ultra low power, compact form factor embedded server platform (5017P-TLN4F) based on their new Mini-ITX (6.7" x 6.7") motherboard (X9SPV-F/LN4F). Compared to the previous generation architecture, this solution delivers 15% more processing performance, up to 50% more 3D graphics performance supporting the latest graphic APIs - DirectX 11, OpenCL 1.1 and OpenGL 3.1 and new features such as Intel Smart Response Technology enabling increased storage I/O performance with SSD caching.

Intel, Industry Shaping Future of Computing Experiences on Intel Architecture

Intel Corporation Senior Vice President Tom Kilroy officially introduced the next wave of Ultrabook systems during a keynote address at Computex Taipei 2012. Making a bold statement around the importance of touch technology, Kilroy also announced that Intel has signed agreements with several leading touch panel manufacturers to ensure adequate capacity to meet the expected demand for touch-enabled Ultrabook experiences over the next several years.

He also highlighted the company’s efforts to deliver user-centric experiences across a range of mobile devices from the Ultrabook to smartphones and tablets, pointing to momentum across all three.

Kingston Technology to Ship Ultra-fast 2666 MHz HyperX Memory

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping HyperX dual-channel kits engineered especially for the new Intel third-generation Core i7 and i5 processors (Ivy Bridge). Kingston HyperX memory is available in 16GB and 8GB kits of two at 1600MHz, 2133MHz, 2400MHz and soon to be speedy 2666 MHz frequencies.

“The new 22nm architecture of this processor allows significant performance gains for benchmarkers, enthusiasts and overclockers,” said Mark Tekunoff, senior technology manager, Kingston. “Enthusiasts who want to push the performance boundaries of the new processors will want to pair it with Kingston HyperX memory. Our 2666 MHz kit combined with the top CPU in the Ivy Bridge family will allow unparalleled performance.”

Dell Introduces 22 nm Xeon-Powered PowerEdge C5220 Micro-Servers

Dell today announced that customers such as Morphlabs and Vibrant Media are using Dell microserver technologies based on Intel Xeon processors to power business-critical web 2.0, cloud, and content delivery networks (CDN), as well as high-performance computing (HPC) applications. Driven by the emergence of a growing hardware and application ecosystem, x86-based microservers are rapidly evolving from a niche solution to one with widespread awareness and value.

“We’re constantly inspired by the unique ways our customers are leveraging Dell microserver platforms to drive specialized web 2.0, HPC and cloud computing applications,” said Forrest Norrod, vice president and general manager, Dell Server Solutions. “As the microserver market and ecosystem have matured, customers like Vibrant Media have validated that microservers are a cost-effective, scalable platform in web 2.0 environments.”

AVADirect Introduces Desktops and Notebooks Featuring Intel's Ivy Bridge Processors

AVADirect, a leading custom computer manufacturer, announces newly added desktops and notebooks featuring the new Ivy Bridge architecture by Intel. What does this mean for AVADirect? The world-renowned custom computer manufacturer has strived on the ability to create truly customizable options at their customer’s disposal. As opposed to a 32nm process, the Ivy Bridge processors are designed off of a 22nm process. The Ivy Bridge processors also have a lower power consumption rating of 77w, compared to the Sandy Bridge's 95w on average. Those interested in AVADirect’s slim or compact custom computers, AVADirect Ivy Bridge solutions will allow end-users to have high-end systems with a smaller footprint. Ivy Bridge chipsets were designed behind the motivation of mobile solutions. This is great news for AVADirect considering they offer some of the best mobile solutions available within the custom computer industry. Ivy Bridge solutions designed by AVADirect will provide superior performance with very little or unnoticeable impact to pricing.

MSI H61 (G3) Bags Highest Memory Speed in its Class with Core i7-3770K and ME8L BIOS

MSI announces that its Intel-based H61 (G3) series now offers the latest ME8 BIOS and Driver with support for 3rd generation Intel 22nm processors. Its Intel H61 motherboards are also the fastest in the world, with DDR3 memory support up to 2400MHz. With its solid R&D ability, MSI has created H61 motherboards with superior efficiency that is the best choice for users wishing to upgrade to next-generation 22nm processors from Intel.

As a commitment to long-time MSI users, MSI releases the ME8 upgrade package and related upgrade guide for the most robust update solution, allowing consumers of MSI H61 (G3) / Z68 (G3) motherboards to easily adopt the latest Intel 22nm processor. This solution offers amazing DDR3 memory speeds of up to 2400MHz, efficiency never seen before.

Eurocom Adds Radeon HD 7900M GPUs to its Portfolio

Eurocom Corporation, a developer of long lifespan, fully upgradable notebooks is adding the newest AMD Radeon HD 7970M GPU to their extensive options list of Ivy Bridge powered, high performance notebooks. The addition of the AMD Radeon HD 7970M offers users a new level of high performance GPU computing. Eurocom will also offer the AMD Radeon HD 6990M GPUs separately to existing customers as an upgrade option.

The addition of the AMD Radeon HD 7970M, the highest performing mobile solution from AMD, gives Eurocom customers a superior choice of video processor options to configure into their new Eurocom system or upgrade into their existing system. The addition of the AMD Radeon 7970M GPUs in single and CrossFireX offers customers a greater selection of video processor options to fit any preference or performance level.

Gigabyte Officially Launches GB-AEGT Whitebox All-in-One PC

GIGABYTE introduces its latest whitebox All-in-One PC based on the Thin Mini-ITX standard and addressed to channel resellers, VARs and system integrators. Being the biggest screen size (24") in GIGABYTE's All-in-One PC offering, the GB-AEGT aims at establishing its supremacy as the ultimate entertainment All-in-One PC. To do so, it offers the worldwide exclusive ability to receive off-the-shelf double slot desktop graphic cards up to 400W.

Gaming on an All-in-One PC won’t be a dream anymore, and to complete this dream the GB-AEGT has a full load of multimedia features detailed below. In addition to these features, the GB-AEGT naturally keeps GIGABYTE homemade modular design and is fully upgradable thanks to an easy access to all the internal components.

Definitive Retail Launch Date for Ivy Bridge Core Processors Surfaces

While we're fairly certain about the launch-schedule of Intel's "Ivy Bridge" Core processor family and 7-series chipset from an older article, which pin-points at April 29 to be the day full-fledged reviews (including overclocking performance, and benchmarks that cover new features) can be published, there's still a looming doubt over that day being the one on which you could buy say, a Core i7-3770K off Newegg.com. A latest slide, probably sourced from Intel's Retailedge, lays that doubt to rest. April 29 is indeed the day you will be able to buy most significant "Ivy Bridge" Core i7 and Core i5 models. Certain other models are slated for June 3. Dual-core Core i3 and Pentium processors based on Ivy Bridge silicon are slated for "Holiday". As on April 29, you also be able to buy motherboards based on 7-series chipset, which support Ivy Bridge processors out of the box.

Source: DonanimHaber
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