News Posts matching "28 nm"

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HIS Readies Fanless Radeon HD 7750 iSilence 5 Graphics Card

HIS is ready with a fanless Radeon HD 7750 graphics card that utilizes the company's iSilence 5 cooling solution, which is used on the recently-launched HD 6670 iSilence 5. The cooler consists of a swanky-looking aluminum fin stack to which heat is conveyed by four 8 mm-thick nickel-plated copper heat pipes, which make direct contact with the GPU die. The heat is then passively dissipated by the aluminum fins.

The HIS Radeon HD 7750 iSilence 5 sticks to AMD reference clock speeds. The 28 nm "Cape Verde" GPU, in the HD 7750 configuration, packs 512 Graphics CoreNext stream processors, and a 128-bit wide GDDR5 memory interface, holding 1 GB of memory. The card relies on the PCI-Express slot entirely for its power. Display outputs include one each of dual-link DVI, HDMI, and DisplayPort. HIS is expected to unveil the card at Computex, after which, it joins the league of passive Radeon HD 7000 series graphics cards such as PowerColor HD 7750 Go Green and Sapphire HD 7750 Ultimate.

Source: Overclockers Ukraine

SPARKLE GeForce GTX 680 Inferno Unveiled

Sparkle, one of the leading manufacturers of graphics cards, revealed today its brand new GTX 680 Inferno, using NVIDIA's 28 nm Kepler GPU architecture and GPU Boost technology, which dynamically adjusts GPU speeds to maximize gaming performance up to 2 times higher than GTX 580. SPARKLE GTX 680 Inferno brings you a most fantastic gaming experience to satisfy all hardcore PC gamers' requirements.

Kepler architecture makes a giant leap in efficient-performance
Featuring 1536 CUDA cores, 1006 MHz GPU clock and 2GB of high-speed GDDR5 memory,

SPARKLE's flagship 28 nm GTX 680 Inferno graphics card greatly improves system power consumption and supports the latest PCI Express Gen 3 standards. The card requires two 6-pin power connectors, as the card has a TDP of only 195W. SPARKLE GTX 680 Inferno is not only faster but also operates at a much lower temperature and consumes lesser power than its rivals.

TSMC Gives NVIDIA Priority for 28 nm Manufacturing

Relations between NVIDIA and its principal foundry partner, TSMC, have been unpredictable in recent times, with reports of NVIDIA expressing displeasure with it over 28 nm manufacturing capacity, which is denting its competitiveness; and later crediting collaboration with it, for the energy-efficiency of its latest Kepler family of GPUs. With NVIDIA threatening to find other foundry partners for bulk manufacturing, and reports of Samsung already preparing qualification samples for it, TSMC is responding by issuing NVIDIA a priority over other clients (such as Qualcomm, AMD) for manufacturing of 28 nm chips.

While being unsatisfied with TSMC's output, and its new policy of charging for wafers rather than working chips yielded, NVIDIA refuted rumors of it seeking other foundry partners such as Samsung and Global Foundries. When put on high-priority, TSMC will facilitate speedy launch of new NVIDIA GeForce SKUs towards the end of Q2, 2012. Supply prioritization isn't new, TSMC has, in the past, prioritized Qualcomm when it threatened to shift allocations to other foundries. It remains to be seen how AMD responds to the situation, as such a prioritization would come at the expense of its volumes, and could threaten its competitiveness.

Source: DigiTimes

NVIDIA's GeForce GTX 670 Short PCB Pictured Up Close

Thanks to the impressive power-draw and temperature figures its GeForce GTX 680 could come up with, NVIDIA's newest SKU based on the 28 nm GK104 silicon, the GeForce GTX 670, will feature a compact PCB. The reverse side of this PCB was first pictured on a Colorful-branded graphics card. A picture of its obverse side was posted earlier today. In comparison to the GTX 680, the GTX 670 PCB is quite short. The eight GDDR5 memory chips are distributed between both the sides, these chips are wired to the GPU over a 256-bit wide memory interface. The VRM area is pushed towards the front-end of the PCB. It consists of a 4+2 phase design. The card draws power from two 6-pin PCIe power connectors. Display outputs include two dual-link DVI, and one each of HDMI and DisplayPort. There are two SLI bridge connectors, giving it 4-way SLI capability.

Source: PCinLife

NVIDIA GeForce GTX 690 Starts Selling

Announced last week, NVIDIA GeForce GTX 690 enthusiast graphics card started selling, at an MSRP of US $999 (prices vary greatly by region). A variety of add-in card (AIC) partners will launch their GTX 690 graphics cards today. The GeForce GTX 690 is a dual-GPU graphics card that packs two 28 nm GeForce Kepler 104 GPUs, arranged in an internal SLI configuration. Both these chips have all their components unlocked, including 1536 CUDA cores, and 2 GB of GDDR5 memory across a 256-bit wide memory interface. The card hence ends up with a total of 3072 CUDA cores, and 4 GB of memory. The card should be available on leading retail stores. Despite its high price, it could sell out fast.

TSMC's 28 nm Based ARM Cortex-A9 Test Chip Reaches Beyond 3 GHz

TSMC today announced its 28 nm high performance ARM Cortex-A9 dual-core processor test chip achieved 3.1 GHz performance under typical conditions.

The TSMC 28 nm HPM (high performance for mobile applications) process technology that achieved these results addresses applications requiring both high speed and low leakage power. Using various design signoff conditions, ARM A9 at TSMC 28HPM delivers performance speed range from 1.5 GHz to 2.0 GHz, suitable for mobile computing, and up to 3.1 GHz for high-performance uses. With its wide performance-to-leakage coverage, the 28 nm HPM process was developed for devices targeting networking, tablet and mobile consumer product applications.

Third GK104-based Single GPU Graphics Card SKU Detailed

After GeForce GTX 680, which has all components of the 28 nm GK104 enabled, a dual-GPU GeForce GTX 690, which features two of these chips, and the GeForce GTX 670, NVIDIA is readying its third single-GPU GK104-based SKU. We know from older reports that this SKU could be named GeForce GTX 660 (Ti). A fresh report suggests that it will be carved out by disabling an entire graphics processing cluster (GPC) on the GK104 silicon, resulting in a CUDA core count of 1152; reducing the memory bus width of 192-bit GDDR5; and most likely reducing the ROP count to 24. This SKU could be used to capture a price point of around US $249, targeting AMD's Radeon HD 7800 series.

Source: VideoCardz

Reference NVIDIA GeForce GTX 670 Graphics Card Pictured

Here is the first picture of an NVIDIA reference design GeForce GTX 670. For the most part, its design will resemble that of reference design GTX 680. The card pictured below is said to have had Leadtek branding, which later got removed. GeForce GTX 670 is carved out of 28 nm GK104 silicon by disabling one of the card's eight SMX units, resulting in a CUDA core count of 1344. Its clock speeds are lower than those of the GTX 680, with around 950 MHz core base clock, and core boost clock a little over 1 GHz. It features 2 GB of memory across a 256-bit wide GDDR5 memory interface. The latest price speculation puts it at US $399-$429.

Source: VideoCardz 1, 2

NVIDIA Credits Close Collaboration with TSMC for Kepler's Energy Efficiency

Despite the fact that NVIDIA is frantically seeking out other semiconductor foundries for high-volume manufacturing its 28 nm chip designs, and despite some looming irritants, NVIDIA appears to value its relationship with TSMC highly. NVIDIA's senior vice president for Advanced Technology Group Joe Greco, in a recent company blog post, credited close collaboration with TSMC for the stellar energy-efficiency (performance/Watt) figures NVIDIA's Kepler architecture has been able to achieve.

"The advancement that TSMC offered was a new optimized process technology. Kepler is manufactured using TSMC’s 28nm high performance (HP) process, the foundry’s most advanced 28nm process which uses their first-generation high-K metal gate (HKMG) technology and second generation SiGe (Silicon Germanium) straining," read the blog post. "Using TSMC’s 28nm HP process enabled us to reduce active power by about 15 percent and leakage by about 50 percent compared to 40nm, resulting in an overall improvement in power efficiency of about 35 percent (see charts)."

Club 3D Releases Radeon HD 7870 JokerCard Graphics Card

Club 3D proudly presents the Club 3D Radeon HD 7870 jokerCard graphics card. With PokerSeries Club 3D offers a new level of special gamecards that delivers the best performance, newest features and best coolers. The jokerCard present our highest demands. Get ready for the future with 28 nm GPU technology, Graphics Core Next Architecture, AMD App Acceleration and support for Ultra HD 4096p resolutions and PCI Express 3.0.

If you expect above average performance of your Graphics card, Club 3D CoolStream High Performance Cooling Technology is just the kind of high performance that you have been looking for. Club 3D CoolStream features high performance heatpipes that keeps the components cool and outperforms standard cooling solutions. Transferring heat from the center area to each fin, ensuring enhanced heat dissipipation. The result is a dramatic increase of performance for your gaming and multimedia experience.

NVIDIA Releases GK107-based GT 630, GT 645 and 3 GT 640 Variants to OEMs

NVIDIA released its first desktop graphics cards based on its 28 nm GK107 silicon, in as many as three models, the GeForce GT 630, GT 640, GT 640 (second variant). Apart from these, NVIDIA appears to have launched two more models, one labeled GT 640, and another GT 645, which are based on previous generation GF116 and GF114, respectively. These new SKUs are available only to OEM partners, who will implement them in their new desktop PC designs.

Of the five new SKUs, the GT 630 and GT 640 (28 nm) are most interesting, as they are based on the GK107 silicon, with as many as 384 CUDA cores, and TDP as low as 50W. The GT 630 is a single-slot, low-profile graphics card with 384 CUDA cores, and a 128-bit wide GDDR5 memory interface, 875 MHz GPU clock speed, and 891 MHz memory clock speed. The GT 640 (28 nm) features different clock speeds. The specifications may seem confusing to the end user, but then they really don't concern people who buy retail-channel graphics cards. NVIDIA and AMD design OEM-specific SKUs completely à la carte, to OEM partners' requirements.


Source: VideoCardz

NVIDIA Licenses Integrated, OV-Tolerant I/O and ESD Tech. from Sofics and ICsense

Sofics bvba of Gistel, a leading provider of ESD solutions for ICs, and ICsense of Leuven, a prominent designer of analog, mixed-signal, and high-voltage ICs and turnkey ASICs, today announced that NVIDIA has licensed their integrated ESD and I/O technology to provide a stable 3.3V I/O with robust ESD protection on its Icera modem processors that use 1.8V transistors.

The license includes customized ESD solutions from Sofics and ICsense’s overvoltage-tolerant I/Os. These solutions are based on a novel circuit technique proven in TSMC 0.18 um, 40 nm, and 28 nm processes that allows I/Os to handle more than 2X the voltage of the transistors on the chip.

AMD Chooses Computex 2012 as Radeon HD 7990 Launchpad

Even as NVIDIA is on the verge of unveiling its GeForce GTX 690 dual-GPU graphics card, at GeForce LAN Shanghai, AMD is in no hurry. Its competitive graphics card to the GTX 690, the Radeon HD 7990 "New Zealand", will be kept under the wraps till Computex 2012 (early June), DonanimHaber learned. Radeon HD 7990 will pack two completely unlocked 28 nm "Tahiti" GPUs, a total of 4,096 Graphics CoreNext stream processors, 6 GB of GDDR5 memory, and the ability to drive 6-monitor Eyefinity, out of the box.

Source: DonanimHaber

NVIDIA Wants 450 mm Wafers, Seeking Foundry Partnership with GlobalFoundries, Samsung

NVIDIA is formulating a long-term chip manufacturing strategy that will see its interests secure by the time chip manufacturing has moved on to 14 nm (which follows 20 nm and today's 28 nm), which could arrive around 2015. Chip manufacturing by foundry partners is a potentially major irritant for NVIDIA, which wants to see wafer sizes getting increased from the current 300 mm manufacturing at TSMC, to 450 mm, and fast. TSMC will achieve 450 mm (18-inch) wafer manufacturing capability only by 2015. Another irritant for NVIDIA is TSMC's change in business model, which charges fabless customers "per wafer manufactured", rather than "per working chip yielded", giving them what they perceive to be the shorter end of the stick. NVIDIA is thus rigorously evaluating other foundry partners. We know from a slightly older report that Samsung has sent NVIDIA test chips manufactured at its Austin, Texas facility. There is talk that NVIDIA could also seek partnerships with GlobalFoundries, of which AMD recently relinquished all its stakes on. NVIDIA needs reliable, high-volume foundry partners that can keep it competitive not just with its main business of GPUs, but also a potential gold mine that is application processors.

Source: VR-Zone

AMD Radeon HD 7970M Arrives on 24th

The next "AMD Tuesday" is the coming one, on which the company plans to launch Radeon HD 7970M, its next high-end discrete GPU for notebooks. Codenamed "Thames", the HD 7970M will be based on the 28 nm "Pitcairn" silicon, on which desktop Radeon HD 7800 series, is also based. When launched, the HD 7970M could become the fastest notebook discrete GPU, since NVIDIA's fastest discrete notebook GPU, and the GeForce GTX 675M are based on previous-generation 40 nm GF114, over which Pitcairn already established a performance lead, in the desktop front. We are hearing that notebook vendors already have their designs based on this chip ready in the pipeline.

Source: VR-Zone

ASUS Announces the GeForce GTX 680 DirectCU II TOP

The ASUS GeForce GTX 680 DirectCU II TOP graphics card delivers a true flagship product for dedicated PC gamers and performance enthusiasts. The TOP-selected 28 nm NVIDIA GeForce GTX 680 GPU has been overclocked by ASUS to 1201 MHz to boost frame rates in games, offering users 143 MHz over reference. Its ASUS-designed DirectCU II thermal design runs 20% cooler than stock, while the twin 100 mm fans keep noise at bay with 14 dB quieter operation.

ASUS has added 10-phase DIGI+ VRM digitally regulated power delivery with 30% noise reduction, working in tandem with durable Super Alloy Power components that last 2.5 longer than reference. Users can tap the greater overclocking and overvolting capabilities of the card through both the hardware-level VGA Hotwire and the software-level GPU Tweak utility. Also released is the ASUS GeForce GTX 680 DirectCU II OC edition, with a 1019 MHz core capable of a 1084 MHz boost clock. This card uses the same DirectCU II cooler and PCB as the TOP version.

NVIDIA Approaching Other Foundries than TSMC for 28 nm Production

NVIDIA, along with Qualcomm, is reportedly in talks with foundries other than TSMC, for manufacturing of its new 28 nm chips. Despite the fact that TSMC is ramping up its 28 nm capacity at a breakneck pace, NVIDIA is seeing a shortage of production that could affect its competitiveness. An interesting revelation here is that NVIDIA has begun sampling its GPUs on Samsung's 28 nanometer fab process. Samsung uses this process for contract-manufacturing of ARM application processors. Other foundries with proven 28 nm manufacturing capability include UMC.

Source: DigiTimes

TSMC 28 nm Capacity Ramp-Up Faster Than Older Processes

With launches of new-generation GPUs by NVIDIA and AMD, and new ARM application processor designs by various industry players, TSMC is under pressure to ramp up its production capacity for its new 28 nanometer note. DigiTimes research suggests that this ramp-up is going at a faster rate than older processes such as 40 nm and 65 nm nodes (when those were new). Digitimes Research analyst Nobunaga Chai claims that the 28 nm node started generating revenues in Q4, 2011, and sales ratio reached 5% in the following quarter. It is anticipated to see TSMC significantly ramp up its 28nm production capacity later in 2012, Chai believes.

Source: DigiTimes

ARM Announces Cortex-A15 Quad-Core Hard Macro

ARM today announced the availability of a high performance, power-optimized quad-core hard macro implementation of its flagship Cortex-A15 MPCore processor.

The ARM Cortex-A15 MP4 hard macro is designed to run at 2 GHz and delivers performance in excess of 20,000 DMIPS, while maintaining the power efficiency of the Cortex-A9 hard macro. The Cortex-A15 hard macro development is the result of the unique synergy arising from the combination of ARM Cortex processor IP, Artisan physical IP, CoreLink systems IP and ARM integration capabilities, and utilizes the TSMC 28HPM process.

ARM Expands Processor Optimization Packs for TSMC 40 nm and 28 nm Process Variants

ARM today announced the availability of a significantly expanded lineup of ARM Processor Optimization Pack (POP) solutions for TSMC 40 nm and 28 nm process technologies targeting a range of ARM Cortex processors. At least nine new POP configurations targeting Cortex-A5, Cortex-A7, Cortex-A9 and Cortex-A15 processor cores will be released. An essential element of ARM's comprehensive implementation strategy, POPs enable ARM partners to quickly close timing of single-, dual- and quad-core implementations across a broad envelope of power, performance and area optimization points. This solution reduces risk and improves time-to-market in the development of Cortex processor-based Systems-on-Chip (SoCs) with partners achieving competitive results in as little as six weeks.

At the leading-edge 28 nm HPM (high performance for mobile) and 28 nm HP (high performance) process variants, ARM is launching new POPs for the Cortex-A9 core as well as the first POPs for ARM's newest Cortex-A7 and Cortex-A15 processors. Since the Cortex-A7 and Cortex-A15 cores are used in tandem as ARM's big.LITTLE energy-efficient processing solution, the addition of POPs for both cores assures a complete solution for big.LITTLE implementations. ARM's lead licensee for the Cortex-A15 POP for TSMC 28 nm HPM is progressing toward the tape out of its first chip in the coming months.

NVIDIA GK106 GPU Detailed

Following the launch of a couple of more GK104-based SKUs, namely GeForce GTX 670 Ti, and GeForce GTX 670, some time in May; NVIDIA will launch its third (after GK104 and GK107) Kepler architecture-based silicon, codenamed GK106. GK106 will make up sub-$200 SKUs, and succeeds the GF116, on which SKUs such as the GeForce GTX 550 Ti, are based. The GK106 will make up at least one known desktop SKU, called GeForce GTX 660.

Its specifications are listed below.

TSMC Faces Acute 28 nm Capacity Shortage

Taiwan's premier semiconductor foundry, TSMC, is reportedly facing an acute shortage in 28 nm manufacturing capacity. This shortage is expected to relax in Q3, 2012, according to sources. Qualcomm, AMD, and NVIDIA are the three biggest patrons of the 28 nm process, Qualcomm uses it to manufacture performance ARM application processors, while AMD and NVIDIA use it for their new generation GPUs. Although launched at the very end of Q4 2011, AMD's HD 7970 shipped a relatively small volume due to low manufacturing capacity. NVIDIA launched only two 28 nm GPUs, the GTX 680, and GT 640M, and has had to delay launch of more models, due to this reason, according to source. Qualcomm, meanwhile, shifted some of its orders to UMC.

Source: DigiTimes

ELSA Rolls Out its Gladiac GeForce GTX 680 Graphics Card, Finally

Japanese company ELSA, which specializes in NVIDIA-powered graphics cards, known more for selling Quadro professional graphics, finally unveiled its Gladiac GeForce GTX 680 graphics card. This launch comes nearly 15 days after NVIDIA unveiled the new GPU, and even as Japanese PC enthusiasts queued up outside stores at midnight to get their GTX 680 graphics cards sold by other AIC partners (NVIDIA NDA went up at midnight March 23, in Japan).

ELSA's Gladiac GeForce GTX 680 brings just the NVIDIA-reference design card to the table. It even sticks to NVIDIA's reference clock speeds of 1006/1056/1502 MHz (core-base/core-boost/memory-actual). Making use of a 28 nm GK104 GPU based on the "Kepler" architecture, the GeForce GTX 680 packs 1536 CUDA cores, and 2 GB of GDDR5 memory across a 256-bit wide memory interface, with 192 GB/s memory bandwidth. ELSA GeForce GTX 680 goes for 64,800 JPY (US $787.4), while graphics cards from other AIC vendors are typically priced around 57,000 JPY in the Akihabara shopping district.

Source: Hermitage Akihabara

Sapphire Radeon HD 7970 Toxic 6 GB Detailed

When we saw glimpses of Sapphire Radeon HD 7970 Toxic 6 GB graphics card, we knew Sapphire was prioritizing on aesthetics a lot. That turns out to be the case, as the first pictures of this monstrosity reveal. The PCB and cooler are designed from scratch, by Sapphire. The PCB accommodates 6 GB of memory in 24 GDDR5 memory chips, 12 on each side. To power the factory-overclocked 28 nm "Tahiti" GPU and 24 GDDR5 7 GT/s memory chips takes some really strong VRM. Sapphire implemented an 8+3 phase power supply, that makes use of solid-state chokes (don't whine under stress), and International Rectifier DirectFETs. The VRM draws power from two 8-pin PCIe power connectors.

More details, and a benchmark follow.

AMD Radeon HD 7990 Reference Board Pictured, Specs Confirmed in GPU-Z Screenshot

Admittedly, this is a terrible day for news on unannounced GPUs, but we rushed it in anyway. Here are the first board shots of AMD's next-generation dual-GPU graphics card, the Radeon HD 7990 (codename: "New Zealand"). Sources told us that AMD working overtime to release this SKU, to restore performance-leadership of the Radeon HD 7900 series. The dual-GPU card, according to the specifications at hand, is bearing AMD's coveted "GHz Edition" badge, its core is clocked higher than that of the HD 7970.

But first, the board shot. Pictured below is the first picture of this beast. Right away you'll question its authenticity for using a 70 mm fan instead of a lateral-flow blower, but that design change serves a purpose. Despite its high performance, the previous-generation Radeon HD 6990 was plagued with user complaints of high noise. That's because a single, normal-sized lateral-flow blower was positioned in the center, blowing through two sets of aluminum channels, at a very high speed. With the HD 7990, AMD on the other hand, borrowed the ventilation design of NVIDIA's GeForce GTX 590, to a large extant. It reused the fan found on reference-design HD 7850 and HD 7770, and placed it in middle of two heatsinks.
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