News Posts matching "3DS"

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Buffalo Intros RMSD-C6SA Class6 MicroSDHC Cards

Buffalo Japan introduced the RMSD-C6SA series of Class6 microSDHC cards. Pictured below, the cards are available in capacities of 4 GB (RMSD-4GC6SA), 8 GB (RMSD-8GC6SA), 16 GB (16GC6SA RMSD), and 32 GB (RMSD-32GC6SA). As Class6 devices, transfer rates of at least 6 MB/s are guaranteed. The packages include adapters that convert these cards into standard-size SDHC cards. Compatibility with devices such as the Nintendo Wii, 3DS, DSi, and DSii, is guaranteed. The 4, 8, 16, and 32 GB variants are priced at 2,880 JPY (US $34.6), 3,880 JPY (US $46.7), 8,880 JPY (US $107), and 17,880 JPY (US $215), respectively.

Source: Hermitage Akihabara

DDR4 May Use 3D Stacking Technology

Micron Technology, one of the biggest DRAM companies, has announced that it's working the JEDEC standards organization for computer memory, to standardize a new DRAM interface and die-stacking technology called three-dimensional stacking, or 3DS, which may be incorporated into the upcoming DDR4 standard. X-bit labs has a nice summary of how 3DS works:
The idea behind 3DS is to use specially designed and manufactured master-and-slave DRAM die, with only the master die interfacing with the external memory controller. 3DS technology uses optimized DRAM die, single DLL per stack, reduced active logic, single shared external I/O, improved timing, and reduced load to the external world. This combination of features can improve timing, bus speeds, and signal integrity while lowering both power consumption and system overhead for next-generation modules, according to Micron.
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