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Gigabyte Announces GeForce GTX 460 Super Overclock Graphics Card

GIGABYTE, a leading manufacturer of motherboards and graphics cards, introduces a powerful new addition to its Super Overclock Series: GTX 460 SOC (GV-N460SO-1GI). To qualify for Super Overclock Series, a GPU must go through GIGABYTE’s innovative GPU Gauntlet Sorting process and it must be equipped with Ultra Durable VGA or VGA+ boards. Designed specifically for overclocking competition and gaming battle, GIGABYTE’s secret weapon GTX 460 Super Overclock Edition is built with NVDIA GeForce GTX 460 GPU.

Based on 40nm processor and advanced GDDR5 memory technology, the powerful new GPU consists of ground-breaking features including Microsoft DirectX 11 and NVIDIA PhysX which leads to incredibly immersive HD gaming experience and unrivaled performance. GV-N460SO-1GI also features WINDFORCE 2X, 7 phase PWM design, OC Guru graphic card smart tuner and voltage read point.

Gigabyte Launches GeForce GT 430 as a Brand New Home Theater Solution

GIGABYTE Technology Co. LTD, a leading manufacturer of motherboards and graphics cards, today presents the latest entry level graphics card GV-N430OC-1GL. The GV-N430OC-1GL is built on the NVIDIA 40nm process; supports DirectX 11, with 128 bit DDR3 high speed graphics memory and higher default GPU clock. GV-N430OC-1GL provides the best HD gaming and entertainment experience.

GV-N430OC-1GL features GIGABYTE Ultra Durable 2 components to guarantee the lowest operating temperature and longer product life. For cooling solution, GIGABYTE designs brand new low profile inclined dual fan for the entry level graphics card. The inclined dual fan doubles cooling capability and offers extreme silent environment. It also enlarges air channel and minimizes flow turbulence, reducing noise of the operating fan to offer users high quality multi-media enjoyment without interference.

Transcend Rolls Out High Density DRAM Modules with 2Gbit DDR3 Chips

Transcend Information Inc., a worldwide leader in memory and storage products, today launched three new 4GB DDR3 DRAM modules using high-density 2-gigabit (2 Gbit) DDR3 chips: a DDR3-1333 MHz Long-DIMM, a DDR3-1333 MHz SO-DIMM, and a DDR3-1066 MHz SO-DIMM.

Transcend’s 4GB 240-pin DDR3-1333 Long-DIMM for desktops runs at 1333 MHz with latencies of 9-9-9, while the 4GB DDR3-1333 SO-DIMM notebook memory module operates at 1333 MHz with latencies of 9-9-9, and the 4GB DDR3-1066 SO-DIMM runs at 1066 MHz with CL7 timings. Each module is optimized for stable 1.5V operation and is made with high density energy-efficient 2 Gbit chips, enabling conscientious users to take advantage of the best power-performance ratio available for their desktop or laptop computer.

MSI Launches the N480GTX Twin Frozr II Graphics Card

Internationally renowned graphics card and mainboard manufacturer MSI officially launches the N480GTX Twin Frozr II graphics card. Built on the latest 40nm manufacturing process, the N480GTX Twin Frozr II is equipped with 1536MB of high-speed GDDR5 memory. The exclusive, award-winning Twin Frozr II thermal design meets the performance and thermal demands of graphics enthusiasts.

Along with various exclusive technologies from NVIDIA such as 3D Vision Surround, PhysX, and CUDA, the N480GTX Twin Frozr II allows games to be played at the highest resolutions. The Twin Frozr II dual-fan thermal design from MSI reduces temperature by 14°C and noise by 4dB when compared to the the reference design. Without a doubt, the N480GTX Twin Frozr II is the only and best solution for superb performance, low operating temperature, and quiet performance.

Elpida Develops Industry's Smallest, Most Efficient 30nm Process 2-Gb DDR3 Chip

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 30nm process 2-gigabit DDR3 SDRAM. The new 2-gigabit DDR3 SDRAM used 30nm-level advanced process migration technology to create the DRAM industry's smallest-level 2-gigabit DDR3 SDRAM. It achieves 45% more chips per wafer compared with Elpida's 40nm process products. Also, the new process design developed by Elpida will help contain rising chip costs associated with process migration. As a result, the 2-gigabit DDR3 is slated to become an extremely cost-competitive product.

Elpida's new chip meets the JEDEC specs for the high-speed DDR3-1866 and 1.35V low-voltage, high-speed DDR3L-1600 memory chips, both expected to become mainstream industry products in 2011. Also, the 30nm DDR3 SDRAM is eco-friendly. As a DDR3 SDRAM it achieves one of the industry's lowest levels of electric current usage (approximately 15% less operating and approximately 10% less standby usage compared with Elpida's 40nm products), which contributes to lower PC and digital consumer electronics power consumption.

Gigabyte Officially Releases Radeon HD 5770 Silent Cell Graphics Card

GIGABYTE TECHNOLOGY Co., Ltd., a leading manufacturer of motherboards and graphics cards today is pleased to launch the latest in-house designed GIGABYTE GV-R577SL-1GD, featuring GIGABYTE’s own Ultra Durable VGA Technology and silent-cell cooling design. GIGABYTE’s GV-R577SL-1GD is built on the highly anticipated ATI Radeon HD 5770 Series GPU, which utilizes the latest 826 million transistors on 40nm fabrication process and GDDR5 memory. GIGABYTE GV-R577SL-1GD is equipped with Microsoft DirectX 11, ATI Eyefinity Technology, ATI Stream technology, ATI CrossFireX multi-GPU support, UVD 2 and PowerPlay, setting a new standard for HD gaming performance.

The GIGABYTE GV-R577SL-1GD features GIGABYTE’s own Ultra Durable VGA Technology, which can provide outstanding overclocking capability, lower GPU temperature, and excellent power efficiency. GIGABYTE’s unique technology Ultra Durable VGA features 2 oz copper PCB board, Samsung and Hynix memory, Japanese solid capacitor, Ferrite /Metal Core Chokes, and Low RDS (on) MOSFET. Compared with traditional graphics accelerators, Ultra Durable VGA graphics accelerators can lower GPU temperature by 5%~10%, decrease power switching loss by 10%~30%, and increase overclocking capability by 10%~30%. GIGABYTE Ultra Durable VGA graphics accelerator GV-R577SL-1GD can provide truly “high-performance” and “green” graphic card solutions.

Elpida Develops Smallest 2-Gigabit LPDDR2 Memory Chip

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had developed a 2-gigabit DDR2 Mobile RAM, the DRAM industry's smallest LPDDR2 chip. The new DDR2 is expected to become the main product manufactured by the 40nm process line at Elpida's Hiroshima Plant (the 40nm line is currently undergoing a capacity expansion).

The new 2-gigabit DDR2 Mobile RAM was developed to target the smart phone and tablet PC markets. In addition to featuring low operating voltage of 1.2V it achieves a 1066Mpbs high-speed data transfer rate and can reach 8.5GB/second for a 64-bit system configuration. Because it uses roughly 30% less operating current compared with Elpida's existing 50nm products the new Mobile RAM is an eco-friendly DRAM that contributes to extending the operating time of mobile devices.

TSMC Begins Construction on Gigafab in Central Taiwan

TSMC today held a groundbreaking ceremony in Taichung’s Central Taiwan Science Park for Fab 15, TSMC’s third 12-inch (300mm) Gigafab and an important milestone in the company’s pledge to expand investment in Taiwan.

The groundbreaking ceremony was conducted by TSMC Chairman and CEO Dr. Morris Chang. “Science Parks have played a critical role in the development of Taiwan’s high-tech industry. They have also provided important support to TSMC as we grew to become a leading global semiconductor company with its roots in Taiwan,” Dr. Chang said. “Over the past two decades, TSMC has flourished in the Hsinchu and Tainan science parks, and our groundbreaking for Fab 15 today sets the foundation for TSMC to reach new heights.”

Samsung Ramping Up DDR3 Production to Accommodate Demand from Server Manufacturers

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced that it is ramping up 40-nm class production of high-density DDR3 memory chips to accommodate increased demand in server applications. The recent launch of Intel Corporation’s Intel Xeon processor 5600 Series, as well as the introduction of Xeon 7500 processors support the growing industry demand for enhanced performance and low power platform solutions, especially when paired with DDR3 memory.

Samsung’s DDR3 – the industry best-selling DDR3 – enables OEMs to use up to 192 gigabytes (GBs) on a Xeon 5500 platform (16GBx12) with at least a 73 percent improvement in power consumption at 1.35 volts, when accompanied by the Xeon 5600 processor. DDR3 has double the memory bandwidth of DDR2, with speeds up to 1333 Megabits per second (Mbps). With the new Xeon 7500 platform, OEMs can use up to 1 terabyte per 4-socket system and with more sockets, can easily scale to memory densities 2 TBs and higher. Later this year, Samsung’s 4 Gigabit (Gb) DDR3 chips and modules also will be available for use with the latest Xeon platforms and processors.

Samsung Ships Industry’s First Multi-chip Package with a PRAM Chip

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced the industry’s first multi-chip package (MCP) with PRAM – for use in mobile handsets beginning later this quarter.

The 512 megabit Samsung PRAM in the MCP is backward compatible with 40 nanometer-class* NOR flash memory in both its hardware and software functionality, allowing mobile handset designers the convenience of having multi-chip packaging fully compatible with past stand-alone PRAM chip technology. PRAM is expected to be widely embraced by next year as the successor to NOR flash in consumer electronics designs, to become a major memory technology.

Elpida Completes Development of 4-Gigabit DDR3 SDRAM, Industry's Highest Density DDR3

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 4-gigabit DDR3 SDRAM, the highest density DDR3 DRAM in the DRAM industry.

Based on an advanced 40nm process, the new eco-friendly DRAM uses about 30% less power compared to two 40nm process 2-gigabit DDR3 SDRAMs (4-gigabit equivalent) and enables servers, data centers and other large capacity memory systems to reduce power consumption. It can operate at not only standard DDR3 1.5V but also 1.35V to allow greater system power savings.

Samsung First to Begin Shipping 40nm-class, 32-Gigabyte Memory Module for Servers

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun shipping samples of the industry’s highest-density memory module for server systems. The 32 gigabyte (GB) module has been designed for use in advanced servers, which require high-density and high-performance features at low-power consumption levels.

According to Soo-In Cho, president and general manager of Samsung Electronics Memory Division, “Samsung continues to set the pace in advanced memory for high-end server applications by offering 40nm-class 32GB memory modules to reach previously unattainable levels of system capacity.In just 10 months, Samsung has now secured the best competitive advantage with the broadest portfolio of 40nm-class DDR3 based memory solutions in the industry since the 40nm-class DRAM was first produced last July."

Sapphire Introduces Radeon HD 5850 TOXIC 2 GB Graphics Card

SAPPHIRE Technology has just announced a new version of its successful HD SAPPHIRE HD 5850 TOXIC Edition with a larger frame buffer size of 2GB. The SAPPHIRE HD 5850 TOXIC series are SAPPHIRE original designs based on the latest 40nm graphics architecture from the ATI division of AMD. They feature 1440 stream processors and 72 texture units delivering the fastest performance in class as well as supporting ATI Stream technology.

Designed for the enthusiast or demanding user, the SAPPHIRE HD 5850 2G TOXIC Edition is factory overclocked to 765MHz core and has 2GB of high speed DDR5 memory clocked at 1125MHz (4500MHz effective). SAPPHIRE’s World leading Vapor-X technology not only allows the cards to run as much as 15 degrees C cooler and 10dB quieter than the standard models, it provides additional headroom for further performance tuning (overclocking).

GIGABYTE Launches Latest Ultra Durable VGA Based Radeon HD 5800 Series

GIGABYTE TECHNOLOGY Co., Ltd., a leading manufacturer of motherboards and graphics cards today is pleased to launch the latest in-house designed GIGABYTE GV-R5800 series graphics cards featuring GIGABYTE’s own Ultra Durable VGA Technology which can provide outstanding overclocking capability, lower GPU temperature, and excellent power efficiency. Building on the ultimate kernel of ATI Radeon HD 5800 art-of-the-state single-GPU architecture and advanced GDDR5 memory technology, the GIGABYTE GV-R587UD-1GD, GV-R585OC-1GD and GV-R583UD-1GD deliver seamless frame rates with massive graphics processing muscle for any tomorrow’s demanding applications. In addition, the GIGABYTE the GIGABYTE GV-R587UD-1GD, GV-R585OC-1GD and GV-R583UD-1GD feature a wide range of the latest graphics technologies, including native DispalyPort, native Golden-Plated HDMI, TeraScale graphics engine, ATI CrossFireX, and ATI Stream, to deliver supreme scalability so gamers can take their games to new heights.

SAPPHIRE Releases Special Edition Radeon HD 5830 Graphics Cards with MW2 Bundle

SAPPHIRE Technology has just released two Special Edition graphics cards bundled with the highly acclaimed game Call of Duty - Modern Warfare 2.

The SAPPHIRE HD 5830 is a new graphics card based on the latest 40nm graphics architecture from the ATI division of AMD. It features 1120 stream processors and 56 texture units. With its core clocks of 800MHz and DDR5 memory with speeds of 1000MHz (4GHz effective), it represents a new value proposition in the successful HD 5800 series.

Club 3D Announces its Radeon HD 5830 Overclocked Edition Graphics Card

Club 3D B.V. today introduces the Radeon HD 5830 graphics cards as the most affordable addition to award winning Radeon HD 5800 series. The Club 3D Radeon HD 5830 fills the gap between HD 5850 and HD 5770 graphics cards to fulfill the demand for HD 5800 series features at a lower price point.

Club 3D Radeon HD 5830 graphics card features DVI, HDMI and Display Port output to support ATI Eyefinity Technology for an incredibly immersive HD gaming and computing experience and a maximized field of view with up to three displays. Perform tasks on your PC faster with ATI Stream technology and accelerated everyday applications. Step now into the world of DirectX 11 gaming and play the first available games, with unrivalled visual quality, astonishing realism and ultra-fast frame rates to dominate the competition.

HIS Announces its Radeon HD 5830 iCooler V Graphics Card Series

Today HIS unleashed the revolutionary new HIS Radeon HD 5830 iCooler V 1GB GDDR5 Turbo and Standard version. Combined with the high performance dual slot iCooler V and stellar overclocking performance, it delivers most affordable high performance graphics with ATI Eyefinity technology supported. Prepare to plug in for a ridiculously immersive HD gaming experience unlike anything you’ve ever seen.

iCooler V features a high performance dual slot cooler. It comes with excellent cooling setup, which transfer heat effectively from the GPU to the internal fins around the central fan. Thanks to the elegant design and smoothness of iCooler fan shroud, massive amount of cool air is drawn from the central cooler to cool down the internal fins directly.

Samsung Expands Green Line-up with Industry’s First Volume 40nm-class 4Gigabit DDR3

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry’s first low-power (green) four gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology. The high-density memory is expected to bring significant power savings to data centers, server systems and high-end notebooks.

“When our 40nm-class DDR3 was first introduced last July, we were well ahead of the curve for high density, high performance DDR3,” said Dong-Soo Jun, executive vice president, memory marketing, Samsung Electronics. “Now, in just seven more months, we have introduced an ultra-low power ‘Green Memory’ – the 4Gb DDR3, which is double the density of its predecessor. At a module density of 16-gigabyte (GB), the 4Gb based module can save 35 percent in power consumption, to support customer requirements for more energy-efficient designs.”

Sapphire Announces its Low Profile Radeon HD 5570 Accelerators

SAPPHIRE Technology is now shipping a new family of graphics cards in the highly successful HD 5000 series. The SAPPHIRE HD 5570 is a new low profile model aimed at the mainstream market, whist sharing many of the exciting features of the latest high end series.

The SAPPHIRE HD 5500 series is based on the latest graphics architecture from the ATI division of AMD, the second generation of GPU to be built in its 40nm process. It supports the advanced graphical features of Microsoft DirectX 11, and delivers superb video clarity and visual effects, whilst consuming very low power levels.

Samsung Develops Most Advanced Green DDR3 DRAM, Using 30nm-class Technology

Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced that the industry’s first 30-nanometer-class DRAM has just successfully completed customer evaluations, in two gigabit (Gb) densities. With DDR3 SDRAM becoming the predominant main memory this quarter, Samsung’s aggressive advancement in process technology will raise productivity and expedite dissemination of high performance, 1.5V and 1.35V DDR3 for servers, desktops and notebook PCs.

“Our accelerated development of next generation 30nm-class DRAM should keep us in the most competitive position in the memory market,” said Soo-In Cho, president, Memory Division, Samsung Electronics.

TSMC Claims 40 nm Yield Issues Resolved

TSMC, one of the world's major semiconductor foundries, said that it has resolved all issues pertaining to proper yields of chips built on the 40 nanometre node. During a company event on the 19th, Mark Liu, Senior VP of Operations, said that the quality of production on the 40 nm node is almost on par with the 65 nm one. Liu stated that the chamber matching problems that had impacted yield rates for the company's 40nm node have been resolved.

TSMC caters to graphics processor giants NVIDIA and AMD, with both having designs of 40 nm performance graphics processors with multi-billion transistor counts. AMD has been selling 40 nm GPUs made by TSMC since its previous generation ATI Radeon HD 4770, it currently makes all its Radeon HD 5000 series GPUs on the node. NVIDIA is poised to release its first billion transistor 40 nm GPU, the GF100, in its consumer GeForce brand later this quarter.

In addition to this, TSMC has just finished building a new factory at the Hsinchu Science Park (HSP), Taiwan, part of its Fab 12. The new facility will be able to commence volume production of 28 nm products as early as by Q3 2010.Source: DigiTimes

Gigabyte Unleashes Next-Gen Mainstream VGA Powered by Radeon HD 5600 Series GPUs

GIGABYTE TECHNOLOGY Co., Ltd., a leading manufacturer of motherboards and graphics cards today is pleased to announce their latest GV-R5600 series graphics cards. GIGABYTE’s GV-R567OC-1GI and GV-R567D5-512I are built on the highly anticipated ATI Radeon HD 5600 Series GPUs ─which utilizes the latest 627 million transistors on 40nm fabrication process and GDDR5 memory. GIGABYTE GV-R567OC-1GI and GV-R567D5-512I provide Microsoft DirectX 11, ATI Stream technology, ATI CrossFireX multi-GPU support, UVD 2 and PowerPlay. GIGABYTE GV-R5600 series are also equipped with GIGABYTE unique features including Ultra Durable 2 technology, and native HDMI port for HD gaming and Blue-ray movie playback.

The GIGABYTE GV-R567OC-1GI and GV-R567D5-512I feature ATI's latest 2nd Generation TeraScale graphics engine, boasting the power of more than 620 GigaFLOPS with 400 stream processors respectively. With 1GB and 512MB GDDR5 memory, the GV-R567OC-1GI and GV-R567D5-512I provide twice the data per pin of GDDR3 memory at the same clock speeds. Utilizing ATI Stream Technology, end-user can easily unleash the massive parallel processing power of GPU for physics, artificial intelligence, stream computing and ray tracing calculations, and tackle demanding tasks like video transcoding with incredible speed.

New NVIDIA Tegra Processor Powers The Tablet Revolution

NVIDIA today launched its Next Generation Tegra, the world’s first processor for the mobile web, specifically designed for the high-resolution needs of tablets. Consumers have been waiting for a truly portable, high-resolution, no-compromise Internet experience. NVIDIA’s new Tegra processor delivers that by combining lightning-quick browsing, streaming 1080p video and Adobe Flash Player 10.1 acceleration with an immersive 3D user interface and days of battery life.

“Without question, 2010 is going to be year of the tablet,” said Tim Bajarin, President, Creative Strategies, Inc. “The new NVIDIA Tegra processor has a unique feature set critical for tablets -- fast web browsing with fully rendered pages, uncompromised graphics, snappy user interface and HD video - all with the battery life we’ve only seen with cell phones.”

AMD Unveils World’s First DirectX 11 Compliant Mobile Graphics

AMD today introduced its lineup of next-generation DirectX 11-capable ATI Mobility Radeon Premium graphics, including ATI Mobility Radeon HD 5870 graphics, the highest performance graphics for notebooks in the world.1 The entire family of DirectX 11-capable graphics consists of ATI Mobility Radeon HD 5800, ATI Mobility Radeon HD 5700, ATI Mobility Radeon HD 5600 and ATI Mobility Radeon HD 5400 series graphics. This top-to-bottom family of Direct 11-capable notebook graphics introduces compelling new features including ATI Eyefinity multi-display technology, bringing powerful visual gaming and computing innovation to the notebook PC. Notebooks featuring the new graphics technology are previewed at the 2010 Consumer Electronics Show (CES) in the VISION Experience Center, located in the Grand Lobby (GL-8 and GL-10) of the Las Vegas Convention Center.

“Six months ago AMD claimed the title of undisputed technology leader in desktop graphics, and now we also offer powerful mobile graphics processors for notebooks to go with our market leadership in that segment,” said Rick Bergman, senior vice president and general manager, Products Group, AMD. “Once again, AMD changes the game both in terms of performance and experience. AMD innovations now give notebook users full DirectX 11 support, eye-opening ATI Eyefinity technology, superb HD multimedia capabilities, and ATI Stream technology designed to help optimize Windows 7 notebook performance.”

Elpida Begins Mass Production of 40nm 2 Gb DDR3 SDRAM

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that its Hiroshima Plant has begun volume production of 40nm process 2-gigabit DDR3 SDRAMs. Since completing development of the DDR3 SDRAM last October it has taken Elpida only two months to ramp up mass production.

The new 2-gigabit DDR3 SDRAM achieves 44% more chips per wafer compared with Elpida's 50nm DDR3 SDRAM and a 100% yield for DDR3 products that operate at 1.6 Gbps, the fastest speed standard for current DDR3. It also supports high-speed products. Compared with 50nm products, it uses about two-thirds less current and supports 1.2V/1.35V operation as well as DDR3 standard 1.5V, resulting in reduced power consumption of around 50%.

Initially, Elpida plans a phased expansion of 40nm 2-gigabit DDR3 SDRAM mass production at its Hiroshima Plant. In the second quarter of 2010, 40nm process production will also begin at Rexchip, a subsidiary in Taiwan, to increase the manufacture of 40nm process products in order to lower products costs. Depending on conditions in the DRAM market, Elpida may transfer 40nm process technology to foundry partners ProMOS and Winbond to expand production based on this technology to an even higher level.Source: Elpida
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