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Samsung Launches New Slim External DVD Writer for Laptop and Netbook Market

Samsung Electronics Co., Ltd., a worldwide leader in digital consumer electronics and information technology, announced today it will display a prototype of its new slim external DVD writer, the SE-S084D optical disk drive (ODD) at the Treasure Island Hotel in a private product display room during CES 2010. Featuring a more compact footprint and lighter weight than competitive offerings, the new DVD writer also delivers high-performance with a USB power source to eliminate electrical outlet requirements.

“Because netbooks are designed for ultra mobility, they aren’t typically equipped with optical disc drives, which can potentially make booting from a CD or playing a DVD movie a problem,” said John Suh, director of OMS sales and marketing, Samsung Semiconductor, Inc. “But with the lightweight, portable SE-S084D Optical Disc Drive, you have the perfect on-the-go, stand-alone. And thanks to its USB BUS power source, you can write at maximum speed with no outlet in sight.”

MSI Introduces Notebooks Based on Newest Members of Intel Core Family Processors

MSI G-Series and C-Series of laptop computers have reached a new apex in their evolution. The first NBs equipped with Intel’s new generation Calpella platform to be shown at CES 2010, both series come with Intel’s most advanced family of New Core processors and Microsoft's Windows 7 operating system. They also come with cinema-class screens coupled with top-end Surround Sound for maximum audiovisual enjoyment.

CoolIT Announces Four New Innovations with Advanced Liquid Cooling

CoolIT Systems, leaders in advanced liquid cooling technology announced today 4 new products set to revolutionize the computer cooling industry yet again. Following the huge success of the CoolIT Domino that hit the market by storm in 2009, CoolIT have wowed visitors at this year's Consumer Electronics Show, Las Vegas, Nevada with even more innovative, affordable and leading-performance advanced liquid cooling products.

"Liquid cooling is the future" remarked Geoff Lyon, CEO, CoolIT Systems. "The advantages of CoolIT's liquid solutions far outweigh any air-based or competitive liquid cooling product, and at CES this year, we're here to prove that".

CoolIT ECO A.L.C
First up is the CoolIT ECO A.L.C CPU cooler which breaks a world record for the ultimate price/performance cooling benchmark.

AMD Unveils World’s First DirectX 11 Compliant Mobile Graphics

AMD today introduced its lineup of next-generation DirectX 11-capable ATI Mobility Radeon Premium graphics, including ATI Mobility Radeon HD 5870 graphics, the highest performance graphics for notebooks in the world.1 The entire family of DirectX 11-capable graphics consists of ATI Mobility Radeon HD 5800, ATI Mobility Radeon HD 5700, ATI Mobility Radeon HD 5600 and ATI Mobility Radeon HD 5400 series graphics. This top-to-bottom family of Direct 11-capable notebook graphics introduces compelling new features including ATI Eyefinity multi-display technology, bringing powerful visual gaming and computing innovation to the notebook PC. Notebooks featuring the new graphics technology are previewed at the 2010 Consumer Electronics Show (CES) in the VISION Experience Center, located in the Grand Lobby (GL-8 and GL-10) of the Las Vegas Convention Center.

“Six months ago AMD claimed the title of undisputed technology leader in desktop graphics, and now we also offer powerful mobile graphics processors for notebooks to go with our market leadership in that segment,” said Rick Bergman, senior vice president and general manager, Products Group, AMD. “Once again, AMD changes the game both in terms of performance and experience. AMD innovations now give notebook users full DirectX 11 support, eye-opening ATI Eyefinity technology, superb HD multimedia capabilities, and ATI Stream technology designed to help optimize Windows 7 notebook performance.”

LaCie Reveals New Server Technology For Small Businesses with Windows Home Server

LaCie demonstrates a new network storage server based on the Microsoft Windows Home Server platform. The product will be shown for the first time at the CES. This server leverages the success of LaCie’s award winning 5big Network, which features five user-replaceable drives, Gigabit Ethernet, and data protection support for data integrity. The technology demonstration shows that by combining Microsoft and LaCie technologies on a single platform, small business users can enjoy a seamless interface to automatically back up computers to a single server. The server secures their backup both locally and remotely by automatically copying their critical data to the cloud, using LaCie’s Wuala technology.

“LaCie’s network server offers an exciting design and provides plenty of storage options with terabytes of capacity and the ability to back up data from local computers and to cloud-based services,” said Leslie McGuire, Director of Windows Server Marketing at Microsoft. “We’re pleased to have LaCie join us as a Windows Home Server partner.”

OCZ Technology to Showcase Cutting-Edge SSDs and other New Products at CES 2010

OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high-reliability memory and flash-based storage as an alternative to hard disk drives, plans to unveil an array of next-generation solid state drives (SSDs) along with other premium hardware at the 2010 International Consumer Electronics Show to be held January 7-10, 2010, in Las Vegas, Nevada. With its finger on the pulse of emerging and booming markets, OCZ’s impending line of SSDs is designed to optimize entire businesses as well as the computing experiences of everyday consumers.

“For this year’s Consumer Electronics Show, OCZ continues to build on its lineup of SSD solutions designed for enterprise-class applications,” commented Ryan Petersen, CEO of OCZ Technology Group. “We are uniquely positioned as the leading developer of SSDs, which we believe will ultimately replace traditional hard drives. In addition to our robust lineup of 2.5-inch solid state drives, we will be launching new drives at CES with interfaces that include SAS and PCI-E. These interfaces make it easier than ever for enterprise clients to replace expensive-to-maintain, traditional storage media with a higher-performing and more reliable solution.”

EVGA Dual LGA-1366 Motherboard Pictured

The recently surfaced high-end dual socket LGA-1366 motherboard is pictured in full, without its cooling assembly. The picture reveals quite a bit about EVGA's new monstrosity. To begin with, the motherboard is neither ATX, nor EATX in the truest sense. Like the recently announced X58 Classified 4-way SLI which was based on the "XL-ATX" form-factor, this motherboard seems to be 13.58 inches (344.93 mm) long, and about as wide as EATX (330 mm, 13 inches), or maybe a little more.

Each LGA-1366 socket is wired to six DDR3 DIMM slots for triple-channel memory, and is powered by an 8-phase digital-PWM circuit. Each socket further has a 3-phase power circuit for its DIMM slots. The CPU VRM for each socket takes input from an 8-pin ATX, and what appears to be a 6-pin +12V (PCI-E?) connector. The motherboard further takes power from a 6-pin PCI-E power connector apart from the usual 24-pin ATX power connector. Some of these inputs may be redundant and needed only for additional electrical stability to support competitive overclocking.

VIA Group Launches World's First USB 3.0 Hub Controller

VIA Technologies, Inc., a leading innovator of power efficient x86 processor platforms, today unveiled the VIA VL810 SuperSpeed Hub Controller, the industry’s first integrated single chip solution that supports the higher transfer rates of the new USB 3.0 specification.

USB 3.0 (also known as SuperSpeed USB) allows for a maximum data transfer rate of up to 5Gbps, or ten times the throughput available to USB 2.0 based devices. Other enhancements provide for improved interaction between device and host controller, including important advancements in power management.

EVGA Prepares High-end Dual-LGA1366 Motherboard

EVGA is keeping up its streak of releasing high-end motherboards for processors based on the new Intel Nehalem architecture, with a new dual-socket monstrosity. Slated for CES 2010, not much about this high-end workstation motherboard has been revealed beyond the picture below. From the looks of it, probably EVGA is making a high-end, overclocker-friendly dual LGA-1366 motherboard based on the Intel 5500 "Tylersburg" chipset with the usual ICH10R southbridge. Existing LGA-1366 processors that support dual-socket operation which includes Xeon 5500 series may work on it. Probably, a future high-end Intel Core family CPU is released that is capable of dual-socket setups, too. The picture reveals two LGA-1366 sockets, each powered by an 8-phase digital PWM circuit. Each socket is wired to six DDR3 DIMM slots supporting triple-channel memory for that socket. More this CES.

Source: EVGA Forums

Thermaltake Ready with Frio CPU Cooler

Thermaltake seems to have finished development of its new high-end CPU cooler, the Thermaltake Frio. Designs of this cooler surfaced as early as in June this year, originally slating it for Computex 2009. After some development delay, it has finally taken shape with the disctinct black+red color scheme the company's Level 10 case comes with. The design consists of a CPU contact block from which five seemingly 8 mm heatpipes arise, conveying heat to a dense aluminum fin array which has largely rectangular fins. The array is cooled a 120 mm fan. There is provision to install one on either sides, that rotates at speeds between 1200 - 2500 rpm. The cooler supports all current CPU sockets, including LGA-1366, LGA-1156, LGA-775, AM3/AM2+. The cooler is now slated for CES 2010.

Source: XTReview
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