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AMD Announces 2012 FX "Vishera" Line of Performance Desktop Processors

AMD announced the 2012 FX "Vishera" line of eight-core, six-core, and quad-core desktop processors. Based on the new "Piledriver" CPU micro-architecture, the new processors feature increased performance and an updated instruction set, over the previous generation. To begin with, the processors are based around the "Vishera" silicon, built on the 32 nm HKMG process at Global Foundries. With a transistor count of 1.2 billion and a die area of 315 mm², Vishera packs four Piledriver modules, with two cores each, 2 MB L2 cache per module (8 MB total), and 8 MB of L3 cache. Eight-, six-, and four-core models are carved out by toggling the number of modules between four, three, and two.

The Vishera silicon also features an updated CPU instruction set, which includes SSE/2/3/S3/4.1/4.2/4A, AVX, AES-NI, FMA/FMA2/FMA3, XOP, and F16C. An x86 processor by design, Vishera features the AMD64 x86-64 instruction set. Its updated integrated memory controller supports up to 64 GB of dual-channel DDR3 memory, with a standard speed of DDR3-1866 MHz, and more possible with overclocking. The memory interface is single, monolithic 128-bit, unlike the dual 64-bit IMC approach of the "Stars" micro-architecture. Built in the same socket AM3+ package as the previous generation FX, the new chips are compatible with existing AM3+ motherboards with a BIOS update. The 2012 FX processor lineup includes a total of four models, the FX-8350 flagship eight-core, FX-8320 performance eight-core, FX-6300 mainstream six-core, and FX-4300 value quad-core. All models feature unlocked base-clock multipliers, making each of them fit for overclocking. Their specifications and target SEP pricing are tabled below. Market prices could be about 5~10% above the SEP prices.

Intel Rounds Off 3rd Generation Core Processor Family with Core i3-3000 Series

3rd Generation Intel Core i3 desktop processors are now available providing value-priced CPU horsepower for those wanting to take advantage of features such as Intel HD Graphics with Intel Quick Sync Video, Intel Wireless display, and more. They will be offered in standard and low wattage models, designated by an "s" or a "t" in the processor name, with frequencies ranging from 2.8 GHz to 3.4 GHz. More information is available here.

AMD Hires John Gustafson as Chief Graphics Product Architect

AMD announced today that the visionary behind Gustafson's Law, John Gustafson, has joined the company as senior fellow and chief product architect, Graphics Business Unit. In this role, Gustafson will set the technical vision for the AMD graphics business unit, driving the technology roadmap and platform for the AMD Radeon and AMD FirePro product lines as well as new technology planning and execution of business objectives. Gustafson will be based in Sunnyvale and will help evangelize AMD graphics leadership internally and externally.

"Our industry-leading graphics technology predicates that we consistently deliver the most differentiated and superior graphics processor unit (GPU) architectures and products -- without compromise," said Matt Skynner, corporate vice president and general manager, AMD Graphics. "With the growing importance of parallel compute in defining the computing experience, John brings the full package of industry experience and knowledge needed to help us expand and execute our AMD Radeon and AMD FirePro graphics technology programs, and will help forge an aggressive long-term roadmap that allows AMD to continue to lead and win with our gaming and virtualization technologies."

Zalman CNPS9900DF CPU Cooler Launched

Zalman's newest high-end CPU air cooler, the CNPS9900DF, has been on our radar since May. It was launched in select markets earlier this week. The Computer Noise Prevention System (CNPS) model 9900 heatsink has been leading Zalman's product line for years now, with several variations being launched from time to time. The newest one, the CNPS9900DF, in which "DF" stands for dual-fan, builds on the concept by using two fans in push-pull configuration. The "push" fan is nested in the first copper fin stack, while the "pull" fan is located between the two fin stacks. The design is otherwise similar to every other 9900 series cooler.

The design of the CNPS9900DF consists of a nickel-plated copper base, from which four nickel-plated copper heat pipes pass, making a capital-omega (Ω) shape, along which nickel-plated copper fins are arranged, which appear to project radially. The surface area for heat dissipation is 6,800 cm². Measuring 140 (L) x 100 (W) x 154 (H) mm, the CNPS9900DF weighs in at 850 g. The 120 mm "push" fan spins at 1000 RPM, while the 140 mm "pull" fan spins at speeds between 900 to 1400 RPM. Both fans use fluid-dynamic bearings, and the total noise output of the cooler is said to stay within 27 dBA, according to Zalman. The Zalman CNPS9900DF is priced at an estimated US $89.90 a pop.

Source: Overclockers Ukraine

MSI Introduces OC Certified Mainboards - Change the Game of Overclocking

MSI, the most popular overclocking brand is excited to introduce an all-new standard for overclocking stability. MSI's OC Certified standard is the new baseline for overclocking mainboards. the new MSI Z77 MPOWER, which is OC Certified, is submitted to a Military Class stress-test for overclocking. Where other motherboard manufacturers only test for a limited duration, MSI Z77 MPOWER is submitted to a 24 hour OC stress-test. Only mainboards surviving 24 hours of Prime95 while heavily overclocked. The conditions of the OC Certified test are rigorous high temperature, no airflow testing.

AMD Launches First-Ever AMD FirePro APU

Today AMD launched the AMD FirePro A300 Series Accelerated Processing Unit (APU) for entry-level and mainstream desktop workstations. Featuring AMD Eyefinity multi-display technology, the new AMD FirePro A300 Series APUs are designed for users who demand a high-performance computing platform to power their computer-aided design, and media and entertainment (M&E) workflows. The new AMD FirePro A300 Series APUs combine industry-certified performance and reliability for professional applications with world-class 24-hour customer support, delivering highly-tuned performance and robust feature support across a range of professional applications and tools.

Akasa Euler Fanless PC Case Pictured Some More

Akasa's Euler fanless PC case, which was first pictured at Computex 2012, is inching towards a September 2012 launch. Some of its first press-shots were leaked to the web. The pictures reveal its interiors, including the CPU block that conducts heat to the metallic body, where it is dissipated. This passive CPU cooling mechanism, according to a new report, can handle thermal loads of up to 35W, making it fit for low-power dual-core processors. Akasa Euler will be sold at an affordable price, according to the report.

Source: FanlessTech

Lian Li Announces PC-X2000FN Slim EATX Chassis

Lian-Li Industrial Co. Ltd, today announces a tall, slim brushed aluminum EATX supported chassis – PC-X2000FN. The PC-X2000FN keeps DIY builder's hardware neat and organized in the interior with its three separate compartments, while having a sleek, elegant feel on the outside thanks to the one-piece front panel with no visible vents on holes.

693mm (27.3”) tall and 240mm (9.4”) wide, the PC-X2000FN lets DIY builders install the hardware they desire in a neat, organized and compartmentalized fashion. The top section holds 5.25”, 3.5” and 2.5” drives. The middle section is for motherboards up to the EATX form factor, and has plenty of room for cable management thanks to the rubber grommets and generous space behind the motherboard tray. The bottom compartment holds the power supply as well as an additional 3.5” HDD cage.

Thermaltake Launches the BigTyp Revo The New Down Draft Cooler on the Block

Thermaltake, being the industry pioneer brand with expertise in PC chassis, power supply and thermal solution, is launching the new reinvent CPU cooler – the “BigTyp Revo”, the COMPUTEX 2012 d&i award winner, an award recognises Thermaltake being the pacemaker of CPU cooler, which also made the debut during CeBIT 2012 this March, to users and gamers who favor the down draft rather than the tower cooler.

Thermaltake BigTyp Revo is the next substantial down draft CPU air cooler after the introduction of the Orb Series and the Typhoon Series that marked a brand-new new CPU cooler era for Thermaltake.

Spire Announces NanoTech Bearing Fan Series

Spire is proud to introduce our new fan series with Nano-ceramic precision bearing. Spire fans with Nanobearing offer a more silent, reliable and durable solution for the most demanding situations.

Traditional fans with oil seal bearings have serious wear with a relatively short service life as the bearings can easily overheat which results the impeller jamming and the PCB melting. Fans with nano-ceramic bearings are made from namo-zirconia powder as main material and a collocating special nano-particles lubricant to guarantee an exponentially longer life. The average service life is more than 70,000 hours.

Prolimatech Black Series Genesis CPU Cooler Launched

Prolimatech, the master of cooling is going a step further after the success of the Prolimatech Megahalems by presenting another revolution in CPU cooling with the limited edition Prolimatech Black Series Genesis. Besides the immaculate quality - which is present across their entire product line-up - the Black Genesis sets new standards in cooling capability and cool looks.

Prolimatech continues the trend set by the Megahalems and Super Mega by utilising two separate towers, but instead of placing them next to each other, they have been rearranged for maximum performance. The large array of cooling fins can hold up to three 120 or 140 mm fans, two of which can be installed right out of the box with the included mounting materials. Besides keeping the CPU cool, the construction allows for direct air flow across critical areas like the memory and power phases of the system.

Fujitsu Brings NVIDIA GPU-Accelerated Supercomputing to the Masses

NVIDIA today announced that NVIDIA Tesla GPUs are now available in Fujitsu's PRIMERGY CX400 S1 servers, offering high-performance GPU-accelerated computing to Fujitsu's large installed base of customers in Japan and Europe.

Fujitsu designed the PRIMERGY CX400 S1 server for high performance in a compact form factor by using half-wide, two-socket server nodes -- doubling the number of cores per unit height. The system houses either four 1U hot-plug PRIMERGY CX250 S1 server nodes with two CPUs per node, or two 2U hot-plug CX270 S1 server nodes with two CPUs and one NVIDIA Tesla GPU per node.

AMD, ARM, Imagination, MediaTek and TI Unleash Next Era of Computing Innovation

Today at the AMD Fusion Developer Summit (AFDS), global technology leaders came together to announce the formation of the Heterogeneous System Architecture (HSA) Foundation. The HSA Foundation is a non-profit consortium established to define and promote an open, standards-based approach to heterogeneous computing that will provide a common hardware specification and broad support ecosystem to make it easier for software developers to deliver innovative applications that can take greater advantage of today’s modern processors.

AMD, ARM, Imagination Technologies, MediaTek Inc., and Texas Instruments (TI) are the initial founding members of the HSA Foundation. The companies will work together to drive a single architecture specification and simplify the programming model to help software developers take greater advantage of the capabilities found in modern central processing units (CPUs) and graphics processing units (GPUs), and unlock the performance and power efficiency of the parallel computing engines found in heterogeneous processors.

Warm Tek Also Shows off "Pangolin" Heatsink Design Concept

The next big heatsink design at Warm Tek is called Pangolin C1-6. Its design stays true to the design principle of the Hedgehog series, in which each individual heat dissipation surface makes direct contact with the CPU, eliminating the need for heat-pipes (Warm Tek calls this seamless direct conduction). While the Hedgehog series heatsinks uses copper rods, the Pangolin C1-6 uses copper sheets which are tightly stacked up at the base, and fan-out upwards. The exposed copper sheets are treated with anti-oxidants at the factory. Like with the Hedgehog, it's purely pressure holding the sheets together, and the heatsink is weld-free. Although designed primarily for fan-less setups, a fan-clip is being worked on.

SilverStone Also Shows Off Asymmetric Dual-Tower SST-NT08 CPU Cooler

SilverStone also displayed its own take on asymmetric dual-tower heatsinks, with the SST-NT08 (not to be confused with another heatsink of the same model, first unveiled at Computex 2008). While most other asymmetric dual-tower heatsinks have variations in aluminum fin count or positions of the fin towers, the NT08 has two completely dissimilar fin towers. The thicker fin tower is close to double the thickness of the slimmer one, although the heatsink still has U-shaped heat pipes that pass through both fin towers, with the base in between. The NT08 uses six 6 mm-thick nickel-plated copper heat pipes, and deploys a 120 mm fan between the two fin stacks to ventilate it. The fan pulls air through the slimmer tower, and pushes it through the thicker one.

SilverStone Displays Unique SST-NT01 Pro CPU Cooler

The next in our series on "aluminum oddities" is SilverStone's SST-NT01 Pro, an unconventional aluminum fin heatsink. The design idea is similar in a way, to that of the Antec Kuhler Flow. The aluminum fin stack doesn't propagate directly above the base, but besides it. While the Kuhler Flow has a square fin stack, the NT01 Pro has a rectangular one, with its longer side along the plane of the motherboard, rather than perpendicular to it. As many as six 6 mm-thick nickel-plated copper heat pipes transport heat from the base to the fin stack, which is then ventilated by two 80 mm fans.

LEPA Readies Liquid CPU Cooler with Slim Block

LEPA is working on a closed-loop liquid CPU cooler, which features an "ultra slim" CPU block. Called the HDB120, this closed-loop cooler appears to have its pump located with the radiator, rather than with the block. As a result, its block is no different in form and function, than a DIY CPU water block. It is just 12 mm-thick, with its coolant tubes factory-fitted on its side, rather than on its top. LEPA plans to unveil (and probably demonstrate) the HDB120 at the upcoming Computex 2012 event.

Source: Expreview

Cooler Master Intros Hyper 412 Slim CPU Cooler and Three New Thermal Compounds

Cooler Master, an industry leading chassis, thermal solution, peripheral, and accessory manufacturer updates its Hyper 412S cooler with two slim fans. This significantly increases performance and allows usage of memory on both sides, while keeping the advantages of the previous model. The Hyper 412 Slim is best suited for LGA 2011 systems due to its compact size.

The Hyper 412 Slim is another of Cooler Master’s CPU coolers using the Continuous Direct Contact technology. This technology allows the heatpipes to directly touch all of the CPU’s hottest zones in order to reach the cooling performance in the places it matters most.

Palit Announced Another Legend GeForce GTX 670 JetStream

Palit Microsystems Ltd, the leading graphics card manufacturer, has unleashed the GeForce GTX 670 graphics card. It taps into the powerful Kepler architecture to deliver faster, smoother, richer gaming. It’s more than state-of-the-art technology and features. It’s truly game-changing performance.

Following with GeForce GTX 680 JetStream, JetStream 風– that introduces innovative custom cooling and optimized overclocked capabilities to deliver the ultimate gaming experience, now continuing to represent the exciting new series is the Palit GeForce GTX 670 JetStream, which offers incredible overclocked performance, low noise emission, as well as a powerful cooling design for efficient heat dissipation.

AMD and GameFly Team Up to Get Gamers Playing for Less

AMD today announced an agreement with GameFly, Inc., to give gamers who leverage the quality and performance of AMD CPUs and APUs easier access to GameFly's leading online video game rental and PC download services for a limited time. Gamers purchasing select AMD A-Series APUs, AMD Athlon II CPUs, AMD Phenom II CPUs or AMD FX Series CPUs in regions where GameFly is accessible receive a free, 30-day GameFly membership as well as a 20 percent discount on a new PC game purchase via the new GameFly PC store.

"AMD draws inspiration from gamers, game developers and the PC gaming industry," said John Taylor, director of Global Product and Technology Marketing at AMD. "Hand-in-hand with the AMD Gaming Evolved program, we continue to listen to gamers and fulfill our 'Gamers Come First!' pledge. AMD's close affiliation with GameFly shows our gratitude to gamers and to GameFly for recognizing how AMD represents best-in-class PC gaming experiences."

Ricoh Intros Ivy Bridge Mobile-on-Desktop Micro-ATX Motherboard

Ricoh Japan introduced a FB19M, an Intel HM76 Express chipset based mobile-on-desktop motherboard in the micro-ATX form-factor. The motherboard can seat mobile Core "Ivy Bridge" and "Sandy Bridge" processors in the PGA988 package, and includes a fan-heatsink that can handle these chips (up to 55W). The platform is then wired out to desktop interfaces. 24-pin ATX and 4-pin ATX connectors are used to draw power, the CPU is wired out to full-sized DIMM slots, expansion slots include one PCI-Express 3.0 x16, two PCI-Express 2.0 x8 (electrical configuration not known), and a PCI-Express 2.0 x1.

All six SATA ports from the HM76 PCH are wired out as internal ports, including six SATA 6 Gb/s, and four SATA 3 Gb/s. Display outputs include DVI, D-Sub, and LVDS. Other modern connectivity includes 2-channel HD audio, dual gigabit Ethernet interfaces, four USB 3.0 ports, and a number of USB 2.0 ports. There is quite some legacy connectivity, including two serial RS-232 ports, and headers for other serial and parallel interfaces. The board is fit for industrial PCs and other embedded systems.

Source: Hermitage Akihabara

Thermaltake Institutes the "10" with Frio Extreme, First 10 Year Warranty CPU Cooler

Thermaltake, the leader and pioneer in PC thermal solutions, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, with “delivering the perfect user experiences” as our mission and carrying the corporate vision of “building Thermaltake Technology into a cultural brand for the enjoyment of entertainment, e-Sports, technology and lifestyle.” Today would like to invite enthusiasts and gamers around the world to get an exclusive experience on the new instituted as well as the industry’s first 10 year warranty with the purchase of the Frio Extreme.

Silex Expands Product Line With High-Performance Gigabit and 802.11n USB Device

Silex Technology, a global leader in wired and wireless networking solutions, today announced the SX-DS-3000WAN and SX-DS-4000U2 USB device servers designed to allow users to easily connect virtually any USB device on a wired or wireless network with two hi-speed USB ports.

The SX-DS-3000WAN supports dual-band 802.11a/b/g/n wireless local area networks (WLANs) as well as Gigabit Ethernet wired networks. The SX-DS-4000U2, with an 800 MHz CPU, is a high performance Gigabit Ethernet USB device server designed for high speed applications including scanners, webcams and other peripherals where fast throughput is a requirement.

Nofan Unveils All-Copper CR-95C Silent CPU Heatsink

Silent PC cooling solutions expert Nofan is ready with an all-copper variant of its CR-95 fanless CPU heatsink. Called the CR-95C, the heatink retains the distinct hamster-wheel shape that's optimized for passive cooling. Measuring 180 x 180 x 148 mm (WxDxH), the cooler weighs a little over a kilogram, at 1020 g. Despite its dimensions, particularly its weight, it can only handle processors with TDP up to 100W (95W chips with mild OC could run, too). Its design consists of an octagonal copper (mirror-finish) base, from which two copper heat-pipes emerge, which twine through the copper fin stack. The CR-95C from Nofan is slated for early-June.

Source: FanlessTech

Desktop Core i3 "Ivy Bridge" CPUs Won't Arrive till Q3

Although Intel will launch its first 3rd Generation Core processor family, based on the 22 nm "Ivy Bridge" silicon, towards the end of this month, it will not be in a position to launch Core i3 desktop processors until Q3. These include 3.40 GHz Core i3-3240, the 3.00 GHz Core i3-3240T, the 3.30 GHz Core i3-3225, the 3.30 GHz Core i3-3220 (slower IGP) and the 2.80 GHz Core i3-3220T. All these chips pack two cores, four threads (with HyperThreading enabled), and 3 MB of L3 cache.

The standard models have 55W TDP, with the energy-efficient "T" models bearing just 35W rated TDP. Introduction of these chips was originally slated for June, but the delay to Q3 may have been caused due to a variety of factors, such as undigested inventories of current-generation chips or even lack of 22 nm production volumes (with a bulk of them being allocated to mobile chips). Q3 begins in July.

Source: VR-Zone
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