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MSI Introduces All New Gaming Products at CeBIT 2014

The internationally renowned event of the digital industry, CeBIT 2014 is packed with innovations and will start on 10th March in Hannover, Germany. More than 4,000 companies from over 70 countries will showcase their latest high-tech innovations. Among them, MSI, world leading brand in gaming technology, will proudly present a comprehensive line-up of all new gaming hardware, including notebooks, AIO PCs, motherboards, graphics cards, etc.

Eric Kuo, MSI Notebook vice president for global sales & marketing, points out, "As a result of the booming competitive gaming market, there has been an increasing number of heavy-load games, even up to 15.6" 3K monitors and higher resolution gaming experience, so gamers are demanding more in terms of graphics, functions, and other design features. MSI has heard their longings and responded with numerous breakthroughs and innovations. The result has been gaming hardware with the latest processors and graphics technology, coupled with the most advanced and rich array of gaming features like XSplit Gamecaster and SteelSeries Engine (SSE), to create a perfect gaming experience in 2014."

Antec Presents New Power Supplies and Enclosures for PC Enthusiasts

In the year of their 28th anniversary, Antec Inc., leading provider of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, present numerous innovations in the course of this year's CeBIT exhibition in Hanover, Germany. From 10th to 14th March 2014, Antec' new products will be showcased at booth D21 in Hall 15 at the joint stand with Pilot Computer. Among the novelties are the latest models from the Performance One and Gaming series of Chassis, the innovative, in-house designed Antec CPU-H2O coolers, the new High Current Pro power supplies and the brand new EDGE PSU range.

The new Antec EDGE PSU series provides stable output voltages and efficient and reliable system performance. The fully modular power supplies are Haswell-ready, compatible with the new ATX12V 2.4 standard and they are covered with five years of warranty. The models EDGE 550, EDGE 650, EDG 750E and EDG-850 deliver 550 watts, 650 watts, 750 watts and 850 watts of continuous Power. All models are 80 PLUS Gold certified and achieve an efficiency of up to 92 percent. High-performance Japanese capacitors provide a stable DC output and safe regulations. Sufficient PCI Express port connectors and a 13.5cm fan with white LEDs make EDGE the ideal PSU for high-end gamers and enthusiasts.

Core i7 "Haswell-E" Engineering Sample Pictured

Here's the first picture of Intel's next-generation Core i7 HEDT (high-end desktop) processor, codenamed "Haswell-E." Based on Intel's latest "Haswell" micro-architecture, the chip will be Intel's first HEDT processor to ship with eight cores, and the first client CPU to ship with next-generation DDR4 memory interface. In addition to IPC improvements over "Ivy Bridge" that come with "Haswell," the chip integrates a quad-channel DDR4 integrated memory controller, with native memory speeds of DDR4-2133 MHz; a PCI-Express gen 3.0 root complex with a total of 40 PCI-Express lanes, and yet the same DMI 2.0 (4 GB/s) chipset bus.

Built into the LGA2011-3 socket, "Haswell-E" will be incompatible with current LGA2011 motherboards, as the notches of the package will vary from LGA2011 "Ivy Bridge-E." Intel will introduce the new X99 Express chipset, featuring all 6 Gb/s SATA ports, integrated USB 3.0 controllers, and a PCI-Express gen 2.0 root complex for third-party onboard controllers. Interestingly, there's no mention of SATA-Express, which Intel's next-generation 9-series chipset for Core "Broadwell" platforms reportedly ships with; and X99 isn't looking too different from today's Z87 chipset. With engineering samples already out, it wouldn't surprise us if Intel launches "Haswell-E" along the sidelines of any of next year's big-three trade-shows (CES, CeBIT, and Computex).

Source: VR-Zone

MSI Announces Gaming Series Motherboards Market Availability

MSI, industry leader in motherboard and graphics card technology is happy to announce the availability of its complete Gaming motherboard lineup. At CeBIT 2013 the world got a first hands-on experience with the new models and the completely new look and feel of the motherboards and thanks to that we've received overwhelming positive reviews from gamers and media. As part of the 2013 series of motherboards, the new Z77 Gaming models will be available far into 2014. Together with the recently introduced Gaming Graphics Cards from MSI, they allow awe-inspiring PC builds from PC Gamers and Enthusiasts.

The MSI Z77 Gaming motherboards are designed to have as little lag as possible, to have the best possible input relay connections from your devices (mouse, keyboard and headset) and have the best audio set up integrated in the motherboard and have room for several graphics cards. These are but a few examples of how MSI has tried to perfect this Gaming motherboard for the enthusiasts who want the best hardware to get the best performance where it counts: in-game.

Plextor Shows Off Unnamed TLC NAND-Based Consumer SSD Lineup

At CeBIT, Plextor showed off a yet unnamed line of consumer SSDs featuring 19 nm triple-level cell (TLC) NAND flash memory. The series consists of 128 GB, 256 GB, and 512 GB variants, with 256 MB, 512 MB, and 768 MB of DDR3 DRAM cache, respectively. The three are driven by Marvell 88SS9189 processor, and are built in the 2.5-inch form-factor, with SATA 6 Gb/s interface.

The 128 GB variant offers sequential read speeds as high as 530 MB/s, with up to 380 MB/s writes, and 72,000 IOPS 4K random write performance. The 256 GB variant ups that with 540 MB/s reads, and 450 MB/s writes. Leading the pack is the 512 GB variant, with 540 MB/s reads, and 465 MB/s writes. The lineup is expected to be launched this August.


Source: Guru3D

Cooler Master TPC 612 and V8 GTS CPU Coolers, and JetFlo 120 Fans Pictured

Cooler Master showed off a trio of air-cooling solutions at CeBIT, which includes the TPC 612 and V8 GTS CPU coolers, and JetFlo 120 case fans. The TPC 612 is a compacted version of the TPC 812. It retains the design concept of its older sibling, that of a heatpipe-fed aluminum fin stack that also uses a vapor-chamber tube for more efficient heat transfer; while using just four heat pipes, and a more compact vapor-chamber tube. Measuring 145 x 97 x 161.6 mm (WxDxH, including the fan), it weighs about 640 g. It uses a single 120 mm PWM fan that spins in the range of 600 to 2,000 RPM, pushing 24.9 to an impressive 82.9 CFM of air. The TPC 612 is compatible with all modern CPU socket types.

Moving on, the V8 GTS is Cooler Master's latest monstrosity, one that is designed to take on pre-assembled closed-loop liquid CPU coolers. It uses a triple independent aluminum fin stack design, which is ventilated by a pair of 140 mm fans. An unknown (we're guessing six) number of 6 mm-thick nickel plated copper heat pipes convey heat from the base through the three fin stacks. Measuring a whopping 154 x 149 x 160 mm, it weighs 1,140 g. Each of its two 140 mm fans uses a 4-pin PWM connection, spins at 600 to 1,600 RPM, pushing 28 to 82 CFM of air. Lastly, Cooler Master showed off its JetFlo 120, a neat little 120 mm spinner featuring PWM, 800 to 2,000 RPM speed range, and up to 85 CFM air-flow.

Source: Guru3D

Asustor Implements Atom CE5315 SoC with 3-Series NAS

Asustor displayed its first consumer NAS devices implementing Intel's recently announced Atom CE5315 SoC. The new model fill into the company's 3-series. On display at CeBIT are the 2-bay AS-302T and 4-bay AS-304T. The two are positioned a notch below the 2 GHz Atom dual-core powered AS-602T and AS-604T. The two feature single gigabit Ethernet interfaces, a couple of USB 3.0 and USB 2.0/1.1 ports, and HDMI display outputs. The company's ADM 1.0 "Dolphin" interface is standard issue. The two are expected to launch some time in June.

Source: Hardware.info

Be Quiet! Unveils Shadow Rock 2 CPU Cooler

At its CeBIT booth, German PC peripherals maker Be Quiet! unveiled the Shadow Rock 2, its latest high-performance air CPU cooler. Pictured below, the Shadow Rock 2 uses a fairly cube-shaped (120 x 120 x 120 mm) aluminum fin stack with jagged and curved edges; through which four 8 mm-thick copper heatpipes pass; which draw heat from a copper base. A 120 mm Shadow Wings fan comes included. The Shadow Rock 2 is expected to be priced around €45.

Source: Hardware.info

GA-Z87X-OC To Lead GIGABYTE's LGA1150 Motherboard Pack

At a private media unveiling held on the sidelines of CeBIT, GIGABYTE disclosed its next-generation flagship motherboard, the Z87X-OC. Like most socket LGA1150 motherboards unveiled this week, this one is still under development, and the company is yet to finalize color-scheme and heatsinks for the PCH and VRM, so don't judge it by its looks just yet. The Z87X-OC is designed primarily for overclockers.

The LGA1150 socket is powered by an 8-phase VRM, which draws power from a combination of 4-pin ATX and 8-pin EPS, in addition to the board's 24-pin ATX connector. To stabilize the board's various power domains, you can optionally plug in a 6-pin PCIe power connector. The board gives overclockers a high degree of physical on-the-fly voltage control, and measurement points. One of the chipset's four USB 3.0 ports are wired out as a type-A port on-board, letting you install and run your Windows 7/8 installation off a USB 3.0 flash-drive.

Enermax Shows Off Fanless 650W Platinum PSU

At CeBIT, Enermax showed off its premium Fanless 650W Platinum PSU. Relying entirely on passive cooling, this box offers 100% modular cabling (including the 24-pin ATX and 8-pin EPS connectors), a dynamic hybrid topology, and DC-to-DC switching. To sweeten the deal for those concerned with its 650W capacity, the PSU is 80 Plus Platinum-compliant, with over 94 percent efficiency. It appears to include sufficient cabling for a gaming PC build with up to two graphics cards (a total of four 6+2 pin PCIe connectors).

Source: Lab501.ro

First ASRock Socket LGA1150 Motherboards Shown Off at CeBIT

Here is the first selection of ASRock socket LGA1150 motherboards, pictured at the 2013 CeBIT expo being held in Hanover, Germany. Intel's 4th generation Core "Haswell" desktop processor family introduces the new 1150-pin LGA socket and Intel 8-series chipset, to form the platform. An upgrade to to "Haswell" processors should hence also involve buying new motherboards. Top-two motherboard manufacturers ASUS and GIGABYTE reportedly lack booths at CeBIT, leaving only the rest to show off their LGA1150 goods. This first compilation includes boards by ASRock and BIOSTAR. The boards are also a little rough on the edges, as their component/PCB color schemes, heatsinks, etc., haven't been finalized.

ASRock unveiled two LGA1150 motherboard models, the entry-level B85M, and the high-end Z87-Extreme6 (pictured in that order). The B85M, based on the chipset that succeeds today's small business-optimized B75 chipset, is a compact micro-ATX motherboard. It features just the two DDR3 DIMM slots, an expansion area with a PCI-Express 3.0 x16, a PCI-Express 2.0 x16 (electrical x4), and two legacy PCI slots. Connectivity includes six SATA 6 Gb/s ports, 8-channel HD audio, four USB 3.0 ports, gigabit Ethernet; DVI, D-Sub, and HDMI display outputs, legacy connections such as COM/LPT over headers, and PS/2 mouse/keyboard connectors.

OCZ Technology Launches New VXL 1.3 Software at CeBIT 2013

OCZ Technology Group, Inc. (Nasdaq:OCZ), a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced the general availability of the next release of its popular VXL Cache and Virtualization Software. VXL 1.3 has evolved its synchronous data mirroring capabilities and automatic server failover mechanisms to enable 'SAN-less,' highly available, fault tolerant environments based entirely on virtualized host flash. The ability to provide uninterrupted service for business-critical applications even during severe system failures is a requirement for IT managers of any sized data center, and ideally suited for virtualized database deployments, email servers, or cloud computing applications.

Another innovation in this new version of VXL allows IT managers to pre-load the cache with critical data at pre-determined schedules to ensure that important data is available on SSD flash at the precise time it is required by the application.

TYAN's New 1U Server and 4 GPU Compatible 2U Server Announced

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, launched the TYAN TA77-B7061, its latest and flexible 2U GPU supported platform; the S7042, entry-level dual socket motherboard; GT62A-B5512 and the GT20A-B7040, the cost-effective 1U server during the CeBIT. TYAN welcomes customers to visit the TYAN website for more detail product information during CeBIT or experience the latest products at ISS EMEA in Dublin, Ireland from April, 10-12.

TYAN TA77-B7061 is the ideal platform designed for users who are looking for accelerated data-processing and efficient computing performance. Supporting up to four GPUs in a 2U server chassis, it is a high performance option that also offers outstanding computing density, saving both time and server/rack space in conjunction with industry-leading companies' GPU products such as Intel Xeon Phi processors, NVIDIA Tesla K20 Series and ATI FirePro. The non-compromised TA77-B7061 will be displayed at TYAN booth at ISS EMEA (Intel Solution Summit) in Dublin, Ireland from April, 10-12. TYAN TA77-B7061 supports (2) Intel Xeon E5-2600 Series Processors, (8+8) DDR-III R/U/LR-DIMM, (4) PCI-E x16 G3 slots, (1) PCI-E x8 G3 slots, (2) GbE ports and (8) 2.5" HDDs. Customers could enjoy more flexible and upgradeable computing performance to tailor to their own computing environment with TYAN's TA77-B7061 server platform.

Intel Introduces Atom CE5300 SoC for Consumer NAS Servers

With consumers increasingly sharing and viewing content among different devices, Intel Corporation today introduced storage solutions based on the Intel Atom media processor CE5300 series. The new low power system-on-chip (SoC) enables high definition (HD) video to be simultaneously watched on smartphones, tablets and other smart devices, in real time, while also shared with consumer devices such as a Smart TV. "Streaming content across numerous mobile devices, not just from the cloud but locally, has become a common practice for today's consumers," said Bev Crair, general manager, of Intel's Storage Division. "New storage solutions based on the Intel Atom CE5300 series elevate this to a whole new level by making it simple to 'browse, click, and play'. The new SoC provides an excellent foundation for creating compelling entertainment experiences."

The powerful, dual-core Intel Atom CE5300 series delivers simple application and I/O support, making it ideal for synchronizing and streaming video content without compromising power for the performance necessary to allow seamless I/O and media transcoding. Storage solutions based on the Intel Atom CE5300 series allow consumers to easily set up all of their media in one place and avoid capacity limitations of mobile devices. They can use their storage system either as an iTunes server or DLNA (Digital Network Living Alliance) media server, and access that content from their mobile device of choice. Users can also simultaneously transcode 1080p video content to a smartphone, tablet, TV, Ultrabook or other smart device. The media processor system intelligently adapts to the screen resolution for each of these devices.

MSI Gaming Series AG2712 All-in-One Desktop Unveiled

Touting the innards of a gaming notebook, MSI's Gaming Series AG2712 is a prominent exhibit at the company's CeBIT booth. It features a 27-inch 1080p matte display (which isn't a touchscreen), various Intel Core i5/i7 "Ivy Bridge" processor choices (with chance of a near-future Core "Haswell" refresh), NVIDIA GeForce GTX 670MX as standard equipment, HDMI and D-Sub display outputs, USB 3.0, multi-format card reader, and what appears to be a THX-certified sound-bar lining its bottom.

Source: Engadget

MSI Z77A-GD65 Gaming and GeForce GTX 670 Gaming Teased Some More

We've known since a little earlier this week that MSI has been working on a new product line targeting gamers, which builds on the success of its Gaming Series notebooks; that the company has been working on a variant of the Z77A-GD65 motherboard based on the series; and that the series could also include graphics cards and gaming-grade all-in-one desktops. MSI revealed a few more byte ahead of its big CeBIT unveiling.

To begin with, our suspicious voiced last week are true, the company's first Gaming Series motherboard is in fact a variant of the Z77A-GD65, with a few changes: an overhauled VRM and chipset heatsink design inspired by the dragon-head logo; a black+red color scheme, Bigfoot Killer E2200 low-latency network controller, and possibly Creative Sound Blaster Cinema audio. Moving on, we're hearing that the first graphics card in the Gaming Series will be based on GeForce GTX 670. It could be positioned above the company's fastest GTX 670, the Power Edition/OC. In addition to a slightly new cooling solution, the card could feature an improved VRM.

Enermax Previews Silent PSU and Fulmo ST Case, and More Ahead of CeBIT

Enermax plans to enter CeBIT with a three main attractions to its booth. First, a new lineup of fanless/silent PSUs; second, additions to its Fulmo line of ATX mid~full-tower cases; and third, the DreamBass line of notebook coolers that replace your notebook's built-in tweeters speakers with ones that can begin to do justice to bass. To begin with, Enermax is looking to launch a line of fanless PSUs in the mid-capacity range (500W-700W), which toss out fans for chunkier heatsinks, feature modular cabling, and are 80 Plus Platinum-compliant.

Moving on, Enermax will show off a handful of its newest gaming PC cases, including the Fulmo ST ATX mid-tower, pictured below. The Fulmo ST, according to the company, is spacious enough for triple graphics-card gaming PC builds, with room for 240 mm radiators, and a liquid-cooling loop that doesn't stick out. It will pack ten 3.5-inch/2.5-inch drive bays, and various nifty locking/mounting mechanisms that help PC enthusiasts. Following its CeBIT unveil, the Fulmo ST will make it to stores in April.

MSI Teases Gaming Series Motherboards, Graphics Cards, and All-in-One Desktops

MSI, the world-leading manufacturer of Gaming motherboards, graphics-cards and All-in-Ones PCs storms CeBIT with a new line-up of Gaming products. Hardware enthusiasts and gamers will flock to MSI's new Z77 GAMING motherboards with their new distinctive looks. To complement MSI's new Gaming motherboards MSI will also display a new concept of graphics cards that match the striking looks of the new gaming motherboards. CeBIT 2013 will also be the first opportunity to touch MSI's new AG2712, world's first Gaming All-in-One. 2013 is an exciting year in the computer industry and MSI has reserved a spot in the driver's seat, as can be seen on CeBIT 2013.

MSI Integrates Creative SoundBlaster Cinema Audio Technology into Select Motherboards

MSI, the world's leader in motherboards and graphics cards has chosen Creative Sound Blaster Cinema audio technology for its new motherboard lineup. Sound Blaster is the leading brand in PC gaming audio and MSI is excited about the prospect of providing class-leading audio technology with its motherboards. Thanks to the Sound Blaster Cinema suite of audio technologies, gamers can enjoy upgraded surround sound through their stereo headphones, enhanced gaming sound effects and Smart Volume control for long gaming sessions.

When using Sound Blaster Cinema, gamers will be able to hear their opponents more clearly and easily while enjoying the competitive advantage of accurate positional audio to reveal the precise location of their opponents. Sound Blaster Cinema will first be introduced on MSI's new Gaming motherboards, on display at CeBIT 2013 in Hanover from March 5th to March 9th.

OCZ to Unveil ZD-XL SSD Accelerator for SQL Applications at CeBIT

OCZ Technology Group, Inc. (NASDAQ: OCZ), a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced that it will preview a variety of enterprise storage solutions at next week's CeBIT 2013 conference in Hannover, Germany. As a renowned global forum, CeBIT represents a great opportunity for attendees to be the first to see and experience the latest innovations in solid-state storage from an industry leader in enterprise SSDs, virtualization, and caching software. OCZ offers a complete suite of storage solutions that address VMware, Linux, and SQL Server platforms, and invites IT decision-makers who are evaluating or implementing solid-state storage in the data center to visit the Company's exhibit in Hall 2, Stand E43, from March 5th through 9th.

OCZ will unveil the next-generation ZD-XL SQL Accelerator, a culmination of enterprise hardware and software converging as one tightly integrated and optimized solution. The ZD-XL Accelerator addresses SQL Server database applications to not only ensure that the data for this implementation is right, relevant, and readily available on SSD flash when the SQL Server needs it, but also that the data is accessed with the highest possible I/O performance. For simple deployment and ease of use, this tightly integrated, optimized solution features 'implementation wizards' to guide DBAs so they can optimally manage data cached to the flash. While showcasing the ZD-XL solution OCZ will invite enterprise customers to become beta testers for this exciting solution.

MSI to Integrate Killer NIC Into Gaming Notebooks and Motherboards

MSI, the world-leading manufacturer of graphics cards and motherboards, is happy to announce an extensive partnership with Qualcomm Atheros to implement Killer Networking technology in not only MSI's gaming notebooks, but also a new lineup of MSI gaming motherboards. With this implementation gamers and professionals alike can now utilize Killer technology to enhance their gaming and video streaming experience. By adding a healthy dose of intelligence to the networking part of MSI motherboards a lot of work is taken out of the hands of the users who can focus better at the task at hand, be it fragging competitors or professional network services.

Intel Core "Haswell" Delayed till Computex 2013, No Show at CES

It looks like Intel's Core "Haswell" processor family will miss its anticipated March-May launch window, with the company choosing Computex 2013 as its next launch-pad. According to a leaked document intended for distributors and large retailers, desktop Core "Haswell" processors will launch only after May 27, before June 7, and retailers are told to hold off advertising the launch till June 2nd.

Among the products featuring in the new May 27 - June 7 launch window are the Core i7-4770K flagship product, i7-4770, i7-4770S, i7-4770T, i7-4765T, i5-4670K, i5-4670, i5-4670S, i5-4670T, i5-4570, i5-4570S, i5-4570T, i5-4430, and i5-4430S, all of which are quad-core parts. In addition, socket LGA1150 motherboards based on Intel Z87 (flagship, OC-ready), H87, Q87, Q85, and B85 chipsets, will be launched. In all likelihood, one piece of decoration the CES venue could miss, is the wall of LGA1150 motherboards, which is usually put up by Intel.

Thermaltake Launches the BigTyp Revo The New Down Draft Cooler on the Block

Thermaltake, being the industry pioneer brand with expertise in PC chassis, power supply and thermal solution, is launching the new reinvent CPU cooler – the “BigTyp Revo”, the COMPUTEX 2012 d&i award winner, an award recognises Thermaltake being the pacemaker of CPU cooler, which also made the debut during CeBIT 2012 this March, to users and gamers who favor the down draft rather than the tower cooler.

Thermaltake BigTyp Revo is the next substantial down draft CPU air cooler after the introduction of the Orb Series and the Typhoon Series that marked a brand-new new CPU cooler era for Thermaltake.

Sharkoon DarkGlider Gaming Mouse Generally Available

Sharkoon has let its latest rodent loose: the DarkGlider gaming mouse presented at CeBIT is now available on the market. The Sharkoon DarkGlider is the high-end model presented in Hannover under Sharkoon's gaming input devices. Under its ergonomically designed, secure-grip rubber cover in matte black sits the latest version of the ADNS-9500 LaserSensor Sensors. The mouse contains up to a 6,000 DPI resolution, 11,750 FPS frame rate, 30 G maximum acceleration, a millisecond response time and a maximum 5 mm liftoff distance as a very precise, reliable and responsive playmate. The DarkGlider glides on five lenticular ceramic feet, which cannot afford to support any significant sliding resistance. The DPI sampling rate can be arbitrarily set and read in the illuminated LED display.

ASRock X79 Extreme11 New Iteration Pictured, Packs Stronger VRM

At CeBIT, ASRock already grabbed a lot of attention with its unveiling of the X79 Extreme11 motherboard. The motherboard was detailed to great lengths then. It appears like the design was still a work-in-progress, and the company has an even newer iteration. Pictured below is this latest iteration. You will notice how ASRock redid the CPU VRM. While the one shown at CeBIT packed a 16-phase VRM, this one steps it up to 24. On the obverse side of the PCB, it squeezed in chokes for all 24-phases, and compact Driver-MOSFET (DrMOS) chips for 12 (probably the other 12 are located on the reverse side of the PCB). The first iteration shown at CeBIT used LFPAK MOSFET design. A DrMOS combines up/down FETs and driver IC into a single, space-efficient package. Companies like Renesas have held interest in innovating with DrMOS chips, even compacting them further. The rest of the board is identical to the one pictured at CeBIT, except that the Creative Sound Core3D chip has the signature plastic cover over it, which can be found on Creative's Sound Core3D discrete sound cards.

Source: TweakTown
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