News Posts matching "Computex"

Return to Keyword Browsing

BitFenix to Showcase Latest Innovations at Computex 2014

Computex Taipei is just around the corner, and this year, BitFenix invites showgoers to catch a glimpse of the next level of visual impact for hardware design.

Since the legendary Prodigy, BitFenix has proven to the world that compact cases don't have to mean small performance. This year, the designers at the BitFenix Labs have turned their attention to the living room, and have devised a new slim case specifically tailored to the living room environment, both in form and in function. Adding a never before seen user-configurable visual element, the BitFenix Pandora is a sleek mini ITX case that is poised to once again shake the world of compact case designs.

COUGAR Launches eSports Gaming Line at COMPUTEX 2014

COUGAR will be launching a new line of products tailored to the eSports gaming peripherals market at the COMPUTEX 2014 trade show in Taiwan at the Nangang Exhibition Hall, Booth #J0624, June 3rd through the 7th. In addition to this, there will be new power supply and case products announced as well. 2014 was a year of innovation at COUGAR. At Computex, with the launch of many new products, COUGAR will be showing products that reflect an accumulation of more technological experience, which has grown more sophisticated and more mature in quality. COUGAR is launching series of gaming eSports products and aims to be one of the top brands of eSports gaming product going forward.

For the next generation of upcoming power supplies, COUGAR will be launching a digital and budget bronze power supply. The power supply will no longer just be a cold metal box. The digital features of the PSU will allow for the interaction between users and the product. Gamers will instantly be able to monitor power data in real time such as efficiency, output status of consumption, voltage and electric current as well as the temperature of each PC component.

G.Skill to Host OC World Cup Finals at Computex 2014

G.SKILL International Co. Ltd., the leading high performance memory designer and manufacturer, is proud to announce the 6 finalists to compete in the G.SKILL OC World Cup 2014 & battle for the ultimate prize of $10,000 USD during Computex 2014. After a month-long of online qualifiers on HWBot, 6 of the top qualifiers including "der8auer" from Germany, "8 Pack" from UK, "ZeR0_Dan" & "Hero" from China, "Xtreme Addict" from Poland and "Splave" from USA will be attending G.SKILL OC World Cup live finals at G.SKILL booth I0218, Nangang Exhibition Center, Computex 2014, going head-to-head for a shot at the largest single cash prize in competitive overclocking history, $10,000 USD.

G.SKILL OC World Cup 2014 live qualifiers will be held from Tuesday, 3rd to Thursday, 5th June with 2 rounds per day, finals & award ceremony will be held on Friday 6th June. With the Championship title & $10,000 cash prize at stake, overclockers are expected push their hardware to the absolute limit using G.SKILL TridentX Memory, MSI GTX 750Ti Gaming VGA cards, Seasonic 1000W Platinum PSUs and 4th Gen Intel Core processor, More details on official event page.

ADATA's Flagship M.2 SSD Pictured

ADATA revealed its flagship consumer SSD in the M.2 form-factor, the SR1020NP series, which is an evolution of the AXNP280e it unveiled at this year's International CES. The drive comes in capacities of up to 1 TB, is based on LSI-SandForce 3700 series processor wired to MLC NAND flash, and a host interface with wiring for PCI-Express 2.0 x4 physical layer. Most M.2 SSDs, in contrast, are being designed for PCI-Express 2.0 x2.

That's not all, most motherboards launched on Intel's 9-series chipset feature M.2 slots with just PCI-Express 2.0 x2 wiring, with the exception of ASRock's top-end Z97-Extreme6, which features a special M.2 slot with PCI-Express 2.0 x4 wiring. Using that slot, however, will eat into the bandwidth meant for graphics cards, and the primary PCI-Express 3.0 x16 slot will run at 3.0 x8, because ASRock wired the slot to the CPU's root complex. Under ideal conditions, SandForce 3700 series processors are advertised to offer sequential transfer rates as high as 1.8 GB/s. Given that, this drive should be bottlenecked on most motherboards with PCI-Express 2.0 x2 based M.2 slots. ADATA will display the drive at the 2014 Computex, early next month, alongside gaming-grade and overclocker-grade DDR4 modules.

AMD Readies 28 nm "Tonga" to Take on GM107

NVIDIA's energy-efficiency leap achieved on existing 28 nanometer process, using the "Maxwell" based GM107, appears to have rattled AMD. The company is reportedly attempting a super-efficient, 28 nm, mid-range chip of its own, codenamed "Tonga." The chip could power graphics cards that compete with the GeForce GTX 750 Ti and GTX 750. The chip is likely to be based on Graphics CoreNext 2.0 micro-architecture, the same one that drives "Hawaii," which means AMD isn't counting on the micro-architecture for efficiency gains. It could feature an evolution of PowerTune, which works closer to the metal than its existing implementation on "Hawaii." Other features could include Mantle, TrueAudio, and perhaps even XDMA CrossFire (no cables needed). The chip could be wired to up to 2 GB of memory.

Another equally plausible theory doing rounds is that "Tonga" could be a replacement to "Tahiti Pro," designed to compete with the GK104 at much lower power footprint (than "Tahiti"), so AMD could more effectively compete with the GeForce GTX 760. The chip could be similar in feature-set to "Tahiti," with a narrower memory bus (256-bit wide), but higher clock speeds to make up for it. If this theory holds true, then "Tonga" could disrupt both Tahiti Pro and "Curacao XT." Curacao XT (R9 270X) is designed to offer a value-conscious alternative to the $250 GTX 760. The R9 280 is competitive in performance, but takes a beating on the energy-efficiency front, and is also costlier to manufacture, due to the higher transistor count and four additional memory chips. We could hear more at Computex 2014.


Source: VideoCardz

Samsung XP941 M.2 SSD Shows Up at Retailers

At Computex 2014, we're expecting the proverbial Noah's Flood of new SSDs in the M.2 form-factor, which overcome the bandwidth limitation of SATA 6 Gb/s, and aren't as messy when installed as SATA-Express. The first generation of M.2, at its physical layer, is PCI-Express 2.0 x2, with a theoretical maximum bandwidth of 1000 MB/s per direction. Among the first such drives is the XP941 from Samsung. The drive went into mass production way back in June 2013, but it's only now hitting the stores, as the first motherboards with M.2 slots launched, with the advent of Intel's 9-series chipset.

What sets this drive apart from conventional M.2 drives is it follows a draft specification that mandates PCI-Express 2.0 x4 interface. When installed on slots with x4 wiring, the drive offers sequential read speeds of up to 1,170 MB/s, and up to 930 MB/s maximum writes. It also offers 4K random read performance of up to 122,000 IOPS, and 4K random write performance of up to 72,000 IOPS. The only 9-series motherboard with such a slot is the Z97 Extreme6 by ASRock. You could also try using PCI-Express 2.0 x4 add-on cards such as the one Plextor's M6e comes with. The 512 GB variant of the drive is priced at 79,800 JPY including local taxes (US $780).

Source: PC Watch

Thermaltake to Showcase Level 10 Titanium Limited Edition Chassis at Computex

Thermaltake biennially announces a special edition of Level 10 in a Titanium finish, restricted to 500 builds worldwide, will take orders in July and time to market in September. Designed in collaboration with BMW Group DesignWorksUSA since 2009, Thermaltake Level 10 Series are highly appreciated and gained numerous awards like Red Star, IDEA, Good Design, Golden Pin Design, iF, reddot, and d&i for its intelligent design in succession. From the very first launch of Level 10, Thermaltake has redefined the architectural aesthetics of chassis design, continuously driving toward the corporate mission of "delivering the perfect user experience".

This Summer, Thermaltake Level 10 Titanium version would convey a unique and unmatched massage to everyone with modern, innovative, futuristic and stunningly elegant style which will revive the famous Level 10 Gaming Station Titanium Limited Edition at COMPUTEX Taipei 2014 (Nangang Exhibition Hall, 4th floor, booth no. M620), from 3rd- 7th June, 2014.

Thecus to Showcase Daisy Chaining and New 4-Bay NAS at Computex 2014

Network storage expert Thecus will be at COMPUTEX 2014 in Taipei, Taiwan, from June 3 to June 7. Thecus invites all interested parties to visit their booth (J0617 in Nangang Exhibition Hall 1F) to get a first-hand look at some of its latest offerings and technology. Visitors will not want to miss out on Thecus's two live demos - one for enterprise and one for home. Headlining the enterprise demo will be Thecus's new Daisy Chaining technology, which will combine the capacities of 80 drives. This cost-efficient set-up can theoretically, in conjunction with Volume Expansion, provide up to 3.8 petabytes of network storage, roughly the equivalent of 900,000 DVDs.

Tesoro To Unveil New Products and Gaming Technology at Computex 2014

Tesoro Technology USA Inc. - leading manufacturer of Gaming peripheries - will be releasing new products targeted to professional gamers and will announce new technology used in its mechanical keyboards during Computex IT Show in Taipei, from June 3rd to June 7th.

During the show, Tesoro will release new products: Tizona Elite G2NFL - world first 80% mechanical keyboard with full color LED with detachable Tizona Elite Numpads G2NFLP - world first full color programmable mechanical numerical pads. Furthermore, Tesoro will launch its new aggressive high quality mechanical keyboard Excalibur G7NL, which comes with built in memory, macro recording and LED lighting at the price range easily available to most users.

PowerColor Readies Air-Cooled Radeon R9 295X2 Devil13

While AMD may have scored one up over NVIDIA by making its 500-Watt dual-GPU graphics card, the Radeon R9 295X2, a 2-slot thick product that draws power from just two 8-pin PCIe power connectors, AMD's implementation also lugs along a radiator and coolant tubing that not everyone may find room in their cases for. Some enthusiasts may simply not trust factory-fitted water cooling solutions. For such people and more, who'd like to keep their builds "dry," PowerColor is coming up with the first truly non-reference design R9 295X2, the Devil13.

Pictured below, the R9 295X2 Devil13 from PowerColor features a completely custom-design PCB that is said to feature a meatier VRM than the one you get on reference design boards; which draws power from 4 (that's right, four) 8-pin PCIe power connectors. The PCB appears taller but just as long as the reference one, and features a back-plate that doubles up as structural reinforcement. The cooler is an interesting piece of engineering. It appears to feature two independent aluminium fin heatsinks, each over one of the two GPUs, and a base-plate heatsink to cool the memory, VRM, and bridge chip. The contraption is then ventilated by three 100 mm fans that appear to feature lateral+axial hybrid air-flow blades, on their impellers. PowerColor could launch the R9 295X2 Devil13 at Computex 2014, if not sooner.


Source: Hardware.info

ASUS Demos its HyperXpress SSD

ASUS demonstrated its first SSD, the HyperXpress. As its name might give away, the drive is co-developed by HyperX, the enthusiast memory and storage brand of Kingston. Built in the 9.5 mm-thick 2.5-inch form-factor, the drive features SATA Express interface, which will hit the consumer space this May, with the arrival of Intel's Z97 Express chipset, and Core "Haswell Refresh" processors. Internally, there's not much to this drive. It's a host-agnostic RAID 0 array of two mSATA 6 Gb/s SSDs, wired to a host controller made by ASMedia. To the host machine, it will look like a single drive. The sample demoed to the press, ASUS claims, is a very early prototype, and future iterations could run two M.2 SSDs instead of mSATA, for even higher throughput. The drive was tested to offer sequential transfer rates as high as 778 MB/s. At Computex 2014, flash memory manufacturers are expected to launch legions of new SSDs in the SATA-Express and M.2 form-factors.

Source: LegitReviews

Intel Core "Haswell" Refresh Lineup Slated for Q2

Intel is expected to launch its refreshed Core "Haswell" processor lineup in the second quarter of 2014 (between April and June), beating its Computex 2014 anticipated launch window. Motherboard vendors will launch their products based on Intel's new Z97 Express and H97 Express chipsets by the end of April. The products will have reached retail channels worldwide by May.

Intel will release as many as 20 new SKUs spanning its Core i7, Core i5, Core i3, and Pentium brands, including the Core i7-4790, Core i5-4690, Core i5-4590, Core i3-4360, Pentium G3450, and Celeron G1840. Among the low-power SKUs are the Core i7-4790S, Core i5-4590S, and Core i3-4150T. The overclockers among you may want to hold out until Computex (June), because it's only then that Intel is expected to launch the Core i7-4790K and Core i5-4690K, which come with unlocked base-clock multipliers. These chips should be compatible with current socket LGA1150 motherboards, with a BIOS update. Intel's Core i7 "Haswell-E" HEDT platform could also launch around that time. Q2~Q3 promises to be a hectic time of the year for motherboard makers once again.Source: DigiTimes

Intel Core i7 "Haswell-E" to Launch in Q3 2014

Intel is planning to launch its 4th generation Core i7 HEDT (high-end desktop) platform, codenamed "Haswell-E," in the third quarter of 2014 (after June), which should space its launch roughly a year from Core i7 "Ivy Bridge-E." With Haswell-E, Intel is expected to increase core counts across the board, launching an "affordable" six-core part around the $400 mark, an eight-core part around the $600 mark, and an Extreme Edition eight-core part around the $1,000 mark. The three will be based on the LGA2011-3 socket, which has the same pin count as today's LGA2011, yet is incompatible with it, because the pin map of Haswell-E will differ from its predecessors'. Driving the platform will be Intel's X99 Express chipset, with support for up to ten SATA 6 Gb/s ports, and a large number of USB 3.0 ports. Some of the first X99 motherboards are expected to be unveiled at Computex 2014.

Source: WCCFTech, Image Courtesy: VR-Zone

Core i7 "Haswell-E" Engineering Sample Pictured

Here's the first picture of Intel's next-generation Core i7 HEDT (high-end desktop) processor, codenamed "Haswell-E." Based on Intel's latest "Haswell" micro-architecture, the chip will be Intel's first HEDT processor to ship with eight cores, and the first client CPU to ship with next-generation DDR4 memory interface. In addition to IPC improvements over "Ivy Bridge" that come with "Haswell," the chip integrates a quad-channel DDR4 integrated memory controller, with native memory speeds of DDR4-2133 MHz; a PCI-Express gen 3.0 root complex with a total of 40 PCI-Express lanes, and yet the same DMI 2.0 (4 GB/s) chipset bus.

Built into the LGA2011-3 socket, "Haswell-E" will be incompatible with current LGA2011 motherboards, as the notches of the package will vary from LGA2011 "Ivy Bridge-E." Intel will introduce the new X99 Express chipset, featuring all 6 Gb/s SATA ports, integrated USB 3.0 controllers, and a PCI-Express gen 2.0 root complex for third-party onboard controllers. Interestingly, there's no mention of SATA-Express, which Intel's next-generation 9-series chipset for Core "Broadwell" platforms reportedly ships with; and X99 isn't looking too different from today's Z87 chipset. With engineering samples already out, it wouldn't surprise us if Intel launches "Haswell-E" along the sidelines of any of next year's big-three trade-shows (CES, CeBIT, and Computex).

Source: VR-Zone

Lepa G-Series and B-Series Power Supplies Begin Rolling Out

Lepa began rolling out its first G-Series (80 Plus Gold-compliant) and B-Series (80 Plus Bronze-compliant) modular PSUs for gaming PCs, though its EcoMaster sister brand. The two were first unveiled at this year's Computex event. Both series feature identical body designs, cabling, and features, but differ with innards. The G-Series includes 1000W, 800W, 700W, 600W, and 500W variants; while the B-Series includes 1000W, 650W, and 550W variants. Both series feature single +12V rail designs, DC-DC switching, Anti3s Q-Brick bodies, active-PFC, and various electrical protection mechanisms. Measuring about 150 x 165 x 86 mm, these units feature 135 mm fans, are ErP Lot6 compliant, and support low-power C-states of the new Core "Haswell" processors.

Source: Hermitage Akihabara

Brace for Cylons, In Win Tòu Inbound

Initially displayed at Computex this year, In Win's latest marvel bares the name Tòu, which in Mandarin Chinese stands for transparency, or the phenomenon of light passing through a non opaque medium. A concept which In Win's designers managed to beautifully and successfully evoke with their latest creation. The Tòu employs two distinct and interestingly married materials in its construction. The case panels are made of tough, 3mm thick tempered glass, which achieves mirror like properties after receiving a special, transparent coating. While the frame is made of 2-4mm think aluminium, which is manufactured through a labor intensive process known as Sand Casting, which employs sand molds to produce the intricate shapes displayed by this design.

The Tòu is a full tower chassis, with seven PCI slots, supporting ATX motherboards and smaller form factors (mATX & mITX). It can accommodate four 120mm fans, one frontal intake and three top exhaust fans, where there is also sufficient space for a large 360mm radiator. Aside from the On/Off function, the touch controlled front panel also allows the used to cycle through the integrated fan controller speed steps and to adjust the lighting level inside the case. When the system is turned Off and no lights are On inside the case, the Tòu becomes completely opaque and all the panels become highly reflective, mirrors essentially. But when the system is On and so are the lights inside the case, the panels become transparent and the internals visible, an uncomplicated yet striking visual effect.

Akasa Newton NUC Cases Official

Akasa officially launched its Newton V line of cases for Intel NUC platform, which it unveiled at this year's Computex. The all-aluminium cases are available in black, silver, and gold colors, and like most other NUC cases are designed to passively cool the processor and chipset, the two hot components on the platform. Its body panels are chunky and ridged, to double up as heatsinks. The Newton V is designed specifically for Intel's D53427RKE motherboard, which features a 17W Core i5-3427U dual-core processor. Measuring 150 x 150 x 47 mm, the Newton V dry-weighs 950 g. It features VESA wall-mount holes, two holes for Wi-Fi/Bluetooth antennae, three front-panel USB ports, of which one is USB 3.0, and a Kensington lock slot. Akasa didn't announce pricing.

OCZ Announces Preliminary 1Q14 Financials

OCZ Technology Group, Inc. (NASDAQ: OCZ), a leading provider of high-performance solid-state drives (SSDs) and power management solutions for computing devices and systems today announces selected preliminary financial results for the first quarter ended May 31, 2013, subject to customary closing and audit procedures.
Preliminary revenue for the first quarter of fiscal 2014 is estimated to be between $50 and $55 million. The sequential decrease in revenue was primarily due to the continued tight supply of NAND flash. The Company's revenue mix continued to shift towards the mainstream and higher-end client markets, as well as enterprise and OEM solutions as the Company continued to focus on these end markets. At the end of the quarter there was an additional $23 million of shippable backlog that was unrealized in the quarter due to supply constraints.

Gross margin continued to improve and is estimated to be between 17% and 20% for the first fiscal quarter as revenue generated from our Enterprise solutions increased sequentially. The Company continued to reduce its operating expenses by further reducing non critical spending. The Company's break-even level continues to improve due to these actions. Operating expenses for the first quarter are estimated to be between $20 and $22 million, which include restatement related expenses of approximately $1.5 million and stock compensation charges of approximately $2 million. Cash flow improved as we reduced our quarterly cash usage to approximately $6 million in the quarter. Cash ended the quarter between $6 and $7 million with total debt outstanding of $10 million. The Company expects that it will require access to additional capital which it is currently in the process of securing.

ID-Cooling Introduces their Processor Cooling Lineup for Europe

ID-Cooling is a new Brand in Europe founded by Shenzhen Wan Jing Hua Technology co., Ltd. Located in Shenzhen China. The Company has a long History in the OEM Business for Cooling Products. In the 10 Years of Company History create the Company behind the Brand ID-Cooling a lot technologies for Cooling.

ID-Cooling had their first International release on the Computex 2013 in Taiwan. The Fair was very successful for the Brand a lot of contacts was created and the Distribution Channel in Europe is Interested in ID-Cooling Products.

Xigmatek Orthrus SD1467 Released

Displayed initially at the recently concluded Computex event in Taipei, Xigmatek's newest cooler employs a number of unconventional design choices, meant to usher "the future of CPU cooling." The cooler sits on a solid copper base from which seven 6 mm heat pipes conduct heat into two distinct fin stacks, the five central heat pipes feed the upper, larger aluminium fin stack, which is cooled by a 140 mm PWM fan spinning at 800-1200 RPM, while the two peripheral heat pipes conduct the heat into a smaller aluminium fin stack, situated underneath the larger one, and being cooled by its own 80 mm PWM fan with a maximum speed of 2000 RPM. The heat sink's weight is 875 grams and its makers claim it can dissipate up to 180 W using the two stock fans. Xigmatek chose to dress up the cooler in a black plastic shroud which some may find appealing. I, however, do not find myself among them.

ASUS ROG Maximus VI Extreme Demonstrates Overclocking Supremacy

ASUS announced that the Intel Z87-based Republic of Gamers Maximus VI Extreme motherboard has achieved a decisive 91% success rate at a Computex Taipei 2013 overclocking summit sponsored by Intel and Corsair. Additionally, the board tallied eight world performance records at a separate gathering that took place at ASUS headquarters, all mere days after its official launch.

Ten out of eleven wins at the Intel and Corsair Computex OC Main Event
Competing against top-tier overclocking motherboards from a variety of brands, Maximus VI Extreme took ten out of eleven top spots (or 91%) at the Intel and Corsair Computex OC Main Event. Full details found here.

G.Skill Helps Achieve Six OC World Records

During the week of Computex 2013, 6 overclocking records were shattered by professional overclockers with G.SKILL extreme performance DDR3 memory. Established in 1989 by computer hardware enthusiasts, G.SKILL is a leading memory & Solid State Drive manufacturer based in Taipei, Taiwan. The company's top priority is quality. All of the products undergo a series of the most rigorous tests and strict quality control processes. In addition to a committed, qualified IC testing house to examine the products, all G.SKILL products are 100% tested to ensure the highest yield, reliability and quality.

GIGABYTE GTX TITAN with WindForce 3X Bundle Official

At Computex, GIGABYTE unveiled its GeForce GTX TITAN with WindForce 3X bundle (GV-NTITANOC-6GD-B), in which you get a reference-design yet factory-overclocked card, and a WindForce 3X cooling solution that you DIY install it on the card yourself. Both the card and the cooler are bundled into a single large box. The card comes factory-overclocked at 928 MHz core, 980 MHz GPU Boost, and 6.00 GHz memory. It maintains these clocks even with the reference cooler, but it could get louder than normal, and may not be able to sustain boost states as the GPU temperature jousts with the 80°C mark. With the WindForce 3X cooler installed, the card will run quieter, and the GPU will sustain boost states better.

The WindForce 3X cooler is complex aluminum fin-stack heatsink, in which two equally-sized aluminum fin stacks draw heat from the GPU, using five 8 mm-thick copper heat pipes. These are ventilated by a trio of 80 mm fans suspended on a metal shroud. Included in the add-on package are thermal pads for the memory and VRM, two syringes of TIM, screws, washers, an Allen key, and a large mouse-pad. GIGABYTE could price the card at a premium.

AeroCool showcases New GT Series of PC Cases

Aerocool Advanced Technologies Corp., one of the world leading manufacturers of gaming PC gear, has introduced a brand new PC chassis series during their VIP event related to this year's Computex 2013 exhibition in Taipei, Taiwan. Attendees had a chance to witness three different models of GT series - a new gaming line of PC cases. Each model is already available in black and a white version, which makes it a total of six product editions.

With the focus on ambitious gamers both inside and outside of all the three GT series models - GT-S (super-tower), GT-R (mid-tower), GT (compact mid- tower) were designed with a special effort to satisfy the high demands of different types of users. Top notch of the new series is the Aerocool GT-S model, which is equipped with a big variation of features. It comes in a two-color mix - white and blue and black and red. During the Computex event, the GT-S model attracted a lot of attention thanks to the magnetic front door, which can be placed in any location on the front panel or completely removed. Another highlighted feature of this new PC case is the maximum space (enough for XL-ATX motherboard) which is assured thanks to the super tower form factor and many expansion possibilities.
Return to Keyword Browsing