News Posts matching "DDR2"

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How Intel Plans to Transition Between DDR3 and DDR4 for the Mainstream

The transition between DDR2 and DDR3 system memory types was slower than the one between DDR and DDR2. DDR3 made its mainstream debut with Intel's X38 and P35 Express platforms, at a time when the memory controller was still within the domain of a motherboard chipset, at least in Intel's case. The P35 supported both DDR2 and DDR3 memory types, and motherboard manufacturers made high-end products based on each of the two memory types, with some even supporting both.

Higher module prices posed a real, and higher latencies, posed a less real set of drawbacks to the initial adoption of DDR3. Those, coupled with the limited system bus bandwidth, to take advantage of DDR3. DDR3 only really took off with Nehalem, Intel's first processor with an integrated memory controller (IMC). An IMC, again in Intel's case, meant that the CPU came with memory I/O pins, and could only support one memory type - DDR3. Since then, DDR3 proliferated to the mainstream. Will the story repeat itself during the transition between DDR3 and the new DDR4 memory introduced alongside Intel's Core i7 "Haswell-E" HEDT platform? Not exactly.

I'M Intelligent Memory Announces High Capacity DDR2 SDRAM ICs

With capacities of up to 4 Gigabit per chip, I'M Intelligent Memory, a Hong Kong based fabless DRAM manufacturer, enters the market for industrial DDR2 memory components with their mission statement "Beyond Limits".

DDR2 SDRAM technology is the memory standard that most industrial applications have been designed around for years. I'M pushes this technology even further by offering higher capacities and wider temperature ranges than other manufacturers. The most common densities of DDR2 continue to be 512 Mb and 1 Gb. The larger capacities, such as 2 Gb and 4 Gb, are defined by JEDEC, but their availability from other manufacturers continues to be very limited. I'M Intelligent Memory focuses on the high end of DDR2 capacities with their 2 Gbit monolithic, 2 Gbit Dual-Die (DDP) and 4 Gbit DDP components in standard or industrial temperature ranges. For automotive customers, AEC-Q100 versions are also available.

Samsung Mass Producing 10 nm Class High-Performance 128-Gbit 3-bit MLC NAND Flash

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing a 128-gigabit (Gb), 3-bit multi-level-cell (MLC) NAND memory chip using 10 nanometer (nm)-class process technology this month. The highly advanced chip will enable high-density memory solutions such as embedded NAND storage and solid state drives (SSDs).

"By introducing next-generation memory storage products like the 128Gb NAND chip, Samsung is extremely well situated to meet growing global customer needs," said Young-Hyun Jun, executive vice president, memory sales & marketing, Device Solutions Division, Samsung Electronics. "The new chip is a critical product in the evolution of NAND flash, one whose timely production will enable us to increase our competitiveness in the high density memory storage market."

AMD Rolls Out Athlon II X2 280 Value Dual-Core Processor

It's not retirement time for AMD's 45 nm "Regor" silicon just yet, with the company announcing the Athlon II X2 280 value dual-core processor. Built in the socket AM3 package (compatible with AM2/AM2+/AM3/AM3+ motherboards), and based on the company's K10.5 micro-architecture, the chip features two x86-64 cores clocked at 3.60 GHz, 1 MB of L2 cache per core (2 MB total), an instruction set that includes SSE3 and SSE4A, and a dual-channel integrated memory controller that supports both DDR2 and DDR3 memory types. The chip can take advantage of HyperTransport 3.0 interface, with a maximum data-rate of 4.0 GT/s. It features a rated TDP of 65W, and is designed for entry-level desktops. It is priced at US $49.99.

Handheld Launches New Version of its Algiz XRW Ultra-Rugged Notebook

Handheld Group, a fast-growing manufacturer of rugged mobile computers, PDAs and smartphones, today announced the launch of the new version of its highly popular Algiz XRW rugged notebook. The updated Algiz XRW is considerably faster than its predecessor, and has twice the amount of RAM.

The new Algiz XRW is a slim, lightweight, compact and fully rugged notebook that delivers unprecedented performance in the field. Its 10.1-inch touchscreen display features MaxView technology, providing spectacular screen clarity and brightness in any outdoor condition, even direct sunlight. The Algiz XRW is one of the lightest and most compact rugged notebooks on the market, weighing in at a mere 1.6 kilograms, or 3.5 pounds.

Quanmax Announces QBOX Mini-1000 Series

IPC, digital signage, and panel PC maker Quanmax announced the QBOX Mini-1000 series of pocketable based on Intel x86 platform. Measuring just 130.11 x 83.06 x 19.2 mm (DxWxH), weighing 174 g, or roughly the size and weight of a portable hard drive, the QBOX Mini-10x0 is driven by an Intel Atom E640T embedded processor clocked at 1.00 GHz, with 512 KB cache, and 3.5W TDP; up to 1 GB of DDR2 memory; featuring D-Sub (QBOX Mini-1000) or HDMI (QBOX Mini-1010) display outputs, up to three USB 2.0 ports, stereo audio with line-in/mic, and mPCIe and mSATA slots for expansion. This pocket-sized PC is sufficiently powered to serve as a nettop.

Source: FanlessTech

ITC Issues Notice of Final Determination in Rambus Matter

Rambus Inc. (RMBS), one of the world's premier technology licensing companies, today announced that the International Trade Commission (ITC) has issued its notice of final determination in the action brought by Rambus against LSI Logic, ST Microelectronics and other Respondents. In its notice, the ITC affirmed the initial determination of Administrative Law Judge (ALJ) Theodore R. Essex that there was no violation of Section 337 of the Tariff Act of 1930 with respect to the asserted patents. The Commission also reversed the ALJ’s determinations that Rambus demonstrated the existence of a domestic industry, that certain asserted Dally claims were invalid, and that those claims were infringed. The action is Investigation Number 337-TA-753.

Rambus has not yet received the full opinion by the Commission. A copy of today’s summary is available here.

Micron Announces Availability of Phase Change Memory for Mobile Devices

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an industry first with high-volume availability of its 45-nanometer (nm) Phase Change Memory (PCM) for mobile devices, featuring 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package. As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

PCM provides enhanced boot time, simplifies software development and boosts performance with overwrite capability. It also provides very low power consumption and extremely high reliability. In addition, the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with JEDEC industry standards.

DETSEL-01: Pocket-Sized x86 PC

Russian Communication Technology LTD. launched DETSEL-01, one of the smallest Intel x86-powered mini-PCs ever. Measuring just 125 x 74 x 12 mm (roughly the size of a Seagate GoFlex 2.5-inch portable HDD), the DETSEL-01 is driven by an Intel Atom E680 processor (1.60 GHz, single-core with HTT, 4.5W TDP), with 1 GB of DDR2-800 memory, with 128 GB or 64 GB SATA 3 Gb/s SSD handling storage, and an external 12V DC input powering it. Connectivity is aplenty, with 802.11 b/g/n, gigabit Ethernet, Bluetooth 4.0, D-Sub display output (HDMI coming soon), stereo HD audio, and two USB 2.0 ports. The best part about this pocket-sized PC is its ability to run 32-bit Windows XP and Windows 7.

Source: FanlessTech

Samsung Now Producing Highest Density Mobile LPDDR2 Using 20nm-class Technology

Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology solutions, announced today that it has begun producing the industry’s first four gigabit (Gb), low power double-data-rate 2 (LPDDR2) memory using 20 nanometer (nm) class* technology. The mobile DRAM (dynamic random access memory) chip, which went into mass production last month, will help the market to deliver advanced devices that are faster, lighter and provide longer battery life than today’s mobile devices.

“Samsung began expanding the market for 4Gb DRAM last year with the first mass-produced 30nm-class DRAM, and now we are working on capturing most of the advanced memory market with our new 20nm-class 4Gb DRAM,” said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. “In the second half of this year, we expect to strongly increase the portion of 20nm-class DRAM within our overall DRAM output to make the 4Gb DRAM line-up the mainstream product in DRAM production, and therefore keeping the leadership position in the premium market and strengthening our competitive edge.”

Princeton Intros 5-bay 10 TB Desktop NAS

Japanese company Princeton introduced the ProNAS DN-503AH-PDC-10T 5-bay NAS for small businesses, with 10 TB of pre-installed storage. Its storage controller supports SATA 3 Gb/s interface, with RAID 6 mode for data redundancy. The NAS is powered by Intel x86 architecture, an Intel Pentium Dual-Core 1.60 GHz processor, with 2 GB of DDR2-533 MHz memory drives the machine. Surprisingly, it features four gigabit Ethernet interfaces. A Linux-based OS drives the NAS, which supports most modern NAS technologies. Measuring 199 x 338 x 264 mm, the DN-503AH-PDC-10T weighs about 13 kg. Its price is not given out, but varies depending on the warranty and on-site maintenence packages that go with it.

Source: Hermitage Akihabara

Edimax Shows Off 802.11ac Router, USB Dongle

Taiwan-based Edimax, which is known more for its low-cost networking hardware, took a big leap, by unveiling its first 802.11ac wireless networking hardware. These include a static router, and a USB adapter. The router uses a Broadcom-made 600 MHz Intensi-fi MIPS32 central processor. This chip has two PCI-Express interfaces, a built-in USB 2.0 host controller, and DDR2 memory controller. It has two WLAN modules, the Broadcom BCM4331 handles 802.11 b/g/n in the 2.40 GHz band, while a Broadcom BCM4360 handles 802.11ac in the 5 GHz band. This module supports network bandwidths up to 1.35 Gbps. Then you have a wired LAN interface, with one gigabit uplink port, and four gigabit downstream ports.

Moving on, Edimax showed off one of the industry's first USB 802.11ac adapters. This dongle uses Broadcom BCM43526 chip, and offers dual-band operation. In the 5 GHz band, it offers bandwidths of up to 900 Mbps, while in the 2.4 GHz band, it offers 300 Mbps. Sadly for this adapter, the USB interface is USB 2.0 HiSpeed, which poses a host bandwidth bottleneck of 480 Mbps. When you factor in things such as the various protocol overheads, the actual bandwidth yield could be much lower. Edimax is yet to name its products, so quite some development is left.

Source: VR-Zone

Creative ZiiLabs Announces 100 Core CPU

ZiiLABS, a pioneering media processor and platforms company (a wholly-owned subsidiary of Creative Technology Ltd), today unveiled its ground-breaking 100-core ZMS-40 StemCell Media processor optimized for Android. The ZMS-40 combines 96 of ZiiLABS' StemCell media processing cores with four 1.5GHz ARM Cortex-A9 CPUs to deliver stunning multi-tasking application and media processing performance.

By doubling the number of StemCell Media processors compared to the previous ZMS-20, the ZMS-40 delivers twice the peak media performance, while running the larger array at lower clock speeds to achieve the same performance leads to greater energy efficiency and a reduction in power consumption of up to 50 percent. With 2X the performance and 2X the power efficiency, the ZMS-40 delivers ground-breaking media capabilities to handheld devices such as tablets, including ultra-high-resolution H.264 HP decoding of up to 3840x1080 for true 1080p 3D stereo, a rich and interactive desktop browsing experience, 2560x1600 (WQXGA) display resolution support, higher-quality video encoding and immersive OpenGL ES graphics and future support for High Efficiency Video Coding (HEVC).

RAIDON Launches Scheduled Backup and Reliable SAS Storage Solutions

RAIDON is releasing the new generation of SAS storage solutions, GR2880 and GR4880. These models can to be easily deployed while offering a stable performance and scheduled backup to the SMB. GR2880 and GR4880 offer remarkable SAS storage solutions, embed dual SAS host interface to the fastest data throughput for an extraordinary performance, also provides up to RAID 6 the highest RAID level protection to data from work station and data server for a secured operating environment.

Both models also provide snapshot function which only offered from high standard storage devices. This function will backup stored data in records from designation time, to prevent data encounters inevitable problems through capability of restoring primitive correct data from files of saved records.

Gigabyte Intros New Revision of GA-EG41MFT-US2H

The market for socket LGA775 is still far from dead as there are large inventories of cheap Core 2, Pentium, and Celeron chips left in the market, as well as buyers upgrading their DDR2 systems to those with DDR3, to benefit from the DDR3 fire sale. Gigabyte introduced a new revision of its GA-EG41MFT-US2H, revision 1.4, with an updated gigabit Ethernet chip. The micro-ATX motherboard uses 3+1 phase VRM to power the processor, a wide range of Core 2 Duo and Core 2 Quad processors are supported. The processor is wired to Intel's G41 northbridge. Surprisingly, its graphics controller gives out an HDMI connection apart from DVI and D-Sub. It is wired to four DDR3 DIMM slots, supporting up to 8 GB of memory.

Expansion slots include two PCI, one each of PCI-Express 1.1 x16 and PCIe x1. The ICH7 southbridge drives four SATA 3 Gb/s ports, and an IDE connector. The gigabit ethernet controller has been updated to RTL8111E, from the 8111D found on the older revision. Other features include 8-channel HD audio, Firewire, FDC, COM, and a number of USB 2.0 ports. Expect a sub-$100 pricing for this board.

Leak: The Intel Medfield Files

VR-Zone have been having a little chat with Intel 'sources', who have leaked some juicy tidbits for us to enjoy in the form performance and power news. The upcoming next generation Medfield platform is Intel's first true System on a Chip (SoC) and is designed to compete with various low power ARM offerings in the tablet space. To help achieve this, they've gone through an internal restructure, merging four business units into just one: Ultra-Mobility, Mobile Wireless, Mobile Communications and Netbook & Tablet PC. The business unit is now simply known as Mobile and Communications. It's being run by Mike Bell and Hermann Eul and the first product to emerge from it will be is the 32 nm Medfield SoC solution.

VR-Zone explained that the competition will be "Apple's A-Series, NVIDIA Tegra, Qualcomm Snapdragon, Samsung Exynos, Texas Instruments OMAP and the likes. Out of all the chips mentioned above, only Samsung's Exynos is currently manufactured in 32nm process, just like Medfield."

Crucial Further Expands Gaming Line With New Ballistix Tactical and Ballistix Elite

Crucial, a leading global brand of memory and storage upgrades, today announced two product line additions to its highly successful Ballistix high-performance memory: Crucial Ballistix Tactical and Crucial Ballistix Elite lines. Building on the recent successful launch of the Crucial Ballistix Sport memory, these new product lines create a comprehensive high-performance memory portfolio addressing the needs of a broad range of users across performance memory segments.

Whether casual enthusiast or hardcore gamer, the expanded Ballistix portfolio now provides a distinct choice of performance memory solutions and is available in a variety of speeds and densities, along with differentiated product features. The complete line of Ballistix memory features a new logo treatment and updated heat spreader designs, as well as a full range of products from low latency DDR2-800MHz up to high-speed DDR3-2133MHz. Additionally, 4GB densities will be available in DDR3-1600MHz, -1866MHz, and -2000MHz modules.

Elpida Uses High-k Metal Gate Technology to Develop 2-gigabit DDR2 Mobile RAM

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced the DRAM industry's first-ever use of high-k metal gate (HKMG) technology to develop a 2-gigabit DDR2 Mobile RAM (LPDDR2) at the 40nm-class DRAM node.

HKMG is technology that uses insulator film with a high dielectric constant (abbreviated to "high-k," a semiconductor industry measure of how much charge a material can hold) in the transistor gate to reduce current leakage and improve transistor performance. Metal gate electrodes that are required for the high-k dielectrics process are also used. Some makers of logic semiconductors have started to use HKMG, but higher heat treatment temperatures after HKMG formation and complicated DRAM structural characteristics have prevented consistent application in the DRAM fabrication process. Elpida, however, has managed to lower the heat treatment load and overcome certain memory device structural complications.

WinChip Displays its Fancy Memory Modules

After Aexea, it's time to move onto another boutique memory module vendor, WinChip. This Taiwan-based PC memory vendor seems to focus on the form and design of the memory module (particularly the heatspreaders or heatsinks), so much so, that some of its modules even bear artistic true-color paintings. The first set of modules we came across used a unique kind of heatsinks. Among these, the first one reminded us of some of Mushkin's early heatspreader designs. The second one looks more unique, with a central portion of the heatsink protruding out. A heat pipe is running along the length of the module, evenly distributing heat. In another part of the exhibit, there's a module with a strange heatspreader design. The heatspreader increases module height by almost double, and has a few horizontal grooves to dissipate heat.

Moving on, there are a couple of normally-sized DDR2-800 and DDR3-1333 modules that bears branding of Avatar: The Game. Next up, are the modules attracting a lot of attention. These ones have heatspreaders with fancy true-color graphics, some are photographs, while the others are 3D art, mostly wild-animal themed, including the African Savannah, a gliding eagle, dolphins, toco toucans in a tropical jungle with banana trees, etc.,etc. The last set has heatspreaders with abstract writings in Asian scripts. Like Aexea, WinChip's modules are sold more on their product design. The modules themselves are mostly JEDEC-specced, with the exception of some heavier ones that run at PC3-12800 speeds.

Samsung Offers World's First 64 Gb MLC NAND Flash Using Toggle DDR2 Interface

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has started the industry's first production of a high-performance toggle DDR 2.0 multi-level-cell (MLC) memory chip. The new NAND flash chip features a 64 gigabit (Gb) density, made possible by using an advanced 20 nanometer (nm) class* process technology. The chip is designed to support the high-performance requirements of mobile devices such as smartphones, tablets and solid state drives (SSDs).

Equipped with a toggle DDR (Double Data Rate) 2.0 interface, the new 64Gb MLC chip can transmit data at a bandwidth of up to 400 megabit per second (Mbps). This provides a 10-fold increase over the 40Mbps Single Data Rate (SDR) NAND flash memory in widespread use today, and a three-fold boost over 133Mbps toggle DDR 1.0, 32Gb NAND flash memory, which Samsung was first to produce in 2009.

AMD Intros Phenom II X4 980 Black Edition Quad-Core Processor

Today AMD released to market its latest quad-core processor, the Pheonom II X4 980 Black Edition. The new, faster SKU was first reported to be taking shape back in March. Based on the 45 nm "Deneb" silicon and K10.5 architecture, the X4 980 BE is yet another speed-bump, clocked at 3.70 GHz (18.5 x 200 MHz), with room for some overclocking thanks to its unlocked BClk multiplier.

The Deneb die packs four x86-64 cores with 512 KB caches each, and a shared 6 MB L3 cache. Despite its high clock speed, the processor maintains TDP of 125W. Its IMC supports dual-channel DDR3/DDR2 memory, and is backwards compatible with AM2+ socket apart from its native AM3 socket. HyperTransport 4 GT/s is its chipset interconnect. The new processor is priced at US $195.

Crucial Expands Gaming Line With New Ballistix Sport Memory Series

Lexar Media, a leading global provider of memory products for digital media, today introduced the Crucial Ballistix Sport memory series designed to provide mainstream users, gamers, and general PC enthusiasts with a reliable, no-hassle gaming experience. The new Crucial Ballistix Sport memory supports today's latest AMD and Intel platforms, including 2nd Generation Intel Core processor (formerly codenamed Sandy Bridge) technology. It also features a stylish new heat spreader design, along with standard timings and voltages, providing maximum memory stability and system compatibility. Additionally, industry-standard specifications require little or no BIOS configuration, resulting in easy product installation.

"Over the years, Crucial Ballistix memory has earned a reputation amongst gamers and enthusiasts as high-quality, high-performance, reliable memory," said Jeremy Mortenson, senior product manager. "The Crucial Ballistix Sport series offers casual gamers an accessible, easy-to-use Ballistix memory product at an affordable price. This new Ballistix offering is part of our broader product strategy and a commitment to satisfy the needs of our customers."

AMD Also Readies 3.50 GHz Clocked Phenom II X2 Part

Apart from the 3.70 Phenom II X4 980, AMD's next, and probably (hopefully) final wave of Phenom II processors will include a 3.50 GHz clocked dual-core part, the Phenom II X2 570 Black Edition. This socket AM3 chip will be based on the "Callisto" silicon, which is essentially a "Deneb" quad core die used in X4 parts, with two of its four cores disabled. The chip features two cores clocked at 3.50 GHz (17.5 x 200 MHz), 512 KB dedicated L2 caches per core, and 6 MB shared L3 cache. The integrated dual-channel memory controller supports DDR3-1333 MHz on AM3 socket, and DDR2-1066 MHz on AM2+. As a Black Edition part, the BClk multiplier is unlocked, to help with overclocking. At these speeds, the TDP is rated at 80W.

Source: DonanimHaber

AMD Readies 3.70 GHz Phenom II X4 980 Black Edition Processor

AMD is looking to give its Phenom II series a finale, with a new quad-core Phenom II X4 model, the Phenom II X4 980 Black Edition. The new chip will be clocked at 3.70 GHz out of the box (18.5 x 200 MHz). It achieves this speed while staying within the 125W TDP envelope. Based on the 45 nm "Deneb" silicon, the X4 980 BE features four x86-64 cores with 512 KB dedicated L2 cache each, and a 6 MB shared cache. Compatible with AM3 and AM2+ sockets, the chip packs a dual-channel memory controller that supports DDR3-1333 MHz or DDR2-1066 MHz memory standards. AMD will unveil the new chip soon, as the company gears up to launch next-generation chips in June.

Source: DonanimHaber

ONFI Announces Publication of 3.0 Standard, Pushes Data Transfer Speeds to 400 MB/sec

The Open NAND Flash Interface (ONFI) Working Group, the organization dedicated to simplifying integration of NAND Flash memory into consumer electronic devices, computing platforms, and industrial systems, today published the new ONFI 3.0 standard. By using the non-volatile DDR2 (NV-DDR2) interface, the newly ratified standard reaches speeds of up to 400 megabytes (MB)/sec, doubling the current NAND interface transfer rates.

The ONFI 3.0 standard details the interface and infrastructure that ONFI's more than 100 members can employ to develop products that deliver the industry's fastest NAND interface. Improvements in ONFI 3.0's NAND interface speeds will also enable future NAND controllers to achieve similar performance with half the number of channels, providing both a cost and space savings, which are key requirements for solid-state drive (SSD) design. The ONFI 3.0 incorporates a sophisticated die selection feature that reduces the number of chip enable (CE) pins, which in turn lowers the number of controller pins making PCB routing more efficient. Reducing the number of CE pins is especially important for SSDs, providing a significant cost reduction and allowing the extra pins to be assigned to other applications within the system.
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