News Posts matching "DIMM"

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Team Group Industrial Control Wide Temperature Series Memory Announced

Team Group Inc. has been invested a great deal of efforts in developing commercial products that catch up with global trends. Now we are expanding our spectrum to industrial markets and dedicate ourselves in the development of industrial products that features high standard and resistance to extreme environmental conditions. This year, Team Group rolls out the new industrial control memory module series, including Registered DIMM, ECC U-DIMM, VLP U-DIMM and Micro-DIMM, in the largest embedded system exhibition, the ESEC, in Japan.

The "industrial control wide-temperature series," the point in the show, is the "mighty warrior" that is able to operate in an environment at a temperature ranging from -40°C to 95°C. It is like operating stably in an extreme environment in the Arctic Circle or a scorching desert. This is absolutely the top choice for your industrial control memories and server memories.

Ricoh Intros Ivy Bridge Mobile-on-Desktop Micro-ATX Motherboard

Ricoh Japan introduced a FB19M, an Intel HM76 Express chipset based mobile-on-desktop motherboard in the micro-ATX form-factor. The motherboard can seat mobile Core "Ivy Bridge" and "Sandy Bridge" processors in the PGA988 package, and includes a fan-heatsink that can handle these chips (up to 55W). The platform is then wired out to desktop interfaces. 24-pin ATX and 4-pin ATX connectors are used to draw power, the CPU is wired out to full-sized DIMM slots, expansion slots include one PCI-Express 3.0 x16, two PCI-Express 2.0 x8 (electrical configuration not known), and a PCI-Express 2.0 x1.

All six SATA ports from the HM76 PCH are wired out as internal ports, including six SATA 6 Gb/s, and four SATA 3 Gb/s. Display outputs include DVI, D-Sub, and LVDS. Other modern connectivity includes 2-channel HD audio, dual gigabit Ethernet interfaces, four USB 3.0 ports, and a number of USB 2.0 ports. There is quite some legacy connectivity, including two serial RS-232 ports, and headers for other serial and parallel interfaces. The board is fit for industrial PCs and other embedded systems.

Source: Hermitage Akihabara

Giada Intros MI-HM65T Mini ITX Motherboard

The versatile new MI-HM65T Mini ITX motherboard from Giada is at home in all environments, including the factory floor, tough monitoring and control applications, embedded computing, office desks, and the home. Built around Intel's HM65 chipset and the Sandy Bridge platform, this motherboard brings users high performance and almost unlimited connectivity, with economical power consumption. It offers all the industry-standard features of a desktop PC in a tiny package, to support a wide range of applications.

Powered by Intel's fast Core i7, i5, i3 or Celeron 867 CPUs, supported by up to 4GB of memory, with onboard integrated graphics and video support, the Giada MI-HM65T can easily take care of almost any task you throw at it. This tough but tiny powerhouse handles industrial control, monitoring and automation applications as well as office and productivity, or home entertainment.

BOXX Introduces Intel Xeon Workstation Available With Four GPUs

BOXX Technologies, the leading authority on dedicated rendering and innovator in high-performance computing systems for product design, visualization, engineering, visual effects, and more, today introduced the 3DBOXX 4925, the industry's first single Intel Xeon processor workstation with support for up to four GPUs. The latest addition to the BOXX 4900 series workstation line, 4925 enables users of Autodesk Revit, Autodesk 3ds Max, SolidWorks, CATIA, and other professional software applications, to simultaneously design and render without bogging down the processes.

Tyan Announces its Embedded Product, S5515 & S5517 for Core "Ivy Bridge" Processor

TYAN, an industry-leading server platform manufacturer and subsidiary of MiTAC International Corp., announces new CPU support for the S5515 and S5517. These embedded motherboards now support the 3rd Generation Intel Core processor product family (codename: Ivy Bridge) with a quick bios update. These two platforms now deliver the benefits of Intel’s 22 nm Core i3/i5/i7 processor architecture with stronger performance, consistent reliability, and low cost in small form factor that targets various applications in the embedded industry.

TYAN’s S5515 and S5517 embedded motherboards now offer support for 3rd Generation Intel Core i3/i5/i7 Processors. Existing motherboards will only need a BIOS update to support the new processors. Intel’s 3rd Generation Intel Core processors offer greater performance with multiple expansion options such as PCI-E x16 Gen.3 slots, SATA 6G/3G controllers, U-DDR3 1600/1333/1066 w/o ECC memory slots and USB 3.0 ports. These two products deliver enhanced computing performance, greater 3D (tri-gate) effect and more RAM support. This makes them the ideal platforms for customers with critical requirements from telecom, networking, storage, medical imaging, embedded severs, security and surveillance appliances.

ASRock X79 Fatal1ty Champion Motherboard Detailed

ASRock is readying its second Fatal1ty-branded socket LGA2011 motherboard, the X79 Fatal1ty Champion. The company's first LGA2011 Fatal1ty motherboard is the X79 Fatal1ty Professional, which was launched in February. The new X79 Fatal1ty Champion will be launched on April 27. Those familiar with Creative Sound Blaster Fatal1ty line of sound cards will note Fatal1ty Champion as being a more feature-rich version of Fatal1ty Professional. In this case, the X79 Fatal1ty Champion is based on a completely new PCB, with the design idea of more expansion, and the latest Creative Sound Core3D audio solution.

The X79 Fatal1ty Champion features eight DDR3 DIMM slots (X79 Fatal1ty Professional has four), and a PCIe-only expansion slot layout. The LGA2011 socket is powered by a 12-phase DigiPower VRM, similar to the one on the Professional. The VRM heatsink is assisted by two other secondary heatsinks, to which heat is conveyed by a heat-pipe. One of these is connected to the PCH heatsink. Power is drawn by 24-pin ATX, 8-pin EPS, and one 4-pin Molex (angled, optional). The board features consolidated voltage measurement points, which are socketed to hold your multimeter's leads in place. The board will be augmented by a feature-rich UEFI BIOS setup program, and ASRock-exclusive features such as XFastLAN, XFastUSB, and XFastRAM will be included.

Kingston Launches New System-Specific Memory Packages for Notebooks

Kingston launched a fleet of new system-specific SO-DIMM memory packages. Each of these packages contain memory that's tested for 100% compatibility and rated performance on the notebook makes they're specific to. These include HP, Dell, Apple, Lenovo, Sony, and Toshiba. The new packages make it easy for ground-store buyers to pick the right memory for their notebooks off the rack, with minimal help from the storekeepers. Newer batches of Kingston DDR3 SO-DIMM memory for notebooks will implement the new packaging.

Source: Hermitage Akihabara

J&W Unveils First Nano-ITX Atom "Cedar Trail" Motherboard

Embedded systems and IPC maker J&W unveiled the first Atom "Cedar Trail" motherboard in the nano-ITX form-factor. The board measures just 120 x 120 mm, and is designed for embedded computing devices. It draws power from a 2-pin 12V DC input. It holds a dual-core Intel Atom D2700 (2.13 GHz) or D2500 (1.83 GHz) processor, one DDR3 SO-DIMM slot (reverse side), which supports up to 4 GB of DDR3-1066/800 MHz memory, and basic connectivity. The lone expansion slot is a mini-PCIe, designed to hold WLAN adapters.

Display outputs include D-Sub (by header), LVDS, and HDMI. Connectivity options include one SATA 3 Gb/s (AHCI), five USB 2.0 ports (three type-A connectors, two via headers), gigabit Ethernet, 6-channel HD audio over HDMI and 2-channel analog audio, RS232 Serial, SD/SDHC card reader, SIM card slot (3G option), consumer IR, and PS/2 (header). The CPU and core logic can be passively cooled. The Cedar Trail Nano-ITX board from J&W will be available to embedded systems and IPC markets, soon.

Source: FanlessTech

Samsung Urges Intel to Launch DDR4 Systems Ahead of Schedule

With over-production, swelling-inventories, and cutthroat competition that doesn't allow even subtle price-increases, DDR3 is a lost-cause for DRAM makers such as Samsung. It is hence hedging its bets on the early arrival of DDR4, and the only company that can make that happen is Intel. Samsung is not only a major supplier of DRAM memory, but also a big player in server memory. It had its first DDR4 UDIMM ready as early as in January 2011. Reports of Intel slating DDR4-equipped platforms in 2013 has Samsung perturbed. Samsung and Hynix are the only two DRAM majors with developed DDR4 products. According to DigiTimes' analysis, DRAM vendors see DDR4 as the only way they can pull themselves out of their ailing situation.

Source: DigiTimes

ZOTAC Unveils ZT-Z77-U1D SuperOverclock High-End Motherboard

ZOTAC unveiled a monster LGA1155 motherboard aimed at professional overclockers, and based on the new Intel Z77 Express chipset, the ZT-Z77-U1D. Pictured below, the designers' focus was evidently on giving the motherboard a very strong VRM, apart from just enough expansion and connectivity features for 2-way multi-GPU setups. To begin with, the LGA1155 socket is powered by a 27-phase VRM, which consists of AIO ferrite-core solid-state chokes, DrMOS, tantalum capacitors, and a super-ML multiphase capacitor to condition power. The VRM is controlled by a VRD12-compliant controller.

The LGA1155 socket is wired to four DDR3 DIMM slots, supporting dual-channel DDR3-2133+ MHz memory, and two PCI-Express 3.0 x16 slots (x8/x8, when both are populated). Other expansion slots include four PCI-Express 2.0 x1, wired to the Z77 PCH. All six SATA ports from the PCH are assigned as internal ports, that's two SATA 6 Gb/s, and four SATA 3 Gb/s. Display connectivity includes DVI, HDMI, and DisplayPort. Other connectivity includes 8+2 channel HD audio, 802.11 b/g/n, Bluetooth 3.0, gigabit Ethernet, six USB 3.0 ports (two on the rear panel, four via headers), and a number of USB 2.0 ports.

Intel Haswell-EX Enterprise Processors To Introduce DDR4 Memory

The computing industry will see its next transition to a new memory standard only by 2014, and enterprise processors based on the "Haswell" microarchitecture will drive the change, according to a VR-Zone report. While client processors based on the Haswell architecture will retain current DDR3 memory standard with a possibility of higher DDR3 clock speeds, enterprise processors under the "Haswell-EX" family will feature the industry's first DDR4 memory controllers for x86. Following that, DDR4 will filter down to future client platforms. Pictured below, is a DDR4 UDIMM by Samsung.

Source: VR-Zone

A-Tech Fabrication Intros HeatSync 1200 Fanless Ultra-Slim HTPC

A-Tech Fabrication, a company that specializes in hand-crafted HTPCs, unveiled the HeatSync 1200 fanless HTPC. The part that makes it fanless is the chassis itself, which is made of aluminum, with fins on the sides, that dissipate heat. Copper heat pipes transfer heat from key components such as the CPU and chipset to the sides of the chassis, which takes care of the rest. Although most of the chassis is anodized black, with its front-panel, you can choose between silver and black options.

The HeatSync 1200 internally packs an Intel DH61AG thin mini-ITX motherboard, which seats an Intel Core i3-2100T dual-core 35W processor, clocked at 2.50 GHz. 4 GB Corsair Vengeance SO-DIMM memory comes standard. Also standard is the Intel SSD 310 40 GB mSATA SSD. Considering there are no mechanical hard drives, or a PSU with active-cooling (a 160W power-brick does the job), the HeatSync 1200 is literally silent. A consumer IR (CIR) receiver with Windows Media Center remote, and Windows 7 Home Premium make for the rest of it.

I-O Data Outs Value 8 GB DDR3 Memory Module

I-O Data of Japan introduced a new value 8 GB DDR3 memory module (model: DY1333-8G). The module runs at JEDEC-specified speeds of DDR3-1333 MHz, with 9-9-9-24/CR-1T timings, with 1.5V module voltage. The module is sold standalone, and in 16 GB dual-channel kits (model: 8GX2 DY1333). It features standard 240pin UDIMM dimensions, without any heat-spreaders. The single-module kit is priced at 18,060 JPY (US $217.2), while the dual-channel kit goes for 35,280 JPY (US $424.4).

Source: Hermitage Akihabara

MSI B75MA-P45 Motherboard Detailed

MSI released details about its upcoming value socket LGA1155 motherboard, the B75MA-P45. MSI finds the B75 PCH a worthy option over the current-generation H61 PCH, and could hence price its B75-based motherboards competitively, to capture the entry-level LGA1155 market. The B75MA-P45 comes with out of the box support for 22 nm "Ivy Bridge" Core processors, apart from current-generation "Sandy Bridge" ones. The B75MA-P45 packs a simple 5-phase VRM to power the LGA1155 CPU. The CPU is wired to four DDR3 DIMM slots, supporting dual-channel DDR3-1600 MHz memory.

Expansion slots include one PCI-Express 3.0 x16, one PCI-Express 2.0 x1, and a legacy PCI. The legacy PCI logic is reintegrated with the PCH, and so the board doesn't use any bridge chips, further, since USB 3.0 and SATA 6 Gb/s are integrated with the PCH, MSI didn't add third-party controllers handling the two. SATA connectivity includes one SATA 6 Gb/s, and five SATA 3 Gb/s. The PCH gives out four USB 3.0 ports, two of which are found on the rear panel, two via internal header. Display connectivity includes DVI and D-Sub. 6-channel HD audio, gigabit Ethernet, and legacy PS/2 connectors complete the package. The board is driven by UEFI firmware (5 MB ME 8.0), with a graphical setup program. The B75MA-P45 is said to capture a price-point under US $100.

Tyan Unveils its Latest Generation Platforms Featuring Intel Xeon Processor E5-2600

TYAN has launched 8 cutting-edge platforms based on the Intel Xeon processor E5-2600 product family. These platforms are designed to deliver the benefits of Intel's latest processor architecture. We offer high peak performance along with outstanding power efficiency and are designed for today's HPC/GPU and general server applications. These products help channel customers build solutions for applications ranging from the largest data centers all the way down to the smallest server room implementations in a quick and efficient way.

Sapphire Intros Pure Platinum A55V Motherboard

Sapphire released the new Pure Platinum A55V motherboard to the market. The board offers a value socket FM1 platform based on AMD A55 FCH chipset, in the ATX form-factor. The motherboard supports AMD A4, A6, A8, and Athlon II "Llano" APU/CPUs in the FM1 package. This model is not exactly designed to be "no-frills", as it does pack an interesting mix of features that could help it grab a comfy price-point in the market.

The FM1 socket is powered by a 6-phase VRM, which uses a simple whine-free choke + DPAK MOSFET design, but throws in a heatsink to cool the MOSFETs. The socket is wired to four DDR3 DIMM slots, supporting up to 16 GB of dual-channel DDR3 memory, with speeds of over DDR3-1600 MHz with overclocking. The APU is also wired to a PCI-Express 2.0 x16 slot, and two PCI-Express 2.0 x1 slots. Apart from these, you get three legacy PCI slots, wired to the FCH.

Transcend Launches New Server-Class DDR3 Memory Modules

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB DDR3-1600 Registered DIMM (RDIMM) and 8GB DDR3L-1333 Low Voltage RDIMM modules. Fully compatible with the latest generation of Intel Xeon and Core i7 processors, the cost-effective DDR3 memory modules provide increased memory density and higher performance, while significantly reducing power consumption.

As Transcend's highest density DDR3 module, the 16GB DDR3-1600 RDIMM is constructed with top quality 4 Gb DDR3 1 Gbx4 35nm DRAM chips that deliver stable performance and durability. A single 16 GB memory module can lower power consumption by a staggering 75% compared with using four 4 GB modules, thereby saving energy and costs. The 16GB DDR3 module is rated at 1600 MHz with low latency of 11-11-11-28 and an operating voltage of a mere 1.5V. Offering memory bandwidth up to 12.8 GB/s and the flexibility to expand maximum capacity to 96 GB (per processor), the 16GB DDR3-1600 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.

ECS Z77H2-A3 Detailed

Apart from the two Black Extreme models based on the Z77 chipset, ECS also has a value ATX motherboard that will capture a key sub-$150 price point, the Z77H2-A3. It is designed for single graphics cards, and lends the platform with all the connectivity and overclocking capabilities of the Z77 chipset. The CPU is powered by a simple 6-phase VRM, although the PCB is narrow (305 x 210 mm), there's room for four DDR3 DIMM slots. Expansion slots include one PCI-Express 3.0 x16, four PCIe x1, and two PCI.

The Z77H2-A3 doesn't add much features beyond what the chipset does. There are two SATA 6 Gb/s, four SATA 3 Gb/s, 8-channel HD audio, gigabit Ethernet, display connectivity that includes D-Sub, DVI/HDMI (variants), and four USB 3.0 ports (two on the rear-panel, two via headers). UEFI with graphical setup program and ECS EZ-Charger come standard.

Source: Lab501.ro

NEC Adds New Servers Based on the New Intel Xeon E5-2600 Product Family

NEC Corporation of America (NEC), a leading provider of innovative IT, communications, and biometrics solutions, today announced the launch of NEC’s new generation of servers based on the new Intel Xeon E5-2600 product family supporting ProgrammableFlow networking.

The new generation of Express5800 E5 Generation Series servers will benefit from the performance boost and energy-efficiency of the new Intel Xeon processor E5 family combined with NEC’s own innovations for higher manageability, energy efficiency and higher scalability. Combined with NEC’s new ProgrammableFlow support, these new features will become an important factor to help accelerate cloud computing by maximizing the effectiveness of operational expenditure, especially business critical applications and database consolidation at corporate data centers. The Express5800/R120d-2M and R120d-1M family of platforms will be powered by these innovative features.

ASUS TUF Sabertooth Z77 Motherboard is a Dark Knight in Thermal Armour

ASUS hasn't completely ditched the "Thermal Armour" concept it introduced with the TUF Sabertooth P67, which we thought it did away, with the Sabertooth X79. The newest member in the series, the Sabertooth Z77, still very much features it. Thermal Armour is ASUS' idea of blanketing most of the motherboard's component area with a perforated sheet that directs air-flow, and also lends it an aesthetic touch (depending on your taste, you may love it, or hate it).

We spy four DDR3-DIMM slots (with matching Corsair Vengeance modules, not included), and an all-PCIe expansion slot layout, with two PCI-Express 3.0 x16 slots, one PCIe 2.0 x16 (x4), and three PCIe x1. There are two additional SATA 6 Gb/s ports augmented to the ones provided by the Z77 PCH. Display connectivity looks to include DVI and HDMI. 8-channel HD audio, GbE, about 6 USB 3.0 ports, and a number of USB 2.0 ports, complete the package. The board supports ASUS' BIOS Flashback feature. ASUS TUF Sabertooth motherboards are designed to be rock-stable and durable enough to be certified by stress-testing agencies for it.

Source: Lab501.ro

MSI ZH77A-G43 Detailed

Apart from other Z77 chipset-based models that have been exhaustively covered in the past, MSI is working on a media-oriented ATX LGA1155 motherboard based on the H77 chipset, the ZH77A-G43. Why MSI added a "Z" in the model name beats us. The LGA1155 socket is powered by a simple 5-phase VRM. MSI is kind enough to provide passive cooling for the entire CPU VRM area. The CPU is wired to four DDR3 DIMM slots, providing dual-channel DDR3 support.

Expansion slots include one PCI-Express 3.0 x16 (wired to the CPU), one PCI-Express 2.0 x16 (electrical x4, wired to the PCH), two PCI-Express 2.0 x1, and three legacy PCI slots. PCI slots are still in good demand by media-professionals who need them for pro-grade sound production cards. Storage connectivity includes two SATA 6 Gb/s, and four SATA 3 Gb/s. All four USB 3.0 ports on this board (two on the rear-panel, two via header) are provided by the H77 PCH. HDMI, DVI, and D-Sub form the display IO. To top it off, you get 8-channel HD audio with THX TruStudio Pro support, and gigabit Ethernet. Expect a value price-point.

Source: Lab501.ro

New ADATA Server DIMM Boosts Performance, Trims Energy Costs

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the launch of new DDR3 server memory modules for cloud business solutions, which feature improved levels of energy efficiency and performance.

The most striking aspect of the new modules is their high efficiency. This results in major energy savings, leading to reduced overall power consumption for cloud businesses, and all-around lower carbon dioxide emissions. These benefits come with no sacrifice in terms of performance- the high speed operation and reduced memory-bus load of these modules leads to greatly enhanced overall system efficiency. Fully compatible with major motherboards, these server DIMM modules are a reliable solution that reduce power costs and increase environmental protection.

ADATA Releases 8 GB DDR3-1600 Memory Modules

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today introduced new industry-leading, single piece 8 GB DDR3-1600 high-density memory modules. Known for industry-high standards of quality control and meticulous device engineering, the new modules will meet and exceed expectations of customers who seek performance and quality in DRAM products.

With this launch ADATA is continuing its tradition as an industry leader in DRAM product line-up. These 8 GB Premier Series DDR3-1600 single piece memory modules allow users to boost system performance over the limitations of memory slot availability.

TUL Readies Barebones Mini PC

PowerColor's parent company, TUL, showed off its barebones Mini-PC at CES. Its main unit measures just 165 x 165 x 55 mm (LxWxH), and is available in black and white color options. Under the hood is an AMD G-Series embedded APU, backed by Hudson M1 FCH chipset. It takes in 1 DDR3-SODIMM module, up to 4 GB in size, and runs it at speeds of up to PC3-8500 (DDR3-1066 MHz). The G-Series APU provides AMD Radeon HD 6310 graphics, with DVI and HDMI display outputs. The mini PC barebone has room for one 2.5-inch SATA 6 Gb/s drive. Its front-panel offers one USB 2.0 port (USB 3.0 can be opted for), a multi-format card reader, and eSATA 6 Gb/s. Its rear panel connectivity includes 2-channel audio outputs, gigabit Ethernet, four USB ports, and display connectivity. The unit has an internal 40W PSU.

ECS H77 Black Series Micro-ATX Motherboard Pictured

Apart from the Z77H2-AX, ECS showed off a mainstream socket LGA1155 motherboard based on the H77 "Panther Point" chipset, in the micro-ATX form-factor. The H77 chipset has the same feature-set as the Z77, except it lacks Rapid Storage Technology, and overclocking features. Out of the box, this board supports next-generation "Ivy Bridge" Core processors.

The LGA1155 socket is powered by a 6-phase VRM. It is wired to four DDR3 DIMM slots supporting dual-channel DDR3 memory; and a PCI-Express 3.0 x16 slot. Other slots include a PCIe 2.0 x1, and two legacy PCI slots driven by an ITE-made bridge chip. Storage connectivity includes two SATA 6 Gb/s, and four SATA 3 Gb/s, all wired to the PCH. Display connectivity includes DVI, D-Sub, and HDMI. Other connectivity includes 8-channel HD audio, gigabit Ethernet, and four USB 3.0 ports (all driven by the PCH). The board uses cost-effective electrolytic capacitors on all circuits that don't deal with large currents, only the power conditioning circuits have solid-state capacitors.
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