News Posts matching "DRAM"

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ADATA Announces DashDrive UV150 USB 3.0 Flash Drive

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, has launched a new DashDrive UV150 USB Flash drive, a value-priced USB 3.0 solution with an attractive pearlescent exterior.

The sleek contour of the UV150 makes the drive as easy in the hand as it is on the eyes, and the USB connector cap snaps in cleanly in the rear of the drive to prevent cap loss. A broad lanyard slot at the base of the drive allows for use with a wider range of carrying straps than is often seen in USB Flash drives. These factors, combined with a weight of only 9g (0.3oz), make the UV150 an essential accessory in today's world of value-driven digital mobility Read transfer speed reaches 90 MB per seconds, provided the needed performance for the most common data storage needs.

Innodisk Releases World's First Industrial-Embedded SATA µSSD - nanoSSD

Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, announces a release of the industrial-embedded industry's first SATA device in accordance to SATA µSSD standards - nanoSSD.

Through the integration of a control chip, flash memory and peripheral power components into a single ball grid array (BGA) package, Innodisk has managed to reduce the size of the nanoSSD to approximately 1% the size of a 2.5" SSD. With dimensions of only 16 x 20 x 2 mm (WxLxH), a weight of only 1.5g, SATA III support, capacities ranging from 4 to 64 GB and both x86 and ARM compatibility, nanoSSD can be incorporated into a wide variety of applications where a small form-factor and high transfer rates are important, including industrial mobile devices, embedded systems, tablets, high-end smart phones and Ultrabooks.

Innodisk Releases DDR4 RDIMM Samples to Server Market

Innodisk is proud to be among the first to supply (DDR4) registered DIMM product samples to key server companies for their next-generation systems. With this announcement, Innodisk, an industry leader in DRAM modules for industrial applications and embedded systems, will continue to offer the most advanced technology to its customers. The result of almost eight years of development, DDR4 (Double Data Rate 4) technology improves on the previous generation, DDR3, in every way. These new memory products provide users with greater performance, but can still cut costs by saving power and space, and reducing waste heat.

DDR4 offers a giant leap in peak performance over DDR3 technology, with a 3.2 Gbps data transfer rate. In fact, DDR4 could eventually even surpass this already high rate, according to standards organization JEDEC, in the same way that DDR3 surpassed its initial ceiling of 1.6 Gbps. DDR4 memory bus speeds start at 2133MHz, which already offers a huge jump in potential performance from the average bus speed of 1333MHz and 1666MHz offered by DDR3.

ADATA Launches Ultra-Compact DashDrive Choice UC51

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced a small but stylish addition to its DashDrive family of USB Flash drives. The new DashDrive Choice UC510 packs durability and charm into a super small and handy profile.

With this new drive, ADATA has once again made the most of Chip on Board (COB) technology, and the result is a highly water-resistant, durable device that is ultra-small and easy to carry. The drive body shines with a metallic gleam, and the capless design eliminates the need for a drive cap and the related chance of cap loss. The UC510 has a USB 2.0 interface, providing the required performance for most common data storage and transfer needs.

SMART Modular Technology Announces 24GB CoolFlex DDR3 RDIMM

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced the addition of a 24GB CoolFlex RDIMM to its product lineup. The 24GB DDR3-1333 1.35V RDIMM helps solve unique memory capacity constraints in servers. SMART's CoolFlex module product family uses state-of-the-art flexible substrate technology to increase system memory capacity.

Servers configured with two processors and sixteen registered DIMMs are generally limited to a maximum memory capacity of 256GB. When using 16GB DDR3-1333 RDIMMs these systems can be fully populated. However, when switching to 32GB four-rank RDIMMs, the maximum number of DIMMs per Channel (DPC) drops down to one. A system configured with two channels per processor and four DIMMs per channel can only be populated with one 32GB RDIMM per channel for a total memory capacity of 128GB. SMART's new 24GB Coolflex RDIMM solves this constraint by allowing these systems to be fully populated with sixteen 24GB RDIMMs totaling 384GB and representing a 50% increase in memory capacity.

Intel Brands Haswell GT3 "Iris", Desktop Variants Planned

With its 4th generation Core "Haswell" processors, Intel is putting in a serious effort to improve integrated graphics (IGP) performance to catch up with AMD's Radeon HD 8600 series on its latest APUs. There are three classes of Intel IGPs for Haswell, the GT1, which features 10 execution units (EUs), and will feature on entry-thru-mainstream Pentium, Core i3, and Core i5 chips; GT2, which features 20 EUs, featuring on mainstream-thru-performance Core i5 and Core i7 chips; and GT3, a large 40-EU IGP, which uses an L4 eDRAM cache. Chips with GT3 graphics are multi-chip modules (MCMs) of the CPU die and this eDRAM due, as detailed earlier. It was earlier believed that Haswell chips with GT3 graphics cores will be confined to notebook and Ultrabook-specific CPU models, but it turns out that it will make an appearance on the desktop platform as well.

Samsung Now Producing 4 Gb LPDDR3 Mobile DRAM, Using 20nm-class Process Technology

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the industry's first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20 nanometer (nm) class* process node. The new 4Gb LPDDR3 mobile DRAM enables performance levels comparable to the standard DRAM utilized in personal computers, making it an attractive solution for demanding multimedia-intensive features on next-generation mobile devices such as high-performance smartphones and tablets.

"By providing the most efficient next-generation mobile memory with a very large data capacity, we are now enabling OEMs to introduce even more innovative designs in the marketplace," said Young-Hyun Jun, executive vice president, memory sales & marketing, Samsung Electronics. "Our 20nm-class four gigabit mobile DRAM provides another example of our ability to deliver well-differentiated, high-performance, high-density memory to customers in a timely manner."

ADATA Introduces XPG Gaming v2.0 Series DDR3-2600 Modules

ADATA Technology Co., Ltd. a world leader in DRAM modules and NAND Flash storage application products, today announced the start of shipments of its latest advanced in gaming technology, the XPG Gaming v2.0 Series DDR3-2600 MHz DRAM 8GB modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2600G 8GB modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.

Intel Readies Haswell Variants with Large Graphics Cores, and eDRAM Caches

To tackle upcoming generations of Ultrabooks and NUC that lack space for discrete graphics, yet having to keep up with the demands of higher display resolutions (i.e. proliferation of 3840 x 2160), Intel is designing special variants of its Core "Haswell" processors that feature large integrated graphics cores bolstered by fourth-level eDRAM caches on-package. Pictured below, is one such contraption.

The graphics-enhanced Core "Haswell" processor is an MCM (multi-chip module) of two dies, the larger one is the actual "Haswell" processor complex with cores, uncore, and the larger GT3 integrated graphics core. While the standard Haswell silicon with GT1 and GT2 integrated GPU options, physically features up to 20 execution units (EUs), the large GT3 silicon features double that, at 40 EUs.

IDF 2013 Transforming Computing Experiences from the Device to the Cloud

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

Hybrid Memory Cube Consortium Finalizes Specifications

More than 100 developer and adopter members of the Hybrid Memory Cube Consortium (HMCC) today announced they've reached consensus for the global standard that will deliver a much-anticipated, disruptive memory computing solution. Developed in only 17 months, the final specification marks the turning point for designers in a wide range of segments-from networking and high-performance computing, to industrial and beyond-to begin designing Hybrid Memory Cube (HMC) technology into future products.

A major breakthrough with HMC is the long-awaited utilization of advanced technologies to combine highperformance logic with state-of-the-art DRAM. With this first HMC milestone reached so quickly, consortium members have elected to extend their collaborative effort to achieve agreement on the next generation of HMC interface standards.

ADATA Announces SX1000L Durable Enterprise SSD Series

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announced the launch of the enterprise grade SX1000L solid state drive (SSD). While the company is well-established in the consumer SSD market, this is ADATA's first offering specifically tailored towards server applications.

Taking advantage of its expertise in NAND flash memory technology, ADATA is emphasizing the reliability and performance of the SX1000L. It employs static wear-leveling technology to maximize device mean time between failures (MTBF) to 1,500,000 hours, providing the long-term dependability required by high density computing and heavy load server operations. Available in 2.5" standard SATA form factor, the SX1000L implements advanced controller technology to enhance read/write performance. Sequential read speeds reach 560 MB/sec, and sequential write is as high as 340 MB/sec, with IOPS of 73,000 and 45,000 (Maximum 4K random read and write, respectively).

Galaxy Rolls Out Thunder GT 128 Pro SSD

Known more for its graphics cards, Galaxy has an SSD lineup, with which it targets the Greater China region. It rolled out the Thunder GT 128 Pro, a 128 gigabyte SSD in the 2.5-inch form-factor, with SATA 6 Gb/s interface. The drive utilizes Toshiba-made Toggle-NAND flash, JMicron JMF667H processor, and an unknown amount of DRAM cache. The drive offers sequential transfer rates as high as 480 MB/s reads, 300 MB/s writes, 70,000 IOPS QD64 reads, and 58,000 IOPS QD64 writes. Available in China from later this month, the Galaxy Thunder GT 128 Pro is priced at 799¥ (US $128).

Source: Expreview

Plextor NGFF SSD Belts Out Up To 700 MB/s Transfer Rates

In addition to its 2.5-inch SATA 6 Gb/s TLC NAND flash SSD, Plextor showed off its upcoming SSD in the NGFF form-factor, designed for next-generation Ultrabooks. Based on the same Marvell 88SS9189 processor and triple-level cell (TLC) NAND flash memory as its 2.5-inch cousin, the drive differs in being a 42 x 22 mm (LxW) NGFF module, with PCI-Express 2.0 x2 interface. The drives will be sold in 128 GB and 256 GB capacities, featuring 256 MB and 512 MB DDR3 DRAM caches, respectively. On offer are read speeds of up to 700 MB/s, writes of up to 550 MB/s, and maximum 4K random write performance of 100,000 IOPS. The NGFF drives should arrive around the same time as Ultrabooks based on 4th generation Core "Haswell" processors.

ADATA Announces DashDrive Elite UE700 USB Flash Drive

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announced the launch of the DashDrive Elite UE700 USB flash drive. Building on the company's past successes and increasing brand strength, the UE700 is a striking blend of technological development and design aesthetics.

The improved transfer speed of the UE700 arrives at an opportune time, with USB flash drives being called on to store and deliver personal media content of higher quality and file size than ever before. Making extensive use of the enhanced bandwidth available to the USB 3.0 interface, it delivers transfer speeds up to an unbelievable 200 MB/sec read and 100 MB/sec write, outperforming the vast majority of USB flash drives available on the market today.

Transcend Announces 32GB DDR3 Load-Reduced DIMMs

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.

Plextor Shows Off Unnamed TLC NAND-Based Consumer SSD Lineup

At CeBIT, Plextor showed off a yet unnamed line of consumer SSDs featuring 19 nm triple-level cell (TLC) NAND flash memory. The series consists of 128 GB, 256 GB, and 512 GB variants, with 256 MB, 512 MB, and 768 MB of DDR3 DRAM cache, respectively. The three are driven by Marvell 88SS9189 processor, and are built in the 2.5-inch form-factor, with SATA 6 Gb/s interface.

The 128 GB variant offers sequential read speeds as high as 530 MB/s, with up to 380 MB/s writes, and 72,000 IOPS 4K random write performance. The 256 GB variant ups that with 540 MB/s reads, and 450 MB/s writes. Leading the pack is the 512 GB variant, with 540 MB/s reads, and 465 MB/s writes. The lineup is expected to be launched this August.


Source: Guru3D

ADATA Launches Premier Series UHS-I Memory Cards

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today introduced its Premier series SDHC, SDXC and microSDHC ,microSDXC memory cards, all of which implement the UHS-I U1 (compatible with SDA 2.0 speed Class 10) specification. The new cards are designed especially to economically meet the performance needs of the most commonly used portable electronics.

With the increasing expectations for smart phones and tablet computers to handle high definition media recording and playback, the memory cards used with these devices require higher read and write speeds than ever before. The Premier series targets those who are looking for a cost-effective entry solution to extend their device's capacity and speed.

Super Talent Certifies RC4 Flash Drive for Windows To Go

Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, announces its USB 3.0 Express RC4 has been certified for usage with Windows To Go, a new feature of Microsoft's Windows 8 Enterprise edition. The RC4 is SuperTalent's second drive to be certified to date. Windows To Go enables enterprises to provision a full corporate image on an external USB drive which users can boot and operate from almost any PC. SuperTalent plans to continue to work with firms to unveil its "hardware secure" version in the near future.

Certified through the Windows 8 Hardware certification kit, Super Talent's RC4 is one of the world's top USB 3.0 drives with SSD technology; it provides high random read/write speed capabilities and reports itself as fixed media. Super Talent's RC4 meets and surpasses many of the performance requirements of Windows To Go certified drives.

Super Talent Launches PCIe & Mini PCIe FDMs

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, showcases its PCIe and mini PCIe Flash Disk Modules.

Bypassing the SATA speed bottleneck, Super Talent's PCIe and mini PCIe FDMs offer huge performance gains with the ability to deliver read speeds up to 350 MB/sec and write speeds up to 220 MB/sec. The ultra-compact form factor is just right for solutions where space is limited, such as embedded applications, industrial PCs, all-in-one PCs, notebooks and netbooks.

Super Talent Technology Features Expansive Line of FDMs

Super Talent Technology, a leader of NAND Flash storage solutions and DRAM memory modules, today highlights its extensive collection of Flash Disk Modules (FDMs). These FDMs are ideal for embedded computing applications with their ability to plug directly into motherboards and their compact size which allows them to fit into small spaces. These FDMs also provide lower power consumption and greater ability to withstand harsh environments than mechanical hard disks, making them a wise upgrade choice or an excellent initial choice.

With offerings of MLC or SLC 40-pin, 44-pin, 7-pin, horizontal, vertical, and USB flash disk modules this collection provides businesses with a plethora of options. Stay alert as STT could expand this line even more in 2013. For more information, visit the product page.

Rambus Introduces R+ LPDDR3 Memory Architecture Solution

Rambus Inc., the innovative technology solutions company that brings invention to market, today announced its first LPDDR3 offering targeted at the mobile industry. In the Rambus R+ solution set, the R+ LPDDR3 memory architecture is fully compatible with industry standards while providing improved power and performance. This allows customers to differentiate their products in a cost-effective manner with improved time-to-market. Further helping improve design and development cycles, the R+ LPDDR3 is also available with Rambus' collaborative design and integration services.

The R+ LPDDR3 architecture includes both a controller and a DRAM interface and can reduce active memory system power by up to 25% and supports data rates of up to 3200 megabits per second (Mbps), which is double the performance of existing LPDDR3 technologies. These improvements to power efficiency and performance enable longer battery life and enhanced mobile device functionality for streaming HD video, gaming and data-intensive apps.

Super Talent Announces Green Very Low Profile (VLP) Memory

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, introduces its updated green memory modules.
With no tradeoffs in price or performance, choosing VLP DIMMs for computing can have an enormous environmental impact when the hundreds of thousands of memory modules produced monthly are taken into account.

"Decreasing overhead in a data center is an easy way for a company to reduce costs. With Super Talent's Green Memory, power and cooling costs can be easily cut while maintaining speed and reliability for a company," said Shimon, VP of Engineering, Super Talent Technology.

Plextor M5S, M5 Pro Get NAND Flash Design Change

Plextor implemented a design change in the NAND flash memory of its M5S and M5 Pro series consumer SSDs. The two see a transit from 20 nm-class NAND flash chips in the BGA package, to 19 nm chips in the TSOP (pins along the shorter edges) package. Both chips are Toshiba-made. The controller and latest firmware (FW 1.02) remain unchanged. The move to chips in the TSOP package doesn't impact on the specifications or price of the products, but gives the controller the ability to handle greater page-size on the chips.

The TSOP chips feature maximum page-size of 16 KB/page, while the BGA chips feature 8 KB/page. In theory, this should improve "buffer management," when the controller decides to use NAND flash as scratchpads, in spite of having a gigabyte of DRAM cache at its disposal. Further, the new TSOP package NAND flash chips have lighter thermal requirements, letting Plextor get rid of the conductive thermal pads over the chips, saving a Dollar or two. The company did not release any markers on how to identify the two variants of drives by looking at serial numbers.

Source: Hermitage Akihabara

Super Talent Launches New mSATA 3 SSD Line

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, announces its updated mSATA 3 SSD drive. Super Talent's mSATA 3 boasts read speeds up to 550 MB/s and write speeds up to 500 MB/s. This mSATA SSD can be installed into tablets and netbooks using an mSATA form factor and the SATA III interface is backwards compatible with previous versions. This drive also has a mean time before failure (MTBF) of over 2 million hours, which is over 200 years of around the clock use.
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