News Posts matching "DRAM"

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Samsung and SK Hynix Ramp Up 20 nm DRAM Node Development

Korean DRAM makers Samsung and SK Hynix have each stepped up efforts to scale up production on the new 20 nanometer silicon fabrication process, to make in the mainstream DRAM manufacturing process in 2013. The two have already begun volume production of DRAM on the 20 nm process in 2012, however, 30 nm remains as the mainstream DRAM production process. By 2H-2012, the 20 nm process could take its place. The two companies will gradually shift their focus from PC DRAM to enterprise and mobile DRAM, as PC DRAM continues to reel with oversupply.

Source: DigiTimes

DRAM Contract Price Falls Below US$16 Due to Weak Demand

According to DRAMeXchange, a research division of TrendForce, PC-ODM shipment figures indicate this year's peak shipment period for PCs has passed. Notebook shipments have shown a downtrend in October, indication that DRAM demand is slipping. As 4 GB modules are now the mainstream specification, price decline was more significant than for the 2 GB modules; average 4 GB price fell by 1.54% to US$16, while the lowest price broke the US$16 mark, arriving at US$15.75, amounting to a mere US$0.83 for 2 Gb chips - nearly the same as spot price. 2 GB module price, on the other hand, stayed the same at US$9.25. As module prices fall to such lows, DRAM suppliers are strategically focusing on high-density 4GB module shipments in hopes of stimulating sales due to content per unit increases.

TSMC Tapes Out CoWoS Test Vehicle Integrating Wide I/O Mobile DRAM Interface

TSMC today announced that it has taped out the foundry segment's first CoWoS (Chip on Wafer on Substrate) test vehicle using JEDEC Solid State Technology Association's Wide I/O mobile DRAM interface. The milestone demonstrates the industry's system integration trend to achieve increased bandwidth, higher performance and superior energy efficiency.

This new generation of TSMC's CoWoS test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's CoWoS technology provides the front-end manufacturing through chip on wafer bonding process before forming the final component. Along with Wide I/O mobile DRAM, the integrated chips provide optimized system performance and a smaller form factor with significantly improved die-to-die connectivity bandwidth.

ARM Announces New High-Performance System IP

To address the significant increase in data over the next 10-15 years, and the demand for more energy-efficient network infrastructure and servers, ARM has announced the ARM CoreLink CCN-504 cache coherent network. This advanced system intellectual property (IP) can deliver up to one terabit of usable system bandwidth per second. It will enable SoC designers to provide high-performance, cache coherent interconnect for ‘many-core’ enterprise solutions built using the ARM Cortex-A15 MPCore processor and next-generation 64-bit processors.

LSI, a leading designer of intelligent semiconductors that accelerate storage, mobile networking and client computing, and Calxeda, an innovative supplier of disruptive SoC technology for the server market, are lead licensees for the CoreLink CCN-504 launch.

SK Hynix Introduces DDR3L-Reduced Standby for Mobile Solutions

SK Hynix announced that it has introduced DDR3L-RS (Reduced Standby) DRAM for mobile solutions using its 20nm class technology. This product significantly reduces the standby power consumption.

By using cutting-edge 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM while it maintains DDR3L performance. DDR3L DRAM which has recently gone mainstream works at 1.35V, while DDR3 DRAM does at 1.5V.

AMD Extends Leadership in Data Center Innovation

AMD today announced the SeaMicro SM15000 server, another computing innovation from its Data Center Server Solutions (DCSS) group that cements its position as the technology leader in the micro server category. AMD's SeaMicro SM15000 server revolutionizes computing with the invention of Freedom Fabric Storage, which extends its Freedom Fabric beyond the SeaMicro chassis to connect directly to massive disk arrays, enabling a single ten rack unit system to support more than five petabytes of low-cost, easy-to-install storage. The SM15000 server combines industry-leading density, power efficiency and bandwidth with a new generation of storage technology, enabling a single rack to contain thousands of cores, and petabytes of storage -- ideal for big data applications like Apache Hadoop and Cassandra for public and private cloud deployments.

AMD's SeaMicro SM15000 system is available today and currently supports the Intel Xeon Processor E3-1260L ("Sandy Bridge"). In November, it will support the next generation of AMD Opteron processors featuring the "Piledriver" core, as well as the newly announced Intel Xeon Processor E3-1265Lv2 ("Ivy Bridge"). In addition to these latest offerings, the AMD SeaMicro fabric technology continues to deliver a key building block for AMD's server partners to build extremely energy efficient micro servers for their customers.

Super Talent's RC8 Controller is certified for Windows To Go

Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, announces its USB 3.0 Express RC8 has been certified as a go to market partner with Microsoft for usage with Windows To Go, a new feature of Microsoft's Windows 8 Enterprise edition. Windows To Go enables enterprises to provision a full corporate image on an external USB drive which users can boot and operate from almost any PC.

Certified through the Windows 8 Hardware certification kit, Super Talent's RC8 is one of the world's top USB 3.0 drives with SSD technology; it provides high random read/write speed capabilities and reports itself as fixed media. Supertalent RC8 meets and surpasses many of the performance requirements of Windows To Go certified drives.

Acer Announces Veriton 6620G Series Commercial Desktops

Acer America today unveiled new commercial desktop PCs specified for corporate customers, government agencies and educational institutions. Multi-monitor support, significant power and expandability make the new Veriton 6620G Series desktops well-suited for enterprise environments.

The Acer Veriton X6620G, a small form factor (SFF) desktop and the Acer Veriton M6620G, a mini tower, offer a three-year warranty(1) and support up to a third-generation Intel Core i7 processor with significant application and graphics performance benefits when compared to prior generations.

Super Talent Tests New Green Line of DDR3 Apple Memory

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today began shipping their new line of Mac compatible DDR3 memory modules. Upon completion of our testing conducted at Apple's Compatibility Lab headquarters (Cupertino, CA)-STT engineers unveiled their new line of Apple approved DDR3 memory modules.

SuperTalent now features eco-friendly modules that reduce the voltage requirements a full 10% from the traditional 1.5-volt to the new 1.35-volt standard. SuperTalent offers a wide variety of green DDR3 modules to meet the needs of new and existing server designs. Now is the perfect time to implement this cost cutting module by adding it to, or replacing your current DRAM memory.

ASUS Presents Full Range of Windows 8-Ready AMD Platform Motherboards

To provide the best user experience on the AMD platform, ASUS has refreshed a variety of motherboards, including mainstream channel models, dedicated products from ROG and the TUF Series, plus FM1 socket-compatible and power-efficient APU-based models. Each product offers a variety of new ASUS exclusive technologies such as digital power control, Remote GO!, and Network iControl, alongside innovative Fast Boot, ASUS Boot Setting, and DirectKey, all specifically leveraging upcoming Windows 8 capabilities. Both new and existing features have been tailored and tested to comply with the Windows 8 architecture for total stability and maximized utility, while all motherboards have gone through a full series of compatibility assurance tests in getting ready for the move to Windows 8.
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