News Posts matching "DRAM"

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Corsair Dominator Platinum DDR3-3000 MHz Memory Pictured

Corsair is finally giving its high-end DRAM family some love, with the new Dominator Platinum family of high-speed DDR3 memory modules. With it, the company also came up with its newest DRAM module heatsink design. The new DHX heatsink uses a revamped design that extracts heat from the DRAM chips more efficiently. At its top portion, the module features a user-swappable "light bar", which is purely an aesthetic touch. Further, the modules support Corsair Link, which lets the user monitor temperatures and voltages of each module via software, in real-time. Pictured below is a DDR3-3000 MHz variant of the Dominator Platinum. The module packs an XMP 1.4 profile for 3000 MHz (1500 MHz actual), with CAS latency of 12T.

Source: TweakTown

Corsair Readies Initial Public Offering

According to a stock market analyst with Seeking Alpha, Corsair is going public, with an initial public offering (IPO), in an effort to raise US $78 million, with a market capitalization of $223 million. Stifel, Nicolaus & Co., and RBC Capital Markets, will be underwriting it. Corsair will use the name "Corsair Components", and market symbol "CRSR" in its IPO.

Corsair has two main branches of products, memory products (DRAM and NAND flash products), and peripherals (power supply, cases, and gaming peripherals). Its income fluctuates with consumers' seasonal purchasing patterns. The company plans to net $42.5 million from its IPO, some of its proceeds go toward repaying a cumulative debt of $28 million, the rest of the proceeds go toward working capital and general corporate purposes. An estimated 4.1 million shares are expected to be sold by Corsair.

Source: Seeking Alpha

Samsung Now Producing Highest Density Mobile LPDDR2 Using 20nm-class Technology

Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology solutions, announced today that it has begun producing the industry’s first four gigabit (Gb), low power double-data-rate 2 (LPDDR2) memory using 20 nanometer (nm) class* technology. The mobile DRAM (dynamic random access memory) chip, which went into mass production last month, will help the market to deliver advanced devices that are faster, lighter and provide longer battery life than today’s mobile devices.

“Samsung began expanding the market for 4Gb DRAM last year with the first mass-produced 30nm-class DRAM, and now we are working on capturing most of the advanced memory market with our new 20nm-class 4Gb DRAM,” said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. “In the second half of this year, we expect to strongly increase the portion of 20nm-class DRAM within our overall DRAM output to make the 4Gb DRAM line-up the mainstream product in DRAM production, and therefore keeping the leadership position in the premium market and strengthening our competitive edge.”

Micron Emerges as Front-Runner To Buy Out Elpida

Following a rapid turn of events, Micron Technology has emerged as a front-runner in the race to buy out ailing Japanese DRAM major Elpida. Elpida revealed Micron as the winner of the second round of bidding for the right to negotiate exclusively to buy it. DRAMeXchange predicts that Micron may offer up to 300 billion JPY (US $3.75 billion) for the deal, and the Micron+Elpida combine that emerges out of the deal, with its DRAM capacity, could bring about a revolutionary change in the industry.

The Elpida buyout, according to market analysts at TrendForce, will give Micron the capability to compete with Korean DRAM heavyweights SK Hynix and Samsung Electronics, in high-volume DRAM manufacturing. Elpida has been known for investments in DRAM R&D, and isn't behind the two Korean companies in terms of volume manufacturing. Its 30 nm-class DRAM yield-rate is nearly mature, while the next-generation 25 nm process is in testing phase.

Source: DRAMeXchange

SK Hynix Drops Out Of Race To Acquire Elpida

Japanese DRAM maker Elpida has been reporting chronic financial problems since the beginning of 2012. It soon filed for bankruptcy, driving interest in competitors Toshiba, Global Foundries, Micron and Hynix (SK Hynix), to acquire it. Hynix has now reportedly withdrawn from the Elpida takeover bid. The withdrawal is likely due to its own financial situation. Hynix is not the first to withdraw from the bid, the first to drop out was Toshiba. With the two gone, Micron Technology is next in line, with a bid of US $1.4 billion to buy out Elpida.

Source: HardwareInfo

Green House Intros New 8 GB DDR3-1333 Memory Modules

Green House Japan released a pair of new 8 GB DDR3-1333 MHz (PC3-10600) memory modules. These consist of the GH-DRT1333-8GB and GH-DVT1333-8GB, which are 240-pin standard DIMM, and differ by the former having lifetime warranty, while the latter has 5 year warranty; and GH-DNT1333 and GH-DWT1333, which are 204-pin SO-DIMM modules with lifetime and 5-year warranties, respectively. Both kinds of modules are JEDEC standards-compliant, and run at DDR3-1333 MHz speeds with CAS latency of 9T, and 1.50V DRAM voltage.

Source: Hermitage Akihabara

OCZ Adds 1 TB Capacity to Octane Series

OCZ introduced a new high capacity variant of its Octane consumer SSD series, the OCT1-25SAT3-1T. Built in the 2.5-inch form-factor with SATA 6 Gb/s interface, the new Octane variant provides 1 TB of unformatted capacity. Based on the Indilinx Everest processor, the drive packs 25 nm MLC NAND flash, and utilizes 512 MB of DRAM cache. It is rated to provide sequential transfer speeds of up to 460 MB/s (reads), 330 MB/s (writes), with 4K read/write random access performance of up to 24,000 IOPS and 32,000 IOPS, respectively. All modern consumer SSD features are present, including TRIM, NCQ, ECC, and 256-bit AES data-encryption. Slated for mid-May, the Octane 1 TB by OCZ won't exactly be cheap.

Source: Hermitage Akihabara

Worldwide Semiconductor Market Grew 3.7% in 2011 to $301 Billion

Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the latest version of the International Data Corporation (IDC) Worldwide Semiconductor Applications Forecaster (SAF). The industry weathered the macroeconomic uncertainties in the U.S and Europe, the earthquake and tsunami in Japan, China's slow down in the second half of the year, and floods in Thailand. Meanwhile, device applications, such as smartphones, media tablets and e-readers, automotive infotainment, notebook PCs, datacenter servers, and wireless and wired communication infrastructure drove robust consumption of semiconductors.

IDC's SAF tracks more than 100 semiconductor companies. Over 40 of these companies experienced year-over-year revenue growth greater than 5%, while about the same number of companies saw their revenue decline by more than 5%.

KINGMAX Launch a Series of Industrial Solution in ESEC

Embedded System Expo (ESEC) Japan 2012 will hold during May 9th to May 11th in Tokyo, and KINGMAX will demonstrate its series of industrial grade of FLASH storage products - SSD (Solid Sate Drive), memory cards, DRAM and embedded memory - on the booth WEST11-65. Leveraging more than 20 years of DRAM and FLASH expertise in R&D and manufacturing, KINGMAX will present a complete series of industrial solution which is not only at latest specification but also has been undergone strict reliability test and verification to ensure the most stable quality.

KINGMAX Group is the world first memory module manufacturer owning IC packaging and testing facilities, and has long been committed to the innovation of the best memory module solutions. Leveraging years of R&D and manufacturing competency, KINGMAX first-launched Industrial products include three categories: Industrial Storage, Industrial Memory and Embedded Memory. First, KINGMAX will exhibit a series of industrial SSD, including SATA III and SATA II SSD—both withstand wide operation temperature(-40℃~ 85 ℃. KINGMAX will also release mSATA SSD and Half-Slim SSD for Ultrabook and small form factor embedded systems.

Giada Intros MI-HM65T Mini ITX Motherboard

The versatile new MI-HM65T Mini ITX motherboard from Giada is at home in all environments, including the factory floor, tough monitoring and control applications, embedded computing, office desks, and the home. Built around Intel's HM65 chipset and the Sandy Bridge platform, this motherboard brings users high performance and almost unlimited connectivity, with economical power consumption. It offers all the industry-standard features of a desktop PC in a tiny package, to support a wide range of applications.

Powered by Intel's fast Core i7, i5, i3 or Celeron 867 CPUs, supported by up to 4GB of memory, with onboard integrated graphics and video support, the Giada MI-HM65T can easily take care of almost any task you throw at it. This tough but tiny powerhouse handles industrial control, monitoring and automation applications as well as office and productivity, or home entertainment.
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