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Acnodes Corp Announces Superior Core-based Fanless Embedded System

Acnodes Corp., a leading manufacturer of industrial and embedded computer platforms and technologies, today announced the launch of a new fanless embedded computer, FES8660. Based on the 3rd generation Core i7 / i5 / i3 or Celeron Processor and HM76 Express Chipset, it features a robust fanless design and is an ideal solution for video applications, digital signage, outdoor advertising, POS/kiosks and gaming. In addition, this application-ready rugged platform also targets a broad range of industrial computing applications such as embedded controller, factory automation and more.

The FES8660 includes a VGA out video interfaces, 4 COM ports, four Gigabit LAN ports, four USB 3.0 ports, and audio for administration and software input. Moreover, the FES8660 has two 204-pin DDR3 memory maximum up to 16 GB, one 2.5" SATA drive bay and CFast slot for solid state storage. The FES8660 provides good expansion capability by offering two PCI Express Mini card slots and two SIM card sockets allowing more efficient, seamless networking options. The onboard Core i7 / i5 / i3 or Celeron processor couples low power consumption with minimal cooling requirements, resulting in improved stability and longevity and allowing for completely fanless computer design.

SanDisk Introduces the iNAND Standard Embedded Flash Drive

SanDisk Corporation, a global leader in flash storage solutions, today announced the iNAND Standard embedded flash drive (EFD), an ideal storage solution for entry-level tablets and smartphones in China and other high-growth markets. The new 1Y nanometer 3-bit-per-cell (X3) NAND flash storage solution enables original equipment manufacturers (OEMs) to quickly introduce new, affordable tablets and smartphones with the reliable performance of SanDisk storage.

"China is the most dynamic smartphone and tablet market today, with state-of-the-art high-end smartphones and new powerful, but affordable, 'entry-level' devices," said Mr. Drew Henry, senior vice president and general manager, Mobile and Connected Solutions, SanDisk. "We leveraged our flash technology expertise to specifically design our new iNAND Standard for the high-volume China budget mobile device market. Because we work closely with mobile systems providers, it offers near plug-and-play capability that enables OEMs to rapidly introduce highly capable entry-level tablets and smartphones that are optimal for the China mass market."

Axiomtek Unveils the eBOX635-881-FL Rugged, Fanless Embedded Computer

Axiomtek, one of the world's leading designers and manufacturers of innovative, high performance and reliable PC-based industrial computer products, announces the eBOX635-881-FL, its new fanless embedded box computer utilizing 4th Generation Intel Core i7/i5/i3 and Intel Celeron processor with Intel H81 chipset.

The super light yet compact eBOX635-881-FL comes packaged in an IP40-rated aluminum and cold-rolled steel enclosure and is designed to operate at temperatures ranging from -20°C to +50°C for use in the extremely environments. The fanless embedded system supports six jumper-less RS-232/422/484 and sixteen DI/DO ports along with three display outputs of two HDMI, DisplayPort and VGA for applications used in transportation, POS, kiosk, industrial control automation and medical equipment. Two PCI Express Mini Card slots are added to the system for greater expansion capability. One SIM slot is also available for 3G/4G, GPS, Wi-Fi and Bluetooth applications, allowing for more efficient networking options.

Synology Debuts Embedded DataStation EDS14 NAS

Synology today introduced Embedded DataStation EDS14, a palm-sized, state-of-the-art NAS server combining durability with reliability, implementing Synology's advanced network storage solutions in a wide range of application scenarios. "Designed to survive extreme conditions and harsh environments, the EDS14 is vibration-resistant and complies with the industrial thermal endurance level from -20˚C to 50˚C," said Chad Chiang, product manager at Synology Inc. "Its drive-less design and the support for high-speed SDXC UHS-I SD storage and USB 3.0 further maximize system reliability with performance and capacity."

Synology EDS14 measures at 125 x 125 x 31mm, nearly 70% smaller than an ordinary 2-bay NAS server, and is particularly suitable for areas where space is a challenge. Despite the compact physical size, the EDS14 makes no compromise in reliability by engineering the dynamic cooling mechanisms to ensure CPU health in challenging thermal environments. Optimized for deployment in a variety of environments, the EDS14 can tolerate dynamic DC input voltage from 7 to 24V, is compatible with PoE splitters, and supports 3G/LTE. The EDS14 even comes with multiple mounting solutions, including DIN rail, and a schedulable DC output to power peripheral devices, making it a good fit for versatile deployment.

VIA Announces AMOS-3003 Fanless System

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3003, a compact embedded IoT system designed around the tiny VIA EPIA-P910 Pico-ITX board. Combining low power, rich connectivity and high performance 64-bit computing in a ruggedized design, the VIA AMOS-3003 delivers all the latest features and digital media standards required in data collection terminals for in-vehicle control as well as machine to machine controllers in a host of industrial automation applications.

Leveraging the advanced capabilities of the combined 1.2GHz VIA Nano X2 E-Series dual core processor and VIA VX11H media system processor (MSP), the VIA AMOS-3003 features rich connectivity including dual Gigabit Ethernet and optional WiFi, GPS and 3G networking with Dual SIM card support. With a host of extendable I/O options to connect peripheral devices as well as Wake On LAN (WOL) and pre-boot execution environment (PXE) support, the VIA AMOS-3003 is the ideal solution for customers to create a host of remotely managed IoT devices for almost any environment.

AMD and Mentor Graphics Accelerating Open-Source Development for Embedded Systems

AMD today announced a multi-year agreement with Mentor Graphics Corporation to expand availability of open-source embedded Linux development for heterogeneous and multi-core processors from AMD. Dedicated to providing embedded developers with a more manageable and focused open source framework, the agreement will provide embedded developers with more supported processor options, robust development tools, and greater speed in open platform development.

As a Yocto Project compatible product, Mentor Embedded Linux will now bring standardized features and tools, and ensure quick access to the latest Board Support Packages (BSPs) for AMD 64-bit x86 architecture beginning with the upcoming AMD Embedded G-Series system-on-a-chip (SoC) (codenamed: "Steppe Eagle") and AMD Embedded R-Series APU/CPU (codenamed: "Bald Eagle").

Silicon Motion Expands Ferri Series Single-Package SSD Portfolio

Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduces new additions to its Ferri portfolio with single-package Ferri-eMMC and ultra-high performance SATA 6 Gb/s FerriSSD embedded memory solutions supporting industrial and commercial grade temperatures. Silicon Motion will be showcasing and demonstrating these new products at the upcoming EE Live! Conference and Expo in San Jose, CA from April 1 to 3.

Ferri-eMMC is designed for a wide range of embedded applications and is fully compliant with JEDEC-standard eMMC 4.5 protocol. With a 100-ball 1.0 mm pitch BGA package, Ferri-eMMC provides for more flexible PCB design and low-cost manufacturing. Ferri-eMMC delivers market leading data integrity and protection capabilities featuring Silicon Motion's advanced NAND management technologies including error correction, bad block management and NAND health monitoring.

NVIDIA Unveils First Mobile Supercomputer for Embedded Systems

NVIDIA today opened the door to the development of a new generation of applications that employ computer vision, image processing and real-time data processing -- with the launch of a developer platform based on the world's first mobile supercomputer for embedded systems.

The NVIDIA Jetson TK1 Developer Kit provides developers with the tools to create systems and applications that can enable robots to seamlessly navigate, physicians to perform mobile ultrasound scans, drones to avoid moving objects and cars to detect pedestrians.

Sapphire Now Delivering Embedded Solutions

SAPPHIRE Technology has just announced that it has begun delivering products from its newly formed Embedded Systems Business Unit, targeting graphics intensive embedded system designs and small format computing solutions for a wide range of applications. SAPPHIRE Technology is a leading manufacturer and global supplier of a broad range of innovative technologies for PC enthusiasts, home users and professionals. The company was first formed over a decade ago as a manufacturer and global supplier of state-of-the-art graphics add-in boards, for which it is now recognized as a premier AMD add-in graphics board partner for both consumer and professional products. The company's extensive product line has grown to include motherboards, mini PCs and Professional AV products.

SMART Modular Unveils XR-DIMM Small Form Factor DDR3 Module

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced its new XR-DIMM small form factor DDR3 module, specifically designed for ruggedized single board computing (SBC) applications requiring high reliability, density and performance attributes.

SMART's XR-DIMM solves the traditional space-constraint issue for Advanced Memory Card (AMC) form factor SBC's, where the clips from the horizontally mounted SO-DIMM's socket violate the "keep-out" areas of the card and interfere with the system chassis when the AMC card is removed. The XR-DIMM solves this issue by using a low profile, snap-down mezzanine connector with no clips. In addition, SMART's XR-DIMM form factor provides a ruggedized attach method and features improved signal integrity ideal for AMC cards, as well as ATCA, PCIe, and COMe embedded computing applications.

Stealth.com Announces LPC-630F Fanless Mini PC

Stealth.com Inc. (Stealth Computer), a leader in rugged small form factor computing has released the new model LPC-630F, a high performance fanless small form computer. The highly reliable LPC-630F is loaded with features generally found in systems many times its diminutive size.

Stealth's LPC-630F is a quiet yet powerful small form factor computer that operates without noisy cooling fans which could draw in dirt resulting in potential failures. Stealth's fanless computers are encapsulated in a rugged extruded aluminum chassis performing as a heat sink to dissipate heat build-up. Its compact size 7.9" x 7.9" x 2.56" (200 x 200 x 65 mm) make it ideal for space challenged applications.

SMART Introduces New Memory Module Form Factor

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced MIP, the industry's first module-in-a-package memory form factor. SMART's innovative tiny form factor design is targeted for broadcast video, mobile router, high-end video/graphics cards and embedded computing applications where power consumption, performance and space limitations are of principle concern.

While SMART's MIP occupies just one-fifth the area of an SO-DIMM, it offers higher performance and consumes less power. Key improvements with MIP include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. Being a "soldered down" module, unlike an SO-DIMM, the need for a mating connector is eliminated with MIP. SMART's MIP supports both, applications requiring ECC and the ones that do not. These are key benefits for applications where memory capacity in a small space is critical. And unlike other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.

Intel Delivers Intelligence from Device to Cloud to Drive Internet of Things

Intel Corporation today announced plans to accelerate the development and deployment of the Internet of Things (IoT) by enabling intelligent devices, end-to-end analytics and connecting legacy devices to the cloud to drive business transformation.

In support of this effort, the company unveiled several products including the Intel Atom processor E3800 product family (formerly codenamed "Bay Trail-I"), a new family of Intel-based intelligent gateway solutions featuring integrated software from McAfee and Wind River, and new features for the Intel Quark SoC X1000.

MSI Unveils the MS-98D3 Ultra Low-Profile Embedded Board

MSI, the leading brand of embedded computers recently released a new Mini-ITX embedded board that focuses on advanced POS application. Powered by the 4th Gen Intel Core processor, MS-98D3 brings the POS system to a new level with the capability of multiple processing covering front-end retailing to back-end management at the same time, while keeps the system active and prompt at both ends.

The fast growth of information technology and network communication has made POS no longer in the stereotype of a stand-alone cash register in a store or restaurant, processing simple ordering and checkout works. With increasing POS system connected to network, wireless, or cellular communication to form a networked or even cloud-based POS system, high-end POS host is required by the market. The MS-98D3 is an embedded board designed in response to this demand.

AMD Details Embedded Product Roadmap

AMD (NYSE: AMD) today disclosed its roadmap for the fast-growing embedded computing market, as it becomes the first company to offer both ARM and x86 processor solutions for low-power and high-performance embedded compute designs. The new lineup includes two best-in-class x86 accelerated processing units (APUs) and central processing units (CPUs), a first look at a high-performance ARM system-on-chip (SoC) and a new family of discrete AMD Embedded Radeon graphics processing units (GPUs) expected to launch in 2014. These additions provide the embedded industry's engineering community with more choices to match their exact design needs, and are designed to offer improvements in performance-per-watt and performance-per-dollar. Together with the recent launch of the award-winning AMD Embedded G-Series SoC family that set a superior bar for performance-per-watt low-power multicore APUs, these latest additions to the embedded product roadmap further signify a strategic push by AMD to focus on the high-growth embedded market.

MSI Unveils the MS-98C7 Haswell-Powered Embedded Board

MSI, the global renowned embedded computing provider, proudly releases the MS-98C7 Mini-ITX embedded board for high-density processing and graphic application markets. The MS-98C7 boosts processing power with the Intel 4th Generation 8 series chipset platform, which CPU performance is rated to be 5 to 15% higher and graphic performance 30% higher than the 3rd generation platform.

Armed with the great processing and graphic power, the MS-98C7 also supports sufficient memory capacity up to 16 GB to ensure smooth outputs with efficiency, even when tough tasks are required. Plus its 3 or 2 independent displays with output interfaces of VGA, LVDS, and DP, the MS-98C7 delivers an excellent solution for industrial scenes with intensive display requirements, such as digital signage, onboard MOD, gaming, and more.

AMD Offers New Multi-Core R-Series CPUs and Discrete AMD Radeon GPU Bundle

AMD today announced new CPU offerings for the AMD Embedded R-Series high-performance computing platform, along with the introduction of a discrete GPU promotional program to provide embedded designers more choices for meeting demanding performance requirements.

The new options include quad-core and dual-core CPUs scaling from 2.2 GHz to 3.2 GHz with Thermal Design Power (TDP) ranging from 17 to 35 watts for applications that require high performance x86 compute such as network attached storage (NAS). To address high-end visual needs for applications like digital gaming and signage that require high-performance x86 compute coupled with industry-leading discrete graphics, AMD is introducing a new discrete GPU promotional program that provides customers with both a CPU and discrete GPU for savings of up to 20 percent.

AMD Extends Embedded SoC Leadership by Lowering G-Series Energy Consumption

AMD today announced a new low-power Accelerated Processing Unit (APU) in the award-winning AMD G-Series SOC family with the GX-210JA, further reducing x86 power requirements for embedded designs. The new GX-210JA APU, a full System-on-Chip (SoC) design, uses one third less energy than the previous low-power Embedded G-Series SOC product while providing industry-leading graphics capabilities.

At only 6 watts maximum thermal design power (TDP), and approximately 3 watts expected average power, this new member of the G-Series SOC family will enable additional fanless designs for a variety of applications ranging from industrial controls and automation, digital gaming, communications infrastructure and visual embedded products including thin client, digital signage and medical imaging.

MSI MS-9A68 Embedded System Satisfies Display-Critical Tasks In Diverse Fields

MSI's IPC division proudly announced a new embedded system, MS-9A68, for display-critical applications in diversified industrial fields. Aiming at the monitoring, video-interactive, or demanding applications with both intensive displaying and processing tasks, MS-9A68 is designed with high-performance CPU power and brilliant display capability that well-satisfy those applications, such as digital signage, gaming, surveillance, Kiosk, and public transportation. In addition to its outstanding performance, the slim, light-weighted mechanical design makes the MS-9A68 especially ideal for space-limited sites or cabinet installation.

Stealth.com Introduces LPC-700F Fanless Mini-PC

Stealth.com Inc. (Stealth Computer), a leading ISO 9001 manufacturer of industrial rugged computers and peripherals has released a new powerful Fanless Mini PC model LPC-700F featuring built-in PCI or PCIe expansion slot capability. The LPC-700F outperforms other small sized PC systems due to the integration of the latest Intel 3rd Generation Core i7 mobile processors. The LPC-700F ships standard with an Intel i7 Processor 3610QE CPU exceeding the performance of computers many times its physical size. The LPC-700F fanless mini PC features a multitude of I/O connectivity built directly into its impressively small design such as; 4x USB 3.0, 6x RS232/Serial, 2x Gigabit LAN ports, VGA, DVI-D & HDMI video connectors and Audio In/Out. The LPC-700F fanless computer comes standard with a 128GB solid state drive (SSD).

"Our new Stealth Model: LPC-700F is the most powerful and technologically advanced fanless PC we have introduced to date. Our full featured machine features built in PCI or PCIe expansion card slots for applications requiring additional expansion capability", stated Ed Boutilier CEO of Stealth.com Inc. Stealth's LPC-700F is a powerful diminutive computer that operates without noisy cooling fans that could draw in dirt and dust potentially causing catastrophic failures. Stealth's fanless computers are encapsulated in a rugged extruded aluminum chassis performing as a heat sink to dissipate heat build-up.

Innodisk Releases World's First Industrial-Embedded SATA µSSD - nanoSSD

Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, announces a release of the industrial-embedded industry's first SATA device in accordance to SATA µSSD standards - nanoSSD.

Through the integration of a control chip, flash memory and peripheral power components into a single ball grid array (BGA) package, Innodisk has managed to reduce the size of the nanoSSD to approximately 1% the size of a 2.5" SSD. With dimensions of only 16 x 20 x 2 mm (WxLxH), a weight of only 1.5g, SATA III support, capacities ranging from 4 to 64 GB and both x86 and ARM compatibility, nanoSSD can be incorporated into a wide variety of applications where a small form-factor and high transfer rates are important, including industrial mobile devices, embedded systems, tablets, high-end smart phones and Ultrabooks.

Advantech Launches ATX Intel Xeon E5 Industrial Serverboard

Advantech, a global embedded platform manufacturer, today unveiled the new ASMB-822I server-grade motherboard powered by Intel Xeon processor E5-2600 family technology. This new technology comprises 64-bit multi-core processors, PCI Express Gen3 high speed communications, and DDR3 memory with total capacity up to 96GB. ASMB-822I is perfect designed for high performance demands such as NVR, DVR and also target to video wall, video conferencing, surveillance and other mission-critical applications.

"Advantech is committed to providing a full spectrum of embedded systems with advanced and intelligent built-in technology, from fanless and ruggedized to high-performance solutions," said Linda Tsai,Director of Advantech Embedded Systems Group. The ASMB-822I is an ATX server board equipped with LGA 2011 Intel Xeon processor E5-2600 series and Intel C602J series chipset. It supports six DDR3 registered DIMM slots for a 96 GB total capacity and dual GbE LANs using Intel controllers.

AMD Unveils New Embedded G-Series System-on-Chip

AMD today announced the new AMD Embedded G-Series System-on-Chip (SOC) platform, a single-chip solution based on the AMD next-generation "Jaguar" CPU architecture and AMD Radeon 8000 Series graphics. The new AMD Embedded G-Series SOC platform further signifies a strategic push to focus on high-growth markets outside the PC industry, with an emphasis on embedded systems. The announcement was made at this year's DESIGN West expo.

Embedded systems are increasingly driving intelligence into new areas of our lives, from smart TVs and set-top boxes to interactive digital signage and informational kiosks. This supports greater productivity and connectivity and is expected to be a strong driver for Surround Computing, an area of substantial growth in the computing industry. Among the forces that are enabling this next-generation computing era are single-chip, SOC solutions that offer smaller size, higher performance and more energy-efficient processors.

Axiomtek Announces the eBOX623-831-FL Fanless Embedded PC

Axiomtek ultra low-power fanless embedded system with Intel Cedar Trail platform and dual display interfaces, the eBOX623-831-FL, is available now! It provides advanced graphics processing capability via the new dual core Intel Atom Cedarview processor N2600 at 1.6 GHz or D2550 1.86 GHz in 45nm technology with Intel NM10 Express chipset. This slim yet compact embedded system supports system memory of one 204-pin DDR3 800 MHz maximum up to 2 GB with N2500 and DDR3 1066/1333 MHz maximum up to 4 GB with D2550. By adopting the new Intel Cedar Trail platform, fanless eBOX623-831-FL boosts graphics performance and power efficiency. With the optimized graphics capability and dual view support (VGA and DisplayPort), the rugged unit is an ideal fit for automatic optical inspection, digital signage appliance (DSA), POS/Kiosk, embedded controller, factory automation and more applications.

MSC Intros COM Express Module with High Performance iGPU, Supports Up to 4 Displays

MSC Embedded Inc., manufacturer of highly integrated standard board level products and customer-specific boards and systems, today introduced a powerful, new COM Express Type 6 module family. This family, called MSC C6C-A7, is based on the AMD embedded R-Series processors also known as accelerated processing units (APUs). MSC C6C-A7 members are compact form factor computer-on-modules characterized by very powerful graphics and high parallel computing performance with low power dissipation.

The MSC C6C-A7 module family integrates AMD R-460L 2.0 GHz (2.8 GHz Turbo) or AMD R-452L 1.6 GHz (2.4 GHz Turbo) quad-core processors. The thermal design power (TDP) levels are 25 W and 19 W, respectively. The two dual-core versions are populated with the AMD R-260H 2.1 GHz (2.6 GHz Turbo) processor or the AMD R-252F 1.7 GHz (2.3 GHz Turbo) processor -- each featuring 17 W TDP. The processors support the AMD64 technology and the AMD-V virtualization technology. The AMD Fusion Controller Hub (FCH) A75 chipset was also selected. The main memory can be expanded to 16 GB DDR3-1600 dual-channel SDRAM via two SO DIMM sockets.
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