ASUS IoT, the global AIoT solution provider, today announced PE8000G at Embedded World 2024, a powerful edge AI computer that supports multiple GPU cards for high performance—and is expertly engineered to handle rugged conditions with resistance to extreme temperatures, vibration and variable voltage. PE8000G is powered by formidable Intel Core processors (13th and 12th gen) and the Intel R680E chipset to deliver high-octane processing power and efficiency.

With its advanced architecture, PE8000G excels at running multiple neural network modules simultaneously in real-time—and represents a significant leap forward in edge AI computing. With its robust design, exceptional performance and wide range of features, PE8000G series is poised to revolutionize AI-driven applications across multiple industries, elevating edge AI computing to new heights and enabling organizations to tackle mission-critical tasks with confidence and to achieve unprecedented levels of productivity and innovation.

According to the latest report from ComputerBase, Intel had a strong presence at the recently concluded Embedded World 2024 conference. The company officially showcased its Arc series of GPUs for the embedded market, based on the existing Alchemist chips rebranded as the "E series." However, industry whispers hint at a more significant development—the impending launch of Intel's second-generation Arc Xe² GPUs, codenamed "Battlemage," potentially before the lucrative Black Friday shopping season. While Alchemist serves as Intel's current offering for embedded applications, many companies in attendance expressed keen interest in Battlemage, the successor to Alchemist. These firms often cover a broad spectrum, from servers and desktops to notebooks and embedded systems, necessitating a hardware platform that caters to this diverse range of applications.

Officially, Intel had previously stated that Battlemage would "hopefully" arrive before CES 2025, implying a 2024 launch. However, rumors from the trade show floor suggest a more ambitious target—a release before Black Friday, which falls on November 29th this year. This timeline aligns with Intel's historical launch patterns, as the original Arc A380 and notebook GPUs debuted in early October 2022, albeit with a staggered and limited rollout. Intel's struggles with the Alchemist launch serve as a learning experience for the company. Early promises and performance claims for the first-generation Arc GPUs failed to materialize, leading to a stuttering market introduction. This time, Intel has adopted a more reserved approach, avoiding premature and grandiose proclamations about Battlemage's capabilities.

AMD today announced the expansion of the AMD Versal adaptive system on chip (SoC) portfolio with the new Versal AI Edge Series Gen 2 and Versal Prime Series Gen 2 adaptive SoCs, which bring preprocessing, AI inference, and postprocessing together in a single device for end-to-end acceleration of AI-driven embedded systems.

These initial devices in the Versal Series Gen 2 portfolio build on the first generation with powerful new AI Engines expected to deliver up to 3x higher TOPs-per-watt than first generation Versal AI Edge Series devicesi, while new high-performance integrated Arm CPUs are expected to offer up to 10x more scalar compute than first gen Versal AI Edge and Prime series devicesii.

DFI, the world's leading brand in embedded motherboards and industrial computers, proudly announced the launch of its innovative product lineup featuring Windows on Arm (WoA) at Embedded World 2024. DFI NXP products deliver high power efficiency and seamlessly integrate Windows on Arm, introducing a new era in computing where the traditional stronghold of Windows on x86 processors is evolving.

Arm and Microsoft revealed a compelling study that projected an 81% growth in the Windows on Arm market within the next five years. DFI's commitment to embracing this dynamic landscape is evident in its latest product offerings, designed to unlock the true potential of WoA. The diverse NXP product lineup included Single Board Computers, system-embedded Box PCs, and Panel PCs tailored to various customer needs.

AMD has introduced the Ryzen Embedded 8000 Series processors, the first AMD embedded devices to combine NPUs based on the AMD XDNA architecture with traditional CPU and GPU elements, optimized for workload versatility and adaptability targeting industrial AI applications. Embedded solution engineers and developers can harness the processing power and leadership features for a variety of industrial AI applications including machine vision, robotics, and industrial automation. AI is widely used in machine vision applications today to enhance quality control and inspection processes.

AI can also help robots make real-time, route-planning decisions and adapt to dynamic environments. In industrial automation, AI processing helps intelligent edge devices perform complex analysis and decision-making without relying on cloud connectivity. This allows for real-time monitoring, predictive maintenance, and autonomous control of industrial processes, enhancing operational efficiency and reducing downtime.

SolidRun, a leading developer and manufacturer of high-performance System on Module (SOM) solutions, Single Board Computers (SBC) and network edge solutions, today announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the 8-core/16-thread Ryzen Embedded V3C48 Processor. Boasting AMD's state-of-the-art 6 nm "Zen 3" architecture, this ultra-powerful embedded solution offers industry-leading performance and power efficiency. As SolidRun's first x86-based Com Express 7 module, the Ryzen V3000 CX7 Com module ushers in a new era of efficient, high-performance computing for a diverse range of networking and edge applications.

"Our new Ryzen V3000 CX7 Com module is an exciting addition to our CX7 product line as it represents a significant leap forward in embedded computing and offers unmatched performance and scalability for networking and edge applications," said Dr. Atai Ziv, CEO at SolidRun. "By leveraging the power of AMD's Ryzen Embedded V3000 processor, we are empowering developers to create innovative solutions that meet the evolving demands of modern embedded computing."

Simply NUC, Inc, a leading computing solutions company focused on small form factor PCs, announced the launch of Bravo Canyon (ASUS NUC 13 Rugged), the newest addition to the Intel-based Rugged NUC lineup. Set to revolutionize embedded computing with its robust features, unparalleled versatility, and engineered to excel in demanding environments, Bravo Canyon offers a range of processor variants and customization options to meet the diverse needs of industrial applications.

"Bravo Canyon represents a significant leap forward in embedded computing," said Aaron Rowsell, Founder & President of Simply NUC. "With its powerful processor variants, rugged design, and extensive customization options, it's a game-changer for industries seeking reliable and adaptable computing solutions. We're proud to introduce a product that sets a new standard in the field."

AMD today announced the launch of AMD Embedded+, a new architectural solution that combines AMD Ryzen Embedded processors with Versal adaptive SoCs onto a single integrated board to deliver scalable and power-efficient solutions that accelerate time-to-market for original design manufacturer (ODM) partners. Validated by AMD, the Embedded+ integrated compute platform helps ODM customers reduce qualification and build times for faster time-to-market without needing to expend additional hardware and R&D resources. ODM integration using Embedded+ architecture enables the use of a common software platform to develop designs with low power, small form factors, and long lifecycles for medical, industrial, and automotive applications.

"In automated systems, sensor data has diminishing value with time and must operate on the freshest information possible to enable the lowest latency, deterministic response," said Chetan Khona, senior director of Industrial, Vision, Healthcare and Sciences Markets, AMD. "In industrial and medical applications, many decisions need to happen in milliseconds. Embedded+ maximizes the value of partner and customer data, with energy efficiency and performant computing that enables them to focus in turn on addressing their customer and market needs."

Today, AMD announced it will showcase automotive innovation at CES 2024 and expand its portfolio with the introduction of two new devices, the Versal AI Edge XA adaptive SoC and Ryzen Embedded V2000A Series processor. The devices underscore AMD automotive technology leadership and are designed to serve key automotive focus segments including infotainment, advanced driver safety and autonomous driving. Working alongside a growing automotive partner ecosystem, AMD will demonstrate at CES 2024 the broad range of capabilities and applications for these new devices in automotive solutions available today and in the future.

Versal AI Edge XA adaptive SoCs add an advanced AI Engine, enabling the devices to be further optimized for numerous next-generation advanced automotive systems and applications including: forward cameras, in-cabin monitoring, LiDAR, 4D radar, surround-view, automated parking and autonomous driving. Versal AI Edge XA adaptive SoCs are also the first AMD 7 nm device to be auto-qualified, bringing hardened IP and added security to automotive applications where safety is paramount.

DEEPX (CEO, Lokwon Kim), an original AI semiconductor technology company, is announcing that it has surpassed 40 customers for its flagship chip solution, DX-M1—the only AI accelerator on the market to combine low power consumption, high efficiency and performance, and cost-effectiveness. The groundbreaking solution has been deployed for a hands-on trial to this customer pool, which spans global companies and domestic Korean enterprises across various sectors.

DEEPX is currently running an Early Engagement Customer Program (EECP) to provide customers with early access to its small camera module, a one-chip solution featuring DX-V1; M.2 module featuring DX-M1; and DXNN, the company's developer environment. This allows customers to receive pre-production validation of DEEPX's hardware and software, integrate them into mass-produced products, and realize AI technology innovations with the brand's technical support.

AMD today announced at Smart Production Solutions 2023 the AMD Ryzen Embedded 7000 Series processor family, optimized for the high-performance requirements of industrial markets. By combining "Zen 4" architecture and integrated Radeon graphics, Ryzen Embedded 7000 Series processors deliver performance and functionality not previously offered for the embedded market. With its expanded features and integration, Ryzen Embedded 7000 Series processors are ideal for a wide range of embedded applications, including industrial automation, machine vision, robotics and edge servers.

The Ryzen Embedded 7000 Series processor is the first embedded processor to use next-generation 5 nm technology with a 7-year manufacturing availability commitment. The new embedded processor integrates AMD Radeon RDNA 2 graphics that eliminates the need for a discrete GPU for industrial applications. And because embedded applications require additional operating system software options, Ryzen Embedded 7000 Series processors include support for both Windows Server and Linux Ubuntu, on top of Windows 10 and Windows 11. Ryzen Embedded 7000 Series processors also include up to 12 high-performance "Zen 4" CPU cores, which combined with its integrated features and wide operating system choices, offers unparalleled ease of integration for system designers.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2023 of $5.8 billion, gross margin of 47%, operating income of $224 million, net income of $299 million and diluted earnings per share of $0.18. On a non-GAAP basis, gross margin was 51%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.70.

"We delivered strong revenue and earnings growth driven by demand for our Ryzen 7000 series PC processors and record server processor sales," said AMD Chair and CEO Dr. Lisa Su. "Our data center business is on a significant growth trajectory based on the strength of our EPYC CPU portfolio and the ramp of Instinct MI300 accelerator shipments to support multiple deployments with hyperscale, enterprise and AI customers."

Advantech has skillfully incorporated 13th Gen Intel Core processors across a wide array of products, setting new benchmarks for performance and capability. These enhanced solutions harness cutting-edge CPU architectures in their latest designs, delivering a noticeable performance boost over the previous processor generation. This upgrade significantly enhances application efficiency in smart factories, computer vision, intelligent retail, healthcare, and edge AI applications. At Advantech, we are unwavering in our commitment to providing long-term support, ensuring that customers can rely on our products for uninterrupted operation.

Advantech's new solutions offer Intel processors with up to 24 cores and 32 threads, up to 128 GB of DDR5 memory, and a PCIe 4.0/5.0 x16 slot for efficient multitasking. Experience optimized productivity with Advantech's Embedded Design-In Services and quality solutions featuring industrial-grade components. Advantech's embedded OS and value-added software options include Windows, Ubuntu, and Yocto BSP, along with the Edge AI Suite for AI performance evaluation and DeviceOn for device management.

SAPPHIRE Technology, in cooperation with Thinlabs, presents a unique computing solution that utilizes 802.3bt PoE++ (Power-over-Ethernet) technology - the Thinlabs PoE NUC. It allows for up to four ThinLabs HD displays to be fully powered over a single Ethernet cable. Utilizing this technology brings many advantages like eliminating the need for electrical outlets or simplifying power backups. At the heart of the Thinlabs PoE NUC lies a motherboard developed by SAPPHIRE, featuring the AMD Ryzen Embedded V2000 series processor. This AMD Ryzen processor, with efficient "Zen 2" x86 CPU and Radeon Graphics cores offers versatility, low power and high performance. The AMD Ryzen flagship model, V2718, features an 8-core / 16-thread CPU with 7 integrated Radeon Graphics Compute Units.

Advantages of Power-over-Ethernet
The Thinlabs NUC solutions is equipped with the advanced 802.3bt PoE++ (PoE++ Type 4) technology. This innovation enables seamless supply of up to 90 W of power through a standard Cat 6 Ethernet cable. This simplifies deployment significantly, eliminating the need for a certified electrician to install an electrical outlet wherever the PC and monitors are required. Instead, a single Ethernet cable up to 100 m in length can be used to provide data and power to the complete system. Such an approach also greatly reduces installation cost and cable clutter.

ASRock Industrial, the leading provider of global industrial motherboards and systems, has released new Mini PCs and motherboards powered by Intel Processor N97 (Alder Lake-N). The available selections include NUC BOX-N97, iBOX-N97, and Motherboard Series consisting of NUC-N97, Pico-ITX (SOM-P104), SBC 3.5" (SBC-260, SBC-261), and Mini-ITX (IMB-1005, IMB-1006, IMB-1007) form factors. Compared to the previous Intel Celeron Processor J6412 (Elkhart Lake), the Intel Processor N97 (Alder Lake-N) showcases remarkable CPU performance increase of up to 37% and graphics performance up to 154%. The new NUC BOX-N97, iBOX-N97, and NUC-N97 Motherboard Series provide rich I/O and expansion options, including triple displays up to 4K at 60 Hz, dual 2.5G LAN, and dual storage option with SATA 3.0 and M.2 Key M, catering to diverse application needs, such as entertainment, office, business, retail, transportation, embedded, industrial, and beyond.

Hackboard today announced the launch of Hackboard 2, an affordable single-board computer (SBC) about the size of a smartphone but with the power of a desktop computer and one of the lowest-priced Intel-powered and Windows-based single-board computers ever made. It's ideal for Makers and Hobbyists, IoT, Edge Computing, and Embedded Solutions with customizable Hackboards, contact Support@Hackboard.com for more info. Soon, Hackboard will ship Personal Computer Kits, ideal for work-from-home users, remote learners and the classroom.

The Hackboard 2 allows users to create their ideal computing environment at an affordable price, while taking advantage of the benefits of industry standard technology. With optional 4G or 5G modules, users can connect to the internet from almost anywhere. Users can plug the system into nearly any monitor with an HDMI input, including their TV.

AMD (NASDAQ:AMD) today announced revenue for the first quarter of 2023 of $5.4 billion, gross margin of 44%, operating loss of $145 million, net loss of $139 million and diluted loss per share of $0.09. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $970 million and diluted earnings per share was $0.60.

"We executed very well in the first quarter as we delivered better than expected revenue and earnings in a mixed demand environment," said AMD Chair and CEO Dr. Lisa Su. "We launched multiple leadership products and made significant progress accelerating our AI roadmap and customer engagements in the quarter. Longer-term, we see significant growth opportunities as we successfully deliver our roadmaps, execute our strategic data center and embedded priorities and accelerate adoption of our AI portfolio."

AMD today announced the availability of its high-performance AMD Ryzen Embedded 5000 Series, a new solution for customers requiring power-efficient processors optimized for "always on" networking firewalls, network-attached storage systems and other security applications. The Ryzen Embedded 5000 Series rounds out the "Zen 3"-based AMD embedded processor portfolio which also includes the Ryzen Embedded V3000 and EPYC Embedded 7000 series families.

Built on 7 nm technology with planned five-year manufacturing availability, and equipped with 6, 8, 12 or 16 cores and 24 lanes of PCIe Gen 4 connectivity, Ryzen Embedded 5000 Series processors are designed for enterprise reliability to support the consistent uptime requirements needed by security and networking customers. Ryzen Embedded 5000 Series processors include robust reliability, availability and serviceability (RAS) features, including an ECC-supported memory subsystem. With a thermal design power (TDP) profile ranging from 65 W to 105 W, Ryzen Embedded 5000 processors enable the reduction of overall system cooling footprint for space-constrained and cost-sensitive applications.

Rugged embedded computer brand—Cincoze, recently launched its latest addition to the Display Computing - CRYSTAL product line, the P1201 embedded computer series. The P1201 packs the improved computing performance of the Intel Elkhart Lake platform into a thin and light body (204.5 x 149 x 41.5 mm) with flexible expansion options. The highlight is the dual-purpose design sets the P1201 apart from other embedded computers. As standard, its ultra-thin design makes it well-suited for data collection and analysis in space-limited applications in machine equipment and control cabinets. Attach one of a range of display modules to the P1201 using Cincoze's exclusive CDS (Convertible Display System, Patent No. M482908) technology, and it becomes a panel PC suitable for HMI applications.

The P1201 uses the Elkhart Lake platform Intel Atom x6425E quad-core processor, delivering 1.7x the single-core performance and 1.5x the multi-core performance of the previous generation Apollo Lake processors. It also supports DDR4 memory up to 32 GB and 3200 MHz. The Intel UHD graphics chip ensures smooth graphics by doubling the processing performance of previous generations. Greatly improved computing performance shortens processing times, thereby increasing work efficiency.

In response to the increasing demand for powerful computing that can be relied on in a wide range of even the most challenging installation environments, leading industrial computing manufacturer and solution provider, OnLogic (www.onlogic.com), has unveiled their Helix 401 fanless industrial computer. The compact device is designed for use in edge computing, industry 4.0, Internet of Things (IoT), and many other emerging applications and will make its public debut at Embedded World 2023.

"You may never see them, but industrial computers are everywhere, working diligently to power technology solutions of every shape and size. These systems need to be small and reliable while still being just as powerful as high-end desktop machines," says Mike Walsh, Senior Product Manager at OnLogic. "The Helix 401 balances size and performance while providing a wide range of configuration possibilities to help users tailor it to their specific application. It's small enough to fit in your hand, similar in size to Intel's popular NUC, but capable enough to drive advanced automation solutions and power the next great smart agriculture, building automation or energy management innovation."

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

DFI, a global leader in embedded motherboards and industrial computers, today announced that they will be participating in Embedded World 2023 and joining Qualcomm Technologies, Inc. to showcase the world's first SBC equipped with the high-performance Qualcomm QRB5165 processor. With high integration capability and anti-vibration features, the product can be applied in fields such as industrial automation and AMR. It is expected to increase the overall AI edge computing efficiency and bring more capabilities to the industry.

For the first time during the three-day Embedded World 2023 exhibition, DFI will integrate the QRB551 industrial-grade motherboard built with the Qualcomm Robotics RB5 platform with 5G connectivity and AMR requirements. The solution will be applied to a smart factory environment while executing appearance recognition, defect detection, and human body posture recognition, which are commonly seen in industrial automation.

Phison Electronics, a global leader in NAND flash and storage solutions, announced today the launch of IMAGIN+, an upgraded platform offering R&D resource sharing and ASIC (Application-Specific Integrated Circuit) design services for NAND flash controllers, storage solutions, PMIC, and Redrivers/Retimers. The introduction of IMAGIN+ comes during the Embedded World Exhibition & Conference (March 14-16) in Nuremberg, a premier global event for the embedded community.

Phison's rejuvenated platform, bolstered by more than two decades of research and development expertise, empowers global partners and customers to create not just ASIC chips and NAND flash storage solutions but also to participate in the growth of a thriving ecosystem of emerging technologies. Phison understands that success in today's fast-paced market requires more than just providing NAND storage solutions; it requires the ability to influence and shape the industry through signal integrity and power management ICs, Compute Express Link and other value-added offerings.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is showcasing its latest lineup of Intel 12th / Elkhart Lake motherboards and Barebone systems at the Embedded World 2023 exhibition, currently underway from March 14th to 16th in Nuremberg, Germany. As the largest international trade fair for embedded systems, the exhibition attracts professionals and enthusiasts from various industries worldwide. BIOSTAR's product lineup includes six industrial motherboards - BIH11-AHB, EIB7B-AXI, BIH61-IHP, BIH60-IHP, BICMA-IHP, and BIELK-IHT - equipped with advanced features such as high-performance processing, support for multiple displays, and various connectivity options. These motherboards are ideal for applications in digital signage, medical, transportation, and other industries.

In addition to the motherboards, BIOSTAR is also showcasing six barebone systems, including the MP-J4125, MP-J6412, MT-J6412, MT-J6412 PRO, MS-J6412, and MS-N3160. These systems offer powerful performance, efficient energy consumption, and compact design, making them suitable for home entertainment, office productivity, AI, edge computing, and many more versatile applications.

AMD today announced it is bringing world-class performance and energy efficiency to embedded systems with AMD EPYC Embedded 9004 Series processors. The new 4th generation EPYC Embedded processors powered by "Zen 4" architecture provide technology and features for embedded networking, security/firewall and storage systems in cloud and enterprise computing as well as industrial edge servers for the factory floor.

Built on the "Zen 4" 5 nm core, the processors combine speed and performance while helping reduce both overall system energy costs and TCO. The series is comprised of 10 processor models with performance options ranging from 16 to 96 cores, and a thermal design power (TDP) profile ranging from 200 W to 400 W. The performance and power scalability afforded with AMD EPYC Embedded 9004 Series processors make them an ideal fit for embedded system OEMs expanding their product portfolios across a range of performance and pricing options. The AMD EPYC Embedded 9004 Series processors also include enhanced security features to help minimize threats and maintain a secure compute environment from power-on to run time, making them well suited for applications with enterprise-class performance and security needs.