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Industry-First Program Amps Up App Development For Network Devices

NETGEAR, Inc., a global networking company that delivers innovative products to consumers, businesses and service providers, today announced the new NETGEAR Developer Program, a revolutionary, simple way for developers to create new apps to help customers get more out of the millions of NETGEAR devices purchased every month. In an industry first, NETGEAR has created a huge opportunity for developers to produce apps by leveraging the NETGEAR Smart Network architecture built into an increasing number of its consumer and small-business devices, including a selection of routers, gateways and network-attached storage (NAS) devices.

Developers simply register at the NETGEAR Smart Network website (here), where they can access all the Java-based building blocks they need to create apps. NETGEAR makes it easy for developers to share or sell their apps through the NETGEAR genie+ marketplace. For the first time, home and small business customers can remotely download apps directly to their connected NETGEAR devices just as they would to a smartphone or tablet – to expand functionality. No other network vendor offers an app development platform or app store for these types of devices.

VIA Announces First ETX Module, VIA ETX-8X90

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ETX-8X90 module which features a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900 media system processor (MSP), providing industry leading performance in a power efficient design. The VIA ETX-8X90 module provides a highly integrated and compact platform for embedded applications in medical, test and measurement, industrial automation and transportation.

The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles enabling customers to rapidly develop new and innovative devices. Customers can take advantage of a proprietary start-up kit including a multi-I/O baseboard reference, or can utilize extensive technical support from VIA in developing a custom baseboard. In addition to support for the embedded industry leading VxWorks RTOS, the VIA ETX-8X90 runs a wide range of Windows and Linux based operating systems.

VIA Announces Latest VIA EPIA-M920 Mini-ITX Embedded Board

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA EPIA-M920 Mini-ITX board, the first VIA Mini-ITX board to feature the latest VIA VX11H media system processor (MSP) enabling DirectX 11 and 3D stereoscopic display capabilities for immersive environments. Providing superior performance with the latest in connectivity technology in a low power envelope, the VIA EPIA-M920 Mini-ITX provides the ideal platform for a wide array of next-generation compact devices for applications in healthcare, gaming, digital signage, and other vertical market segments.

With the choice of a 1.2GHz VIA QuadCore-E processor for high-end performance or a 1.0GHz VIA Eden X2 dual core processor for fanless system design, the VIA EPIA-M920 is a highly flexible platform for compact, low power systems with today’s latest connectivity options including HDMI and USB 3.0. In combination with the VIA VX11H MSP, the VIA EPIA-M920 Mini-ITX provides the latest in graphic capabilities, for richer textures and more life-like images in even the most demanding multi-display environments.

VIA Announces First QuadCore Pico-ITX Board with 3D Display Capabilities

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA EPIA-P910 Pico-ITX board, the first VIA board to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-Series processor. Providing superior performance and outstanding display capabilities, the VIA EPIA-P910 Pico-ITX provides the ideal platform for a wide array of next-generation ultra compact devices for applications in health-care, logistics, fleet management and other vertical market segments.

The VIA EPIA-P910 Pico-ITX is the first VIA board to include the VIA VX11H MSP which provides the latest in graphic capabilities, including DirectX 11 support, for richer textures as well as 3D stereoscopic display. In combination with a 1.0GHz VIA QuadCore E-Series processor, the VIA EPIA-P910 offers high performance computing in an ultra compact, low power design with today’s latest connectivity options including HDMI and USB 3.0.

Graphics Add-in Board Shipments Seasonally Down from Last Quarter Reports JPR

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics Add-in Board (AIB) shipments and sales’ market share for Q2’12. The JPR AIB Report tracks computer graphics boards, which carry discrete graphics chips. They are used in desktop PCs, workstations, servers, and other devices such as scientific instruments. They may be sold as after-market products directly to customers or they may be factory installed. In all cases, they represent the higher-end of the graphics industry as discrete chips rather than integrated processors.

We found that AIB shipments during Q1 2012 did behave according to past years with regard to seasonality, but in unit shipments was lower on a year-to-year comparison and on a quarter-to-quarter comparison for the quarter. Overall, for the AIB, and PC market in general, 2012 has been, and is forecasted to have a decline in shipments due to the popularity of notebooks and worldwide economic depression.

Samsung Begins Mass Producing Fastest Embedded NAND Storage for Smartphones/Tablets

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has now begun volume production of an ultra-fast embedded memory for smartphones, tablets and other mobile devices in 16-, 32- and 64-gigabyte (GB) densities.

The new Samsung eMMC (embedded multimedia card) Pro Class 1500 delivers the industry's fastest speeds for an embedded memory device, reading data sequentially at up to 140 megabytes per second (MB/s) and writing it at up to 50 MB/s. For random reading and writing, it can process up to 3500/1500 IOPS (inputs and outputs per second), four times the speed of previous eMMC solutions.

VIA Announces First Embedded ARM Based Pico-ITX Board, VIA VAB-800

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA VAB-800 Pico-ITX embedded ARM board. Featuring a choice of an 800MHz or a 1GHz Freescale ARM Cortex-A8 processor, the VIA VAB-800 combines a wide operating temperature range with extremely low power consumption to meet the demands of high-end industrial and in-vehicle fanless embedded applications.

Based on the industry standard 10 cm x 7.2 cm Pico-ITX form factor created by VIA, the VIA VAB-800 Pico-ITX board combines a rich I/O set with superb multimedia performance, supporting playback of the most demanding video formats in resolutions up to 1080p. Leveraging VIA’s hardware design expertise, the VIA VAB-800 delivers the highest I/O integration on the Pico-ITX form factor for an ultra compact yet highly flexible platform for the latest embedded devices.

TRENDnet Ships World's Smallest Powerline Networking Adapter

TRENDnet, a best-in-class wired and wireless networking hardware brand, announces today the availability of the 500 Mbps Compact Powerline AV Adapter Kit, model TPL-406E2K, which comes with two TPL-406E powerline adapters. These high performance 500 Mbps adapters are fifty percent smaller than the average 500 Mbps adapter.

New media center devices such as Internet televisions, digital video recorders (DVRs), receivers, and game consoles are capable of streaming large HD files directly from the Internet. TRENDnet's ground breaking TPL-406E2K connects all of these devices to the Internet using existing electrical lines.

AMD Introduces New Low-Power AMD Embedded G-Series APU, Extending Platform to 2017

AMD today introduced the latest entry to the AMD Embedded G-Series processor family with the AMD Embedded G-T16R Accelerated Processing Unit (APU). The AMD G-T16R is targeted at very low power, small form factor and cost-sensitive embedded designs that require a combination of x86 compatibility and graphics. The optimized design of the AMD Embedded G-T16R sips power, with power consumption of just 2.3 wattsiv on average or 4.5 watts thermal design power (TDP).

Embedded product designers are taking to the industry’s green challenge to design a broad range of next-generation applications for the industrial control, point-of-sale, medical appliance and transportation markets. For example, industrial customers can use the APU to help create greener factories based on more power-efficient factory hardware. Additionally, embedded designers can develop applications like point-of-sale order entry stations and tablets, medical bedside terminals and even solar-powered traffic control devices using the AMD G-T16R.

VIA Announces ARM Digital Signage System with Android Support

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA ARM DS (Digital Signage) system.

Developed for the Android operating system, the VIA ARM DS is an all-in-one system-ready solution for managing dynamic displays for cost sensitive high volume segments where high performance video and connectivity are paramount for enhanced customer engagement. Applications range from kiosks, POS systems, video walls, and menu boards to TVOIP, cloud streaming, and Out of Home Advertising across a broad spectrum of retail, hospitality, education, and entertainment environments.

AMD Appoints Arun Iyengar as General Manager of Newly-Formed Embedded Solutions Group

To further capitalize on the opportunity for Accelerated Processing Units (APUs) in embedded applications and form factors, AMD today announced the formation of a new Embedded Solutions Group and appointed Arun Iyengar as its corporate vice president and general manager. The AMD Embedded Solutions Group will operate as a separate business within AMD's Global Business Units under AMD Senior Vice President Lisa Su.

"AMD APUs have been extremely well received by embedded system designers who require more graphic-intensive displays and compute power, while continuing to increase our engagement with ecosystem partners to deliver a complete solution," said Lisa Su, senior vice president and general manager, AMD Global Business Units. "Arun's appointment and dedicated focus on expanding our differentiated embedded offerings will help ensure we are seizing the opportunity to expand in this rapidly growing market."

Wave of Innovation Coming from Microsoft and its Partners This Year

Today during a keynote address at COMPUTEX, Steven Guggenheimer, corporate vice president of the original equipment manufacturer (OEM) division at Microsoft Corp., demonstrated the breadth of innovation happening across Windows and the Windows ecosystem. He announced the second community technology preview (CTP) for Windows Embedded Standard 8, unveiled Quanta's new private cloud server solution, highlighted Ford's launch of its award-winning SYNC in-car connectivity system for Taiwan, and showed off some of the latest Windows devices.

When it comes to delivering Windows technologies across PCs, servers, phones and specialized devices, Microsoft is taking a holistic approach by providing familiar tools and technologies that enable customers and partners to maximize their investments. To that end, Microsoft today announced the second CTP for Windows Embedded Standard 8, which delivers the power of Windows for specialized devices running line-of-business applications within intelligent systems. Windows Embedded Standard 8 encompasses tools for natural, immersive user experiences and the ability for OEMs to define and control the device capabilities, with additional technologies that extend the power of Windows on industry devices. The CTP is available immediately for download by visiting this page.

TRENDnet Launches Smallest 500 Mbps Powerline Adapter With Built in Outlet

TRENDnet, a best-in-class wired and wireless networking hardware brand, announces today from Computex Taipei, the launch of the 500 Mbps Compact Powerline AV Adapter with Built in Outlet, model TPL-407E, and the 500 Mbps Compact Powerline AV Adapter Kit with Built in Outlet, model TPL-407E2K, which comes with two TPL-407E adapters.

TRENDnet's innovative TPL-407E connects Internet televisions, media players, game consoles, and computers to the Internet using existing electrical lines. The TPL-407E is about half the size of comparable solutions available today, saving valuable space around crowded electrical outlets.

PowerColor Shows Off Graphics Cards with Radeon E6000 Embedded GPUs

PowerColor showed off a handful of entry-level graphics cards that use the Radeon E6000 series GPUs. Designed for embedded systems, the E6000 series GPUs use multi-chip module packages, which seats the GPU die and memory on the same package, reducing board footprint. PowerColor's cards are targeted at productivity desktops, where reliable display connectivity, and responsive 2D display are priority. Among the cards shown by PowerColor, are full-height, half-height, and pseudo-half-height graphics cards, with a variety of display output configurations.

Team Group Launches Industrial Memory Modules

The largest professional computer show in Asia, the COMPUTEX TAIPEI, is coming on June 5. Team Group Inc., one of the leading memory manufacturers in the world, is ready to reveal its latest industrial memory modules to professional buyers around the world, including industrial-standard and server-grade memory modules, embedded industrial flash memories, and so on. The emphasis on customization, product performance and after-sale service quality are the live demonstration of how Team Group is determined for the industrial grade/SI market.

Team Group’s industrial memory modules come with Standard series, Green series and Wide temperature series. The modules are produced with chips from original manufacturers and go through multiple meticulous and sophisticated verification analyses and hi-low temperature tests. The Wide temperature series is capable of working at the temperature ranging from -40℃ to 95℃, and provides stable operation performance even in conditions as punishing as at a desert or in arctic environment. The Green series works only with minimal voltage as low as 1.35V. You cannot be any greener than that. The newly developed high frequency and large volume memory modules complete the full product series for various demands in medial equipment, surveillance systems and industrial computers.

AMD Launches AMD Embedded R-Series APU Platform

AMD today launched the AMD Embedded R-Series accelerated processing unit (APU) platform. Designed for mid- to high-end graphics-intensive applications such as digital signage, casino gaming, point-of-sale systems and kiosks, as well as parallel-processing-intensive applications spanning medical imaging and security/surveillance, the AMD Embedded R-Series APU combines the new "Piledriver" CPU architecture, an evolution of the "Bulldozer" architecture, with discrete-class, DirectX 11-capable AMD Radeon HD 7000 Series graphics in a heterogeneous multicore embedded processing platform.

"AMD pioneered the embedded APU to offer our customers a high-performance, power-efficient, small form-factor embedded processor," said Buddy Broeker, director, AMD Embedded Solutions. "With the AMD Embedded R-Series, we are taking our APU technology to the next level. By leveraging its seamlessly integrated heterogeneous system architecture, developers can tap into a high-performance and efficient parallel processing engine to accelerate their graphics- and compute-intensive applications, all while using industry-standard libraries such as OpenCL and DirectCompute."

VIA Announces Ultra Compact, Fanless VIA AMOS-3002 System

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3002, an ultra compact, fanless system designed around the tiny VIA EPIA-P900 Pico-ITX board. The VIA AMOS-3002 provides embedded customers with a system that delivers all the latest features and digital media standards required for a diversified range of embedded applications including telematics, in-vehicle control, machine to machine controller (M2M), digital signage and kiosks.

Leveraging the digital prowess of the combined 1.0GHz VIA Eden X2 dual core processor and the VIA VX900H media system processor (MSP) on the VIA EPIA-P900 board, the VIA AMOS-3002 offers a powerful, rugged and HD-ready industrial-class PC that combines all the benefits of high performance 64-bit computing in an ultra compact system. The highly integrated, all-in-one VIA VX900H boasts ruthless hardware acceleration of the most demanding codecs, including MPEG-2, WMV9 and H.264, in resolutions up to 1080p across the latest display connectivity standards, including native HDMI support, for next generation multimedia-intensive applications.

Intel Launches 3rd Generation Intel Core vPro Platforms

Today’s IT managers face a range of challenges from complex business processes to sophisticated security threats. Additionally, a number of industries such as retail, healthcare and industrial are turning to technology to develop innovative solutions to solve the unique challenges facing them in an increasingly connected world. To address these challenges, Intel Corporation has announced the availability of its 3rd Generation Intel Core vPro processor-based platforms for business and intelligent systems.

The enhancements to the Intel Core vPro processor platform provide a more secure platform for business computing and drive the next wave of innovation in intelligent systems. The Intel Core vPro processor-based platforms address the realities of today’s business climate, where data integrity and organizational efficiency create a competitive advantage. New capabilities embed security at every layer, including the silicon, without compromising performance. Software innovation allows IT managers to set up and configure systems within minutes to quickly implement compelling solutions. Additionally, the enhanced graphics and secure manageability help accelerate the transition and growth in intelligent systems for the retail, industrial, and healthcare industries.

Buffalo Readies New Line of SSDs with MRAM Caches

Buffalo launched a new line of SSDs that incorporate MRAM (magnetic random access memory) caches. The caches provide increase tolerance to power loss, and momentarily hold data that's being transacted between the drive and the host, which buys the controller some time to prevent data loss, when the power goes down. Pictures suggest that Buffalo could have SSDs in both SATA and IDE flavors. So far, MRAM cache is the only distinctive feature of a new line of SSDs Buffalo is working on, which it will unveil a little later, at the Embedded Systems Expo (ESEC) 2012.

Source: Hermitage Akihabara

Devon IT Announces Powerful New TC6 Thin Client

Devon IT, Inc., a leading provider of thin client and virtual desktop infrastructure (VDI) hardware and software solutions, today announced the powerful Devon IT TC6 thin client based on AMD's Dual Core G-T56N 1.6 GHz Processor with AMD Radeon HD 6320 Graphics. The TC6 will be fully manageable by Devon IT's Echo thin client management software.

"The TC6, operating with AMD's powerful, newly-designed processor, sets the thin client computing industry standard with high-performance application capabilities that rival the user experiences delivered by PCs," says Joe Makoid, president of Devon IT. "Devon IT's goals have always been anchored in driving innovation to develop high-performance products that use less energy and reduce IT costs across-the-board. We are excited to work with our industry partners, including Citrix and Microsoft, to deliver the enterprise-wide benefits of the TC6 to customers needing high-performance, low-cost IT solutions."

AMD Embedded G-Series Platform Supports Windows Embedded Compact 7 Real-Time OS

AMD today announced that its AMD Embedded G-Series platform now supports Windows Embedded Compact 7, the next generation of the Windows Embedded CE real-time operating system. Windows Embedded Compact 7, paired with AMD Embedded G-Series Accelerated Processing Units (APU) is optimized to deliver feature-rich applications on small, specialized devices for industries such as medical, retail and industrial automation. This enables board, module and system OEMs, among others, to develop a wide range of applications requiring high performance and integrated graphics processing with minimal size, power and cooling constraints.

"AMD is committed to providing our customers with the broadest possible range of operating system support to help them bring devices to market quickly and cost effectively," said Buddy Broeker, director, AMD Embedded Solutions. "Seamless support for Windows Embedded Compact 7 helps ensure that AMD Embedded G-Series customers are equipped to take full advantage of the many benefits afforded via the combination of these leading technologies."

VIA Announces Latest Computer-on-Module Solution, the VIA COMe-8X91

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.

Measuring 84 mm x 55 mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA Eden X2 dual core processor and the VIA VX900 media system processor (MSP) providing a ruggedized, ultra compact solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications.

RunCore Introduces the Mini DOM, the World's First Single-Chip SATA DOM

RunCore, a leading manufacturer of high-performance and rugged solid state drives (SSDs), today introduced their latest single-chip SATA DOM SSDs, the Mini DOM.

The RunCore Mini DOM SSD is a SATA DOM SSD in a real tiny size. By applying SATA II interface, the RunCore Mini DOM offers even higher performance and reliability as compared to the earlier IDE/ATA models in the market. In order to fulfill different system structures, RunCore Mini DOM provides three different solutions: 7 pin Horizontal-female SATA DOM, 7 pin Vertical-female SATA DOM, and 22 pin Horizontal-male SATA DOM. With different capacity ranges from 8 GB to 64 GB and 2 grades of temperature range, Commercial Grade (0℃ to 70℃) and Industrial Grade (-40℃ to 85℃), RunCore Mini DOM SSD can be widely used in National defense field, Industrial PC and Embedded Systems.

KINGMAX Launch a Series of Industrial Solution in ESEC

Embedded System Expo (ESEC) Japan 2012 will hold during May 9th to May 11th in Tokyo, and KINGMAX will demonstrate its series of industrial grade of FLASH storage products - SSD (Solid Sate Drive), memory cards, DRAM and embedded memory - on the booth WEST11-65. Leveraging more than 20 years of DRAM and FLASH expertise in R&D and manufacturing, KINGMAX will present a complete series of industrial solution which is not only at latest specification but also has been undergone strict reliability test and verification to ensure the most stable quality.

KINGMAX Group is the world first memory module manufacturer owning IC packaging and testing facilities, and has long been committed to the innovation of the best memory module solutions. Leveraging years of R&D and manufacturing competency, KINGMAX first-launched Industrial products include three categories: Industrial Storage, Industrial Memory and Embedded Memory. First, KINGMAX will exhibit a series of industrial SSD, including SATA III and SATA II SSD—both withstand wide operation temperature(-40℃~ 85 ℃. KINGMAX will also release mSATA SSD and Half-Slim SSD for Ultrabook and small form factor embedded systems.

Biwin Announces e-MMC SSD-on-a-Chip for Embedded Computing Applications

Embedded computing OEMs are seeking ways to shorten their design cycles and save precious space inside their systems. Biwin, an industry leader in flash storage products, today announced an e-MMC SSD in a 169-ball BGA chip that addresses both those demands, enabling customers to design in a complete storage solution on a single chip with an industry standard interface.

Biwin's new e-MMC SSDs are offered in capacities from 2 GB to 64 GB. They integrate both flash and a full SSD controller into a single chip, featuring advanced SSD features such as ECC, wear leveling and bad block management. They also include two key new features for embedded memory applications: power-on boot and explicit sleep mode, which translate to significant benefits for the end-user.

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