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Team Group Launches Industrial Memory Modules

The largest professional computer show in Asia, the COMPUTEX TAIPEI, is coming on June 5. Team Group Inc., one of the leading memory manufacturers in the world, is ready to reveal its latest industrial memory modules to professional buyers around the world, including industrial-standard and server-grade memory modules, embedded industrial flash memories, and so on. The emphasis on customization, product performance and after-sale service quality are the live demonstration of how Team Group is determined for the industrial grade/SI market.

Team Group’s industrial memory modules come with Standard series, Green series and Wide temperature series. The modules are produced with chips from original manufacturers and go through multiple meticulous and sophisticated verification analyses and hi-low temperature tests. The Wide temperature series is capable of working at the temperature ranging from -40℃ to 95℃, and provides stable operation performance even in conditions as punishing as at a desert or in arctic environment. The Green series works only with minimal voltage as low as 1.35V. You cannot be any greener than that. The newly developed high frequency and large volume memory modules complete the full product series for various demands in medial equipment, surveillance systems and industrial computers.

AMD Launches AMD Embedded R-Series APU Platform

AMD today launched the AMD Embedded R-Series accelerated processing unit (APU) platform. Designed for mid- to high-end graphics-intensive applications such as digital signage, casino gaming, point-of-sale systems and kiosks, as well as parallel-processing-intensive applications spanning medical imaging and security/surveillance, the AMD Embedded R-Series APU combines the new "Piledriver" CPU architecture, an evolution of the "Bulldozer" architecture, with discrete-class, DirectX 11-capable AMD Radeon HD 7000 Series graphics in a heterogeneous multicore embedded processing platform.

"AMD pioneered the embedded APU to offer our customers a high-performance, power-efficient, small form-factor embedded processor," said Buddy Broeker, director, AMD Embedded Solutions. "With the AMD Embedded R-Series, we are taking our APU technology to the next level. By leveraging its seamlessly integrated heterogeneous system architecture, developers can tap into a high-performance and efficient parallel processing engine to accelerate their graphics- and compute-intensive applications, all while using industry-standard libraries such as OpenCL and DirectCompute."

VIA Announces Ultra Compact, Fanless VIA AMOS-3002 System

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3002, an ultra compact, fanless system designed around the tiny VIA EPIA-P900 Pico-ITX board. The VIA AMOS-3002 provides embedded customers with a system that delivers all the latest features and digital media standards required for a diversified range of embedded applications including telematics, in-vehicle control, machine to machine controller (M2M), digital signage and kiosks.

Leveraging the digital prowess of the combined 1.0GHz VIA Eden X2 dual core processor and the VIA VX900H media system processor (MSP) on the VIA EPIA-P900 board, the VIA AMOS-3002 offers a powerful, rugged and HD-ready industrial-class PC that combines all the benefits of high performance 64-bit computing in an ultra compact system. The highly integrated, all-in-one VIA VX900H boasts ruthless hardware acceleration of the most demanding codecs, including MPEG-2, WMV9 and H.264, in resolutions up to 1080p across the latest display connectivity standards, including native HDMI support, for next generation multimedia-intensive applications.

Intel Launches 3rd Generation Intel Core vPro Platforms

Today’s IT managers face a range of challenges from complex business processes to sophisticated security threats. Additionally, a number of industries such as retail, healthcare and industrial are turning to technology to develop innovative solutions to solve the unique challenges facing them in an increasingly connected world. To address these challenges, Intel Corporation has announced the availability of its 3rd Generation Intel Core vPro processor-based platforms for business and intelligent systems.

The enhancements to the Intel Core vPro processor platform provide a more secure platform for business computing and drive the next wave of innovation in intelligent systems. The Intel Core vPro processor-based platforms address the realities of today’s business climate, where data integrity and organizational efficiency create a competitive advantage. New capabilities embed security at every layer, including the silicon, without compromising performance. Software innovation allows IT managers to set up and configure systems within minutes to quickly implement compelling solutions. Additionally, the enhanced graphics and secure manageability help accelerate the transition and growth in intelligent systems for the retail, industrial, and healthcare industries.

Buffalo Readies New Line of SSDs with MRAM Caches

Buffalo launched a new line of SSDs that incorporate MRAM (magnetic random access memory) caches. The caches provide increase tolerance to power loss, and momentarily hold data that's being transacted between the drive and the host, which buys the controller some time to prevent data loss, when the power goes down. Pictures suggest that Buffalo could have SSDs in both SATA and IDE flavors. So far, MRAM cache is the only distinctive feature of a new line of SSDs Buffalo is working on, which it will unveil a little later, at the Embedded Systems Expo (ESEC) 2012.

Source: Hermitage Akihabara

Devon IT Announces Powerful New TC6 Thin Client

Devon IT, Inc., a leading provider of thin client and virtual desktop infrastructure (VDI) hardware and software solutions, today announced the powerful Devon IT TC6 thin client based on AMD's Dual Core G-T56N 1.6 GHz Processor with AMD Radeon HD 6320 Graphics. The TC6 will be fully manageable by Devon IT's Echo thin client management software.

"The TC6, operating with AMD's powerful, newly-designed processor, sets the thin client computing industry standard with high-performance application capabilities that rival the user experiences delivered by PCs," says Joe Makoid, president of Devon IT. "Devon IT's goals have always been anchored in driving innovation to develop high-performance products that use less energy and reduce IT costs across-the-board. We are excited to work with our industry partners, including Citrix and Microsoft, to deliver the enterprise-wide benefits of the TC6 to customers needing high-performance, low-cost IT solutions."

AMD Embedded G-Series Platform Supports Windows Embedded Compact 7 Real-Time OS

AMD today announced that its AMD Embedded G-Series platform now supports Windows Embedded Compact 7, the next generation of the Windows Embedded CE real-time operating system. Windows Embedded Compact 7, paired with AMD Embedded G-Series Accelerated Processing Units (APU) is optimized to deliver feature-rich applications on small, specialized devices for industries such as medical, retail and industrial automation. This enables board, module and system OEMs, among others, to develop a wide range of applications requiring high performance and integrated graphics processing with minimal size, power and cooling constraints.

"AMD is committed to providing our customers with the broadest possible range of operating system support to help them bring devices to market quickly and cost effectively," said Buddy Broeker, director, AMD Embedded Solutions. "Seamless support for Windows Embedded Compact 7 helps ensure that AMD Embedded G-Series customers are equipped to take full advantage of the many benefits afforded via the combination of these leading technologies."

VIA Announces Latest Computer-on-Module Solution, the VIA COMe-8X91

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.

Measuring 84 mm x 55 mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA Eden X2 dual core processor and the VIA VX900 media system processor (MSP) providing a ruggedized, ultra compact solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications.

RunCore Introduces the Mini DOM, the World's First Single-Chip SATA DOM

RunCore, a leading manufacturer of high-performance and rugged solid state drives (SSDs), today introduced their latest single-chip SATA DOM SSDs, the Mini DOM.

The RunCore Mini DOM SSD is a SATA DOM SSD in a real tiny size. By applying SATA II interface, the RunCore Mini DOM offers even higher performance and reliability as compared to the earlier IDE/ATA models in the market. In order to fulfill different system structures, RunCore Mini DOM provides three different solutions: 7 pin Horizontal-female SATA DOM, 7 pin Vertical-female SATA DOM, and 22 pin Horizontal-male SATA DOM. With different capacity ranges from 8 GB to 64 GB and 2 grades of temperature range, Commercial Grade (0℃ to 70℃) and Industrial Grade (-40℃ to 85℃), RunCore Mini DOM SSD can be widely used in National defense field, Industrial PC and Embedded Systems.

KINGMAX Launch a Series of Industrial Solution in ESEC

Embedded System Expo (ESEC) Japan 2012 will hold during May 9th to May 11th in Tokyo, and KINGMAX will demonstrate its series of industrial grade of FLASH storage products - SSD (Solid Sate Drive), memory cards, DRAM and embedded memory - on the booth WEST11-65. Leveraging more than 20 years of DRAM and FLASH expertise in R&D and manufacturing, KINGMAX will present a complete series of industrial solution which is not only at latest specification but also has been undergone strict reliability test and verification to ensure the most stable quality.

KINGMAX Group is the world first memory module manufacturer owning IC packaging and testing facilities, and has long been committed to the innovation of the best memory module solutions. Leveraging years of R&D and manufacturing competency, KINGMAX first-launched Industrial products include three categories: Industrial Storage, Industrial Memory and Embedded Memory. First, KINGMAX will exhibit a series of industrial SSD, including SATA III and SATA II SSD—both withstand wide operation temperature(-40℃~ 85 ℃. KINGMAX will also release mSATA SSD and Half-Slim SSD for Ultrabook and small form factor embedded systems.

Biwin Announces e-MMC SSD-on-a-Chip for Embedded Computing Applications

Embedded computing OEMs are seeking ways to shorten their design cycles and save precious space inside their systems. Biwin, an industry leader in flash storage products, today announced an e-MMC SSD in a 169-ball BGA chip that addresses both those demands, enabling customers to design in a complete storage solution on a single chip with an industry standard interface.

Biwin's new e-MMC SSDs are offered in capacities from 2 GB to 64 GB. They integrate both flash and a full SSD controller into a single chip, featuring advanced SSD features such as ECC, wear leveling and bad block management. They also include two key new features for embedded memory applications: power-on boot and explicit sleep mode, which translate to significant benefits for the end-user.

JEDEC Announces Plans to Standardize Non-Volatile Wireless Memory

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards has formed a Subcommittee focused on the standardization of non-volatile wireless memory. To be chaired by Nokia and vice-chaired by Micron Technology and Samsung Semiconductor, the JC-64.9 Subcommittee for Wireless Memory welcomes interested companies worldwide to participate by joining JEDEC or calling 703-907-7560 for more information.

Wireless memory is rapidly emerging as the next generation in data transfer technology, and is intended to enable fast, wireless connectivity with read/write capability between mobile devices (Wireless Memory Hosts) and battery-free memory tags (Wireless Memory Tags).

AMD Embedded G-Series APU Platform Adds Real-Time Operating System Support

AMD today announced a collaboration with Green Hills Software, the largest independent vendor of embedded software, that brings its industry-leading INTEGRITY real-time operating system (RTOS) to the AMD Embedded G-Series Accelerated Processing Unit (APU) platform. The combination of INTEGRITY RTOS with the AMD Embedded G-Series APU creates a high performance, reliable and secure embedded computing solution or use across a range of applications including industrial control systems, consumer, networking, military/aerospace and medical.

The INTEGRITY RTOS offers support for multi-core x86 CPUs in the AMD Embedded G-Series APU with its v10.0.2 SMP release. The AMD Embedded G-Series APU offers an advanced, low-power, multi-core x86 CPU and a discrete-class DirectX 11-capable GPU on a single chip. This specific family of APUs was created expressly for the requirements of embedded systems, many of which require the precise, deterministic timing of an RTOS.

AMD and Rockwell Collins Help Improve Situational Awareness

AMD today announced Rockwell Collins, a leader in innovative communications and avionics systems for the aerospace and defense industries, has selected the AMD Radeon E2400 embedded graphics processor for inclusion in its highly-intuitive, integrated flight deck solution, Pro Line Fusion. Chosen for its advanced 3D graphics rendering capabilities, the AMD Radeon E2400 helps generate realistic graphical models of the external aircraft environment to help improve awareness of terrain, obstacles and runways in low visibility conditions. With this technology, pilots can now have key information at their fingertips, enabling them to make informed decisions during every phase of flight.

“The rapid and accurate visualization of data and access to information are essential for professionals in the aerospace and defense industries,” said Richard Jaenicke, director, Embedded Client Business, AMD. “The AMD Radeon E2400 was specifically designed to meet customers’ demand for high-quality graphics with a stable, long-lasting supply, making it ideal for system designers such as Rockwell Collins.”

VIA Announces New System-on-Module Solutions

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the two latest VIA modules in the growing VIA Modular Solutions portfolio, the VIA COMe-8X92 and the VIA QSM-8Q90. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles allowing customers to rapidly develop new and exciting devices.

Measuring 95mm x 95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module (COM) Express Compact form factor, developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). The VIA COMe-8X92 module combines a 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP) providing a ruggedized solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Apacer Brings New Embedded SSD Designs to ESC West 2012

Apacer will display our newest embedded offerings along with live booth demonstrations emphasizing Apacer’s strengths in managing abrupt power failure in all of our products, please join us at booth #848 during the ESC DESIGN West 2012 exhibition in the San Jose McEnery Convention Center.

With an established background in providing reliable embedded memory solutions, Apacer looks forward in presenting our latest products including high capacity 2.5” SSDs with both SATA and PATA availability, high speed mSATA 6Gb/s and embedded flash cards.

RunCore to Show Strong Presence at ESC Silicon Valley 2012

RunCore, leading developer and brand manufacturer of high-end Solid State Drives (SSDs) and storage solutions, is once again taking part in and showcasing at the world’s leading conference for the design and development of embedded systems, the ESC Silicon Valley (Electronics System Conference) in San Jose from Mar 26th to Mar 29th, 2012. RunCore will show SSD innovations ranging from consumer, enterprise to industrial solutions. The focus of RunCore’s product line-up will be on most advanced SSD storage solutions that provide highest speeds and lowest power consumption with best data security/lifetime. These characteristics make them ideal components for highly advanced embedded system in almost any field of application.

As the miniaturization in computing is continuously progressing, this is also the case for storage demands. RunCore is addressing this demand with their Rugged SSD for Embedded Market - rSSD series - offering highly sophisticated small form factor SATAII SSD solutions for embedded systems. Dimensions of these rSSD are compressed dramatically by virtue of the 104-ball FBGA packaging when compared to conventional drives, while reducing power consumption to 670 mW and offering a wide range of operating temperatures from -40°C up to +85°C.

Intel "Ivy Bridge" Pentium G2120 Arrives in Q4-2012

Intel's first Pentium processors based on the 22 nm "Ivy Bridge" silicon will arrive in Q4, 2012. One of the first models in the series, is the Pentium G2120. Specifications reveal that the chip will be quite generously designed as far as specifications go. To begin with, it is a dual-core processor, with a clock speed of 3.10 GHz. It lacks HyperThreading, so 2 logical CPUs is all that the OS will see; as well as Turbo Boost, so the clock speed won't normally scale beyond 3.10 GHz. Interestingly, the chip has 3 MB of L3 cache, on par with some Core i3 dual-core chips. The instruction-set has SIMD instructions up to SSE 4.2, but lacks AVX. Further, the PCI-Express root hub only supports PCI-Express 2.0, lacking PCI-Express 3.0 support. Its TDP is rated at 65W.

Source: CPU World

TRENDnet Ships a 500Mbps Powerline Adapter with Four Integrated Gigabit Ports

TRENDnet, a best-in-class wired and wireless networking hardware brand, today announces the availability of the 4-Port 500Mbps Powerline AV Adapter with four integrated Gigabit ports, model TPL-405E.

New media center devices such as internet televisions, media players, network video recorders, receivers, and game consoles are now network ready-respective devices are capable of connecting to and streaming HD files directly from the Internet. TRENDnet's 4-Port 500Mbps Powerline AV Adapter connects up to four media center devices to the Internet simultaneously using existing electrical lines.

Building Intelligent Systems With Windows 8 Embedded

Over the past year, Microsoft has been discussing the vast possibilities offered by the emergence of a new category within the traditional embedded market - intelligent systems.

A critical component of Microsoft's enterprise strategy, intelligent systems enable an unprecedented flow of data with the power to transform industries such as retail, manufacturing and medicine, by connecting devices where data is generated through employees and customers to back-end systems and services where it is translated into strategic insight to inform business decisions.

Super Talent Introduces USB 3.0 and PCIe Flash Disk Modules

Super Talent Technology, a leading manufacturer of NAND flash solutions, today announces two new Flash Disk Module (FDM) solutions for Industrial and Embedded applications.
Already known for their IDE, SATA and USB flash disk modules; Super Talent now introduces two new FDM solutions focused on increase performance, PCIe and USB 3.0 FDM modules. Designed for Industrial and Embedded applications, Super Talent’s FDM solutions provide high speed data throughput and reliability.

The new USB 3.0 FDM features a 20-pin DIP configuration, now appearing on many new motherboards, and is available in capacities of 8GB to 32GB. These USB 3.0 FDMs mount vertically and measure 32.2mm(h) x 26.2mm(w) and 4mm(t) and can hit speeds of 85MB/s Reads and 40 MB/s Writes.

SanDisk iNAND Extreme Embedded Flash Memory Included on Windows 8 Dev Platforms

SanDisk Corporation, a global leader in flash memory storage solutions, today announced it is working with key industry chipset vendors to help ensure a best-in-class user experience for mobile devices based on Microsoft Corp.'s upcoming Windows 8 operating system.

Companies such as Intel Corporation, Qualcomm Incorporated and Texas Instruments Incorporated (TI) are using SanDisk iNAND Extreme embedded flash memory with some of their top Windows 8 hardware development platforms. SanDisk is working with these companies to optimize its iNAND Extreme flash memory products with Windows 8-based tablet and mobile designs.

VIA Announces Latest Computer-on-Module (COM) Express Module, the VIA COMe-8X90

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Measuring 95 mm x 125 mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.

AOpen joins Microsoft at Embedded World 2012

AOpen being a valued partner of Microsoft is working closely with the Windows Embedded team to show the benefits of the AOpen Digital Engine combined with WES 7.

At Embedded World, AOpen will demonstrate the latest AOpen Digital Engine DE67-HA that includes support for the Intel 2nd Generation Core Processor Family i3, i5 and i7. It is the strongest and most powerful AOpen Digital Engine to date. The system supports Intel Active Management Technology 7.0 to enable remote system management from a single location. AMT technology enables the system to be managed from for instance the UK while the systems are located at several locations in Europe. The system also allows to be connected to multiple displays while maintaining quality performance, thus eliminating the need to buy more media players than necessary and reducing implementation costs.

Transcend to Showcase Advanced Industrial Solutions at Embedded World 2012

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, will exhibit at Embedded World 2012 in Nuremberg, Germany on February 28 - March 1, 2012. Throughout the exhibition, Transcend will display a wide range of industrial-grade products from SSDs to memory modules, specifically designed for diverse industrial applications. Transcend`s booth will be located in Hall 1, booth no. 216.

Participating at Embedded World again this year, Transcend is proud to display a more comprehensive and advanced industrial grade product portfolio, including SATA III 6Gb/s SSD, SLC SSD, mSATA and half-slim SSDs, flash modules, flash cards, and memory modules. Transcend will also set up professional on-site demonstrations, such as SSD lifespan monitoring and sudden power-off test, to highlight the ultimate stability and guaranteed reliable data transfer of Transcend SSDs.
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