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Kingston Releases 4th Generation High-Speed Media Reader; 64GB 600X CF Card

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced its 4th generation HS4 All-In-One Media Reader. The multi-function reader improves upon the previous model as it reads all major card format types including the latest SD card speeds (UHS-I, UHS-II) and CF Type I and II (UDMA 0-7).

Users can easily back up and transfer music, photos, videos and other digital data with USB 3.0 high-speed performance. This allows users to save time transferring files as USB 3.0 allows up to 5Gb/s data transfer speed - almost 10x faster than USB 2.0. The portable, small form factor reader has a brushed nickel case and is backwards compatible with USB 2.0.

Micron and Intel Unveil New 3D NAND Flash Memory

Micron Technology, Inc., and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Samsung Introduces 128GB 3-bit NAND Flash Memory Storage Device

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced a high-performance mobile memory storage based on Embedded MultiMediaCard (eMMC) 5.0 technology. The new 128-gigabyte (GB), 3-bit NAND-based eMMC 5.0 storage is targeted at the smartphone and tablet mass markets.

"With the introduction of our value-focused, 3-bit NAND-based eMMC 5.0 line-up, we expect to take the lead in the expansion of high-density mobile storage," said Dr. Jung-Bae Lee, Senior Vice President of Memory Product Planning and Application Engineering Team, Samsung Electronics. "We are continuing to enhance our next-generation embedded mobile memory offerings with improved performance and higher densities to meet increasing customer demand across the mobile industry."

Team Group Announces C151 Color Series USB Flash Drives

The world's leading memory brand, Team Group Inc. released the all new exquisite USB flash drive Team C151. Team C151's minimal design with a clean white color shows us what smart living with a fashionable twist is all about. C151 is made out of one round piece, which creates a close feeling for the users. The thoughtful design of a loop and a fashion strap makes it easy for users to carry it around and store the precious memory at any time.

Team C151 are made by COB assembly process which offers an all-around protection in waterproof and dust-proof. Consumers are able to store their precious memory at ease. C151 provides a wide range of capacity available for different needs, 4GB, 8GB, 16GB, 32GB and 64GB. By giving each capacity its own color, we make it easier for consumers to choose and purchase a mobile storage that has their own personal style.

Samsung Introduces Industry's First 128-Gigabyte UFS for Smartphones

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now mass producing the industry's first 128-gigabyte (GB) ultra-fast embedded memory based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard for next-generation flagship smartphones. The new embedded memory's UFS 2.0 interface is the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world.

"With our mass production of ultra-fast UFS memory of the industry's highest capacity, we are making a significant contribution to enable a more advanced mobile experience for consumers," said Jee-ho Baek, Senior Vice President of Memory Marketing, Samsung Electronics. "In the future, we will increase the proportion of high-capacity memory solutions, in leading the continued growth of the premium memory market."

Corsair Launches New High-Performance USB 3.0 Flash Drives

Corsair, a worldwide leader in high-performance PC hardware, today announced the immediate availability of new USB 3.0 flash drive families - Flash Voyager Slider X1 and Flash Voyager Slider X2. Corsair also unveiled a rugged new look for the ultra-performance Flash Voyager GS and Flash Voyager GTX families with the addition of a 512GB size for Flash Voyager GS. Equipped with new bold styling and offering a wide range of performance and capacities to suite any budget, these new drives bring the Flash Voyager line up-to-date and ready for the demands of 2015.

Patriot Launches Second Generation of Supersonic Magnum and Rage USB Flash Drive

Patriot, a leading manufacturer in mobile accessories, computer and USB/flash memory, today released the Supersonic Magnum 2 and Supersonic Rage 2, 3.0 USB Flash Drive. Leading the industry in capacity and speed, Patriot has set the new standard in the flash memory world boasting record speeds of up to 400MB/s and 300MB/s read and write times.

Living up to its name sake, the Patriot Supersonic Magnum 2 will be available in extreme capacities of 256GB and 512GB making the frustration of not having enough room to store data virtually non-existent. With impressive maximum read and write speeds reaching 400MB/s and 300MB/s it's the fastest high capacity/high performance USB flash drive on the market. Designed with a sturdy matte black, industrial grade metal housing that enables shock resistance up to 15Gs to protect stored data and laser etched, the Magnum 2 doesn't compromise appearance and class for safety. A detachable cap covers the USB connector to prevent damage and debris from entering the port.

Lexar Increases Speeds of USB 3.0 Flash Drive Line

Lexar, a leading global brand of flash memory products, today announced performance enhancements to its JumpDrive USB 3.0 flash drives, which include the Lexar JumpDrive P20, JumpDrive S75, JumpDrive S55, JumpDrive S35, and JumpDrive S25 flash drives. Enhancements include increased read and write speeds for faster transferring of photos, videos, and files, as well as EncryptStick Lite software to help protect essential files by providing the option to keep these files in a password protected vault.

"Flash drives are no longer just used to bring term papers to the library. More often, people are relying on these devices to store movies, transfer photos, and back up important documents. And they want to do all that quickly and securely," said Aaron Lee, director of product marketing, Lexar. "The enhanced JumpDrive USB 3.0 line offers the best of both worlds: increased speed and heightened security."

PNY Launches Duo-Link OU2 On-the-Go USB Flash Drive

PNY, the leading manufacturer of memory products and PC peripherals, has recently launched the newest addition to their OTG flash drive range, the Duo-Link OU2. This thumb-sized adapter packs performance and speed in its petite size. It comes with dual USB connectors with USB and micro-USB ports, providing convenient data transfer and storage for PCs, notebooks, and Micro-USB OTG-compatible Android phones and tablets.

PNY's Duo-Link OU2 flash drive enables transfer of videos, music, and photos from and between OTG-compatible Android devices while the USB 2.0 connector enables easy and fast storage of those files to and between desktop and laptop computers. The drive also doubles up as a convenient storage expansion for OTG-compatible Android phones and tablets to free up precious device memory.

Toshiba Offers World's Smallest-Class e-MMC Embedded NAND Flash Memory Products

Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a class of e-MMCTM embedded NAND flash memory products that are among the world's smallest.The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15 nm process technology and a controller to manage basic control functions for NAND applications into a single package.

Fully compliant with the latest JEDEC e-MMC standard, the new chips are designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and wearable devices. Sample shipment of the 16 gigabyte (GB) products begins today, with 8GB, 32GB, 64GB, and 128GB products to follow. By utilizing the 15nm process technology, the new product's package size is approximately 26 percent smaller than comparable Toshiba products and offers faster read/write performance due to improvements in basic chip performance and controller optimization. The read speed is approximately eight percent faster (max.), while the write speed is approximately 20 percent faster (max.).

Corsair Releases Flash Voyager Vega USB 3.0 Flash Drive

Corsair, a world leader in high-performance PC hardware, today announced the ultra compact, low-profile Flash Voyager Vega USB 3.0 flash drive. The slim, thumb-sized drive is less than 5mm thin and 24mm long including the built-in key ring loop, making it a perfect keychain companion for data transfers on the go, or an ideal plug-and-leave storage solution for notebooks, car audio systems, game consoles, and other devices. The new drive is available immediately in 16GB, 32GB, and 64GB capacities from Corsair.com and retailers around the world.

Protected in a gleaming scratch-resistant hard chrome plated zinc alloy enclosure, the Flash Voyager Vega drive is as eye-catching as it is rugged. Thanks to high-speed USB 3.0 support, file transfers complete in a fraction of the time of previous generation flash drives, with a discrete blue LED showing when data transfers are active. The drive also supports USB 2.0 for compatibility with older PCs, and Microsoft Windows, Mac OS X, and Linux are all supported with no additional software required.

Silicon Motion Announces the Fastest Single-Channel UHS-II SD Card Controller

Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the SM2704, the world's fastest single-channel UHS-II SD card controller solution. The SM2704 supports the highest-level SD card standards: UHS-II bus interface & UHS Speed Class 3 (U3) featuring a maximum data read speed of up to 280 MB/s along with a maximum data write speed of up to 260 MB/s. By supporting the new U3 Speed Class, the SM2704 delivers ample performance to handle the needs of professional photography, high-definition video recording and compressed 4K video capture and playback.

"Silicon Motion is the number one merchant supplier of UHS-I/II card controllers, which are the majority of our overall SD card controller sales. The SM2704 extends the company's leadership with the highest performance UHS-II controller while utilizing a cost-effective, single-channel design," said Wallace Kou, President and CEO of Silicon Motion. "We are pleased to partner with Micron in enabling the world's fastest UHS-II SD cards in the market today."

Toshiba and SanDisk Celebrate the Opening of the Second Phase of Fab 5

Toshiba Corporation and SanDisk Corporation today celebrated the opening of the second phase of the No. 5 semiconductor fabrication facility (Fab 5) and the start of construction of the new No. 2 fabrication facility (Fab 2) at Yokkaichi Operations, Toshiba's NAND Flash memory plant in Mie prefecture, Japan.

Toshiba started construction of the second phase of Fab 5 in August 2013, and Toshiba and SanDisk have overseen installation of production equipment in the expanded facility since July this year. Production in phase 2 began at the start of this month, with 15 nm NAND flash memory process technology, the world's smallest and most advanced node. Toshiba and SanDisk announced deployment of this jointly developed 15 nm NAND flash process in April this year, with initial production in part of Fab 5 phase 1, and now target conversion of the remaining capacity in phase 1 to the new process technology.

Flash-Based Storage System Adoption Is on the Rise in Enterprises: IDC

Flash-based storage continues to move from being an expensive niche technology targeted at a few workloads to a more mainstream technology. According to the International Data Corporation (IDC), the broader availability of products, a growing level of familiarity with the benefits of solid state technologies, and declining prices are all adding to the momentum behind flash-based storage.

To gain end-user insights into how flash-based storage is being adopted, IDC conducted a survey of more than 1,000 storage administrators across the globe as part of its biannual Storage User Demand Study (SUDS). This study provides essential details on current and future deployments of storage systems as well as more forward-looking opinions of end users about emerging technologies or market developments.

Enmotus Showcases Its Flash/HDD Hybrid Storage Solutions at Flash Memory Summit

Enmotus Inc. announced that it is demonstrating its FuzeDrive hybrid storage software solutions at the Flash Memory Summit in Santa Clara, CA. The product and technology demos highlight the versatility of Enmotus' hybridization technology, which enables high performance, cost effective hybrid storage utilizing storage media such as Flash/HDD and Flash/Flash as well as next generation Storage Class Memory such as NVDIMM.

FuzeDrive targets applications that require high performance such as databases and analytics as well as content delivery solutions. The demonstration can be seen at the Flash Memory Summit, booth 219, taking place in the Santa Clara Convention Center on Aug. 5-7.

ATP Introduces advancedMLC (aMLC) Technology

ATP, the leading manufacturer of embedded Flash and ruggedized SSD and DRAM modules, introduces its latest technology, advancedMLC, also known as "aMLC". Developed by ATP, aMLC is an advanced firmware technology uniquely implemented onto ATP's NAND Flash products to vastly improve the endurance and performance of these storage devices while using mainstream MLC NAND to provide the best cost effective solution for any read/write intensive applications.

ATP will showcase this technology and related products at the Flash Memory Summit 2014 from August 5 to 7 at the Santa Clara Convention Center, booth# 516.

Toshiba Launches SDHC Card with Embedded WLAN Communications

Toshiba Corporation's Semiconductor & Storage Products Company today announced that it will start the sales of SDHC memory cards with embedded wireless LAN communications for third-party solution providers.

The new product, THNSW008GAA-B(QB6) has the same hardware composition as "FlashAir", the SDHC memory card with embedded wireless LAN communications, currently available in the consumer market. Since the card itself has embedded wireless LAN and web server functions, its insertion into an SDHC memory card slot adds wireless functions to various devices.

NAND Flash Brand Supplier Revenue Falls 6.6% in First Quarter

The shipment performances of Smartphones, Tablets, and Notebooks were relatively weak in the first quarter due to seasonality. As a result of the entire NAND Flash market's oversupply in 1Q 2014, the branded suppliers' Q1 revenues saw a 6.6% drop compared to the previous quarter, and slid to approximately US$ 7,244 million, according to Sean Yang, Assistant Vice President at DRAMeXchange, the memory and storage research division of TrendForce.

Looking at the branded supplier revenue ranking, Samsung managed to retain its lead in the market with approximately US$ 2,175 million in sales, but saw its market share dip slightly to 30.0%; Toshiba came in second with a revenue total of US$ 1,548 million and an improved market share of 21.4%; SanDisk ended up in third place with US$ 1,367 million in revenue, while Micron came in fourth with US$ 1,050 million; Affected by its capacity allocations, SK Hynix's revenues slid to approximately US$ 594 million, resulting in market share of 8.2%.

Seagate to Acquire LSI Flash Businesses From Avago

Seagate Technology plc, a world leader in storage solutions, and Avago Technologies Limited, a leading semiconductor device supplier to the enterprise storage, wired, wireless and industrial end markets, today announced that they have entered into a definitive asset purchase agreement under which Seagate will acquire the assets of LSI's Accelerated Solutions Division ("ASD") and Flash Components Division ("FCD") from Avago for $450 million in cash.

The acquisition strengthens Seagate's strategy to deliver a full suite of storage solutions, providing Seagate with established Enterprise PCIe flash and SSD controller capabilities to deliver solutions for the growing flash storage market. LSI's ASD business, which is the second largest player in the PCIe flash space, offers a highly differentiated enterprise-grade PCIe flash solution focused on the high-growth cloud and hyperscale markets. LSI's FCD business, led by its SandForce SF2000 and SF3700 controller products, is driving a multi-product roadmap to address volume markets.

Toshiba to Replace Fab 2 at Yokkaichi Japan for Transition to 3D NAND Technology

Toshiba Corporation today announced that it will demolish the No. 2 semiconductor fabrication facility (Fab 2) at Yokkaichi Operations, the company's NAND Flash memory plant in Mie prefecture, Japan, and replace it with a new fab on the same site. Toshiba also entered into a non-binding memorandum of understanding with SanDisk Corporation to invest jointly in the new facility. The primary purpose of the new wafer fab is to secure space for converting existing Toshiba and SanDisk 2D NAND capacity to 3D NAND beginning in 2016.

Demolition work on the current Fab 2 will start in May with construction beginning in September 2014, with a target completion date of Summer 2015. The clean room within the new fab will be built in phases to align the clean room investment with the timing of conversion of 2D NAND capacity to 3D NAND. Construction of the initial cleanroom will be complete in time for 2016 output. Decisions on capacity conversion ramp and equipment investment, the start of production, and production levels in the new fab will reflect market trends.

Toshiba Starts Mass Production of World's First 15 nm NAND Flash Memory

Toshiba Corporation today announced that it has developed the world's first 15-nanometer (nm) process technology, which will apply to 2-bit-per-cell 128-gigabit (16 gigabytes) NAND flash memories. Mass production with the new technology will start at the end of April at Fab 5 Yokkaichi Operations, Toshiba's NAND flash fabrication facility (fab), replacing second generation 19 nm process technology, Toshiba's previous flagship process. The second stage of Fab 5 is currently under construction, and the new technology will also be deployed there.

Toshiba has achieved the world's smallest class chip size with the 15nm process plus improved peripheral circuitry technology. The new chips achieve the same write speed as chips formed with second generation 19 nm process technology, but boost the data transfer rate to 533 megabits a second, 1.3 times faster, by employing a high speed interface.

Spansion Introduces Industry's Highest-Performance 1.8V Serial NOR Flash Memory

Spansion Inc., a global leader in embedded systems solutions, today expanded the company's high-speed Serial NOR portfolio with a high-performance family of 1.8V flash devices, the Spansion FS-S Serial Flash family.

With read speeds up to 133 MHz in Single/Dual/Quad I/O mode and 80 MHz in double data rate (DDR) mode, the FS-S family delivers up to 80 MBytes/second (MB/s) of read throughput and is 50 percent faster than competing solutions. In addition, industry leading programming performance of up to 1.08 MB/s - twice the programming speed of competing solutions - accelerates manufacturing throughput and lowers programming costs dramatically. Spansion's FS-S family also offers the fastest erase time in the industry of up to 0.5 MB/s.

SK Hynix Started Full-Scale Mass Production of 16 nm NAND Flash

SK Hynix Inc. announced that it has started full-scale mass production of 16 nm 64 Gb (Gigabit) MLC (Multi Level Cell) NAND Flash, which uses the industry's thinnest process technology.

SK Hynix has been mass producing its 1st version of the world's first 16 nm NAND Flash since June and recently has started to mass produce the 2nd version which is more cost competitive due to its smaller chip size. In consequence, the Company geared up for strengthening its competitiveness in NAND Flash.

Silicon Power Launches Touch T03 Flash Drive

Silicon Power, the world's leading provider of memory storage solutions launches the brand new designed stainless steel USB flash drive - Touch T03. Along with the trendy Northern Europe style and exquisite metal casing, Touch T03 is designed to be the perfect combination of technology, fashion and extraordinary living style. Featuring the eye-catching look and delicate faceted-body, Touch T03 is more than an ordinary storage device but a great fashion accessory for users to show their charm and taste.

SP Touch T03 stands out with its stunning appearance which delivers great sense of luxury and elegance. Furthermore, Touch T03 is extremely tiny and featherweight that allows an easy and convenient way for carrying and storage. With the application of COB (Chip on Board) technology, Touch T03 ensures great durability and offers high protection for the drive body, promising complete resistance to water, dust and vibration. Moreover, Touch T03 shines with the sleek stainless steel casing with stylish groove design at the end of the body, which can be easily attached to the key rings, purses or bags.

Micron Unveils Serial NOR Flash Interface for Future Ultrathin Devices

Micron Technology, Inc., today announced the availability of a replay-protected monotonic counter (RPMC) feature for their SPI NOR Flash memory devices, which are validated for future Intel Ultrabook platforms. The cost-effective 64Mb density is the sweet-spot solution currently available for immediate platform-enablement activities.

The RPMC feature in Micron's SPI NOR device is the first in a family of cryptographic primitives that will significantly enhance preboot security in cost-sensitive embedded, mobile, and personal computing architectures. The RPMC-enabled device facilitates critical nonvolatile data storage, while making systems resistant to rollback and replay attacks. It enables original equipment manufacturers (OEMs) to further strengthen code/data storage in the boot memory and deliver more secure systems to customers.
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