News Posts matching "Fusion"

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ASUS Readies Fully-Loaded Brazos-Powered E35MI-I Deluxe Motherboard

Closely trailing other, ASUS also made its AMD Brazos platform motherboard public. The E35MI-I Deluxe from ASUS is filled to the brim with features, its most significant being a completely silent passive heatsink design that keeps the system cool without eating into precious mini-ITX board space. A large monolithic heatsink covers the central portion of the motherboard, cooling both the AMD Fusion E-350 dual-core processor and the Hudson M1 chipset. It uses a dense aluminum fin array to which heat is supplied from its base by heat pipes.

The processor is wired to two DDR3 DIMM slots, the lone expansion slot is a PCI-Express 2.0 x16. There are five internal SATA 6 Gb/s ports, and an eSATA 6 Gb/s. The rear panel is an equally crowded place. There's 6-channel HD audio, gigabit Ethernet, four USB 3.0 (two rear + two internal) and a number of USB 2.0 ports, Bluetooth, WiFi b/g/n, optical SPDIF, and display connectivity that includes DVI and HDMI. Featuring Turbo Key II, the board can overclock the processor at the turn of a small switch. ASUS is also readying a "lite" version of this motherboard, which is likely to lack some features, such as WiFi.


Sapphire Announces the First Fusion APU Motherboard

SAPPHIRE Technology, the world’s largest manufacturer and supplier of graphics systems based on technology from AMD has just announced its first mainboard based on the exciting new APU (Accelerated Processing Unit) architecture from AMD. As a result of close collaboration with AMD, SAPPHIRE will introduce the SAPPHIRE Pure White Fusion E350M1W mainboard through its Global channel - heralding a new generation of low-power, fully featured PC solutions.

The SAPPHIRE Pure White Fusion E350M1W is a mini-ITX mainboard featuring the E350 (Zacate) APU from AMD. Zacate is the first generation of APU – a combination of CPU and GPU computing technologies onto a single die to improve the performance of both visual and data-intensive tasks. For the first time it combines high-performance serial computing and parallel graphics processing cores on a single chip. The SAPPHIRE Pure White Fusion E350M1W also uses the companion Hudson-M1 (A50M) Chip from AMD.

Lenovo Announces ThinkPad X120e Ultraportable with AMD Fusion E-Series APU

Lenovo today announced its latest entry ultraportable, the ThinkPad X120e laptop, that raises the bar for affordable business-class performance. As the first commercial laptop to feature an AMD Fusion E-Series Accelerated Processing Unit (APU), the X120e blends real-world needs for faster applications and graphics processing with enhanced battery life and digital display features starting at less than $400.

"Multimedia elements like audio and video have become important parts of our world, and businesses are embracing this trend in digital content," said Dilip Bhatia, vice president, ThinkPad Marketing and Product Operations, Lenovo. "We've optimized the ThinkPad X120e to not only give businesses an excellent experience creating and consuming multimedia content, but we've also made key improvements to an area that has plagued laptops: battery life."

Toshiba Ready with AMD Fusion ''Brazos'' NB550D 10.1-inch Netbook

Toshiba joined the small but growing group of PC manufacturers ready with a netbook powered by AMD's upcoming Fusion "Brazos" platform. Revealed by Toshiba Germany, the NB550D is a 10.1-inch netbook driven by AMD C-50 Fusion APU with two processor cores clocked at 1.00 GHz, carrying AMD Radeon HD 6250 DirectX 11 compliant graphics. It is backed by 1 GB of memory, 250 GB of storage, connectivity that includes WiFi b/g/n, Bluetooth 3.0, and gigabit Ethernet. The unit itself weighs 1.32 kg, comes in three bezel color options: orange, green and brown. It embeds a VGA webcam, and is powered by a 6-cell battery. At full charge, the battery can run the netbook for up to 9.5 hours. It comes with Windows 7 Starter pre-installed. It should be released along with most other Fusion Brazos netbooks, in Q1-2011.

Source: Notebook Italia

Acer Readies AMD Fusion ''Brazos'' Powered Aspire One Netbook

Acer will be one of the first adopters of AMD's "Brazos" Fusion platform for its netbooks. The company is developing a new 10-inch Aspire One model, the Aspire One 522, which makes use of AMD Fusion C-50 "Ontario" dual-core processor clocked at 1.00 GHz, with TDP of under 9W, and AMD Radeon HD 6250 graphics embedded. The x86-64 processor cores are based on the "Bobcat" architecture, feature the latest instruction sets, while the graphics core supports DirectX 11 and UVD 3.0 video acceleration.

The 10.1-inch screen features a native resolution of 1280 x 720 pixels, which can be extended onto a HDTV or a monitor using HDMI. Most other features including connectivity are similar to existing Aspire One netbooks. The battery can provide 6 hours of usage on full charge. Acer is expected to unveil this powerful netbook in early 2011.

Source: Macles

MSI's AMD Fusion ''Brazos'' Powered CR650 Notebook Pictured

MSI will be among the first to release notebooks based on AMD's ambitious "Brazos" mobile platform, that takes AMD's Fusion accelerated processing units to notebooks, at price points that will strike a sweetspot between performance-crippled netbooks and entry-level notebooks. At the center of MSI's first such notebook, the CR650, is an AMD Fusion E-350 dual-core processor, supported by AMD Mobility Radeon HD 6300 series graphics.

With a screen size of 15.6-inches, the MSI CR650 is a typically sized widescreen notebook with features and product design (styling) very much into notebook domain. It looks to pack several multimedia features such as D-Sub and HDMI video output, high quality HD audio with some enhancement DSPs, a high-definition webcam, and Color Film Print Technology that adds clarity to images close to analog displays such as film projection and CRTs (less pixellation). The Fusion APU combines a dual-core processor with a GPU, and low-latency memory controller. Not much more is known about the CR650 at this point.

Gigabyte AMD Fusion ''Brazos'' Mini-ITX Motherboard Pictured

The first motherboard that brings the AMD Fusion "Brazos" platform to nettops was pictured, the GA-E350V-USB3, which is a mini-ITX motherboard that makes use of AMD Fusion E-350 accelerated processing unit (APU), and Hudson M1 chipset. AMD is targeting the nettop and HTPC markets with such motherboards, also as competitors to Atom and new Pentium Dual-Core (LGA1156/LGA1155) desktops. The GA-E350V-USB3 makes use of Gigabyte's Ultra Durable 3 construction that makes use of a PCB with 2x copper layers, solid-state capacitors, low RDS (on) MOSFETs, and ferrite core chokes.

The board uses a 3+2 phase power design. The Fusion E-350, like the Intel Atom, is hard-wired to the board, and cooled by a small fan-heatsink. It connects to two DDR3 DIMM slots for single-channel DDR3-1800+ MHz memory. The lone expansion slot is a PCI-Express 2.0 x16 (electrical x8). The Fusion APU packs two x86-64 cores clocked at 1.60 GHz, and an AMD Radeon HD 6310 graphics processor that features 80 stream processors, and clock speed of 500 MHz. Connectivity include four SATA 3 Gb/s ports, 8-channel HD audio, two USB 3.0 ports, display connectivity includes DVI, D-Sub, and HDMI. Pricing and availability are not known, as AMD didn't officially launch the platform.

Source: Xbit Labs

MSI Introduces FR600 3D Cinema Entertainment Notebook

MSI just rolled out the FR600 3D multimedia notebook computer equipped with the latest 3D graphics technology and cinema-quality THX TruStudio Pro smart wrap around sound. Put on a pair of 3D glasses and enjoy an all-new 3D multimedia experience with true-to-life graphics whether you’re playing videos games, watching films, or browsing through a photo album.

MSI Marketing Director Sam Chern points out that the 15.6” FR600 3D laptop boasts the latest raised totem seal coating technology to protect it against scratching and smudges. The inside cover comes with silver components that stand out in contrast with the jet black color theme. What’s more, under the hood, you’ll find Intel’s powerful Core i5 processor as well as MSI’s own TDE technology for the ultimate in 3D multimedia performance.

AMD Fusion APU Codenamed ''Llano'' Demonstrated at 6th Annual AMD TFE 2010

At the 6th Annual AMD Technical Forum & Exhibition (TFE) 2010, AMD today showcased for its ecosystem partners the first public demonstration of the forthcoming AMD Fusion Accelerated Processing Unit (APU) codenamed “Llano”, designed for notebook, ultrathin and desktop PCs. AMD demonstrated the accelerated single-chip processing muscle of Llano by simultaneously processing three separate compute-and graphics-intensive workloads.

“The serial and powerful parallel processing capability of the Llano APU has the potential to make OEMs and consumers re-think their computing experience,” said Chris Cloran, corporate vice president and general manager, client division, AMD. “The experience potential of Llano is truly incredible, and the demos we showed today on stage provide a glimpse of what this processor is capable of delivering in sleek form factors with long battery life. Everything consumers love about their digital lifestyles today – social networking, gaming, consuming and creating media – can be enhanced with Llano, enabling a more interactive, vivid and immersive experience.”

AMD Extends AMD Fusion Partner Program to Distributors

Today at the Canalys Channels Forum in Barcelona, AMD is marking the one-year anniversary of the AMD Fusion Partner Program with the introduction of the AMD Fusion Partner Program distributor track. The expanded program will provide distributor partners access to all of the benefits within the AMD Fusion Partner Program to help accelerate sales of AMD-based solutions. AMD is also unveiling the AMD Rewards Program, which creates added sales-based incentives for partners to drive channel sales growth.

“It’s amazing to see how far we’ve come in such a short amount of time,” said David Kenyon, corporate vice president, Worldwide Channel Marketing, AMD. “By extending the AMD Fusion Partner Program to all of our valued distribution partners, AMD is proud to now offer them vital information, motivation, support and incentives to help them to be successful in today’s marketplace.”

AMD Readies Two Fusion ''Zacate'' Models for Q1 2011

At least two new Fusion APU models based on the "Zacate" silicon are slated for Q1 2011. The Fusion "Zacate" processors are meant for ultra-portables, nettops, and SFF PCs, with a small TDP of 18W, an even lower-power version codenamed "Ontario" is being worked on, with a TDP of 9W. The first two Zacate chips include Fusion E240 single-core, and Fusion E350 dual-core. These chips are based on the Bobcat architecture, and pack DirectX 11 compliant IGPs with UVD 3.0, a single-channel DDR3 memory controller. The platform release will include the supportive Hudson D1 chipset.
Source: X-bit Labs, Image Courtesy:

AMD to Demonstrate Next Generation PC Experience Powered by AMD Fusion ''Zacate'' APU

Next week in San Francisco, AMD will unveil the first North America public demonstrations of its AMD Fusion Accelerated Processing Unit (APU) codenamed “Zacate,” a new dual-core, 18-watt TDP processor containing discrete-level graphics capabilities on die and designed to dramatically improve the user’s PC experience. Targeting value and mainstream notebooks and desktops, “Zacate” APU-based platforms bring many of the vivid digital computing experiences once reserved for high-end PCs into the opening price points of the mainstream segment.

AMD will conduct demonstrations of the experience consumers can expect to see early in 2011 from a broad range of mainstream notebook and desktop PCs based on the AMD Fusion APU codenamed “Zacate”, including:
  • Full HD streaming online video, showcasing the versatility of the “Zacate” APU-based platform to handle the most demanding multimedia tasks
  • Immersive online gaming with high image-quality settings, demonstrating the DirectX 11-compliant “Zacate” APU-based platform
  • Preview of accelerated Internet browsing, showing how “Zacate” APU-based platforms support the future of GPU-enabled web browsing today and how these platforms perform side-by-side against currently available AMD- and Intel processor-based notebooks

Picture of AMD ''Cayman'' Prototype Surfaces

Here is the first picture of a working prototype of the AMD Radeon HD 6000 series "Cayman" graphics card. This particular card is reportedly the "XT" variant, or what will go on to be the HD 6x70, which is the top single-GPU SKU based on AMD's next-generation "Cayman" performance GPU. The picture reveals a card that appears to be roughly the size of a Radeon HD 5870, with a slightly more complex-looking cooler. The PCB is red in color, and the display output is slightly different compared to the Radeon HD 5800 series: there are two DVI, one HDMI, and two mini-DisplayPort connectors. The specifications of the GPU remain largely unknown, except it's being reported that the GPU is built on the TSMC 40 nm process. The refreshed Radeon HD 6000 series GPU lineup, coupled with next-generation Bulldozer architecture CPUs and Fusion APUs are sure to make AMD's lineup for 2011 quite an interesting one.

Update (9/9): A new picture of the reverse side of the PCB reveals 8 memory chips (256-bit wide memory bus), 6+2 phase VRM, and 6-pin + 8-pin power inputs.Source: ChipHell

AMD's Fusion ''Ontario'' APU Chip Pictured

At the ongoing IFA event in Berlin, AMD displayed one of the first derivatives of its Bobcat low-power x86 processor architecture, codenamed "Ontario". This Fusion APU (accelerated processing unit), which is a combination of an x86 CPU and a DirectX 11 compliant GPU is built for low-power devices such as netbooks, handhelds, and tablets. AMD also showed off the chip package itself, which is roughly the size of a 1 Euro coin. The package, like AMD's mobile Athlon/Phenom processors, has no integrated heatspreader (IHS), but like the Intel Atom, uses a ball-grid array (BGA) to permanently fix itself to the system board.

AMD claims that the chip offers "mainstream performance" at less than half the die area (in this case, below 100 mm²), and a fraction of the power. Speaking of which, the "Ontario" Fusion APU has a TDP of 9W, while a higher-performance APU codenamed "Zacate", which is probably competitive with Intel's CULV processors, and is built for ultra-thin notebooks, nettops and slim all-in-one PCs, has a TDP of 18W. AMD claims that the two will ship (to OEMs, because these are not end-user products) in Q4 2010. For the desktop, AMD is developing the "Llano" Fusion APUs that are of a different form-factor and package altogether.


Bulldozer-based Orochi and Fusion Llano Die Shots Surface in GlobalFoundaries Event

The first official die-shots of the first Bulldozer architecture derivative, the eight-core "Orochi" Opteron die was displayed at Global Technology Conference, by GlobalFoundries, AMD's principal foundry-partner. While AMD did not give out a die-map to go with it, the structures we can make out are four Bulldozer modules holding two cores and a shared L2 cache each, a L3 cache spread across four blocks that's shared between all cores, the northbridge-portion cutting across the die at the center, and the integrated memory controller along its far-right side. Various I/O portions are located along the other three sides.

Next up is the Llano die. This is AMD's very first Fusion APU (accelerated processing unit) die. It is based on the K10 architecture and integrates a graphics processor and northbridge completely into one die. It precedes APUs based on the Bobcat architecture. Fortunately, there is a die-map at hand, which shows four K10 cores with dedicated 1 MB L2 caches per core, no L3 cache, an integrated SIMD array that holds 480 stream processors. The GPU component is DirectX 11 compliant. Other components include an integrated northbridge, integrated memory controller, integrated PCI-Express root complex, and HyperTransport interface to the chipset.

Worldwide PC Microprocessor Unit Shipments and Revenues Rise in the 2Q, 2010

Worldwide PC microprocessor unit shipments and revenues in the second calendar quarter of 2010 (2Q10) increased 3.6% and 6.2%, respectively, compared to the first quarter of 2010, according to the latest PC processor study from International Data Corporation (IDC).

The average sequential change in unit shipments between a calendar year's first quarter and its second quarter is an increase of 1.6%. For revenues, the average sequential change is a decrease of -2.8%. So, these increases represent better performance than usual for a second calendar quarter.

"Such a sequential increase in PC processor shipments alone would have been enough to conclude that the first half was strong for the market," said Shane Rau director of Semiconductors: Personal Computing research at IDC. "However, a modest rise in revenues, too, points directly to a rise in average selling prices. System makers bought more and higher-priced PC processors in 2Q10 than in 1Q10. Digging a little deeper into the numbers shows that they bought more mobile processors and more server processors, while desktop processors remained flat."

AMD Spurs Software Development to Benefit from Heterogeneous Compute Architectures

AMD today announced the availability of the ATI Stream Software Development Kit (SDK) v2.2 with full OpenCL 1.1 support to provide developers with the tools they need to build incredible next-generation applications. By taking advantage of both CPU and GPU processing power in a given system, applications like 3D video, HD video chat and multi-display 3D gaming are possible.

A development platform created by AMD, the ATI Stream SDK v2.2 brings a wide range of tools to the developer community including support for OpenCL 1.1, in addition to Ubuntu 10.04 and Red Hat Enterprise Linux 5.5. This updated development platform empowers the developer community to accelerate applications on the CPU and GPU quickly and efficiently. The new version is available for download here.

AMD Demonstrates Graphics Processing Power of Llano Fusion APUs

AMD demonstrated its first Fusion APU (accelerated processing unit), which is a "fusion" between a processor and a graphics processor. The first such processor in the works is based on the 32 nm silicon fabrication technology, codenamed Llano, and fuses a quad-core processor with a DirectX 11 compliant GPU. AMD's Rick Bergman showed off a wafer of the Llano APUs, but it didn't stop there. Rick surprised the press when he went on to claim that the APU can power Aliens vs. Predator in DirectX 11 mode, with a reasonable level of detail, which was demonstrated. Find a video of the same at the source.

Source: TweakTown

AMD Appoints Manju Hegde to Lead Fusion Experience Program

AMD today announced the appointment of Manju Hegde as corporate vice president, Fusion Experience Program. A renowned parallel and visual computing innovator, Hegde previously served as vice president of CUDA Technical Marketing at NVIDIA before joining AMD to lead the AMD Fusion Experience Program, an initiative focused on identifying innovative computing solutions and applications poised to take full advantage of the forthcoming AMD Fusion family of Accelerated Processing Units (APU). Hegde reports to Rick Bergman, senior vice president and general manager, AMD Products Group.

“We are thrilled to be able to attract an experienced industry leader like Manju Hegde to the AMD team, a sign of the quality of talent we are able to attract to AMD on the strength of our Fusion roadmap,” said Bergman. ”Manju brings prized expertise in developing the ecosystem for enabling breakthrough and heightened experiences on new architectures to AMD. As Manju and his team work with the ecosystem to usher in a new era of visual computing, we expect a wide range of industry leaders to embrace the future of accelerated computing through the combination of the GPU and CPU -- a combination only AMD can deliver with its AMD Fusion technology.”

AMD Slated to Receive 56 Million CAD Grant from Ontario Government

AMD today announced that it has entered into a Memorandum of Understanding with the Ontario Ministry of Economic Development and Trade, under which the Ministry will award a five-year grant of $56.4 million CAD ($52.8M USD) to AMD Canada under Ontario’s Next Generation of Jobs Fund. The grant is expected to fund R&D activities by AMD’s Markham-based engineers in the development of its upcoming AMD Fusion family of processors, related software infrastructure and integrated computing platforms. Ontario expects to make its initial investment of $11.2 million CAD to AMD upon signing the formal agreement, with periodic payments occurring thereafter throughout the grant period.

In turn, AMD will commit to substantially invest in AMD Fusion processor-related R&D activities in Markham, and retain and create hundreds of high-value R&D jobs during the grant time frame. AMD also plans to increase collaborative activities with local universities.

AMD to Sample 32 nm Processors Within H1 2010

AMD, in its presentation at the International Solid State Circuits Conference (ISSCC) 2010, presented its plan to build its much talked about 'Fusion' processor platform, codenamed Llano, central to which, is the Accelerated Processing Unit (APU). AMD's APU is expected to be the first design to embed a multi-core x86 CPU and a GPU onto a single die. This design goes a notch ahead of Intel's recently released 'Clarkdale' processor, where Intel strapped a 32 nm dual-core CPU die and a 45 nm northbridge die with integrated graphics, onto an MCM (multi chip module) package. Llano is also expected to feature four processing cores, along with other design innovations.

Some of the most notable announcements in AMD's presentation is that the company will begin sampling the chip to its industry partners within the first half of 2010. The Llano die will be build on a 32 nm High-K Metal Gate process. On this process, each x86 core will be as small as 9.69 mm². Other important components on the Llano die are a DDR3 memory controller, on-die northbridge, and a DirectX 11 compliant graphics core derived from the Evergreen family of GPUs. The x86 cores are expected to run at speeds of over 3 GHz. Each core has 1 MB of dedicated L2 cache, taking the total chip cache size to 4 MB.

Toshiba Unveils High-Performance Qosmio X500 Multimedia Laptop

Toshiba’s Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today unveiled the Qosmio X500 Series, an enthusiast-class line of performance laptops geared for high definition multimedia and gaming. Featuring a striking design on the outside and packed with premium technologies and features on the inside, the Qosmio X500 Series offers hardcore gamers and digital content creators a portable, well-equipped “pro-class” laptop.

Qosmio X500 Series laptops feature the new Intel Core i7 processor, delivering four cores of intelligent processing power, Windows 7 and Intel’s Turbo Boost Technology, which automatically allows processor cores to run faster than the base operating frequency if it is operating below power, current and temperature specification limits. The laptops also offer ultra-fast DDR3 system memory, dual hard-drive configurations, as well as NVIDIA GeForce GTS 250M graphics with 1GB of GDDR5 video memory. Together, this pairing of high-performance technologies allow consumers to rip through the latest 3D games at lightning-fast frame-rates or create hi-definition video and audio faster and more efficiently with smooth rendering and encoding.

AMD Announces VISION Technology, Consumers Gain Clarity in the PC Buying Experience

AMD today announced a new way to help consumers select the PC that best meets their needs. Working with retailers and PC manufactures, VISION Technology from AMD breaks the model in how PC benefits are communicated. Rather than the traditional model, which focuses on the technical specifications of individual hardware components, VISION communicates the value of the whole system and demonstrates the combined processing power of both the CPU and GPU to deliver a superior visual experience to mainstream PC users. It emphasizes how an AMD-based PC is optimized for video, digital media and content creation activities. VISION guides the industry past the era of CPU-centric marketing and describes the PC capabilities in terms of what can be enjoyed on the system – see, share, create. This helps consumers to make better informed buying decisions.

“Today’s consumer cares about what they can do with their PC, not what’s inside,” said Nigel Dessau, CMO of AMD. “They want a rich HD and entertainment experience on their PC, delivered by the combined technology of AMD CPUs and GPUs, without having to understand what gigahertz and gigabytes mean. VISION technology from AMD reflects the maturation of marketing in the PC processing industry and communicates the technology in a more meaningful way.”

Integrated Graphics Chip Market to Disappear by 2012 According to Jon Peddie Research

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, today announced a new study that indicates the end of the market for the popular integrated graphics chipset, known as the IGP.

After fifteen years of stellar growth the IGP will cease to exist, replaced by embedded graphics in the processor. Integrated graphics are used in desktop and net top PCs, notebooks, and netbooks, and various embedded systems such as point of sale, set-top boxes, and signage systems.

Patriot Launches Fusion SSD, Featuring Latest in Buffered SSD Technology

Patriot Memory, a global pioneer in high-performance memory, NAND flash and computer technology, today announced the release of their Fusion SSD Series. The Fusion SSD line has been specifically designed with cutting-edge technology by adding 64MB of DRAM cache in conjunction with its current equipped NAND technology. The ultimate result is an SSD that allows faster transfer rates between the controller and the host device.

"By the addition of the DRAM cache, the Fusion greatly increases the random and sequential read and write transfer rates," according to Meng J. Choo, Patriot's Flash Product Manager. He goes on to say, "The DRAM acts as a buffer and increases the reliability, and lessens the possibility for 'bottlenecks' within the data transfers."
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