News Posts matching "HPC"

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Samsung Begins Mass-Producing 4-Gigabyte HBM2 Memory Stacks

Samsung Electronics Co., Ltd., announced today that it has begun mass producing the industry's first 4-gigabyte (GB) DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface, for use in high performance computing (HPC), advanced graphics and network systems, as well as enterprise servers. Samsung's new HBM solution will offer unprecedented DRAM performance - more than seven times faster than the current DRAM performance limit, allowing faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.

"By mass producing next-generation HBM2 DRAM, we can contribute much more to the rapid adoption of next-generation HPC systems by global IT companies," said Sewon Chun, senior vice president, Memory Marketing, Samsung Electronics. "Also, in using our 3D memory technology here, we can more proactively cope with the multifaceted needs of global IT, while at the same time strengthening the foundation for future growth of the DRAM market."

The newly introduced 4GB HBM2 DRAM, which uses Samsung's most efficient 20-nanometer process technology and advanced HBM chip design, satisfies the need for high performance, energy efficiency, reliability and small dimensions making it well suited for next-generation HPC systems and graphics cards.

Seagate Engineers Tiered Archive System for HPC Storage

Seagate Technology plc. today introduced ClusterStor A200, a first-of-its-kind tiered archive storage system for high performance computing (HPC). The A200 helps reduce storage and operational costs by up to 50 percent compared to tier-one storage platforms.

The A200 was designed to complement the rest of Seagate's ClusterStor family of scale-out storage systems. It allows customers to non-disruptively migrate designated data off of the performance-optimized, primary storage tiers while keeping it online for fast retrieval. This avoids a common problem in shared HPC environments where the organization is forced to choose between having all of the data available to make the best analysis versus the time required to retrieve data from tape. Performance of the primary storage is often improved by migrating data and freeing up space for more efficient data layout. The pre-configured ClusterStor A200 solution includes an automatic policy-driven hierarchical storage management (HSM) system and near limitless scale-out capacity.

NVIDIA GPUs to Accelerate Microsoft Azure

NVIDIA today announced that Microsoft will offer NVIDIA GPU-enabled professional graphics applications and accelerated computing capabilities to customers worldwide through its cloud platform, Microsoft Azure. Deploying the latest version of NVIDIA GRID in its new N-Series virtual machine offering, Azure is the first cloud computing platform to provide NVIDIA GRID 2.0 virtualized graphics for enterprise customers.

For the first time, businesses will have the ability to deploy NVIDIA Quadro-grade professional graphics applications and accelerated computing on-premises, in the cloud through Azure, or via a hybrid of the two using both Windows and Linux virtual machines. Azure will also offer customers supercomputing-class performance, with the addition of the NVIDIA Tesla Accelerated Computing Platform's flagship Tesla K80 GPU accelerators, for the most computationally demanding data center and high performance computing (HPC) applications.

AMD and Dell Support Bioinformatics Studies at University of Warsaw in Poland

AMD today unveiled innovation in heterogeneous high performance computing (HPC) by delivering more than 1.5 petaFLOPS of AMD FirePro S9150 server GPU performance for the Next Generation Sequencing Centre (NGSC) at the Centre of New Technologies, University of Warsaw in support of bioinformatics research related to next generation sequencing (NGS) studies. The new ORION cluster features 150 Dell PowerEdge R730 servers with two AMD FirePro S9150 server GPUs, for a total GPU peak of 1.52 petaFLOPS single precision and 0.76 petaFLOPS double precision performance. The energy-efficient cluster enables high speed and efficient calculations for genomic data, applicable to a range of genomics and bioinformatics studies, using a fast and power efficient OpenCL implementation for research applications.

"We're committed to building our HPC leadership position in the industry as a foremost provider of computing applications, tools and technologies," said Sean Burke, corporate vice-president and general manager, AMD Professional Graphics. "This installation reaffirms AMD's leading role in HPC with the implementation of the AMD FirePro S9150 server GPUs in this 1.5 petaFLOPS supercomputer cluster. AMD and Dell are enabling OpenCL applications for critical science research usage for this cluster. AMD is proud to collaborate with Dell and NGSC to support such important life science and computer science research."

IBM, NVIDIA and Mellanox Launch Design Center for Big Data and HPC

IBM, in collaboration with NVIDIA and Mellanox, today announced the establishment of a POWER Acceleration and Design Center in Montpellier, France to advance the development of data-intensive research, industrial, and commercial applications. Born out of the collaborative spirit fostered by the OpenPOWER Foundation - a community co-founded in part by IBM, NVIDIA and Mellanox supporting open development on top of the POWER architecture - the new Center provides commercial and open-source software developers with technical assistance to enable them to develop high performance computing (HPC) applications.

Technical experts from IBM, NVIDIA and Mellanox will help developers take advantage of OpenPOWER systems leveraging IBM's open and licensable POWER architecture with the NVIDIA Tesla Accelerated Computing Platform and Mellanox InfiniBand networking solutions. These are the class of systems developed collaboratively with the U.S. Department of Energy for the next generation Sierra and Summit supercomputers and to be used by the United Kingdom's Science and Technology Facilities Council's Hartree Centre for big data research.

Seagate Announces ClusterStor Hadoop Workflow Accelerator

Seagate Technology plc, a world leader in storage solutions, today announced availability of the ClusterStor Hadoop Workflow Accelerator a new solution providing the tools, services, and support for High Performance Computing (HPC) customers who need the best performing storage systems for Big Data Analytics. The Hadoop Workflow Accelerator is a set of Hadoop optimization tools, services and support that leverages and enhances the performance of ClusterStor, the market leading scale-out storage system, designed for Big Data analysis.

Computationally intensive High Performance Data Analytics (HPDA) environments will benefit from significant reductions in data transfer time with the Hadoop Workflow Accelerator. This solution also includes the Hadoop on Lustre Connector, which allows both Hadoop and HPC Lustre clusters to use exactly the same data without having to move the data between file systems or storage devices.

Intel Reveals Details for Future HPC System Building Blocks

Intel Corporation todayannounced several new and enhanced technologies bolstering its leadership in high-performance computing (HPC). These include disclosure of the future generation Intel Xeon Phi processor, code-named Knights Hill, and new architectural and performance details for Intel Omni-Path Architecture, a new high-speed interconnect technology optimized for HPC deployments.

Intel also announced new software releases and collaborative efforts designed to make it easier for the HPC community to extract the full performance potential from current and future Intel industry-standard hardware. Together, these new HPC building blocks and industry collaborations will help to address the dual challenges of extreme scalability and mainstream use of HPC while providing the foundation for a cost-effective path to exascale computing.

Cray Launches New High Density Cluster Packed With NVIDIA GPU Accelerators

Global supercomputer leader Cray Inc. today announced the launch of the Cray CS-Storm -- a high-density accelerator compute system based on the Cray CS300 cluster supercomputer. Featuring up to eight NVIDIA Tesla GPU accelerators and a peak performance of more than 11 teraflops per node, the Cray CS-Storm system is one of the most powerful single-node cluster architectures available today.

Designed to support highly scalable applications in areas such as energy, life sciences, financial services, and geospatial intelligence, the Cray CS-Storm provides exceptional performance, energy efficiency and reliability within a small footprint. The system leverages the supercomputing architecture of the air-cooled Cray CS300 system, and includes the Cray Advanced Cluster Engine cluster management software, the complete Cray Programming Environment on CS, and NVIDIA Tesla K40 GPU accelerators. The Cray CS-Storm system includes Intel Xeon E5 2600 v2 processors.

AMD Introduces the FirePro S9150 Server Card

AMD today announced the AMD FirePro S9150 server card -- the most powerful server Graphics Processing Unit (GPU) ever built for High Performance Computing. Based on the AMD Graphics Core Next (GCN) architecture, the first AMD architecture designed specifically with compute workloads in mind, the AMD FirePro S9150 server card is the first server card to support enhanced double precision and break the 2.0 TFLOPS double precision barrier. With 16 GB of GDDR5 memory -- 33 percent more than the competition -- and maximum power consumption of 235 watts, AMD FirePro S9150 server GPUs provide supercomputers with massive compute performance while maximizing available power budgets.

"Today's supercomputers feature an increasing mix of GPUs, CPUs and co-processors to achieve great performance, and many of them are being implemented in an environmentally responsible manner to help reduce power and water consumption," said David Cummings, senior director and general manager, professional graphics, AMD. "Designed for large scale multi-GPU support and unmatched compute performance, AMD FirePro S9150 ushers in a new era of supercomputing. Its memory configuration, compute capabilities and performance per watt are unmatched in its class, and can help take supercomputers to the next level of performance and energy efficiency."

Puget Systems Launches New Quad CPU Workstations

Puget Systems has been providing quad socket workstations for years now. Today, we refresh that product with a new duo of quad socket workstations that offer even more capacity, better cooling, and quieter operation. The new Peak Quad CPU workstations come in both Intel and AMD varieties. Our intention with this refresh is to take some of the highest performance workstation configurations available today and make them something you can put in your lab or office. Most workstations and servers of this caliber come with a prohibitive noise level but the Peak line of workstations solves this problem while still providing excellent cooling and long component lifespan.

In addition to supporting four CPUs, these workstations also support other high performance options such as large SSD arrays and accelerator cards including Intel Xeon Phi and NVIDIA Tesla. Most importantly, we have designed these workstations to be flexible. With systems at this level, it is typical for us to plan, design, implement and test a custom solution for each customer and use case. If you are unsure whether Peak is right for you, just ask! We have dedicated staff on hand for HPC, parallel and cluster computing.

Eurotech, AppliedMicro and NVIDIA Develop New HPC System Architecture

Eurotech, a leading provider of embedded and supercomputing technologies, has teamed up with Applied Micro Circuits Corporation and NVIDIA to develop a new, original high performance computing (HPC) system architecture that combines extreme density and best-in-class energy efficiency. The new architecture is based on an innovative highly modular and scalable packaging concept.

Eurotech, which has years of significant experience in designing and manufacturing original HPC systems, has successfully developed an HPC systems architecture that optimizes the benefits of greater density, as well as the energy efficiency of ARM processors and high-performance GPU accelerators.

Micron Collaborates With Intel to Enhance "Knights Landing"

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.

"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."

Intel Details Its Next-Gen Xeon Phi Processor

Intel Corporation today announced new details for its next-generation Intel Xeon Phi processors, code-named Knights Landing, which promise to extend the benefits of code modernization investments being made for current generation products. These include a new high-speed fabric that will be integrated on-package and high-bandwidth, on-package memory that combined, promise to accelerate the rate of scientific discovery. Currently memory and fabrics are available as discrete components in servers limiting the performance and density of supercomputers.

The new interconnect technology, called Intel Omni Scale Fabric, is designed to address the requirements of the next generations of high-performance computing (HPC). Intel Omni Scale Fabric will be integrated in the next generation of Intel Xeon Phi processors as well as future general-purpose Intel Xeon processors. This integration along with the fabric's HPC-optimized architecture is designed to address the performance, scalability, reliability, power and density requirements of future HPC deployments. It is designed to balance price and performance for entry-level through extreme-scale deployments.

NVIDIA GPUs Open the Door to ARM64 Entry Into High Performance Computing

NVIDIA today announced that multiple server vendors are leveraging the performance of NVIDIA GPU accelerators to launch the world's first 64-bit ARM development systems for high performance computing (HPC).

ARM64 server processors were primarily designed for micro-servers and web servers because of their extreme energy efficiency. Now, they can tackle HPC-class workloads when paired with GPU accelerators using the NVIDIA CUDA 6.5 parallel programming platform, which supports 64-bit ARM processors.

ASUS Unveils the ESC4000 G2S Series HPC GPU Servers

ASUS today announced ESC4000 G2S, a new 2U-sized server series based on the dual Intel Xeon E5-2600 v2 processor platform and designed for use in environments that demand high-density GPU/coprocessor servers.

The new ESC4000 G2S series servers feature a highly optimized thermal design, six hot-swappable 2.5-inch SATA drive bays and nine PCI Express 3.0 (PCIe 3.0) x16 expansion slots. The innovative and thoughtful design delivers high-density computing power, easy scalability and exceptional energy efficiency, making ESC4000 G2S series servers the ideal choice for applications in the high-performance computing (HPC) fields of life and medical sciences, engineering science, financial modeling and virtualization.

Intel Brings Supercomputing Horsepower to Big Data Analytics

Intel Corporation unveiled innovations in HPC and announced new software tools that will help propel businesses and researchers to generate greater insights from their data and solve their most vital business and scientific challenges.

"In the last decade, the high-performance computing community has created a vision of a parallel universe where the most vexing problems of society, industry, government and research are solved through modernized applications," said Raj Hazra, Intel vice president and general manager of the Technical Computing Group. "Intel technology has helped HPC evolve from a technology reserved for an elite few to an essential and broadly available tool for discovery. The solutions we enable for ecosystem partners for the second half of this decade will drive the next level of insight from HPC. Innovations will include scale through standards, performance through application modernization, efficiency through integration and innovation through customized solutions."

AMD to Research Interconnect Architectures for High-Performance Computing

AMD today announced that it was selected for an award of $3.1 million for a research project associated with the U.S. Department of Energy (DOE) Extreme-Scale Computing Research and Development Program, known as "DesignForward." The DOE award is an expansion of work started as part of another two-year award AMD received in 2012 called "FastForward." The FastForward award aims to accelerate the research and development of processor and memory technologies needed to support extreme-scale computing. The DesignForward award supports the research of the interconnect architectures and technologies needed to support the data transfer capabilities in extreme-scale computing environments.

DesignForward is a jointly funded collaboration between the DOE Office of Science and the U.S. National Nuclear Security Administration (NNSA) to accelerate the research and development of critical technologies needed for extreme-scale computing, on the path toward Exascale computing. Exascale supercomputers are expected to be capable of performing computation hundreds of times faster than today's fastest computers, with only slightly higher power utilization.

Cray Adds NVIDIA Tesla K40 to Its Complete Line of Supercomputing Systems

Global supercomputer leader Cray Inc. today announced the Cray CS300 line of cluster supercomputers and the Cray XC30 supercomputers are now available with the NVIDIA Tesla K40 GPU accelerators. Designed to solve the most demanding supercomputing challenges, the NVIDIA Tesla K40 provides 40 percent higher peak performance than its predecessor, the Tesla K20X GPU.

"The addition of the NVIDIA K40 GPUs furthers our vision for Adaptive Supercomputing, which provides outstanding performance with a computing architecture that accommodates powerful CPUs and highly-advanced accelerators from leading technology companies like NVIDIA," said Barry Bolding, vice president of marketing at Cray. "We have proven that acceleration can be productive at high scalability with Cray systems such as 'Titan', 'Blue Waters', and most recently with the delivery of a Cray XC30 system at the Swiss National Supercomputing Centre (CSCS). Together with Cray's latest OpenACC 2.0 compiler, the new NVIDIA K40 GPUs can process larger datasets, reach higher levels of acceleration and provide more efficient compute performance, and we are pleased these features are now available to customers across our complete portfolio of supercomputing solutions."

NVIDIA Launches the Tesla K40 GPU Accelerator

NVIDIA today unveiled the NVIDIA Tesla K40 GPU accelerator, the world's highest performance accelerator ever built, delivering extreme performance to a widening range of scientific, engineering, high performance computing (HPC) and enterprise applications.

Providing double the memory and up to 40 percent higher performance than its predecessor, the Tesla K20X GPU accelerator, and 10 times higher performance than today's fastest CPU, the Tesla K40 GPU is the world's first and highest-performance accelerator optimized for big data analytics and large-scale scientific workloads.

Asetek to Demo RackCDU Liquid Cooled 92 Node HPC Cluster at SC13

Asetek will showcase its range of RackCDU hot water liquid cooling systems for HPC data centers at SC13 including a running 92 node cluster cooled by RackCDU D2C (Direct to Chip) with monitoring software providing real-time reporting and alerting in Denver, Colorado - November 18-21.

Asetek's RackCDU range includes RackCDU D2C and RackCDU ISAC (In-Server Air Conditioning). RackCDU D2C provides cooling cost reductions up to 80% and density increases of 2.5x-5x. RackCDU ISAC provides cooling cost reductions exceeding 80% and enables operation without concern for air quality. Operating demonstrations of both technologies will be on display in Asetek's booth #4329.

Cray XC30 Supercomputers Added NVIDIA Tesla GPUs and Intel Xeon Phi Coprocessors

Global supercomputer leader Cray Inc. today announced the Company has broadened its support for accelerators and coprocessors, and is now selling the Cray XC30 series of supercomputers with NVIDIA Tesla K20X GPU accelerators and Intel Xeon Phi coprocessors. This marks the latest step in Cray's Adaptive Supercomputing vision, which is focused on delivering innovative systems that integrate diverse technologies like multi-core and many-core processing into a unified architecture.

"Our first experience with climate and materials science applications showed that replacing one of the multi-core processors in the XC30 with an NVIDIA Tesla GPU boosts application performance and disproportionally reduced energy to solution," said Thomas Schulthess, professor at ETH Zurich and director of the Swiss National Supercomputing Center, which was one of the first Cray customers to order a hybrid Cray XC30 system. "This provides necessary proof of principle in favor of hybrid compute nodes as a promising solution to the energy challenges we face in supercomputing."

OCZ to Showcase NVM Aeon Series 3.5" SSD Next Week at HPC for Wall Street Show

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, will showcase the company's latest enterprise storage and acceleration solutions at the 2013 High Performance Computing (HPC) for Wall Street Show in booth 201 at the Roosevelt Hotel in New York City on September 9. One of the largest shows catering to the HPC market, it is an ideal venue for OCZ to showcase solid state storage products designed for addressing big data performance and low latency for financial applications.

OCZ will unveil the upcoming Aeon Series 3.5" SSD, a Non-Volatile Memory (NVM) SAS drive specifically targeted to meet the stringent requirements of latency sensitive applications currently being mired by legacy hard-disk drive (HDD) infrastructures. Designed for demanding transactional environments such as high-frequency trading (HFT), Aeon delivers the speed and ultra low latency read and writes of DRAM with the persistence and scalability of storage. Aeon reduces file system overhead in enterprise appliances while accelerating applications and improving overall I/O efficiency, along with providing unlimited endurance supporting an infinite number of drive writes per day without wearing out or slowing down.

Intel Powers the World's Fastest Supercomputer, Reveals New HPC Technologies

A system built with thousands of Intel processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers. The system, known as "Milky Way 2," includes 48,000 Intel Xeon Phi coprocessors and 32,000 Intel Xeon processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

Hybrid Memory Cube Consortium Finalizes Specifications

More than 100 developer and adopter members of the Hybrid Memory Cube Consortium (HMCC) today announced they've reached consensus for the global standard that will deliver a much-anticipated, disruptive memory computing solution. Developed in only 17 months, the final specification marks the turning point for designers in a wide range of segments-from networking and high-performance computing, to industrial and beyond-to begin designing Hybrid Memory Cube (HMC) technology into future products.

A major breakthrough with HMC is the long-awaited utilization of advanced technologies to combine highperformance logic with state-of-the-art DRAM. With this first HMC milestone reached so quickly, consortium members have elected to extend their collaborative effort to achieve agreement on the next generation of HMC interface standards.

TYAN Showcases Cutting-edge GPU Platforms at GTC 2013

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC International Corp, will present its cutting-edge GPU supporting platform during the NVIDIA GTC 2013. Ranging from 2U to 4U and compatible with1 to 8 GPUs. TYAN offers a full product portfolio to customers which are compatible with NVIDIA Tesla K Series GPU Accelerators. The TYAN S7055 and S7056 motherboard will be showcased as well as TYAN TA77-B7061 and FT48-B7055 barbones at TYAN's booth (#503) during the GTC 2013.

Targeting from mainstream applications to the most complicated high performance computing, TYAN develops a rich product portfolio of GPU based platforms. These products offer flexible and scalable performance as well as maximum efficiency in order to help customers deploying an ideal GPU cluster solutions. All the TYAN GPU platforms are under-validation with industry-leading companies' GPU products. The TYAN TA77-B7061, FT48-B7059 and FT77-B7059 GPU platforms passed the validation and are fully compatible with NVIDIA Tesla K Series GPU Accelerators. The bundled product portfolios of TYAN GPU platforms and NVIDIA Tesla K Series will be widely available in Q2.
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