News Posts matching "Haswell"

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Intel Skylake De-lidded, Reveals Tiny Die

When Japanese tech publication PC Watch got under the hood (lid) of a Core i7-6700K quad-core processor, what they found was an unexpectedly small silicon, that's shorter in proportion to its width, than previous dies from Intel, such as Haswell-D, and Ivy Bridge-D. It's smaller than even the i7-5775C, despite the same 14 nm process, because of its slimmer integrated graphics core with just 24 execution units (compared to 48 on the i7-5775C), and the lack of an external 128 MB SRAM cache for the iGPU.

The substrate Intel is using on the i7-6700K was found to be slimmer than the one on the i7-4770K, at 0.8 mm thick, compared to 1.1 mm on the latter. The thicker IHS (integrated heatspreader) makes up for the thinner substrate, so it shouldn't cause problems with using your older LGA1150 coolers on the new socket. Intel is using a rather viscous silver-based TIM between the die and the IHS. The die is closer to the center of the IHS than its predecessors were. PC Watch swapped out the stock TIM with Prolimatech PK-3 and Cool Laboratory Liquid Pro, and found some impressive drops in temperatures at stock speed (4.00 GHz) and with a mild overclock (4.60 GHz).


Source: PC Watch

Moore's Law Buckles as Intel's Tick-Tock Cycle Slows Down

Intel co-founder Gordon Moore's claim that transistor counts in microprocessors can be doubled with 2 years, by means of miniaturizing silicon lithography is beginning to buckle. In its latest earnings release, CEO Brian Krzanich said that the company's recent product cycles marked a slowing down of its "tick-tock" product development from 2 years to close to 2.5 years. With the company approaching sub-10 nm scales, it's bound to stay that way.

To keep Moore's Law alive, Intel adopted a product development strategy it calls tick-tock. Think of it as a metronome that give rhythm to the company. Each "tock" marks the arrival of a new micro-architecture, and each "tick" marks its miniaturization to a smaller silicon fab process. Normally, each year is bound to see one of the two in alternation.

Logic Supply Previews its Upcoming ML600 Series Fanless PC

Industrial & embedded computer manufacturer Logic Supply has launched a preview of their upcoming ML600 Series of fanless and ventless industrial computer systems. Optimized for passive heat distribution, the new systems enable up to Intel i7 desktop processing without the need for a cooling fan, reducing a common failure point in commercial PCs and virtually eliminating noise.

"Logic Supply's goal is to offer our clients the ideal system to fit their needs," said Logic Supply Product Manager Logan Cooke. "While there are other systems on the market that may offer a certain number of COM ports, or i7 processing, or fanless cooling, or a ventless chassis, there was nothing available that combined all of these features into one system. With each of the ML600 systems we wanted to offer a computer that would offer users a unique combination of capabilities and connectivity."

Raidmax Intros XT-Series Entry-level PSUs

Raidmax announced three XT-series entry-level PSUs, the 300-Watt RX-300XT, the 400-Watt RX-400XT, and the 500-Watt RX-500XT. The three offer a very basic feature-set, but offer a few neat features such as a low-noise, temperature-controlled 120 mm fan; Core "Haswell" C-states support, a single +12V rail design, and modern electrical protection mechanisms, against over/under-voltage, overload, and short-circuit. The 300W model lacks PCIe power cables; the 400W model offers a single 6-pin cable; while the 500W tops it with a 6+2 pin cable in addition to the 6-pin. Other connectors include 24-pin ATX, 4+4 pin EPS, 4x SATA-power, and two 4-pin Molex. The company didn't announce pricing.

Source: Hermitage Akihabara

Gigabyte Intros Z97X-Game Plus Motherboard

From a sea of black and red, Gigabyte brushed a refreshing stroke of green, with its latest socket LGA1150 motherboard, the Z97X-Game Plus. Designed to compete with $150-ish mainline products such as ASUS Z97-Pro Gamer, which are loaded with gamer-centric features and product design, though barely missing premium gaming brands such as ROG or G1.Gaming; the new Z97X Game Plus could be particularly appealing to gamers with "green" (read: reference NVIDIA) gaming PC builds. The Z97X-Game Plus is a socket LGA1150 motherboard, with out of the box support for 5th gen Core "Broadwell" processors, in addition to Core "Haswell."

The board draws power from 24-pin ATX and 8-pin EPS power connectors. An 8-phase VRM conditions it for the CPU, which is wired to four DDR3 DIMM slots, and three PCI-Express 3.0 x16 slots (x16/NC/NC or x8/x8/NC or x8/x4/x4). Other expansion slots include three PCI-Express 2.0 x1 and one legacy PCI. Storage connectivity includes six SATA 6 Gb/s ports (from which two wire out as SATA-Express 10 Gb/s), and one M.2 (PCIe 2.0 x2 physical layer). Notable features include Gigabyte's famed AMP-UP onboard audio, with an EMI-shielded 115 dBA SNR CODEC, ground-layer isolation, audio-grade electrolytic caps, and an OPAMP with tuning for music and gaming; Broadcom Killer E2200 gigabit Ethernet, six USB 3.0 ports, and dual-UEFI BIOS. Expect a $140-150 pricing.

95W TDP of "Skylake" Chips Explained by Intel's Big Graphics Push

Intel's Core "Skylake" processor lineup, built on the company's swanky new 14 nanometer fab process, drew heads to its rather high 95W TDP for quad-core parts such as the Core i7-6700K and Core i5-6600K, even though their 22 nm predecessors, such as the i7-4770K and the i5-4670K run cooler, at 84W TDP. A new leaked slide explains the higher TDP. Apparently, Intel is going all-out with its integrated graphics implementation on Core "Skylake" chips, including onboard graphics that leverage eDRAM caches. The company is promising as much as 50% higher integrated graphics performance over "Haswell."

Although the chips have high rated TDP, the overall energy efficiency presents a different story. SoCs based on "Skylake" will draw as much as 60% lower power than "Haswell" based ones, translating into 35% longer HD video playback on portable devices running these chips. Intel's graphics performance push is driven by an almost sudden surge in display resolutions, with standards such as 4K (3840 x 2160) entering mainstream, and 5K (5120 x 2880) entering the enthusiast segment. Intel's design goal is to supply the market with a graphics solution that makes the two resolutions functional on desktop and video, if not gaming.

Source: AnandTech Forums

AMD to Emphasize on "Generation" with Future CPU Branding

AMD is planning to play a neat branding game with Intel. Branding of the company's 2016 lineup of CPUs and APUs will emphasize on "generation," much in the same way Intel does with its Core processor family. AMD will mention in its PIB product packaging, OEM specs sheets, and even its product logo (down to the case-badge), that its 2016 products (FX-series CPUs and A-series APUs) are the company's "6th generation." 2016 marks prevalence of Intel's Core "Skylake" processor family, which is its 6th generation Core family (succeeding Nehalem/Westmere, Sandy Bridge, Ivy Bridge, Haswell, and Broadwell). AMD is arriving at its "6th generation" moniker counting "Stars," "Bulldozer," "Piledriver," "Steamroller," and "Excavator," driving its past 5 generations of APUs, and the occasional FX CPU.

It turns out that the emphasis on "generation" is big with DIY and SI retail channels. Retailers we spoke with, say that they find it easier to break through Intel's often-confusing CPU socket change cycle, which ticks roughly every 18-24 months. Customers, they say, find it easier to simply mention the "generation" of Core processor they want, to get all relevant components to go with them (such as motherboard and memory bundles). While AMD's FX brand clearly didn't see generations beyond "Piledriver," the company's decision to unify the socket for its FX and A-Series product lines next year, with AM4, makes "6th generation FX processor" valid.

Desktop OEMs Begin Listing "Broadwell" Chips, "Skylake" Arrives in Q3

Major pre-built desktop manufacturers began listing products driven by 5th generation Core "Broadwell" processors, which are having a brief stint at the markets before being replaced by 6th generation Core "Skylake" processors in Q3-2015. The 5th Generation Core family is led by two parts, the Core i5-5675C, and the Core i7-5775C, both of which come with unlocked base-clock multipliers, are based on Intel's new 14 nanometer silicon fab process, and built in the LGA1150 package, compatible with existing Intel 9-series chipset based motherboards, with BIOS updates.

The Core i5-5675C and i7-5775C aren't exactly successors of the i5-4690K and i7-4790K. The i7-5775C is placed in a product tier Intel calls "P1+," while the i5-5675C is placed in one called "MS2+." The two aren't exactly in the same plane as P1K (eg: i7-4790K) or MS2K (eg: i5-4690K), respectively, and don't qualify as P1 (eg: i7-4790 non-K) or MS2 (eg: i5-4690 non-K). The two still feature unlocked multipliers. This places them somewhere between P1K/MS2K and P1/MS2. Both the i5-5675C and i7-5775C are quad-core chips, and physically feature just 6 MB of L3 cache. The i7-5775C has access to all 6 MB of it, while the i5-5675K features just 4 MB.

ASRock Develops Mini-ITX LGA2011v3 Motherboard with Quad-Channel Memory

They've done it! After building the first LGA2011v3 motherboard in the mini-ITX form-factor, letting you cram up to 8 "Haswell" cores into a lunchbox-sized PC, albeit having to make do with just dual-channel memory; ASRock developed the first mini-ITX motherboard with not just LGA2011v3, but also its full quad-channel memory interface, called the EPC612D4I. There's just one rider, which shouldn't really be a dealbreaker - this is a server-grade motherboard, and is bound to be expensive.

The EPC612D4I achieves its quad-channel memory chops by using smaller DDR4 SO-DIMM slots instead of standard-sized DIMM slots. Availability of aftermarket DDR4 SO-DIMM memory is close to non-existent, but that could change with 6th Generation Core processor notebooks hitting the shelves by Holiday 2015. As an enterprise board, it also supports Xeon E5-1600 V3 and E5-2600 V3 processors.

Intel "Skylake" to be 6th Generation Core Series, First i7-6700K Benchmarks

Intel's next major CPU architecture, codenamed "Skylake," could be classified as the company's 6th generation Core processor family. It will succeed the brief stint Core "Broadwell" will have at the market, with no major chips for PC enthusiasts to look forward to. The Core i7-6700K appears to be the flagship product based on the Skylake-D silicon, succeeding the i7-4770K and i7-4790K. The Core i5-6600K will succeed the i5-4670K and i5-4690K.

The i7-6700K is a quad-core chip, with HyperThreading enabling 8 logical CPUs. Its nominal clock will be 4.00 GHz, with a rather shallow 4.20 GHz Turbo Boost frequency. It will feature an 8 MB L3 cache, and an integrated memory controller that supports both DDR4 and DDR3 memory types. This makes Skylake a transition point for the mainstream PC market to gradually upgrade to DDR4. You'll have some motherboards with DDR3 memory slots, some with DDR4 slots, and some with both kinds of slots. The resulting large uncore component, and perhaps a bigger integrated GPU, will result in quad-core Skylake parts having TDP rated as high as 95W, higher than current Haswell quad-core parts, with their 88W TDP.

AMD "Zen" CPU Core Block Diagram Surfaces

As a quick follow up to our older report on AMD's upcoming "Zen" CPU core micro-architecture being a reversion to the monolithic core design, and a departure from its "Bulldozer" multicore module design which isn't exactly flying off the shelves, a leaked company slide provides us the first glimpse into the core design. Zen looks a lot like "Stars," the core design AMD launched with its Phenom series, except it has a lot more muscle, and one could see significant IPC improvements over the current architecture.

To begin with, Zen features monolithic fetch and decode units. On Bulldozer, two cores inside a module featured dedicated decode and integer units with shared floating-point units. On Zen, there's a monolithic decode unit, and single integer and floating points. The integer unit has 6 pipelines, compared to 4 per core on Bulldozer. The floating point unit has two large 256-bit FMAC (fused-multiply accumulate) units, compared to two 128-bit ones on Bulldozer. The core has a dedicated 512 KB L2 cache. This may be much smaller than the 2 MB per module on Bulldozer, but also indicate that the core is able to push through things fast enough to not need cushioning by a cache (much like Intel's Haswell architecture featuring just 256 KB per core). In a typical multi-core Zen chip, the cores will converge at a large last-level cache, which routes data between them to the processor's uncore, which will feature a DDR4 IMC and a PCI-Express 3.0 root complex.
Source: Planet3DNow, Many Thanks to qubit for the tip.

Eurocom Launches 13.3-inch M4 Ultraportable

Eurocom has launched the 13.3" M4 high-performance, upgradeable, ultraportable laptop, now with NVIDIA GeForce GTX 960M graphics, Intel Core i7-4940MX upgradeable processors and QHD+ 3200-by-1800 13.3" display while only weighing 2 kg. "The EUROCOM M4 is the culmination of all of our experience in putting the most powerful computer components in the world into small form factor laptops. The M4 is a very slight 13.3" ultraportable but has the power of a mobile supercomputer." Mark Bialic, Eurocom President.

Customers now have the option of choosing between three levels graphics technology in the M4, the NVIDIA GeForce GTX 960M, 860M and 765M. This gives customers the ability to choose the perfect graphics performance for their needs. The NVIDIA GeForce GTX 960M GPU provides a potent combination of immersive features and performance for all your games, applications, and entertainment; while also providing intelligent power features to extend battery life. "The EUROCOM M4 offers a very compelling combination of ultra-portability, hgh performance graphics, processors and memory and an ultra-crisp 3200x1800 QHD+ display. For those on the go that require high performance, the EUROCOM M4 is the best choice." Mark Bialic, EUROCOM President.

Intel Rolls Out Energy-efficient Core i3-4170T Dual-Core Processor

Intel topped off its value dual-core processor lineup with a new energy-efficient part, the Core i3-4170T. One of the last chips to be based on the 22 nm "Haswell" silicon, this chip offers two cores with HyperThreading enabling four logical CPUs, 3.20 GHz clock speeds, 3 MB, and a TDP of just 35W (standard i3-41xx series feature 54W TDP). The i3-4170T is priced roughly on par with the current series-leading chip, the i3-4160. A little later this month, Intel will unveil the i3-4170, which will be the fastest part in the series, featuring 3.70 GHz clock speeds.

Source: Akiba PC Watch

Intel to Launch Just Two LGA1150 "Broadwell" Parts

In what could be a sign of Intel being stuck with "undigested" Core "Haswell" inventories, BGA chips becoming commonplace for desktop platforms that don't see CPU upgrades, or even "Broadwell" being too short a stopgap between "Haswell" and "Skylake," the company has reportedly decided to launch just two socket LGA1150 Core "Broadwell" parts, when the silicon hits the market towards June.

Built in the 14 nm silicon fab process, "Broadwell" will bring about performance/Watt increments, and Intel doesn't appear to be in the mood to trade those in for higher clock speeds (higher performance out of the box). It's relevant to note here, that the "Broadwell" core is essentially an optical shrink of the "Haswell" CPU architecture to 14 nm, much like "Ivy Bridge" was to "Sandy Bridge," even if the silicon seating the cores itself is much different (meatier iGPU). Intel will be going in with just two parts, both of which are unlocked, for PC enthusiasts to chew on. These include the Core i7-5775C and the Core i5-5675C.

Intel to Launch Socketed "Broadwell" Processors in mid-2015

Along the sidelines of GDC 2015, Intel offered a few details on how the year could look for its desktop processor lineup. The company is preparing to launch socketed Core "Broadwell" processors in mid-2015 (late Q2 or early Q3), likely in the sidelines of Computex 2015. Broadwell is an optical shrink of "Haswell" to the new 14-nanometer silicon fab process, with a minor feature-set update, much in the same way as "Ivy Bridge" was an optical shrink of "Sandy Bridge" to the 22 nm process.

The socketed Core "Broadwell" chips could come in the LGA1150 package, running on existing 8-series and 9-series chipset motherboards, with BIOS updates. The optical shrink seems to be working wonders for the silicon. Quad-core chips based on "Broadwell" could come with TDP rated as low as 65W (and we're not talking about the energy-efficient "S" or "T" brand extensions here). Some dual-core variants in the series may even be based on the smaller Core M "Broadwell" silicon, which physically features just 2 cores (and isn't a bigger quad-core silicon with two cores disabled in what's a colossal waste of rare-earth metals on a production scale). Some of those dual-core parts could come with TDP rated as low as 28W.Source: TechReport

Antec Announces VPF Series Power Supplies

By virtue of their 80 PLUS Bronze certification, the new generation of reliable entry-level allrounders in Antecs VPF series for gamers and system integrators achieve an efficiency of up to 88 percent. Because of the excellent ratio of expended power to usable energy, the VPF family is not only more efficient, but also more powerful than its predecessors.

Compared to other power units in this price segment, the new VPF models are equipped with additional safety standards and due to the innovative CircuitShield technology offer as much as nine industrial quality protective circuits. Users can therefore rely on their high quality pc components to be perfectly protected. The complete set consisting of overcurrent protection (OCP), overvoltage protection (OVP), undervoltage protection (UVP), short circuit protection (SCP), overload power protection (OPP), overheating protection (OTP), surge and inrush protection (SIP), low-load operation (NLO) and protection against temporary fall of voltage (BOP) renders the new VPF power units reliable and stable power suppliers.

AMD's Excavator Core is Leaner, Faster, Greener

AMD gave us a technical preview of its next-generation "Carrizo" APU, which is perhaps the company's biggest design leap since "Trinity." Built on the 28 nm silicon fab process, this chip offers big energy-efficiency gains over the current-generation "Kaveri" silicon, thanks to some major under-the-hood changes.

The biggest of these is the "Excavator" CPU module. 23 percent smaller in area than "Steamroller," (same 28 nm process), Excavator features a new high-density library design, which reduces die-area of the module. Most components are compacted. The floating-point scheduler is 38% smaller, fused multiply-accumulate (FMAC) units compacted by 35%, and instruction-cache controller compacted by another 35%. The "Carrizo" silicon itself uses GPU-optimized high-density metal stack, which helps with the compaction. Each "Excavator" module features two x86-64 CPU cores, which are structured much in the same way as AMD's previous three CPU core generations.

Antec Unveils 750W EDGE Silence Defined PSU

Antec expanded its super-quiet EDGE Silence Defined line of power supplies, which made its debut in September with 550W and 650W model, with a series-topping 750W one, aimed with gaming PC builds with up to two high-end graphics cards. The unit is characterized by a 135 mm FDB fan that stays off until the unit kicks a load/temperature threshold; and rubber grommets and bands that dampen whatever little vibration slips out of the fan.

The innards of the 750W EDGE Silence Defined are made by Seasonic, featuring a single +12V rail design, APFC, Haswell C7 state support, and all modern electrical protection mechanisms. The unit features fully modular cabling, with enough juice and straws to go around, for a build with two high-end graphics cards.

Thermaltake Outs Toughpower Grand Series with a Fully Modular Design

Thermaltake, being an industry leader in computer chassis, thermal solutions, and power supply units, launches the latest power supply units from new "Toughpower" line. Rated between 650W to 1200W, Thermaltake's new Toughpower Grand Series Platinum (650W, 750W, 850W, 1050W and 1200W) is a high-end PC power supply unit with a fully modular design. The grandiose look with a classy black finish makes a clear statement through its sheer appearance.

The series is 80 PLUS Platinum-certified, so users not only get a guaranteed eco-friendly PSU but also superior performance with easy cable routing and increased airflow. The Toughpower Grand Platinum models are ideally suited for high-end gaming and enthusiast PCs powering multi-core processors in combination with multi-GPU setup.

Super Talent Unveils its DDR4 DRAM Modules

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions, announces line of DDR4 DRAM modules. DDR4 is the successor to DDR3 which is widely used in global enterprise computing solutions. Chip support for DDR4 comes with Intel's next-generation Xeon server processors based on Haswell architecture.

DDR4 provides double the rate of data that DDR3 is able to and allows for increased module densities to provide greater DRAM capacity. In addition, the power usage of these modules is 1.2V compared to DDR3's 1.5V - 20% lower than the previous generation's standard power draw. With lower power usage and higher bandwidth to work with, overhead costs can be reduced while providing increased bandwidth.

Xigmatek Announces Maverick S Line of Power Supplies

Xigmatek rolled out the Maverick S line of mid-range power supplies, which are designed to offer high value for money, and come at price points deep inside the $100 mark. Although designed to fit ATX or micro-ATX cases, the Maverick S conforms to the PS3 form-factor, which has the same height and width, but lesser depth than standard ATX. The unit measures 150 mm x 85 mm x 123 mm (WxHxD). It still uses a 120 mm PWM controlled spinner to keep cool, which is tucked away behind a refreshing new grille pattern. Xigmatek also launched the conventional ATX version of these PSUs, the Maverick, which comes with a depth of 158 mm.

The Maverick S is a partially modular PSU, with ATX, EPS, and at least one set of PCIe power connectors being fixed, which others being modular. It comes in three models, 400W, 500W, and 600W. The three feature single +12V rail designs, active PFC, most common electrical protection systems (over/under voltage, overload, short-circuit). All three models offer 80 Plus Bronze certified efficiency, and ATX 2.3/EPS 2.92, with support for Core "Haswell" C6 power-states. The company didn't disclose pricing or availability details.

Thermaltake Announces TR2 Bronze Series 450W, 500W, and 600W PSUs

Thermaltake, being an industry leader in computer chassis, thermal solutions, and power supply units, would like to take this opportunity to introduce the TR2 Bronze Series 450W, 500W, and 600W, PSU that incorporates various high-quality components, enabling non-stop usage with a constantly stable and reliable performance. With 80 PLUS Bronze certified, the new TR2 Bronze series is the most valuable and economical choice-line, especially as it is specifically designed for the users who are looking for an excellent balance between cost and performance.

To support all of today's PC requirements, the TR2 Bronze Series complies with the latest ATX 12V 2.3 Standard for the utmost reliability and compatibility that supports state-of-the-art technologies. The embedded 120mm cooling fan delivers not only silent cooling, but also intelligent temperature control. The series is equipped with a single +12V rail design to provide superior performance for its PC system. The new Thermaltake TR2 Bronze Series will always accommodate every type of mainstream build under any and all circumstances.

Thermaltake Announces TR2 Bronze Series PSUs

Thermaltake, being an industry leader in computer chassis, thermal solutions, and power supply units, introduces TR2 Bronze Series 450W, 500W, and 600W PSU that incorporate various high-quality components, enabling non-stop usage with stable and reliable performance. With 80 PLUS Bronze certified, the new TR2 Bronze series is the most valuable and economical choice line, especially designed for the users who are looking for the excellent balance between cost and performance. To support all of today's PC requirements, the TR2 Bronze Series comply with the latest ATX 12V 2.3 Standard for utmost reliability and compatibility supporting state-of-the-art technologies. Embedded 120mm cooling fan delivers silent cooling with intelligent temperature control. The series is equipped with a single +12V rail design to provide superior performance for PC system. TR2 Bronze Series can always accommodate any mainstream build under any circumstance.

Antec Announces Availability of New EDGE Line of Power Supplies

Antec Inc., leading provider of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, broadens its range of modular power supplies with the new EDGE series. Cutting-edge components and technologies make EDGE a premium addition to Antec's range of industry-leading power supplies. With a EU release date of September, the EDGE is a powerful choice for performance enthusiasts in the market for a quiet, high-quality power supply.

The new Antec EDGE series is based on a brand-new platform, co-developed with their partner Seasonic. Housed in 0.8 mm SECC steel with an anti-scratch black coating, the Antec EDGE series PSUs are built with noise-reducing components. The EDGE series PSUs features a fluid dynamic bearing (FDB) fan with white LED lighting, which operates nearly silent at all speeds. Furthermore, silicone anti-noise de-couplers minimize vibrations for enhanced noise reduction.

Shuttle Puts Intel Haswell Performance in a 3-litre Case

Shuttle Computer Handels GmbH, the European subsidiary of Shuttle Inc., one of the leading developers and manufacturers of compact PC solutions, such as the world-renowned XPC Mini PC Barebones, today introduces two new 3-litre models for fourth-generation Intel Core processors. The XH81 and the XH81V are available on the European market with immediate effect. The Shuttle Barebones XH81 and XH81V are based on an Intel H81 Express Chipset and designed for current Intel processors for socket LGA1150 up to a maximum TDP of 65 W. Two SO-DIMM slots can be equipped with up to 16 GB of DDR3 memory. An efficient heatpipe cooling with two 60 mm fans channels waste heat directly to the outside. An external 90 W power supply is present to drive the system.

The flat case barely measuring 24 x 20 x 7.2 cm (DWH) can be equipped with up to three drives. Installation options for 3x 2.5" HDD/SSD drives or alternatively 2x 2.5" HDD/SSD drives plus an optical slimline drive are available. A 3.5" drive can also be installed using the PHD4 accessory which is sold separately. 3x SATA 6 Gbit/s and 1x SATA 3 Gbit/s are available. There are also two Mini-PCIe 2.0 slots inside which can be used for expansion cards, e.g. for a WLAN or an mSATA SSD drive. Neither the Shuttle Barebone XH81 nor the XH81V skimps when it comes to connections - with DisplayPort, HDMI, USB 3.0 Gigabit LAN, RS 232 and 5.1 Audio, for example, high connectivity can be found on the front and the back panel.
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