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Intel Core i7 "Haswell-E" to Launch in Q3 2014

Intel is planning to launch its 4th generation Core i7 HEDT (high-end desktop) platform, codenamed "Haswell-E," in the third quarter of 2014 (after June), which should space its launch roughly a year from Core i7 "Ivy Bridge-E." With Haswell-E, Intel is expected to increase core counts across the board, launching an "affordable" six-core part around the $400 mark, an eight-core part around the $600 mark, and an Extreme Edition eight-core part around the $1,000 mark. The three will be based on the LGA2011-3 socket, which has the same pin count as today's LGA2011, yet is incompatible with it, because the pin map of Haswell-E will differ from its predecessors'. Driving the platform will be Intel's X99 Express chipset, with support for up to ten SATA 6 Gb/s ports, and a large number of USB 3.0 ports. Some of the first X99 motherboards are expected to be unveiled at Computex 2014.

Source: WCCFTech, Image Courtesy: VR-Zone

Mindspeed Selling Assets of Its Wireless Infrastructure Unit to Intel Corp.

Mindspeed Technologies, Inc., a leading supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation. The asset sale was contemplated by the agreement and plan of merger with M/A-COM Technology Solutions Holdings, Inc., announced on November 5, 2013.

"We are excited that our wireless infrastructure business is being incorporated into Intel," commented Raouf Y. Halim, chief executive officer of Mindspeed.

Akasa Rolls Out Tesla H NUC Case

Akasa rolled out the Tesla H, an all-aluminium fanless case for Intel's second-generation NUC, based on its Core "Haswell" processor. At 240 x 150 x 48 mm, it's somewhere in between traditional NUCs and slimline mini-ITX cases; but uses that volume productively, in adding not one, but two 2.5-inch drive bays. The first one takes advantage of the standard SATA 6 Gb/s port on the D54250WYK motherboard, and the other requires the included mSATA to SATA adapter. The case is also compatible with Intel's D54250WYB and D34010WYB motherboards.

As mentioned earlier, the all-aluminium case features ridges along its body that let it double up as a passive heatsink for the Core "Haswell" processor and PCH. In addition to the two 2.5-inch drive bays, the Tesla H offers two front-panel USB 3.0 ports, HDA audio jacks, a USB infrared receiver, three holes for WLAN/Bluetooth antennae, a Kensington lock slot, and VESA wall mounts. Akasa didn't announce pricing or availability details.

Source: FanlessTech

Intel Debuts the RAID RS3 Series Controllers

Organizations can now achieve a higher level of storage performance with Intel RAID RS3 controllers, powered by LSI Technology. They are specifically designed to meet the demands of I/O-intensive applications, cloud datacenters and virtualized server environments.

Businesses that use Intel RAID RS3 controllers as the basis for their storage infrastructure can achieve more than 1 million IOPs in JBOD mode. With 12 Gb/s SAS-3 technology, it can accelerate business-critical applications in enterprise, Web and cloud datacenters.

2014 Intel Solid State Drives Detailed in Leaked Slides

According to some newly-leaked slides, Intel is planning quite a solid state drive release spree for the second quarter of 2014, one that will see the introduction of three storage solutions - the SSD Pro 2500 Series (codename Temple Star), SSD DC P3500 Series (Pleasantdale) and SSD DC P3700 Series (Fultondale). All three SSD families are going to utilize 20 nm MLC NAND Flash memory, will be available in two form factors and will be backed by a five-year warranty.

NCKU Develops World's First Switchless Cluster Supercomputer

The National Cheng Kung University (NCKU) Supercomputing Research Center (RSC) has built the world's first switchless cluster computer. Known as the "CK-Star", this computer connects eight computers without switch control, thus breaking Intel's performance record. Together with the computer systems provided by Acer, the CK-Star is jointly built by NCKU RSC Director Dr. Chi-Chuan Hwang and Dr. Yuefan Deng of Mainland China's National Supercomputing Center in Jinan (NSCCJN), who is also a Distinguished Professor at the State University of New York (SUNY).

NCKU RSC Director Dr. Chi-Chuan Hwang added that CK-Star is the most unique switchless cluster supercomputer compared to traditional cluster supercomputer which requires switch control to control interaction between nodes. He explained that the weakness of the traditional one is that switches will become performance bottlenecks when the number of nodes is large. Besides, switches also consume large amount of power, estimated to be 50% of the total power consumption. With the introduction of the CK-Star which allows the unrestricted expansion of supercomputers, these problems can be overcome.

Intel "Fultondale" and "Pleasantdale" SSDs Not Very Pleasant with Thermals

As SSDs play catch-up with HDDs on the capacity front, the focus will shift to NAND flash memory designers increasing transistor densities using newer silicon fabrication technologies. In the absence of that, SSD designers will have to cram more number of NAND flash chips to achieve desired high capacities. That throws up two key issues with having too many chips in one place - heat and power. Intel is gearing up to deal with heat on its upcoming "Fultondale" and "Pleasantdale" SSDs for data-centers. Leaked company documents seen by VR-Zone reveal renders of what Intel expects the drives to look like.

Built in the 3.5-inch form-factor the drives are built almost entirely of chunky metal, with a retractable top lid, and its body. The body doubles up as heatsink, it features metal ridges which dissipate heat drawn from the NAND flash chips of the SSD to the air. Internally, the drive will feature at least two PCBs, one which holds the controller, cache RAM (if any), and some NAND flash chips; while the other holds NAND flash chips entirely. How hot can things get? According to the source, the drive could draw as much as 25W of power. That could amount to enough heat to warrant a passive heatsink. Intel is expected to unveil the two drives at IDF Beijing, slated for Q4-2014.

Source: VR-Zone

Intel's 2014 Thunderbolt Controller Detailed

Intel is continuing on its mission to establish Thunderbolt as the next universal device interconnect standard, despite steep competition from the 5 Gb/s USB 3.0, the upcoming 10 Gb/s USB 3.1, and stringent validation and licensing barriers on its own end. To that effect, the company outlined its mainstream Thunderbolt controller, which it plans to launch some time in 2014. The company is planning two major introductions to the standard, to help it compete against USB - power delivery, and ad-hoc (peer-to-peer) networking.

The controller, Broadwell Thunderbolt-LP, isn't designed too differently from what's available in the market. It handles a 20 Gb/s Thunderbolt link by aggregating two 10 Gb/s channels, relays DisplayPort 1.2 from the system's graphics device, and connects to the rest of the system over PCIe 2.0 x2. The chip is built in the 8 x 8 mm package, and features operational and idle TDP ratings of 1.5W and 1mW, respectively. The changes Intel is making to the standard will enable power delivery of up to 53W over a standard tethered cable. That's enough power to run a drive dock with up to six 3.5-inch hard drives, or a small (<24-inch) flat-screen monitor. The other big feature is ad-hoc networking, which enables people to set up peer-to-peer 20 Gb/s connections between two PCs much in the same way they did with USB and RS232, back in the day. While it's no Ethernet replacement, it could prove useful in certain environments, such as content-creation. Intel is expected to make some Thunderbolt-related announcements at CES, next January.

Source: VR-Zone

Intel Unveils the SSD Cache Controller RCS25ZB040

Organizations with a virtual desktop infrastructure (VDI) can now get a significant performance boost with the Intel SSD Cache Controller RCS25ZB040. Powered by LSI Nytro Technology, the Intel RCS25ZB040 is designed to expedite data across a VDI while decreasing the cost per desktop.

The Intel RCS25ZB040 accelerates VDI performance with intelligent caching technology, which monitors frequently accessed data and retains it on its enterprise-grade flash for faster access. Plus, it moves data faster across a VDI and reduces the cost per desktop within the infrastructure.

Intel and NVIDIA Raised Graphics Chip Shipments Levels in Q3

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market shares for 2013 3Q. Q3'13 was the second quarter in a row to show a gain in shipments, up 1.6% quarter-to-quarter, but down 8.8% compared to the same quarter last year.

AMD's overall unit shipments decreased 4.2% quarter-to-quarter, Intel's total shipments increased 3.5% from last quarter, and Nvidia's increased 2.3%. The attach rate of GPUs to PCs for the quarter was 137%, which means only 73% of the PCs with embedded graphics are using them.

G.Skill First to Have High Speed SO-DIMMs Advanced Tested on Intel NUC Platform

CMTL, Computer Memory Test Labs, the industry's leading independent memory compatibility and functionality testing lab announced today that G.Skill's 4 GB and 8 GB 1866MHz DDR3L (low voltage, 1.35v) SO-DIMMs have received Advanced Tested certification on the Intel NUC D53427RKE platform with i5 Ivy Bridge processor.

CMTL's President, John Deters stated, "Having high speed G.Skill SO-DIMMs Advanced Tested on the D53427RKE platform is great news for the Intel NUC customer base. The Intel NUC form factor platform is really catching on in the industry based on the number of test requests we are receiving. The NUC D53427RKE with G.Skill's 1866 MHz speed SO-DIMM provides a high performance system solution in a small compact form factor."

Intel Brings Supercomputing Horsepower to Big Data Analytics

Intel Corporation unveiled innovations in HPC and announced new software tools that will help propel businesses and researchers to generate greater insights from their data and solve their most vital business and scientific challenges.

"In the last decade, the high-performance computing community has created a vision of a parallel universe where the most vexing problems of society, industry, government and research are solved through modernized applications," said Raj Hazra, Intel vice president and general manager of the Technical Computing Group. "Intel technology has helped HPC evolve from a technology reserved for an elite few to an essential and broadly available tool for discovery. The solutions we enable for ecosystem partners for the second half of this decade will drive the next level of insight from HPC. Innovations will include scale through standards, performance through application modernization, efficiency through integration and innovation through customized solutions."

Intel Announces "Thunderbolt ready" Upgrade Program for Motherboards, PCs

The past year has seen a flurry of Thunderbolt related activity. Already present on every current Apple Mac, Thunderbolt has continued to grow within PC circles. And the Thunderbolt ecosystem responded, with over 100 Thunderbolt devices now shipping and available, most certified for both Mac and PC. Thunderbolt makes new experiences possible and developers are seeking to take advantage of Thunderbolt's key benefits, including simultaneous data and display transfer, with speeds of up to 10 Gbps, and daisy-chain connectivity of up to six devices. Building upon that foundation, the first Thunderbolt 2 systems were introduced in October this year, with speeds up to 20 Gbps, and support for the DisplayPort 1.2 protocol. Thunderbolt is clearly the fastest, most versatile connection to your PC.

Now we have a new announcement for you - an exciting new program to quickly expand the footprint of Thunderbolt for desktop and workstation users. This new initiative is called "Thunderbolt ready", and it enables PC manufacturers to offer Thunderbolt upgradeable motherboards within desktop and workstation computers. By using a Thunderbolt card, Thunderbolt's blazing fast speed and uncompressed video capabilities can now be added to any motherboard that includes a GPIO header (general purpose input/output header), so even if your system doesn't have Thunderbolt it is now possible to "upgrade" to it. Users that are interested in adding Thunderbolt 2 technology to an existing Thunderbolt ready system can combine a Thunderbolt card with a growing number of enabled motherboards, all identified by the use of the "Thunderbolt ready" moniker. The Thunderbolt ready program makes it simple to identify which components work together to upgrade your PC with Thunderbolt 2 capability.

Intel Forms Group to Accelerate Internet of Things Market

Intel has created a new organization to accelerate and broaden its reach into market segments and applications commonly referred to as the Internet of Things (IoT). Called the IoT Solutions Group, this new organization will combine the Intelligent Systems Group and Wind River organizations, bringing together the intelligent systems hardware, software, services and platform elements together into one organization.

This is the next step in the company's ongoing activities supporting the proliferation of IoT implementations across the industry. Intel will deliver solutions for companies that are investing in technologies to both drive operating efficiencies and create new services by connecting devices to each other and the cloud to transform their businesses. The new organization will be led by Vice President and General Manager, Doug Davis, a long-time Intel leader and embedded industry veteran and will report directly to the executive office (President and CEO).

Intel Debuts Six New Celeron Mobile Processors

Intel has yesterday updated its processor offer, adding no less than six new models, all Celerons and all targeting mobile devices. This fresh batch is of ultra-low voltage variety and it includes two chips based on the Haswell architecture, the Celeron 2981U and 2957U, and four on the Silvermont architecture (and part of the Bay Trail-M line-up), the Celeron N2920, N2820, N2815 and N2806.

Frequency-wise, the processors go from 1.40 GHz to 2.13 GHz, but they don't really vary in terms of pricing as five of them cost $132, while only the Celeron 2981U goes for $137. More details in the table below.

TechPowerUp HWBOT Competition 2013

The TechPowerUp HWBOT team, in partnership with Intel, is announcing the TechPowerUp HWBOT Competition 2013. Spread across three tests which anyone can participate in - 3DMark 2001, 3DMark 03, and SuperPi 32M, the competition gives you the chance to win some cool new gear, including a Core i7-4770K quad-core processor, an AMD CPU and motherboard combo, and a PayPal cash prize. The contest is open from November 1, 2013 to December 15, 2013.

For more information, visit this page.

Akasa Tesla NUC Case Pictured

Here is the first picture of Akasa Tesla, the company's latest fan-less chassis for Intel's NUC (next unit of computing) system boards. When launched, it will be compatible with both generations of the NUC platform. It stays fan-less with its anodized aluminium body doubling up as a heatsink for the CPU, PCH, and other hot components. It's bigger than the average fan-less NUC case, and features room for two 9 mm-thick 2.5-inch drives, which can be anything between a fast SSD, or a spacious HDD. Not much else is known about the case, and one could expect a formal launch pretty soon.

Source: FanlessTech

Tranquil PC Outs Haswell NUC-Compatible Cases

Tranquil PC is refreshing its compact fan-less case lineup with one that supports the second-generation NUC (next unit of computing) platform, based on Intel's Core "Haswell" processors. Pictured below, the all-aluminium cases are fanless, and rely on the body of the case to dissipate heat from the CPU and PCH, all while measuring 110 x 164 x 47 mm. The case supports Intel's D54250WYB NUC system board, featuring Core i5-4250U dual-core processor, and cutouts for its various connectors, including WLAN jack, DC power-input, mini-DisplayPort, dual PCIe mini-card connectors, mini-HDMI 1.4a, gigabit Ethernet, CIR, four USB ports, and audio jacks. Tranquil PC promises 12 to 25 percent lower temperatures than Intel's air-cooled case. Available now, the case is priced at £99.

Source: FanlessTech

First Fanless Core "Haswell" Based NUC Case Unveiled

Impactics unveiled the first fanless case for Intel's second-generation NUC (next unit of computing) desktop, which is based on the company's Core "Haswell" family. The still unnamed cases pictured below, are ready for Intel's D54250WYK motherboard, which feature Intel Core i5-4250U processors (dual-core, up to 2.60 GHz, 3 MB L3 cache). The cases are built from solid blocks of aluminium, and its body panels double up as heatsinks for the processor and chipset. Given that the reference chassis for D54250WYK from Intel comes with a lateral-blower fan that can get noisy on loads, cases such as these from Impactics could go a long way for the platform.

Source: FanlessTech

Intel Capital Unveils $65 Million in New Investments

Intel Capital, Intel Corporation's global investment and M&A organization, is announcing investments in 16 new technology companies totaling $65 million. Spanning nine countries, the investments will help drive innovations in the cloud, datacenter, mobile technologies and consumer-related services. Announced at the 14th annual Intel Capital Global Summit held in San Diego, the new investments are part of Intel Capital's mission of cultivating global innovation by providing entrepreneurs with the resources necessary to scale from startup to global corporation level.

Designed to create growth opportunities for Intel Capital portfolio companies through structured networking, the Intel Capital Global Summit includes a full agenda of keynote presentations, expert panels and more than 2,000 targeted meetings between portfolio company CEOs and key business executives. Portfolio companies attending past Global Summits have gone on to sign business deals with leading corporations across a wide range of industries.

Intel Delays 14 nm "Broadwell" Chips to Q1-2014

Intel delayed its Core "Broadwell" SoCs for desktops and notebooks to the first quarter of 2014, owing to production delays facing the 14 nanometer silicon fabrication node that the chips are based on. These issues, according to Intel CEO Brian Krzanich, could limit the company's ability to ship enough quantities of functioning chips, and so the company is ironing out its fab problems first. The delay, however, shouldn't have a cascading effect on "Skylake," the successor to "Broadwell," which is based on the same fab process. Skylake's position on the long-term company roadmaps is unaffected. "Broadwell" is a particularly important micro-architecture for Intel, which is struggling to get itself on to mainstream "post-PC" devices such as tablets.
Source: CNET, Image Credit: Anandtech

Intel Reports Third-Quarter Revenue of $13.5 Billion, Net Income of $3.0 Billion

Intel Corporation today reported third-quarter revenue of $13.5 billion, operating income of $3.5 billion, net income of $3.0 billion and EPS of $0.58. The company generated approximately $5.7 billion in cash from operations, paid dividends of $1.1 billion, and used $536 million to repurchase 24 million shares of stock.

"The third quarter came in as expected, with modest growth in a tough environment," said Intel CEO Brian Krzanich. "We're executing on our strategy to offer an increasingly broad and diverse product portfolio that spans key growth segments, operating systems and form factors. Since August we have introduced more than 40 new products for market segments from the Internet-of-Things to datacenters, with an increasing focus on ultra-mobile devices and 2 in 1 systems."

BIOSTAR Releases Hi-Fi H81S3 Micro ATX Motherboard

BIOSTAR has released their newest micro-ATX motherboard based on the Intel H81 chipset, the "Hi-Fi H81S3". The board supports the Intel 4th generation Core i7 and Core i5 processors. It features Intel single chip architecture with HD 4600Graphics, along with a new integrated memory controller that will run at speeds up to 1600MHz. The H81 chipset has two SATA 6Gb/s ports (plus four SATA 3Gb/s ports), and two USB 3.0 headers. The "Hi-Fi H81S3" supports one DIMM per memory channel for a maximum of two sticks of RAM for up to 16Gigs. The "Hi-Fi H81S3" is a great option for small form factor systems where you rarely have more than one discrete card and two SATA drives. Being Intel based boards, they will also feature Intel Rapid Start Technology and Intel Smart Connect Technology.

Intel Delivers Intelligence from Device to Cloud to Drive Internet of Things

Intel Corporation today announced plans to accelerate the development and deployment of the Internet of Things (IoT) by enabling intelligent devices, end-to-end analytics and connecting legacy devices to the cloud to drive business transformation.

In support of this effort, the company unveiled several products including the Intel Atom processor E3800 product family (formerly codenamed "Bay Trail-I"), a new family of Intel-based intelligent gateway solutions featuring integrated software from McAfee and Wind River, and new features for the Intel Quark SoC X1000.
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