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Intel "Fultondale" and "Pleasantdale" SSDs Not Very Pleasant with Thermals

As SSDs play catch-up with HDDs on the capacity front, the focus will shift to NAND flash memory designers increasing transistor densities using newer silicon fabrication technologies. In the absence of that, SSD designers will have to cram more number of NAND flash chips to achieve desired high capacities. That throws up two key issues with having too many chips in one place - heat and power. Intel is gearing up to deal with heat on its upcoming "Fultondale" and "Pleasantdale" SSDs for data-centers. Leaked company documents seen by VR-Zone reveal renders of what Intel expects the drives to look like.

Built in the 3.5-inch form-factor the drives are built almost entirely of chunky metal, with a retractable top lid, and its body. The body doubles up as heatsink, it features metal ridges which dissipate heat drawn from the NAND flash chips of the SSD to the air. Internally, the drive will feature at least two PCBs, one which holds the controller, cache RAM (if any), and some NAND flash chips; while the other holds NAND flash chips entirely. How hot can things get? According to the source, the drive could draw as much as 25W of power. That could amount to enough heat to warrant a passive heatsink. Intel is expected to unveil the two drives at IDF Beijing, slated for Q4-2014.

Source: VR-Zone

Intel's 2014 Thunderbolt Controller Detailed

Intel is continuing on its mission to establish Thunderbolt as the next universal device interconnect standard, despite steep competition from the 5 Gb/s USB 3.0, the upcoming 10 Gb/s USB 3.1, and stringent validation and licensing barriers on its own end. To that effect, the company outlined its mainstream Thunderbolt controller, which it plans to launch some time in 2014. The company is planning two major introductions to the standard, to help it compete against USB - power delivery, and ad-hoc (peer-to-peer) networking.

The controller, Broadwell Thunderbolt-LP, isn't designed too differently from what's available in the market. It handles a 20 Gb/s Thunderbolt link by aggregating two 10 Gb/s channels, relays DisplayPort 1.2 from the system's graphics device, and connects to the rest of the system over PCIe 2.0 x2. The chip is built in the 8 x 8 mm package, and features operational and idle TDP ratings of 1.5W and 1mW, respectively. The changes Intel is making to the standard will enable power delivery of up to 53W over a standard tethered cable. That's enough power to run a drive dock with up to six 3.5-inch hard drives, or a small (<24-inch) flat-screen monitor. The other big feature is ad-hoc networking, which enables people to set up peer-to-peer 20 Gb/s connections between two PCs much in the same way they did with USB and RS232, back in the day. While it's no Ethernet replacement, it could prove useful in certain environments, such as content-creation. Intel is expected to make some Thunderbolt-related announcements at CES, next January.

Source: VR-Zone

Intel Unveils the SSD Cache Controller RCS25ZB040

Organizations with a virtual desktop infrastructure (VDI) can now get a significant performance boost with the Intel SSD Cache Controller RCS25ZB040. Powered by LSI Nytro Technology, the Intel RCS25ZB040 is designed to expedite data across a VDI while decreasing the cost per desktop.

The Intel RCS25ZB040 accelerates VDI performance with intelligent caching technology, which monitors frequently accessed data and retains it on its enterprise-grade flash for faster access. Plus, it moves data faster across a VDI and reduces the cost per desktop within the infrastructure.

Intel and NVIDIA Raised Graphics Chip Shipments Levels in Q3

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market shares for 2013 3Q. Q3'13 was the second quarter in a row to show a gain in shipments, up 1.6% quarter-to-quarter, but down 8.8% compared to the same quarter last year.

AMD's overall unit shipments decreased 4.2% quarter-to-quarter, Intel's total shipments increased 3.5% from last quarter, and Nvidia's increased 2.3%. The attach rate of GPUs to PCs for the quarter was 137%, which means only 73% of the PCs with embedded graphics are using them.

G.Skill First to Have High Speed SO-DIMMs Advanced Tested on Intel NUC Platform

CMTL, Computer Memory Test Labs, the industry's leading independent memory compatibility and functionality testing lab announced today that G.Skill's 4 GB and 8 GB 1866MHz DDR3L (low voltage, 1.35v) SO-DIMMs have received Advanced Tested certification on the Intel NUC D53427RKE platform with i5 Ivy Bridge processor.

CMTL's President, John Deters stated, "Having high speed G.Skill SO-DIMMs Advanced Tested on the D53427RKE platform is great news for the Intel NUC customer base. The Intel NUC form factor platform is really catching on in the industry based on the number of test requests we are receiving. The NUC D53427RKE with G.Skill's 1866 MHz speed SO-DIMM provides a high performance system solution in a small compact form factor."

Intel Brings Supercomputing Horsepower to Big Data Analytics

Intel Corporation unveiled innovations in HPC and announced new software tools that will help propel businesses and researchers to generate greater insights from their data and solve their most vital business and scientific challenges.

"In the last decade, the high-performance computing community has created a vision of a parallel universe where the most vexing problems of society, industry, government and research are solved through modernized applications," said Raj Hazra, Intel vice president and general manager of the Technical Computing Group. "Intel technology has helped HPC evolve from a technology reserved for an elite few to an essential and broadly available tool for discovery. The solutions we enable for ecosystem partners for the second half of this decade will drive the next level of insight from HPC. Innovations will include scale through standards, performance through application modernization, efficiency through integration and innovation through customized solutions."

Intel Announces "Thunderbolt ready" Upgrade Program for Motherboards, PCs

The past year has seen a flurry of Thunderbolt related activity. Already present on every current Apple Mac, Thunderbolt has continued to grow within PC circles. And the Thunderbolt ecosystem responded, with over 100 Thunderbolt devices now shipping and available, most certified for both Mac and PC. Thunderbolt makes new experiences possible and developers are seeking to take advantage of Thunderbolt's key benefits, including simultaneous data and display transfer, with speeds of up to 10 Gbps, and daisy-chain connectivity of up to six devices. Building upon that foundation, the first Thunderbolt 2 systems were introduced in October this year, with speeds up to 20 Gbps, and support for the DisplayPort 1.2 protocol. Thunderbolt is clearly the fastest, most versatile connection to your PC.

Now we have a new announcement for you - an exciting new program to quickly expand the footprint of Thunderbolt for desktop and workstation users. This new initiative is called "Thunderbolt ready", and it enables PC manufacturers to offer Thunderbolt upgradeable motherboards within desktop and workstation computers. By using a Thunderbolt card, Thunderbolt's blazing fast speed and uncompressed video capabilities can now be added to any motherboard that includes a GPIO header (general purpose input/output header), so even if your system doesn't have Thunderbolt it is now possible to "upgrade" to it. Users that are interested in adding Thunderbolt 2 technology to an existing Thunderbolt ready system can combine a Thunderbolt card with a growing number of enabled motherboards, all identified by the use of the "Thunderbolt ready" moniker. The Thunderbolt ready program makes it simple to identify which components work together to upgrade your PC with Thunderbolt 2 capability.

Intel Forms Group to Accelerate Internet of Things Market

Intel has created a new organization to accelerate and broaden its reach into market segments and applications commonly referred to as the Internet of Things (IoT). Called the IoT Solutions Group, this new organization will combine the Intelligent Systems Group and Wind River organizations, bringing together the intelligent systems hardware, software, services and platform elements together into one organization.

This is the next step in the company's ongoing activities supporting the proliferation of IoT implementations across the industry. Intel will deliver solutions for companies that are investing in technologies to both drive operating efficiencies and create new services by connecting devices to each other and the cloud to transform their businesses. The new organization will be led by Vice President and General Manager, Doug Davis, a long-time Intel leader and embedded industry veteran and will report directly to the executive office (President and CEO).

Intel Debuts Six New Celeron Mobile Processors

Intel has yesterday updated its processor offer, adding no less than six new models, all Celerons and all targeting mobile devices. This fresh batch is of ultra-low voltage variety and it includes two chips based on the Haswell architecture, the Celeron 2981U and 2957U, and four on the Silvermont architecture (and part of the Bay Trail-M line-up), the Celeron N2920, N2820, N2815 and N2806.

Frequency-wise, the processors go from 1.40 GHz to 2.13 GHz, but they don't really vary in terms of pricing as five of them cost $132, while only the Celeron 2981U goes for $137. More details in the table below.

TechPowerUp HWBOT Competition 2013

The TechPowerUp HWBOT team, in partnership with Intel, is announcing the TechPowerUp HWBOT Competition 2013. Spread across three tests which anyone can participate in - 3DMark 2001, 3DMark 03, and SuperPi 32M, the competition gives you the chance to win some cool new gear, including a Core i7-4770K quad-core processor, an AMD CPU and motherboard combo, and a PayPal cash prize. The contest is open from November 1, 2013 to December 15, 2013.

For more information, visit this page.
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