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Invensas Licenses xFD Technology, will be Demonstrated in Ultrabooks at CES 2013

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., announced today that its new xFD "DIMM-in-a-Package" memory technology has been licensed to an original equipment manufacturer (OEM), and this technology will be demonstrated in Intel-based Ultrabooks at CES 2013. These Ultrabooks contain SK hynix memory chips packaged with Invensas' xFD "DIMM-in-a-Package" memory technology and were built by a leading manufacturer of personal computers. Invensas will showcase the new Ultrabooks at the upcoming Pepcom Digital Experience event being hosted at CES 2013 in Las Vegas.

The DIMM-in-a-Package technology replaces Small-Outline-Dual-Inline-Memory-Modules (SODIMMs), traditionally used in notebook computers, with semiconductor package components that are approximately 80% smaller and offer significant cost and performance benefits. The product is designed to support standard Double-Data-Rate (DDR3 and DDR4) DRAM and Mobile DRAM chips, as well as Intel and ARM based processor architectures.

Tessera and Hynix Enter Into Eight-Year Patent Licensing Agreements

Tessera Technologies, Inc. announced today that its Tessera, Inc. and Invensas Corporation subsidiaries each entered into new eight-year patent license agreements with SK hynix Inc.

"We are delighted that these new and broader agreements build on our long-standing and positive relationship with SK hynix, which has become the first DRAM manufacturer to reach agreements that give it access to both our Tessera, Inc. and our Invensas Corporation patent portfolios," said Robert A. Young, chief executive officer and president, Tessera Technologies, Inc. "Multi-year agreements like these benefit our customers with secure pricing and provide us with running royalties that fund new innovations."

Invensas Unveils Multi-Die Face-Down Packaging Technology at IDF

Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced that it will demonstrate the dual-face down (DFD) implementation of its new multi-die face-down (xFD) packaging technology at the Intel Developer's Forum (IDF) in San Francisco September 13-15, 2011.

As a result of rapid growth in multi-core processing and computing virtualization, today’s data center servers require increased DRAM capacity and performance. New applications for notebook computers, tablets and smart phones also demand additional device performance balanced with battery life and reduced form-factor. A market-ready packaging platform, the Invensas xFD technology is cost-effective and improves capacity and performance for DRAM devices and memory modules.
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