News Posts matching "JEDEC"

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Team Group Announces mSATA MP1 SSD

Team Group, the global leading brand of memory storage launched on a brand new mSATA MP1 with only 1/8 size of general 2.5" SSD, which can meet JEDEC mSATA size specification. Focused on the lightest and thinnest volume and outstanding performance, it becomes perfect collocation of Notebook, Ultrabook, Tablet PC and NUC, etc.

Even though a small mechanism, mSATA MP1 SSD combines all the advantages of SSD in one- high speed, low power consumption, high stability and zero noise. mSATA MP1 supports SATA III, having 6Gb/s transmission rate, reading speed up to 530 MB/sec and writing speed up to 440 MB/sec. Compared with traditional mechanic HDD, it sharply decreases the time to wait for boot up, running program and windows operating and effectively increases operation efficiency. Meanwhile, parts of Ultrabook and PC/Notebook are either changed to built-in small capacity mSATA or installed with mSATA slot to respond market trend of pursuing light mobile device. Consumers have choice to purchase mSATA MP1 as system boot disk or go with HDD, which is used for disk cache to strengthen traditional disk performance. To compare with traditional HDD, mSATA MP1 can save you about 2 times boot operation time and significantly boost overall computer performance.

JEDEC Publishes Release 6 of the DDR3 SPD Standard

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of Release 6 of the DDR3 Serial Presence Detect (SPD) document. The updated standard, SPD4_01_02_11: SPD Annex K - Serial Presence Detect (SPD) for DDR3 SDRAM Modules (Release 6), describes new memory timing parameters and enables higher capacity memory modules, and may be downloaded free of charge from the JEDEC website.

"The DDR3 memory module market is in its full stride, with new applications pushing the technology into an ever-widening array of offerings, and the Serial Presence Detect is a reliable and consistent way to document the features of these new modules so that system software can tune system performance," said Mian Quddus, Chairman of JEDEC's JC-45 Committee for Dynamic Random Access Memory (DRAM) Modules. He added, "This release of the DDR3 SPD standard adds support for memory modules with up to 8 ranks of DDR3 SDRAMs, enabling 64GB per slot using mainstream 4Gb memory chips."

Samsung Develops Industry's First 8 Gb LPDDR4 Mobile DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has developed the industry's first eight gigabit (Gb), low power double data rate 4 (LPDDR4), mobile DRAM.

"This next-generation LPDDR4 DRAM will contribute significantly to faster growth of the global mobile DRAM market, which will soon comprise the largest share of the entire DRAM market," said Young-Hyun Jun, executive vice president, memory sales & marketing, Samsung Electronics. "We will continue introducing the most advanced mobile DRAM one step ahead of the rest of the industry so that global OEMs can launch innovative mobile devices with exceptional user convenience in the timeliest manner."

Samsung's new high-speed 8Gb LPDDR4 mobile DRAM will provide the highest level of density, performance and energy efficiency for mobile memory applications, enabling end users to have faster, more responsive applications, more advanced features, and higher resolution displays while maximizing battery life.

G.Skill Announces AEGIS Performance System Memory

G.Skill announced the AEGIS line of high-performance, standard-height DDR3 memory modules, for gaming PC builds. The modules are available with JEDEC-approved SPD profiles of DDR3-1333 MHz, and DDR3-1600 MHz; and in densities of up to 8 GB. The modules could make up solo and dual-channel kits. The modules are designed to run at DDR3-1333 at voltages of 1.35V, and rather timings of 9-9-9-24; and DDR3-1600 at 1.50V, and rather loose timings of 11-11-11-28. The modules feature black PCBs with heatspreaders that are basically sheets of aluminium, with die-cast prints on them. The modules are backed by lifetime warranties, G.Skill didn't announce pricing.

Team Group ZEUS Overclocking DDR3 Memory Modules Now Available

Zeus in ancient Greek mythology went against his father and unfair principles in his world. After ten years of war, he finally was able to take over the power and introduced to people political freedm and justice in agreements. Today, well known memory manufacturer - Team Group also decided to fight against the rules in our actual world by intoducing ZEUS Overclocking memory series. Normally it has 1600 MHz speed, but model is totally made for overclocking the systems to the maximum limits.

Memory "bones" works normally with voltage from 1.45V to 1.5V, which means it will be totally easy to tweak them into bigger speed with a little higher voltage. All pieces were hand picked and tested at the factory before entering the sales. Total height of Zeus memory is 3 cm, so they are fully suitable for any highend computers with popular lately gigantic CPU coolers.

JEDEC Publishes Universal Flash Storage (UFS) Standard v2.0

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of Universal Flash Storage (UFS) version 2.0. Developed for mobile applications and computing systems requiring high performance and low power consumption, the new UFS v2.0 standard offers increased link bandwidth for performance improvement, a security features extension as well as additional power saving features over the prior version. JESD220B Universal Flash Storage v2.0 may be downloaded free of charge from the JEDEC website: http://www.jedec.org/standards-documents/results/jesd220b

UFS is a high performance interface designed for use in computing and mobile systems requiring low power consumption such as smart phones and tablets. Its high speed serial interface and optimized protocol enable significant improvements in throughput and system performance.

Avexir Announces Core Gold Series Memory

In every Avexir office, there is hanging motto - "What we believe is how we behave". That is the mission and a way Avexir always wanted to act, so we could see that the manufacturer policy is in some points totally different from other memory brands. For example in Avexir factory after producing, each piece is tested on several computers and it goes to packaging and sales only if it fully pass the JEDEC tests. With this brand you know what you are buying.

Thanks to its quality policy Avexir is known as producer of high quality RAM, especially for those who like to overclock their systems. Today European market gets new model named Avexir Core GOLD with yellow LEDs. Memory serie supports Intel XMP 1.3 technology, which allows to overclock computer to the maximum and squeeze as much performance from PC as possible and not be satisfied only with factory defaults.

Greenliant Introduces Industrial Grade mSATA ArmourDrive SSD

Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, has entered the removable solid state drive (SSD) market and is sampling its new mSATA ArmourDrive GLS86 product line. Based on SATA NANDrive, using Greenliant's internally developed NAND controller, mSATA ArmourDrive is designed for applications that require industrial temperature capability, high reliability and long-life data storage.

mSATA ArmourDrive operates at extreme temperatures between -40 to +85 degrees Celsius with 1-bit-per-cell (SLC) or 2-bits-per-cell (MLC) NAND flash memory, which gives customers a dependable, industrial temperature mSATA SSD using cost-effective MLC NAND. Addressing the needs of space-constrained embedded systems, mSATA ArmourDrive measures 29.85mm x 50.80mm x 4.80mm (JEDEC MO-300).

Innodisk Releases World's First Industrial-Embedded SATA µSSD - nanoSSD

Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, announces a release of the industrial-embedded industry's first SATA device in accordance to SATA µSSD standards - nanoSSD.

Through the integration of a control chip, flash memory and peripheral power components into a single ball grid array (BGA) package, Innodisk has managed to reduce the size of the nanoSSD to approximately 1% the size of a 2.5" SSD. With dimensions of only 16 x 20 x 2 mm (WxLxH), a weight of only 1.5g, SATA III support, capacities ranging from 4 to 64 GB and both x86 and ARM compatibility, nanoSSD can be incorporated into a wide variety of applications where a small form-factor and high transfer rates are important, including industrial mobile devices, embedded systems, tablets, high-end smart phones and Ultrabooks.

Innodisk Releases DDR4 RDIMM Samples to Server Market

Innodisk is proud to be among the first to supply (DDR4) registered DIMM product samples to key server companies for their next-generation systems. With this announcement, Innodisk, an industry leader in DRAM modules for industrial applications and embedded systems, will continue to offer the most advanced technology to its customers. The result of almost eight years of development, DDR4 (Double Data Rate 4) technology improves on the previous generation, DDR3, in every way. These new memory products provide users with greater performance, but can still cut costs by saving power and space, and reducing waste heat.

DDR4 offers a giant leap in peak performance over DDR3 technology, with a 3.2 Gbps data transfer rate. In fact, DDR4 could eventually even surpass this already high rate, according to standards organization JEDEC, in the same way that DDR3 surpassed its initial ceiling of 1.6 Gbps. DDR4 memory bus speeds start at 2133MHz, which already offers a huge jump in potential performance from the average bus speed of 1333MHz and 1666MHz offered by DDR3.

AMD Working On Stripped-Down PlayStation 4 SoC for PCs

Ahead of its unveiling last week, it was expected that Sony's PlayStation 4 console would be driven by little more than an AMD A-Series "Trinity" APU. It ended up being a lot more than that. The custom-design SoC that drives the next-generation console is a joint effort between AMD and Sony, which integrates an 8-core x86-64 CPU based on the company's new "Jaguar" micro-architecture; a GPU based on its Graphics CoreNext technology; a GDDR5 integrated memory controller, and certain enhancements by Sony. In an interview with The Inquirer, the company hinted that it's interested in porting the SoC over to the PC platform, minus Sony's share of the development.

Toshiba Ships Samples of Industry's First Universal Flash Storage Devices

Toshiba Corporation and Toshiba America Electronic Components, Inc., a committed leader that collaborates with technology companies to create breakthrough designs, today announced that it began shipping samples of its 64-gigabyte (GB) embedded NAND flash memory module equipped with a Universal Flash Storage (UFS) interface. The first in the industry, the new module is fully compliant with the JEDEC UFS Ver.1.1 standard, and is designed for a wide range of digital consumer products - including smartphones and tablet PCs.

With improved data processing speeds in host chipsets and wider bandwidths for wireless connectivity, demand continues to grow for large density, high-performance memory that supports high resolution video. A proven innovator in this key area, Toshiba is reinforcing its leadership role by being the first in the industry to ship samples with a 64GB UFS module.

Micron Technology Samples New Single-Sided DDR3 DRAM Module

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, and TE Connectivity (TE), a world leader in connectivity, announced today the availability of a Single-Sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets and other thin and light devices. Aimed at providing a reduced-height memory solution for the ultrathin computing market, the new Single-Sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35 percent savings compared to 4.6 mm for a standard SODIMM solution.

Micron's Single-Sided SODIMM is available in a 4 GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.

Super Talent Announces Green Very Low Profile (VLP) Memory

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, introduces its updated green memory modules.
With no tradeoffs in price or performance, choosing VLP DIMMs for computing can have an enormous environmental impact when the hundreds of thousands of memory modules produced monthly are taken into account.

"Decreasing overhead in a data center is an easy way for a company to reduce costs. With Super Talent's Green Memory, power and cooling costs can be easily cut while maintaining speed and reliability for a company," said Shimon, VP of Engineering, Super Talent Technology.

Micron Extends Portfolio of Phase Change Memory for Mobile Devices

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced the addition of a new product to its Phase Change Memory (PCM) portfolio. With high-volume shipments of its 45-nanometer (nm), 1-gigabit (Gb) PCM-based multichip package (MCP) solution for mobile devices well underway, the company is now sampling a 512-megabit (Mb) PCM plus 512Mb LPDDR2 MCP that offers greater flexibility in terms of application requirements. The company also announced that it has been shipping 1Gb PCM to one of the world's leading mobile device manufacturers, Nokia, for use in their recently announced phones.

As the first company in the world to ship PCM solutions in volume, Micron is building on its close cooperation with chipset vendors, enablers and handset manufacturers to meet growing market demand for PCM. Nokia is using Micron's PCM solution to enrich the functionality of select devices in its portfolio.

OCMemory Launches Hynix-Based DDR3-2400 MHz Memory that Stays Cool without Heatsinks

Japanese PC memory maker OCMemory launched a new line of high-speed PC memory that stays cool without need fancy heatsinks or heatspreaders. The OCM2400CL10D-8GBN, launched in the series, takes advantage of Hynix high-density CFR DRAM chips to achieve DDR3-2400 MHz speeds, with timings of 10-12-12-31, and 1.65V, without needing any additional cooling components. In addition to a JEDEC-approved DDR3-1600 MHz fallback SPD profile, it includes an XMP profile to use its advertised speeds. The sticks use 8-layer black PCBs to improve signaling efficiency. The kit includes two 4 GB modules, and is priced at 6,000¥ ($72).

Source: Hermitage Akihabara

NAND Flash Interface Interoperability Standard Gets Published

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, and the Open NAND Flash Interface Workgroup (ONFI) today announced the publication of JESD230 NAND Flash Interface Interoperability Standard (Package). This jointly developed document defines a standard for NAND flash device interface interoperability. JESD230 is available for free download from both www.jedec.org and onfi.org.

JESD230 addresses signaling descriptions, packages, definitions, abbreviations and conventions, and is backwards compatible with existing technologies to the greatest degree possible. The standard will help enable the design of interoperable systems that can support Asynchronous SDR, Synchronous DDR and Toggle DDR NAND flash devices.

Apacer rolls out DDR3 SO-RDIMM, for Networking and Mission Critical Applications

The rapidly developingcloud-based services have brought prospective impact on the enterprise-level storage device, network communication equipment and high-end server.To meet the enterprises' demand for powerful computing, Apacer, the global professional manufacturer of the memory module, launchesDDR3-1333 SO-RDIMM.It's the special memory module tailored for the Mission Critical Application and the Networking System device. As the product features compactness, high-processing speed and high stability brought by registering clock driver with parity chip, it can offer enterprises the multi-advantage storage device in a cloud-based operating environment.

Apacer Launches mSATA Mini SSD Module Optimized for Compactness

Consistently devoted to the compactness and lightweight of the terminal devices, Apacer, one of top ten PC SSD manufacturers in the world, rolls out mSATA Mini M4 SSD of Small Form Factor (SFF for short) today to meet the market demands. The product is only 26.8 × 29.85 mm in size. Compared with mSATA SSD adopting JEDEC MO-300 standard specification, this latest model has its size reduced by over 1/2. Featuring ultra-compactness and slimness, it can break through the physical limit of the spatial design, and significantly reduce the size and weight of the terminal device. In addition, it also boasts anti-shock, anti-vibration and low power consumption, thus enabling itself to become the most reliable storage choice for the portable devices applied in the military, medical equipment, on-board navigation system, tablet computer, etc.

Transcend Announces New 32GB and 16GB DDR3 Registered Memory Modules

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, today launched two new DDR3 memory modules: a 32GB DDR3 1333 MHz Registered DIMM (RDIMM) and a 16 GB DDR3 1600 MHz Very Low Profile (VLP) Registered DIMM. Featuring stable signal integrity at high frequency operation and an onboard thermal sensor for better system thermal control, these high capacity RDIMMs provide better expandability options to server administrators. Additionally, both new modules feature high quality aluminum heat spreaders to ensure optimal heat dispersion and stability.

Aimed at high-powered servers, Transcend's largest capacity 32 GB DDR3-1333 modules significantly increase memory density in servers that support 32 GB RDIMMs (up to a maximum 2 TB), such as IBM's System x3850/3950 X5 and BladeCenter HX5. The new modules are rated at 1333MHz with timings of 9-9-9-24, and operate at industry standard 1.5V. Comprised of high-quality 8 Gb DRAM chips that fully comply with rigorous JEDEC (Joint Electron Device Engineering Council) standards, Transcend's 32GB DDR3 memory offers unparalleled performance and stability.

JEDEC Announces Publication of DDR4 Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the initial publication of its widely-anticipated Synchronous DDR4 (Double Data Rate 4) standard. JEDEC DDR4 (JESD79-4) has been defined to provide higher performance, with improved reliability and reduced power, thereby representing a significant achievement relative to previous DRAM memory technologies. The new DDR4 standard is available for free download from the JEDEC website at http://www.jedec.org/standards-documents/results/jesd79-4%20ddr4.

DDR4 offers a range of innovative features designed to enable high speed operation and broad applicability in a variety of applications including servers, laptops, desktop PCs and consumer products. In addition to the advantages described later in this release, the new technology has been defined with a goal of simplifying migration and enabling adoption of an industry-wide standard.

Samsung Begins Mass Producing World's Highest Density (128GB) Embedded NAND Storage

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun volume production of 128-gigabyte (GB) embedded memory for next-generation smartphones, tablets and other mobile devices. Samsung started producing the new 128GB eMMC (embedded multimedia card) Pro Class 1500 in late August, which is only one month after it started delivering eMMC Pro products in 16-, 32- and 64-GB densities, rapidly completing the industry’s widest line-up of eMMC products.

“By doubling the highest density of its previous eMMC products, Samsung expects to contribute significantly to a timely release of leading-edge mobile devices,” said Wanhoon Hong, executive vice president, Memory Sales & Marketing, Samsung Electronics. “The higher data storage and faster data transmission will bring a range of benefits to users that compare to those of ultra-slim notebook PCs.”

ECS First to Add AMD Memory Profile Support

Elitegroup Computer Systems (ECS) today announces that it is the first hardware manufacturer to support the latest AMD Memory Profile (AMP) on its innovative platform: A85F2-A Deluxe motherboard. It has been ready to take full advantage of the performance, high end gaming, multi-tasking and energy efficiency with the most anticipating technology “AMP”, allowing users to fully satisfy their growing demand with its unique operating designed.

With striving on Research and Development and also closely cooperation with AMD, ECS is honored to become the first AMD Memory Profile (AMP) certified motherboard vendor in the world. The upcoming AMD Memory Profile (AMP) not only breaks through the traditional design, it also enables the performance tuning of DDR3 memory modules beyond standard JEDEC (Joint Electron Devices Engineering Council) specification.

Micron Announces Availability of Phase Change Memory for Mobile Devices

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an industry first with high-volume availability of its 45-nanometer (nm) Phase Change Memory (PCM) for mobile devices, featuring 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package. As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

PCM provides enhanced boot time, simplifies software development and boosts performance with overwrite capability. It also provides very low power consumption and extremely high reliability. In addition, the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with JEDEC industry standards.

JEDEC Updates Universal Flash Storage (UFS) Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of key updates to its Universal Flash Storage (UFS) standard. Specifically tailored for mobile applications and computing systems requiring high performance and low power consumption, the new UFS v1.1 standard is an update to the v1.0 standard published in 2011, incorporating feedback from industry UFS technology implementers. JESD220A Universal Flash Storage v1.1 contains important amendments and references to the latest related MIPI Alliance specifications, and may be downloaded free of charge from the JEDEC website here.

JEDEC has also published a complementary standard, JESD223A UFS Host Controller Interface (HCI) v1.1. JESD223A defines a standard host controller interface on which system designers can create a common host controller software driver layer to work with UFS host controller hardware from different manufacturers. The HCI functionality also enables higher performance and power efficiency by minimizing the involvement of the host processor in the operation of the Flash storage subsystem. JESD223A Universal Flash Storage Host Controller Interface v1.1 may also be downloaded free of charge here.
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