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Apacer rolls out DDR3 SO-RDIMM, for Networking and Mission Critical Applications

The rapidly developingcloud-based services have brought prospective impact on the enterprise-level storage device, network communication equipment and high-end server.To meet the enterprises' demand for powerful computing, Apacer, the global professional manufacturer of the memory module, launchesDDR3-1333 SO-RDIMM.It's the special memory module tailored for the Mission Critical Application and the Networking System device. As the product features compactness, high-processing speed and high stability brought by registering clock driver with parity chip, it can offer enterprises the multi-advantage storage device in a cloud-based operating environment.

Apacer Launches mSATA Mini SSD Module Optimized for Compactness

Consistently devoted to the compactness and lightweight of the terminal devices, Apacer, one of top ten PC SSD manufacturers in the world, rolls out mSATA Mini M4 SSD of Small Form Factor (SFF for short) today to meet the market demands. The product is only 26.8 × 29.85 mm in size. Compared with mSATA SSD adopting JEDEC MO-300 standard specification, this latest model has its size reduced by over 1/2. Featuring ultra-compactness and slimness, it can break through the physical limit of the spatial design, and significantly reduce the size and weight of the terminal device. In addition, it also boasts anti-shock, anti-vibration and low power consumption, thus enabling itself to become the most reliable storage choice for the portable devices applied in the military, medical equipment, on-board navigation system, tablet computer, etc.

Transcend Announces New 32GB and 16GB DDR3 Registered Memory Modules

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, today launched two new DDR3 memory modules: a 32GB DDR3 1333 MHz Registered DIMM (RDIMM) and a 16 GB DDR3 1600 MHz Very Low Profile (VLP) Registered DIMM. Featuring stable signal integrity at high frequency operation and an onboard thermal sensor for better system thermal control, these high capacity RDIMMs provide better expandability options to server administrators. Additionally, both new modules feature high quality aluminum heat spreaders to ensure optimal heat dispersion and stability.

Aimed at high-powered servers, Transcend's largest capacity 32 GB DDR3-1333 modules significantly increase memory density in servers that support 32 GB RDIMMs (up to a maximum 2 TB), such as IBM's System x3850/3950 X5 and BladeCenter HX5. The new modules are rated at 1333MHz with timings of 9-9-9-24, and operate at industry standard 1.5V. Comprised of high-quality 8 Gb DRAM chips that fully comply with rigorous JEDEC (Joint Electron Device Engineering Council) standards, Transcend's 32GB DDR3 memory offers unparalleled performance and stability.

JEDEC Announces Publication of DDR4 Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the initial publication of its widely-anticipated Synchronous DDR4 (Double Data Rate 4) standard. JEDEC DDR4 (JESD79-4) has been defined to provide higher performance, with improved reliability and reduced power, thereby representing a significant achievement relative to previous DRAM memory technologies. The new DDR4 standard is available for free download from the JEDEC website at http://www.jedec.org/standards-documents/results/jesd79-4%20ddr4.

DDR4 offers a range of innovative features designed to enable high speed operation and broad applicability in a variety of applications including servers, laptops, desktop PCs and consumer products. In addition to the advantages described later in this release, the new technology has been defined with a goal of simplifying migration and enabling adoption of an industry-wide standard.

Samsung Begins Mass Producing World's Highest Density (128GB) Embedded NAND Storage

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun volume production of 128-gigabyte (GB) embedded memory for next-generation smartphones, tablets and other mobile devices. Samsung started producing the new 128GB eMMC (embedded multimedia card) Pro Class 1500 in late August, which is only one month after it started delivering eMMC Pro products in 16-, 32- and 64-GB densities, rapidly completing the industry’s widest line-up of eMMC products.

“By doubling the highest density of its previous eMMC products, Samsung expects to contribute significantly to a timely release of leading-edge mobile devices,” said Wanhoon Hong, executive vice president, Memory Sales & Marketing, Samsung Electronics. “The higher data storage and faster data transmission will bring a range of benefits to users that compare to those of ultra-slim notebook PCs.”

ECS First to Add AMD Memory Profile Support

Elitegroup Computer Systems (ECS) today announces that it is the first hardware manufacturer to support the latest AMD Memory Profile (AMP) on its innovative platform: A85F2-A Deluxe motherboard. It has been ready to take full advantage of the performance, high end gaming, multi-tasking and energy efficiency with the most anticipating technology “AMP”, allowing users to fully satisfy their growing demand with its unique operating designed.

With striving on Research and Development and also closely cooperation with AMD, ECS is honored to become the first AMD Memory Profile (AMP) certified motherboard vendor in the world. The upcoming AMD Memory Profile (AMP) not only breaks through the traditional design, it also enables the performance tuning of DDR3 memory modules beyond standard JEDEC (Joint Electron Devices Engineering Council) specification.

Micron Announces Availability of Phase Change Memory for Mobile Devices

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an industry first with high-volume availability of its 45-nanometer (nm) Phase Change Memory (PCM) for mobile devices, featuring 1-gigabit (Gb) PCM plus 512-megabit (Mb) LPDDR2 in a multichip package. As the first company in the world currently offering PCM solutions in volume production, Micron is providing chipset vendors, enablers, and handset manufacturers with a proven product that meets the expanding needs of today's wireless market and paves the way for enhanced features and capabilities.

PCM provides enhanced boot time, simplifies software development and boosts performance with overwrite capability. It also provides very low power consumption and extremely high reliability. In addition, the design-optimizing shared interface between LPDDR2 and PCM is fully compliant with JEDEC industry standards.

JEDEC Updates Universal Flash Storage (UFS) Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of key updates to its Universal Flash Storage (UFS) standard. Specifically tailored for mobile applications and computing systems requiring high performance and low power consumption, the new UFS v1.1 standard is an update to the v1.0 standard published in 2011, incorporating feedback from industry UFS technology implementers. JESD220A Universal Flash Storage v1.1 contains important amendments and references to the latest related MIPI Alliance specifications, and may be downloaded free of charge from the JEDEC website here.

JEDEC has also published a complementary standard, JESD223A UFS Host Controller Interface (HCI) v1.1. JESD223A defines a standard host controller interface on which system designers can create a common host controller software driver layer to work with UFS host controller hardware from different manufacturers. The HCI functionality also enables higher performance and power efficiency by minimizing the involvement of the host processor in the operation of the Flash storage subsystem. JESD223A Universal Flash Storage Host Controller Interface v1.1 may also be downloaded free of charge here.

Greenliant Enters e.MMC Market With Full I-temp NANDrive SSD

Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, is now sampling its e.MMC NANDrive GLS85VM embedded solid state drive (SSD) product family to select customers. The new NANDrive devices support the JEDEC e.MMC 4.4 standard and are backward compatible with 4.3. While the JEDEC operating temperature range specification is -25 to +85 degrees Celsius, e.MMC NANDrive operates at full industrial temperatures between -40 and +85 degrees Celsius, giving customers data storage that can withstand the most severe conditions.

e.MMC NANDrive combines Greenliant's internally developed NAND controller with NAND flash die for a fully integrated SSD in a multi-chip package. It is available with 2-bits-per-cell (MLC) or 1-bit-per-cell (SLC) NAND to meet varying customer requirements for lifespan, endurance and performance. Measuring 14mm x 18mm, e.MMC NANDrive is offered in a 100 ball grid array (BGA) package, with 1mm ball pitch for increased long-term reliability.

Apacer Intros 16 GB DDR3-1600 ECC RDIMM for Emerging Cloud Computing Market

As cloud computing becomes a more mature sector of the IT industry, most enterprises have already regarded this technology as a key point in the building of future information architectures to meet the needs of massive data processing. To better address the high demands for cloud computing, Apacer, a leading memory module manufacturer, has announced an industry-leading and enterprise-level 16GB bulk storage DDR3-1600 high-speed server memory module.

It uses both internal and external voltage reference (Vref.) circuits, allowing the storage system to directly use external Vref. with high efficiency while eliminating signal noise. It helps to facilitate continuous massive data processing and helps to optimize the cloud computing and storage performance in those environments, giving a more stable server storage experience.

Apacer Rolls Out Compact High-Speed mSATA Industrial SSD for Ultrabooks

SSDs, with their advantages of high performance, compactness and low power consumption, are the perfect adaptation of storage products to the emergence of tablet PCs and Ultrabooks. Indeed, SSDs have become the defacto storage solution for ultra-thin notebooks. Apacer, a leading manufacturer of industrial SSDs, understands the demands for even more compactness and has produced a new mSATA A1 modular SSD that features a SATA 3.0 high-speed transmission interface and complies with JEDEC MO-300 standard codes. Currently, this model supports Intel Rapid Start and Intel Smart Response technologies, enabling users to enjoy an almost immediate start-up within seconds and enjoy a continuous high performance of the computer.

Team Group Launches Industrial Memory Modules

The largest professional computer show in Asia, the COMPUTEX TAIPEI, is coming on June 5. Team Group Inc., one of the leading memory manufacturers in the world, is ready to reveal its latest industrial memory modules to professional buyers around the world, including industrial-standard and server-grade memory modules, embedded industrial flash memories, and so on. The emphasis on customization, product performance and after-sale service quality are the live demonstration of how Team Group is determined for the industrial grade/SI market.

Team Group’s industrial memory modules come with Standard series, Green series and Wide temperature series. The modules are produced with chips from original manufacturers and go through multiple meticulous and sophisticated verification analyses and hi-low temperature tests. The Wide temperature series is capable of working at the temperature ranging from -40℃ to 95℃, and provides stable operation performance even in conditions as punishing as at a desert or in arctic environment. The Green series works only with minimal voltage as low as 1.35V. You cannot be any greener than that. The newly developed high frequency and large volume memory modules complete the full product series for various demands in medial equipment, surveillance systems and industrial computers.

Princeton Intros 12 New DDR3-1600 Memory Kits

With the advent of Intel's Core "Ivy Bridge" processors, and DDR3-1600 MHz becoming a standard memory speed, there is a push among memory vendors for affordable memory kits supporting the standard. Princeton Japan launched no less than 12 new memory kits, spanning across standard DIMMs, SO-DIMMs (for notebooks and AIOs); single-module and dual-channel kits, with module densities of 2 GB, 4 GB, and 8 GB. The modules bear basic appearance, and lack fancy heatspreaders. The modules achieve their rated speed of 1600 MHz DDR with a CAS latency as high as 11T, and module voltage of 1.5V. The modules are hence JEDEC PC3-12800 specifications compliant, and don't require XMP profiles to operate at advertised speeds, on compatible platforms. The company is providing lifetime warranty. Prices start at 5,400 JPY (US $68).

Source: Hermitage Akihabara

Apacer Rolls Out New DDR3-1600 16GB ECC RDIMM

As cloud computing becomes mature, most enterprises have already regarded this innovative management technology as the key point to building future information architecture so as to meet the needs for the massive data processing. To fully meet the stringent demands for cloud computing, Apacer, the leading memory module manufacturer, rolls out industry-leading enterprise-level 16GB bulk storage DDR3-1600 high-speed server memory module.

It uses both internal and external voltage reference(Vref.) circuits, allowing the storage system to directly use external Vref. with high efficiency while eliminating signal noise. It provides powerful computing to process on-going massive data, optimizes cloud computing and storage performance and realizes the most stable server storage environment.

JEDEC Announces Publication of LPDDR3 Standard for Low Power Memory Devices

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-3 LPDDR3 Low Power Memory Device Standard, designed to satisfy the performance and memory density demands of the latest generation of mobile devices such as smartphones, tablets, ultra-thin notebooks and similar connected devices on the newest, high-speed 4G networks.

LPDDR3 offers a higher data rate, improved bandwidth and power efficiency, and higher memory densities over its groundbreaking predecessor, LPDDR2. Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, the LPDDR3 Low Power Memory Device Standard is available for free download from the JEDEC website: http://www.jedec.org/sites/default/files/docs/JESD209-3.pdf.

Green House Intros New 8 GB DDR3-1333 Memory Modules

Green House Japan released a pair of new 8 GB DDR3-1333 MHz (PC3-10600) memory modules. These consist of the GH-DRT1333-8GB and GH-DVT1333-8GB, which are 240-pin standard DIMM, and differ by the former having lifetime warranty, while the latter has 5 year warranty; and GH-DNT1333 and GH-DWT1333, which are 204-pin SO-DIMM modules with lifetime and 5-year warranties, respectively. Both kinds of modules are JEDEC standards-compliant, and run at DDR3-1333 MHz speeds with CAS latency of 9T, and 1.50V DRAM voltage.

Source: Hermitage Akihabara

Team Group Industrial Control Wide Temperature Series Memory Announced

Team Group Inc. has been invested a great deal of efforts in developing commercial products that catch up with global trends. Now we are expanding our spectrum to industrial markets and dedicate ourselves in the development of industrial products that features high standard and resistance to extreme environmental conditions. This year, Team Group rolls out the new industrial control memory module series, including Registered DIMM, ECC U-DIMM, VLP U-DIMM and Micro-DIMM, in the largest embedded system exhibition, the ESEC, in Japan.

The "industrial control wide-temperature series," the point in the show, is the "mighty warrior" that is able to operate in an environment at a temperature ranging from -40°C to 95°C. It is like operating stably in an extreme environment in the Arctic Circle or a scorching desert. This is absolutely the top choice for your industrial control memories and server memories.

IDT Introduces Low-power, High-accuracy Temperature Sensor for Solid State Drives

Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced a new family of precision temperature sensors targeted at ultra-low-power solid state drive applications. This new family of devices minimizes power consumption and optimizes bill-of-materials (BOM) costs while maintaining compatibility with existing standards for high-volume memory modules.

The IDT TS3000GB0A0 is a low-power, high-accuracy temperature sensor for enterprise server and storage applications. It supports a 1.8 V power supply for reduced power consumption and compatibility with the existing supply voltage for SSD memory modules, eliminating the need for additional voltage regulators.

JEDEC Announces Plans to Standardize Non-Volatile Wireless Memory

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that its JC-64 Committee for Embedded Memory Storage and Removable Memory Cards has formed a Subcommittee focused on the standardization of non-volatile wireless memory. To be chaired by Nokia and vice-chaired by Micron Technology and Samsung Semiconductor, the JC-64.9 Subcommittee for Wireless Memory welcomes interested companies worldwide to participate by joining JEDEC or calling 703-907-7560 for more information.

Wireless memory is rapidly emerging as the next generation in data transfer technology, and is intended to enable fast, wireless connectivity with read/write capability between mobile devices (Wireless Memory Hosts) and battery-free memory tags (Wireless Memory Tags).

I-O Data Outs Value 8 GB DDR3 Memory Module

I-O Data of Japan introduced a new value 8 GB DDR3 memory module (model: DY1333-8G). The module runs at JEDEC-specified speeds of DDR3-1333 MHz, with 9-9-9-24/CR-1T timings, with 1.5V module voltage. The module is sold standalone, and in 16 GB dual-channel kits (model: 8GX2 DY1333). It features standard 240pin UDIMM dimensions, without any heat-spreaders. The single-module kit is priced at 18,060 JPY (US $217.2), while the dual-channel kit goes for 35,280 JPY (US $424.4).

Source: Hermitage Akihabara

Transcend Launches New Server-Class DDR3 Memory Modules

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB DDR3-1600 Registered DIMM (RDIMM) and 8GB DDR3L-1333 Low Voltage RDIMM modules. Fully compatible with the latest generation of Intel Xeon and Core i7 processors, the cost-effective DDR3 memory modules provide increased memory density and higher performance, while significantly reducing power consumption.

As Transcend's highest density DDR3 module, the 16GB DDR3-1600 RDIMM is constructed with top quality 4 Gb DDR3 1 Gbx4 35nm DRAM chips that deliver stable performance and durability. A single 16 GB memory module can lower power consumption by a staggering 75% compared with using four 4 GB modules, thereby saving energy and costs. The 16GB DDR3 module is rated at 1600 MHz with low latency of 11-11-11-28 and an operating voltage of a mere 1.5V. Offering memory bandwidth up to 12.8 GB/s and the flexibility to expand maximum capacity to 96 GB (per processor), the 16GB DDR3-1600 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.

SMART Modular Technologies Announces 64GB DDR3 Load-Reduced DIMM

SMART Modular Technologies ("SMART Modular"), a leading independent manufacturer of memory modules and embedded flash products announces its 64GB DDR3 load-reduced DIMM (LRDIMM). SMART Modular's 64GB LRDIMM is optimized for high-end servers and will be launching in Q2'12 to serve scientific, engineering, and financial computing applications that require high memory capacity and performance. Specifically, this product targets next-generation Intel Sandy Bridge and Ivy Bridge server platforms for high-performance computing applications.

The new LRDIMM combines innovative module packaging technology leveraging off-the-shelf commodity DRAMs to provide the industry's highest density LRDIMM at the lowest possible cost. Highlighting SMART Modular's design expertise, the new 64GB LRDIMM utilizes a single JEDEC-compliant memory buffer chip, a dual PCB structure and a leading edge interconnect technology to provide maximum performance and density while achieving server-grade quality and reliability.

JEDEC and IPC Cover Non-IC Electronic Components in Latest Update of Standard for SMD

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes. J-STD-033C effectively provides guidance for this category of electronic components that has not been covered by any standard in the past.

IPC/JEDEC J-STD-033C provides surface mount device (SMD) manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Use of the standard helps achieve safe and damage-free reflow with the dry-packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags.

JEDEC Publishes Breakthrough Standard for Wide-IO Mobile DRAM

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the availability of a new standard for Wide I/O mobile DRAM: JESD229 Wide I/O Single Data Rate (SDR). Widely anticipated by the industry, Wide I/O mobile DRAM is a breakthrough technology that will meet industry demands for increased levels of integration as well as improved bandwidth, latency, power, weight and form factor; providing the ultimate in performance, energy efficiency and small size for smartphones, tablets, handheld gaming consoles and other mobile devices. JESD229 may be downloaded free of charge from the JEDEC website here.

Wide I/O mobile DRAM enables chip-level three dimensional (3D) stacking with Through Silicon Via (TSV) interconnects and memory chips directly stacked upon a System on a Chip (SoC). The standard defines features, functionalities, AC and DC characteristics, and ball/signal assignments. It is particularly well-suited for applications requiring extreme power efficiency and increased memory bandwidth (up to 17GBps). Examples include 3D Gaming, HD Video (1080p H264 video, pico projectors), and running multiple applications simultaneously. Wide I/O offers twice the bandwidth of the previous generation standard, LPDDR2, at the same rate of power consumption.

Buffalo Unveils New 8 GB Memory Modules

Buffalo Japan unveiled new 8 GB memory modules in the 204-pin SO-DIMM and standard 240-pin DIMM form-factors. These modules pack 8 GB capacity, and stick to JEDEC DDR3-1333 MHz standards. Featured in the D3N1333 series, these modules 1024M x 64bit DIMM configuration. They achieve 1333 MHz speeds with CAS latency of 9T and DRAM voltage of 1.5V. The Buffalo Tools software comes bundled with these modules. The two are priced at 26,670 JPY, around US $341.6.

Source: Hermitage Akihabara
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