News Posts matching "LGA1150"

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Intel Exits Desktop Board Business

Intel decided to quit the PC motherboard business by shutting down its Desktop Board brand. To company will begin shrinking its motherboard product line with the arrival of socket LGA1150 Core "Haswell" processors, and eventually leave the market within 3 years. One can draw three distinct inferences from this move. First, Intel's Desktop Board lineup is too bloated, and the desktop form-factor is on a rapid decline in relation to the rest of the PC industry. Second, with the emergence of new high-volume brands in the motherboard industry, Intel is finding its lineup out of place.

Third, and more interestingly, this could be a move by Intel to pacify other motherboard vendors about the impending transition of a bulk of the motherboard volume from changeable CPU socket to hardwired BGA, which is bound to happen in a couple of years from now. Other vendors expressed apprehensions over the transition to BGA believing such a more could make Desktop Board put them out of business. Intel's Desktop Board team will instead spend resources in developing new form-factors such as the NUC.Source: PC World

ASRock Misses Motherboard Sales Target for 2012, Ships 7.5 Million

ASRock joined the likes of ASUS, Gigabyte, and others, in missing its motherboard sales target for 2012. According to the latest figures with DigiTimes, the company shipped 7.5 million motherboards in 2012, which is quite a bit short of its modest target of 9 million, given its 2011 shipments of 8 million.

According to industry analysts, the Pegatron subsidiary is expected to see a flat performance at best, in 2013, despite the fact that Intel is launching a brand new socket (LGA1150), prompting higher motherboard sales. In 2012, Intel retained its LGA1155 socket from the 2011-launched "Sandy Brige" platform, and inter-compatibility between its 2nd and 3rd generation Core processors may have stunted sales of its 7-series chipset products.

Source: DigiTimes

Intel Core "Haswell" Delayed till Computex 2013, No Show at CES

It looks like Intel's Core "Haswell" processor family will miss its anticipated March-May launch window, with the company choosing Computex 2013 as its next launch-pad. According to a leaked document intended for distributors and large retailers, desktop Core "Haswell" processors will launch only after May 27, before June 7, and retailers are told to hold off advertising the launch till June 2nd.

Among the products featuring in the new May 27 - June 7 launch window are the Core i7-4770K flagship product, i7-4770, i7-4770S, i7-4770T, i7-4765T, i5-4670K, i5-4670, i5-4670S, i5-4670T, i5-4570, i5-4570S, i5-4570T, i5-4430, and i5-4430S, all of which are quad-core parts. In addition, socket LGA1150 motherboards based on Intel Z87 (flagship, OC-ready), H87, Q87, Q85, and B85 chipsets, will be launched. In all likelihood, one piece of decoration the CES venue could miss, is the wall of LGA1150 motherboards, which is usually put up by Intel.

Arctic Leaks Bucket List of Socket LGA1150 Processor Model Numbers

CPU cooler manufacturer Arctic (aka Arctic Cooling) may have inadvertently leaked a very long list of 4th generation Intel Core processors based on its LGA1150 socket. Longer than any currently posted lists of Core "Haswell" processors, the leak includes model numbers of nine Core i7, seventeen Core i5, five Core i3, and two Pentium models. Among the Core i7 models are already known i7-4770K flagship chip, i7-4770S, and a yet-unknown i7-4765T. The Core i5 processor list is exhaustive, and it appears that Intel wants to leave no price-point unattended. The Core i5-4570K could interest enthusiasts. In comparison to the Core i5 list, the LGA1150 Core i3 list is surprisingly short, indicating Intel is serious about phasing out dual-core chips. The Pentium LGA1150 list is even shorter.

The list of LGA1150 processor models appears to have been leaked in the data-sheets of one of its coolers, in the section that lists compatible processors. LGA1150 appears to have the same exact cooler mount-hole spacing as LGA1155 and LGA1156 sockets, and as such upgrading CPU cooler shouldn't be on your agenda. Intel's 4th generation Core processor family is based on Intel's spanking new "Haswell" micro-architecture, which promises higher performance per-core, and significantly faster integrated graphics over previous generation. The new chips will be built on Intel's now-mature 22 nm silicon fabrication process. The new chips will begin to roll out in the first-half of 2013.

Source: Expreview

Intel Haswell and Broadwell Silicon Variants Detailed

It's no secret that nearly all Intel Core processors are carved out of essentially one or two physical dies, be it the "2M" die that physically features four cores and 8 MB of L3 cache, or the "1M" die, which physically features two cores and 4 MB of L3 cache. The two silicons are further graded for energy-efficiency and performance before being assigned a package most suited to them: desktop LGA, mobile PGA, mobile BGA, and with the introduction of the 4th generation Core "Haswell," SoC (system on chip, a package that's going to be a multi-chip module of the CPU and PCH dies). The SoC package will be designed to conserve PCB real-estate, and will be suited for extremely size-sensitive devices such as Ultrabooks.

The third kind of grading for the two silicons relates to its on-die graphics processor, which makes up over a third of the die area. Depending on the number of programmable shaders and ROPs unlocked, there are two grades: GT2, and GT3, with GT3 being the most powerful. On the desktop front (identified by silicon extension "-DT,") Intel very much will retain dual-core processors, which will make up its Core i3, Pentium, and Celeron processor lines. It will be lead by quad-core parts. All desktop processors feature the GT2 graphics core.

Is Haswell the Last Interchangeable Intel Client Processor?

The processor-motherboard combination as PC enthusiasts know it could end, with Intel LGA1150 processors under the "Haswell" micro-architecture, likely to becoming the last client processors to ship in the retail channel (processor-in-box). Future Intel client processors, codenamed "Broadwell" could ship only in BGA (ball-grid array) packages, with existing motherboard vendors selling their products with processors permanently soldered onto them. The information comes from Japanese PC Watch, which cites sources in the PC industry.

With a compacted socket-processor launch cycle that spans nearly 2 years under the company's "tick-tock" product strategy, the scope for processor updates in the client computing industry might be lower than what it was in the LGA775 days. Perhaps statistics at Intel don't show a sizable proportion of people upgrading processors on existing motherboards, or upgrading motherboards while retaining the processor, rather buying a combination of the two, not to mention the fact that pre-built PCs outsell DIY assembled ones in major markets. With the processor being "tied" to the motherboard, Intel gets room to compact the platform further, combining processor and core logic completely into a single package. It's likely that Intel could still leave processor interchangeability to its HEDT (high-end desktop) platform, which sees processors start at $300, and motherboards at $200.Source: X-bit Labs

Did ECS Just Blurt Out Names of 8-Series Motherboards?

ECS has less than stable RSS and media channels (to our advantage). It may have accidentally blurted out model names of at least three upcoming Intel 8-series chipset based motherboards, for socket LGA1150 Core "Haswell" processors. Among the three are Z87H3-AX Extreme, Z87H3-AX Golden, and H87H3-M4. The two Z87H3-AX motherboards, going by the company's current 7-series chipset motherboard lineup, appear to be identical, with the Z87H3-AX Golden pimping out with gold-colored components and heatsinks. The boards will likely max out the feature-set of Intel's "Lynx Point" chipset family. The Z87 PCH succeeds the current Z77, in supporting overclocking, in addition to all features of the platform, including Small Business Advantage. The H87H3-M4 sounds like the name typically given by ECS to a micro-ATX motherboard based on the H87 chipset. H87 supports nearly every feature the Z87 does, except CPU overclocking.

Thermolab Intros LP53 Low-Profile CPU Cooler

Korean PC cooling components maker Thermolab introduced LP53, a new low-profile CPU cooler. Measuring 100 x 94 x 53 mm (WxDxH), and weighing 410 g (owing to its material), the cooler is made of a dense copper fin stack that is arranged along the plane of the motherboard, to which heat drawn from a copper CPU base is conveyed by two 8 mm-thick copper heat pipes. The heatsink is ventilated by a 92 mm PWM-controlled fan, which spins at 1,000~2,000 RPM, with 16~27.1 dBA noise output. The cooler supports Intel LGA115x mount hole spacing, which makes it fit for LGA1156, LGA1155, and future LGA1150 socket types. It is priced around US $50.

Noctua Presents NH-L9 Series Low Profile CPU Coolers

Noctua today presented its new NH-L9i and NH-L9a low profile CPU coolers for Intel and AMD. At a super-low profile of only 37mm, the NH-L9 coolers are ideal for extremely slim cases and with footprints tailored to the respective socket keep-out zones, they provide full compatibility with tall RAM modules and VGA cards on mini-ITX mainboards. Topped off with the new NF-A9x14 PWM premium fan, the NH-L9 coolers fuse everything users have come to expect from Noctua's larger coolers into a super-compact package for slim HTPC systems.

"The response on our first low profile cooler, the NH-L12, has been overwhelming", says Mag. Roland Mossig, Noctua CEO. "However, users asked for even smaller, lower height models that also provide better compatibility for extra slim, ITX based HTPCs. We're thrilled that we can now meet this demand with the new NH-L9 coolers."

Intel Readies Nine Socket LGA1150 Desktop Boards for Q2-2013

Intel's 4th generation Core processor family will introduce socket LGA1150, and 8-series chipset. The company's own Desktop Board division plans as many as nine motherboard models for March 2013. The three 8-series chipset models making up the lineup are Z87 (high connectivity options, overclocking features), H87 (high connectivity options), and Q87 (essential connectivity, enterprise client features).

Intel plans as many as four motherboard models on the overclocking-ready Z87 chipset, two each in the Extreme Series and Media Series. The Extreme Series models include the DZ87KLT-75K "Kinsley Thunderbolt," DZ87KL-70K "Kinsley" (sans Thunderbolt); the Media Series models include DZ87CA-55K "Carryville," and DZ87CO-50K "Colebrook." The H87 lineup includes DH87MC "Meadow Creek," DH87RL "Round Lake," and DH87FB "Flat Bay." Among the Q87-based models are the DQ87RG "Rainbow Ridge" and DQ87PG "Spring Cave." Their specifications are tabled below.

Source: ComputerBase.de
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