News Posts matching "LGA2011"

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Antec Intros Kuhler H2O Series 4 CPU Coolers

Antec introduced V4 series design updates for its Kuhler H2O 620 and H2O 920 closed-loop CPU coolers. The new coolers are outfitted with a higher-pressure pump, and split-flow copper fin design in the radiators. The company claims the two innovations work to drop temperatures down a further 2-4°C, over temperatures previous versions achieve. Lastly, the coolers are labeled with guaranteed support for current and upcoming CPU socket types, including LGA2011, LGA115x, LGA775, FM2/FM1, and AM3+/AM3/AM2+. Prices remain unchanged.

Eurocom Ships First 8-core Xeon E5-2690 Based Laptop

EUROCOM Panther 4.0 supercomputer laptop delivers unmatched 2D/3D capabilities for heavy duty 3D and 2D applications, like CAD (Computer-Aided Design), CAE (Computer-Aided Engineering), DCC (Digital Content Creation), visualization, and simulation. It is ideal for Engineering on the Go, Rapid Engineering Deployment Teams and for Server on the Go applications.

Sapphire Vapor-X CPU Cooler Launched

Sapphire officially launched the Vapor-X CPU cooler it talked about at trade shows earlier this year. It uses a vapor-chamber plate to draw heat from the CPU, and convey it to four 7 mm-thick nickel-plated copper heat pipes, which then pass through a dense aluminum fin stack, that's ventilated by two 120 mm PWM controlled fans (replaceable) in push-pull configuration. Spinning at speeds ranging between 495 and 2,200 RPM, the fans push 77 CFM of air, each. Measuring 135 x 110.4 x 163.5 mm, the heatsink weighs about 925 g. Nearly every modern client CPU socket type is supported, including Intel sockets LGA2011, LGA115x, LGA775, and AMD sockets AM3+/AM3/AM2+/AM2, and FM2/FM1. Expect a sub-$80 price.

Reeven Arcziel 12 CPU Cooler Pictured

Reeven unveiled the Arcziel 12 CPU cooler. Classified in the large category, the Arcziel 12 is a top-flow air-cooler that uses an aluminum fin stack arranged along the plane of the motherboard, to which heat is conveyed by six 6 mm-thick copper heat pipes that make indirect contact with the CPU over a nickel-plated copper base that's polished to a mirror-finish. The six heat pipes pass through the aluminum fin stack at two points, to even heat distribution. The heatsink is then ventilated by a 120 mm PWM fan that spins at 500 to 1900 RPM, with noise-output of up to 35 dBA. Measuring 140.5 x 131 x 126 mm, the cooler weighs about 557 g. It supports all modern CPU socket types, including LGA2011, LGA115x, AM3+, and FM2. It is slated for November 21.

Source: Hermitage Akihabara

Top Intel Ivy Bridge-E Core Processors To Still Pack Six Cores

Intel's 2011-launched Core i7 "Sandy Bridge-E" HEDT platform is based on a 32 nm silicon that's common with Xeon E5 series processors. While the silicon physically packs eight CPU cores and 20 MB last-level cache (LLC, or L3 cache), client Core i7 processors are configured with only a maximum of six cores, and up to 15 MB L3 cache. According to a MyDrivers.com report, the maximum core count won't change with next-generation 22 nm Ivy Bridge-E Core i7 processors.

Ivy Bridge-E will be an upscale of Ivy Bridge. Similar to Sandy Bridge-E, the silicon will feature up to eight cores and 20 MB L3 cache. In its Core i7 avatar, however, the chip will be configured with no more than six cores, and no more than 15 MB L3 cache. The new chip will introduce IPC improvements, PCI-Express Gen 3.0 certified root complex (one which NVIDIA will approve of), higher CPU core clock speeds, and support for faster memory.

Intel Core i7-3970X Extreme Edition 6-core Processor Starts Selling

Intel's newest flagship desktop processor, the Core i7-3970X Extreme Edition, started selling. In Singapore, the chip is being sold at S$ 1,425 (US $1,167), including local taxes. Based on the 32 nm "Sandy Bridge-E" silicon, and built in the LGA2011 package, the i7-3970X is a six-core processor clocked at 3.50 GHz, with maximum Turbo Boost frequency of 4.00 GHz. The six-core chip is bolstered by HyperThreading, enabling 12 logical CPUs, 256 KB L2 cache per core, 15 MB shared L3 cache, and a quad-channel DDR3 integrated memory controller, supporting up to 128 GB of memory. Surprisingly, the chip's 200 MHz speed bump over the Core i7-3960X affected its TDP, which is rated at 150W, up from 130W of the i7-3960X.

Source: MyDrivers

Zalman Announces A Trio of CPU Liquid Coolers

Korean enthusiast PC components major Zalman announced a trio of closed-loop liquid CPU coolers, the LQ310, LQ315, and LQ320; which are designed to handle maximum thermal loads (Qmax) of 300W, 330W, and 340W, respectively. The USP for all three is an extremely dense copper micro-fin structures inside the main block, where heat is dissipated to the coolant. The three feature what is essentially the same block and pump, and differ with the size of the radiator.

The Radiator component of the LQ310 measures 153 x 120 x 25 mm, that of the LQ315 is slightly thicker, at 35 mm, and LQ320 at 51 mm. A Zalman-made 120 mm fan, with 900 to 2,000 RPM speed range, long life bearing, and 4-pin PWM control, is standard issue for all three models. All modern CPU socket types are supported by the three, including LGA2011, LGA115x, AM3+/AM3, and FM2/FM1. The LQ310, LQ315, and LQ320, are priced at US $85, $100, and $120, respectively.

Source: Overclockers Ukraine

DeepCool Rolls Out New Variant of Big Frost Dual-Tower CPU Cooler

DeepCool announced a new variant of the Big Frost dual-tower CPU cooler which made its debut at this year's Computex event, held in June. Called the Big Frost Extreme Edition, the cooler features six nickel-plated copper heat pipes (the original uses bare copper), its base is polished to a mirror finish. Lastly, it uses a pair of UF120 PWM-controlled fans with blue impellers, and black frames. The cooler is ready for all current CPU socket types, including LGA2011, LGA115x, LGA1366, AM3+/AM3/AM2+, and FM2/FM1. In some markets, the cooler will be sold as "Neptwin Extreme Edition." The company did not finalize pricing.

Source: Expreview

Cooler Master Seidon 120M Liquid CPU Cooler Detailed

Cooler Master's new line of liquid CPU coolers include the Seidon 120M. The self contained (closed-loop) cooler combines a 150.3 x 118 x 27 mm aluminum fin radiator with a copper micro-channel block. The radiator and block+pump unit are factory fitted with flexible tubes. The radiator makes use of a 120 mm 600~2400 RPM PWM-controlled fan with 19~40 dBA noise output. The pump, on the other hand, can be as loud as 17 dBA. The cooler will include retention modules for all popular CPU socket types, including AMD AM3+/AM3/AM2+/AM2, FM2/FM1, Intel LGA1155/1156, LGA2011, LGA1366, and LGA775. Pricing and availability information is not available.

Intel Core i7-4900 Series Arrives in Q3-2013, i7-3970X Around the Corner: Report

The fastest client computing platform, Sandy Bridge-E, won't be seeing successors for a long time now, according to a Bright Side of News report. The next-generation "Ivy Bridge-E" lineup, which will carry processor model number series Core i7-49xx, aren't due until the third quarter of 2013. Ivy Bridge-E will build on the existing Sandy Bridge-E HEDT platform with Intel X79 Express chipset. Existing LGA2011 motherboards will be able to run the i7-4900 series chips with BIOS updates.

Meanwhile, the closest addition to Intel's socket LGA2011 Core i7-3900 series is the Core i7-3970X, which displaces the Core i7-3960X from the top spot. This chip will hit the shelves in a few weeks' time. According to a leaked specs sheet, the i7-3970X ships with a nominal clock speed of 3.50 GHz, with maximum Turbo Boost speed of 4.00 GHz. The specs sheet also confirms that i7-3970X will be a six-core chip, with HyperThreading enabling 12 logical CPUs, allaying rumors that Intel will unlock two additional cores and the full 20 MB L3 cache on the Sandy Bridge-E silicon, making it an eight-core chip.

Source: Bright Side of News

EKWB Supremacy Elite Series CPU Water Blocks Start Shipping

EK-Supremacy Elite, the premium bundle containing the best CPU water block on the market and the best thermal interface on the market - the EK-TIM Indigo Xtreme - is now finally shipping. Please note that due to high demand this product may be shown as out of stock at the time of purchase. These water blocks are therefore manufactured on daily basis to ensure adequate supply and daily re-stock.

EK-Supremacy Elite is the premium bundle containing the best CPU water block on the market - the EK-Supremacy - Full Nickel - and the best thermal interface on the market - the EK-TIM Indigo Xtreme. EK-Supremacy is a universal CPU water block that fits all modern CPU sockets with a universal mounting mechanism that offers error-preventing, tool-less installation. The result is a perfect installation which results in perfect performance every time. EK-Supremacy is truly the best product for performance seeking enthusiasts.

ECS X79R-AX Stealth Motherboard Pictured

ECS is working on the X79R-AX Stealth, a high-end socket LGA2011 motherboard that borrows a design concept from ASUS TUF Sabertooth series, on which the jury is still out - a shroud covering most of the non-critical areas of the motherboard, which ASUS refers to as "Thermal Armor." The X79R-AX Stealth uses a similar shroud, except it isn't as perforated on the surface, and instead uses vents along its edges for ventilation and connections.

The shroud appears to borrow its design from some of the earliest 5th generation (stealth) fighter aircraft, such as the F-117 Nighthawk. Only key components such as the CPU socket, expansion/memory slots, and power connectors protrude from cutouts in the shroud, most other connections such as on-board headers appear to be arranged perpendicularly, and open out along the edges of the board. Most other features of the board appear to be consistent with that of the X79R-AX Black Series. According to ECS, the board should be out very soon.

Intel Ivy Bridge-E Slated for Q3-2013

Intel's next high-end desktop (HEDT) platform, codenamed "Ivy Bridge-E," is slated for Q3-2013, according to the latest platform road-map slide sourced by VR-Zone. According to the leaked slide, launch of Ivy Bridge-E Core i7 processors follows that of Core "Haswell" socket LGA1150 processors (Q2-2013). What's more, the upcoming Ivy Bridge-E chips will be compatible with existing socket LGA2011 motherboards, based on Intel X79 Express chipset.

Intel's next-generation Ivy Bridge-E chips are up-scaled versions of today's Core "Ivy Bridge" chips, built on the same 22 nm process, with more processing cores, memory channels, cache, and PCI-Express 3.0 certified system interfaces. It remains to be seen if Intel launches a new chipset to go with the new processor, or retains the X79 chipset with a few minor updates in the form of steppings. The company retained its X58 Express chipset over the first two HEDT processor generations (45 nm Core i7 "Bloomfield" and 32 nm Core i7 "Westmere").


Source: VR-Zone Chinese

Intel Core i7-3970X Extreme Arrives in Q4

Intel's next high-end desktop processor, the Core i7-3970X Extreme, arrives in Q4, 2012, according to a DonanimHaber report. The i7-3970X is expected to ship with clock speeds of 3.50 GHz, with maximum Turbo Boost frequency of 4.00 GHz. The six-core chip is based on the 32 nm "Sandy Bridge-E" silicon, and built in the LGA2011 package. Its feature-set is consistent with that of the Core i7-3960X, with 15 MB shared L3 cache, HyperThreading, and unlocked base-clock multiplier. In all likelihood, the i7-3970X could displace the i7-3960X from its price-point.

Source: DonanimHaber

Prolimatech Readies Cool-Blue Megahalems Rev. B CPU Cooler

Even as GIGABYTE is shedding its signature blue PCB color scheme for higher-end motherboards, leaving it to entry-thru-mid range products, Prolimatech is giving its flagship CPU cooler, the Megahalems Rev. B, a cool-blue finish in its new variant. This is almost exactly the same shade of blue as the one Gigabyte uses on its motherboards (refer to the third picture below). Most of the cooler's 88 stainless steel fins are blue, with the top fins on each of the two stacks retaining a chrome finish. The six 6 mm-thick heat pipes passing through them are made of nickel-plated copper, while most metal parts of the retention modules are colored black. The cooler otherwise retains the same specifications of the Megahalems Rev. B, including support for the latest CPU socket types, such as LGA2011. Prolimatech could charge a tiny premium over the original's US $70 price-tag.

Sources: Cowcotland, FanlessTech

DeepCool-Aeolus Big Frost Dual-Tower CPU Cooler Detailed

After a brief sighting at Computex 2012, we come across the Aeolus Big Frost dual-tower CPU cooler again. This time, the cooler appears polished and ready for market launch. The cooler is a simplified version of DeepCool's Assassin, retaining its dual aluminum fin tower design. The design consists of two symmetric aluminum fin stacks, through which six 6 mm-thick copper heat pipes pass, drawing heat from a copper CPU base. The fin-stack is then ventilated by two 120 mm fans in push-pull configuration.

The heatsink measures 126 x 136 x 159 mm, weighing 1,109 g (including fans). The fan pushing "fresh" air through the first fin stack is configured to spin at speeds of up to 1,300 RPM, with noise levels as high as 22.6 dBA, while the fan pulling air and conveying it to the second fin stack spins at speeds ranging in 900-1,500 RPM, with 21.4 to 32.1 dBA noise levels. The Big Frost supports a full range of CPU socket types available in the market today, including Intel LGA2011, LGA1155/LGA1156, LGA1366, LGA775, AMD AM3+/AM3/AM2+/AM2, and FM2/FM1. In China, the cooler is expected to sell for 200 RMB (US $32).

Source: Expreview

Akasa Shows Off Venom Medusa High-End Air CPU Cooler

Akasa also unveiled the third entry into its Venom series of CPU coolers, the Venom Medusa. This launch comes exactly an year after that of the Venom Voodoo. In the picture below, the Venom Medusa is shown between the original Venom, and Venom Voodoo. The Venom Medusa is a large aluminum fin dual-tower heatsink, with two symmetrical aluminum fin stacks. It is designed keeping in mind the thermal loads of the new LGA2011 processors.

Its design consists of a large base from which eight nickel-plated copper heat pipes pass, making direct contact with the CPU, and passing through the two aluminum fin stacks at ends. The Venom Medusa ships with two fans, a Viper 120 mm fan pushes fresh air through the first aluminum fin stack, while a larger 140 mm fan conveys air from the first stack to the second. There is provision for a third 120 mm fan, which pulls air from the second stack, for exhaust. The Venom Medusa supports nearly every modern CPU socket type, including LGA2011, LGA1155/LGA1156, LGA1366, AM3+/AM3, and FM2/FM1.

New Details on ASUS ZEUS Emerge

A star attraction at the motherboard section of ASUS booth was its ZEUS Dual-GPU X79 concept motherboard. We got a chance to talk at lengths with people at ASUS about the exhibit, and learned a few details beyond what we already know. To begin with, ASUS is likely using a pair of "Southern Islands" family discrete mobile GPUs, not desktop ones. Further, it's likely that the GPUs are 28 nm "Pitcairn" based. The two GPUs are installed in CrossFire configuration. The next big detail is that the design focus on [evidently] isn't the integrated dual-GPU, but to demonstrate the first Thunderbolt-equipped X79 motherboard. The ZEUS has not one, but two Thunderbolt ports. The third (and most depressing) detail is that it's "highly unlikely" that the ZEUS will ever make it to the market. Think of it as yet another tradeshow concept by a big company. Perhaps ASUS doesn't want the ZEUS to end up like the ROG GSurf-365, its first off-beat ROG motherboard, which went beyond the show-floor but didn't have market-success.

GELID Shows Off Black Edition Gamer CPU Cooler

GELID Solutions showed off its newest Gamer series Black Edition CPU Cooler (doesn't carry a GX## model number). The cooler's design consists of a dark aluminum fin dual-tower design à la NH-D14, Corator DS, etc., and uses no less than seven heat pipes (3x 8 mm-thick and 4x 6 mm-thick) to transport heat from the base to the aluminum fin stacks. In the space between the two fin-stacks, a standard-size 120 mm (25 mm-thick) fan pulls air through the first stack, and pushes it through the second one. Pushing in fresh-air through the first stack is care of a slim 120 mm (15 mm-thick) fan. The cooler will be designed to be compatible with all modern CPU socket types, including LGA2011, LGA1155/LGA1156, LGA1366, AM3+/AM3/AM2+/AM2, and FM2/FM1.

MSI Big Bang MPower Motherboard Series Detailed

Late last week, we came across teaser pictures of a certain new Big Bang series motherboard. Our source didn't reveal its name, but mentioned that we were close in guessing its name to be "ZPower", which we admitted we could go wrong with. It turns out that the new line is named "MPower", and includes not just a new socket LGA1155 motherboard, the Z77 MPower, but also a new LGA2011 one, the X79 MPower. The two are beefed-up versions of the Z77A-GD65 and X79A-GD65 (8D), respectively, with stronger CPU VRM, relaxed warranties that are overclocker-friendly, and a new black+yellow color-scheme, which is consistent with that of its Lightning series graphics cards (such as the R7970 Lightning).

GIGABYTE Launches New Ultra Durable 5 Socket LGA2011 Motherboards

GIGABYTE did not leave out the Sandy Bridge-E HEDT platform when designing its new Ultra Durable 5 line of motherboards, the company showed of two new socket LGA2011 parts, the X79S-UP5 WIFI, and the X79-UP4.

The X79-UP4 is designed to be a sub-$300 offering, being a notch above the X79-UD3 (and perhaps even the X79-UD5). It uses a 6+1 phase CPU VRM, which consists of high-current ferrite core chokes, and PowIRstage IR3550 driver-MOSFETs. GIGABYTE added eight DDR3 DIMM slots, four on either side of the socket, supporting up to 64 GB of quad-channel DDR3 memory. Expansion slots include four PCI-Express 3.0 x16 (x16/x8/x16/x8), two PCI-Express 2.0 x1, and one legacy PCI. The X79-UP4 otherwise has a similar connectivity load-out as the X79-UD3.

GIGABYTE Intros 6PXSV3 Workstation Motherboard

GIGABYTE recently rolled out the 6PXSV3, a workstation motherboard designed for Xeon E5-1600/2600 processors in the LGA2011 package. Based on the Intel C604 chipset, the motherboard is designed to provide essential modern and legacy connectivity to workstations in mission-critical environments. The LGA2011 socket is powered by a 6-phase VRM with CPL-made chokes, and IR-made FETs and VRM controller. It is wired to eight DIMM slots, which support up to 256 GB (RDIMM) and 64 GB (UDIMM) of quad-channel DDR3-1600 MHz memory.

There are just the three expansion slots, two PCI-Express 3.0 x16, and one open-ended PCI-Express 2.0 x4. The remainder of the processor and chipset's PCI-Express lane budgets are allocated PCI-Express DMI-assist, which helps drive the mini SAS with 4 x SAS ports (3Gb/s), apart from four SATA 3 Gb/s, and two SATA 6 Gb/s ports. An ASPEED 2300 provides display output (resolutions up to 1920x1200 supported), and remote management (iKVM, IPMI 2.0). There are two gigbit Ethernet interfaces, driven by Intel 82574L chips, a third management port is also available. The GA-6PXSV3 will be available shortly.

Intel Unveils Desktop Board Extreme DX79SR

Intel unveiled its third socket LGA2011 Desktop Board driven by its X79 Express chipset, the DX79SR. This model is positioned a notch above the DX79SI, and a couple of notches above the DX79TO. It was first unsuspectingly revealed to the world not by Intel, but NVIDIA, in its GeForce GTX 690 press-shots. The DX79SR covers up a few design shortfalls of the DX79SI. It adds two additional SATA 6 Gb/s ports, driven by a Marvell SE9128 2-port controller, and two additional USB 3.0 ports on the rear panel. The total of four USB 3.0 ports on the rear panel are driven by an unknown 4-port USB 3.0 controller.

Apart from the two onboard connectivity additions, Intel will also include a USB add-on module which packs 802.11 b/g/n WLAN and Bluetooth 3.0 interfaces. The package of the board itself will be beefed up a little, with the inclusion of a stylish mouse pad and a thermal probe. To accommodate these features, Intel made a few subtle changes to the board layout, the first and second PCI-Express x16 slots no longer have switches between them, and some capacitors appear changed. With all these, Intel believes it has a shot at capturing the US $299 price-point, which gives it a nice spread from the $249 DX79SI and the $199 DX79TO.


Source: VR-Zone

Shuttle Launches X79 and Z77-based Barebones

Barebones mini PCs expert Shuttle Computer launched its first barebones featuring Intel Z77 Express chipset, ready for 3rd generation "Ivy Bridge" Core processors in the LGA1155 package, while retaining support for every LGA1155 "Sandy Bridge" processor launched till date. Shuttle also launched an Intel X79-based mini PC barebone, which supports Core i7 "Sandy Bridge-E" processors.

Called the SZ77R5, the Z77 barebone features four DDR3 DIMM slots supporting 32 GB of dual-channel DDR3-1600 MHz memory, expansion slots that include one PCI-Express 3.0 x16, one PCI-Express 2.0 x4 and one mPCIe; two SATA 6 Gb/s, two SATA 3 Gb/s ports, one eSATA 3 Gb/s, and one mSATA; four USB 3.0 ports, gigabit Ethernet, and 8-channel HD audio. Its chassis features two 5.25" and one 3.5" drive bays, front-panel that includes two of the four USB 3.0 ports, a USB 2.0 port with "fast charging" (high current), and front-panel HD audio. To power the machine, a 500W 80 Plus-compliant PSU is included. The SZ77R5 measures 332 x 216 x 198 mm (WxDxH). It will be priced around 32,800 JPY (US $404).

ASRock X79 Fatal1ty Champion Motherboard Detailed

ASRock is readying its second Fatal1ty-branded socket LGA2011 motherboard, the X79 Fatal1ty Champion. The company's first LGA2011 Fatal1ty motherboard is the X79 Fatal1ty Professional, which was launched in February. The new X79 Fatal1ty Champion will be launched on April 27. Those familiar with Creative Sound Blaster Fatal1ty line of sound cards will note Fatal1ty Champion as being a more feature-rich version of Fatal1ty Professional. In this case, the X79 Fatal1ty Champion is based on a completely new PCB, with the design idea of more expansion, and the latest Creative Sound Core3D audio solution.

The X79 Fatal1ty Champion features eight DDR3 DIMM slots (X79 Fatal1ty Professional has four), and a PCIe-only expansion slot layout. The LGA2011 socket is powered by a 12-phase DigiPower VRM, similar to the one on the Professional. The VRM heatsink is assisted by two other secondary heatsinks, to which heat is conveyed by a heat-pipe. One of these is connected to the PCH heatsink. Power is drawn by 24-pin ATX, 8-pin EPS, and one 4-pin Molex (angled, optional). The board features consolidated voltage measurement points, which are socketed to hold your multimeter's leads in place. The board will be augmented by a feature-rich UEFI BIOS setup program, and ASRock-exclusive features such as XFastLAN, XFastUSB, and XFastRAM will be included.
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