News Posts matching "LGA2011"

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Core i7-3820 Sandy Bridge-E Starts Selling in Japan

Intel's most affordable processor in the LGA2011 package, the Core i7-3820, surfaced on Japanese stores in the Akihabara electronics shopping district of Tokyo. It is priced around 25,000 JPY (US $322). The retail box of this chip, carrying the S-Spec code "SR0LD", appears to be as big as those of the Core i7-3930K and Core i7-3960X Extreme Edition, its shape indicates that it lacks a bundled cooling solution, and so users should still rely on compatible third-party coolers, or use Intel's RTS2011LC, purchased separately.

The Core i7-3820 is a quad-core part carved out of the Sandy Bridge-E silicon. It has four cores, and eight logical CPUs enabled with HyperThreading Technology. The chip is clocked at 3.60 GHz. Caches include 256 KB L2 per core, and 10 MB shared L3. The chip retains the quad-channel DDR3 IMC present on the more expensive six-core parts. It is also said to be "limited unlocked", meaning it allows multiplier-assisted overclocking to a certain limit. The Core i7-3820 is not officially launched, though it should be unofficially supported by most socket LGA2011 motherboards based on the X79 chipset.


Source: PCWatch Akiba

Prolimatech Toys with Two New LGA2011 CPU Cooler Designs

Among the sea of tower-type CPU coolers which are the same old tripe packaged and colored differently, few companies are actually investing in innovation, one of them is Prolimatech. The company is working on two new yet-unnamed CPU coolers specifically designed for socket LGA2011 motherboards, one has already taken shape, the other is still in its CGI form.

The first one (first two images below), appears to be an leaner, fitter evolution of the Prolimatech Genesis. While the Genesis uses a dual-independent fin-stack design in which one stack propagates perpendicular to the plane of the motherboard while the other propagates parallel to the plane, on this new design, both stacks propagate parallel to the plane, in opposite directions, and both being dissimilar in size.

Titan Sibera TTC-NC55TZ(RB) CPU Cooler Pictured

Titan Technology unveiled its latest Siberia CPU Cooler, the TTC-NC55TZ(RB). The cooler has an asymmetric aluminum fin tower design, which cools other hot components on the motherboard along with the CPU. The design consists of a nickel-plated copper base, from which five copper heat pipes pass. One end of these heat pipes pass through an aluminum fin stack that propagates along the plane of the motherboard, while the other passes though a stack that propagates perpendicular to this plane.

The stack that's along the plane of the motherboard is the larger of the two, and is ventilated by a 140 mm fan. The perpendicular stack is ventilated by a smaller 120 mm fan. The 140 mm fan spins at 700 ~ 1,800 RPM, pushing 34.78 ~ 89.43 CFM of air, with a noise output of 8.3 ~ 28.8 dBA. The 120 mm fan, on the other hand, spins at 800 ~ 2,200 RPM; pushing 24.23 ~ 66.2 CFM, with 15.0 ~ 35.0 dBA noise output. Both fans have 4-pin plugs and support PWM control. The heatsink itself measures 200 x 130 x 162 mm (WxDxH), weighing 755 g. All current sockets, including LGA2011, LGA1366, LGA1155/LGA1156, AM3+/AM3/AM2+/AM2, and FM1 are supported. It is priced at 6,980 JPY (US $91.6).

Source: Hermitage Akihabara

Antec Gives Away Free LGA2011 Bracket for Kuhler H2O 920 and 620

Antec announced today that it is giving away free socket LGA2011 brackets for existing owners of its Kuhler H2O 920 and Kuhler H2O 620 closed-loop CPU water coolers. The two were released before Intel launched its new socket, and so there are large stocks in the market that lack LGA2011 brackets. To avail this offer, existing owners have to write to Kuhler.eu@antec.com with a proof of purchase of their product, and shipping address. Antec also announced that it has started bundling the LGA2011 bracket with all fresh batches of Kuhler H2O 920 and Kuhler H2O 620, which will start shipping from its factories in February.

AMD Vishera Packs Quad-Channel DDR3 IMC, G34 En Route Desktop?

AMD might be a little sore that its "Zambezi" FX processor family based on its much-hyped "Bulldozer" architecture didn't quite meet the performance expectations of a ground-up new CPU architecture, but it doesn't want to take chances and build hype around the architecture that succeeds it. From various sources, some faintly-reliable, we have been hearing that the next-generation of high-performance desktop processors based on "Piledriver" architecture, codenamed "Vishera", will pack five modules or 10 cores, and will be structured essentially like Zambezi, since Piledriver is basically a refinement of Bulldozer architecture. The latest leak comes from the Software Optimization Guide for AMD 15h family (read here), which was picked up by CPU World while most of us were busy with CES.

CPU World compiled most of the features of what it suspected to be AMD referring to its future processors based on the Piledriver architecture, that's "Vishera" (desktop high-performance), "Terramar" (high-density server), and "Sepang" (small-medium business server) parts. The three are not the first chips to be based on Piledriver, AMD has a new mainstream desktop and notebook APU in the works codenamed "Trinity", which is en route for a little later this year. Trinity basically has an identical CPUID instruction-set as Vishera, Terramar, and Sepang, confirming their common lineage compared to today's "Bulldozer" architecture. The most catchy detail is of Vishera featuring 4 DDR3 channels.

Zalman Releases ZM-OC2011 Retention Kit Upgrade for LGA2011

Zalman released ZM-OC2011, a retention kit upgrade for WB5 and WB5 Plus water-blocks to support Intel's latest LGA2011 socket, on which Intel's "Sandy Bridge-E" Core i7 and Core i7 Extreme Edition processors are based. The kit consists of brackets that let you use the mount-hole spacing of all previous Intel LGA sockets, including LGA775, LGA1366, LGA1155/1156; nuts and bolts. In Japan it is priced at around $19.

GIGABYTE Releases its First Entry-Level Motherboard with Dual-UEFI BIOS

After trying to avoid UEFI BIOS by sticking to "HybridEFI" workarounds to its existing AwardBIOS code on most of its socket LGA1155 and AM3+ motherboards, GIGABYTE reluctantly transitioned to UEFI with its socket LGA2011 motherboards, on which it fused its innovative Dual-BIOS technology with UEFI to come up with Dual-UEFI technology. One can imagine this to be particularly tough to implement on lower-end models, since UEFI with graphical setup program requires higher-capacity EEPROM chips, and since Dual-UEFI would need two, it would stress component costs, but GIGABYTE did it anyway.

In Japan, the company released the latest revision of the GA-H61MA-D3V (rev. 2.0), an entry-level socket LGA1155 motherboard based on the Intel H61 chipset, which features Dual-UEFI. Apart from this, the board also features GIGABYTE's Ultra-Durable 4 Classic component loadout, which consists of a new fiberglass fabric weave PCB that's more resistant to humidity that causes short-circuits, high ESD-resistance ICs, anti-surge ICs located on critical circuits, low RDS (on) MOSFETs, and a 100% high-grade solid-state capacitor design.

ECS Enables X79-Driven SAS Ports on its X79R-AX Motherboard

Intel's X79 chipset for Sandy Bridge-E platform was originally designed to have four SAS (serial-attached SCSI) channels apart from its usual loadout of SATA ports. Early prototypes of socket LGA2011 motherboards displayed at last year's Computex event (June), carried a large number of chipset-driven ports. However, Intel found the chipset-integrated SAS RAID controller (independent device from the SATA RAID controller) to have "unreliable performance", and hence changed its specification at the last moment. So the production specification of X79 ended up having the same SATA port loadout as P67 (two SATA 6 Gb/s + four SATA 3 Gb/s).

This specifications change did not result in a design change of the X79 PCH package, its die remained the same, so did its package and pin-map, which motherboard vendors had for nearly an year. So ECS decided to implement the SAS ports despite being out of specifications. LegitReviews discovered that its X79R-AX sample very much did have SAS ports wired to the PCH. With firmware of the SAS RAID controller and drivers, it could enable and use those ports. Although the SAS ports are physically present on the board, users have to enable them via the UEFI firmware setup program (BIOS).

Thermaltake Frio OCK Given Snow Edition Treatment, Too

Like with the Frio Snow Edition, Thermaltake's higher-end CPU air cooler, the Frio OCK, also has a Snow Edition variant. As a variant, its specifications are otherwise identical to the original, except that the black+red colored plastic parts (such as shrouds, fan frames, and impellers), are replaced with white+blue colored ones. The blue, of course, is an "icy" shade of it. The top shroud is black, to offer a nice contrast with the white+blue colored fan frame. Measuring 143 x 136.8 x 158.4 mm (LxWxH), the cooler weighs about 1.1 kg. It uses a slightly larger heatsink than the one found on the Frio, to which heat is conveyed by six 6 mm-thick heat pipes. The heatsink is ventilated by two 130 mm fans in "push-pull" configuration. The new variant also provides out-of-the-box support for LGA2011 socket.

Thermaltake Frio Snow Edition CPU Cooler Pictured

Responding to the market's new-found love for white colored components, Thermaltake announced a few "Snow Edition" products, including the Frio Snow Edition, pictured below. This cooler uses the same exact design as the original version, but replaces the black+red plastic parts of it with white+blue, including a white colored fan impeller. It is a typical aluminum fin tower-type heatsink with two pre-fitted 120 mm fans in push-pull configuration. It measures 139 x 98 x 165 mm (LxWxH), weighing a little over 1 kg. Another feature of this cooler is out-of-the-box support for socket LGA2011.
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