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Super Talent Expands Its NGFF SSD Lineup with PCIe DX1

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, announces its Super Talent PCIe DX1 SSD. The Super Talent PCIe DX1 is 22.00mm x 80.00mm x 3.5mm. Although small in form factor, it is lightning quick when it comes to speed to match and satisfy the demands of a server or mobile environment. Next generation mobile computing can take full advantage of performance with these space saving SSDs. The 128 MB internal cache on the Super Talent PCIe DX1 further speeds up application load times and the overall unit is easily mounted without any cables.

ADATA Announces Market Availability of DashDrive Elite SE720

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, has launched an ultra-thin external solid state drive (SSD) with a SuperSpeed USB interface. Named the DashDrive Elite SE720, it combines the slim stainless steel chassis of the company's award-winning DashDrive Elite HE720 portable hard drive, with the performance of ADATA's market-proven NAND Flash storage solutions.

The advantages of SSDs include high shock resistance, noiseless operation, and low-power consumption. When these features are implemented in a portable USB 3.0 device, the result is a remarkably durable storage option with speeds that far outpace those of mechanical HDDs. The SE720 has read speeds up to 400 MB/sec, and write speeds of up to 300 MB/sec.

SK Hynix Established Flash R&D Center in Taiwan

SK Hynix Inc. announced it established a research and development (or 'R&D') center 'SK Hynix Flash Solutions Taiwan Ltd.'. The Company will strengthen global R&D competence and customer support by adding the R&D center in Taiwan.

The Taiwan R&D center will focus on intensifying its competence in development of high value added NAND Flash memory products. The center is located in Hsinchu, the hub of Taiwan IT industry, so it is expected to become a base of the technology support for Chinese and Taiwanese clients.

KINGMAX Launches SME Xvalue for HDD-to-SSD Upgrade

For today's PC users, high-performance, high-quality SSDs are increasingly the preferred choice. KINGMAX, a premium memory and Flash module manufacturer that serves the world market, is proud to introduce SME 32/35, the latest additions to its SME Xvalue SSD Series. The SME SATA III2.5"SSDs make a timely debut as many must be considering a replacement or upgrade of their HDDs. For most end users, performance is hardly the ultimate determinant for choosing between the two storage devices, empirical studies show. But they know SSDs are faster than HDDs and that the former does speed up their system both during booting and in operation.

An exceptionally attractive cost-performance ratio justifies SME as a bargain. This is especially the case with those who would rather go for a partial refresh as an across-the-board upgrade of their existing old devices seems hardly warranted. Pitted against comparable HDD counterparts, it stands out with an ultra-low cost per IOPS and extraordinary operational efficiency on the same measure of power consumption.

Micron Technology Reports Results for the Fourth Quarter of Fiscal 2013

Micron Technology, Inc., today announced results of operations for its fourth quarter and 2013 fiscal year, which ended August 29, 2013. For the fourth quarter, the company had net income attributable to Micron shareholders of $1.71 billion, or $1.51 per diluted share, on net sales of $2.8 billion. The results for the fourth quarter of fiscal 2013 compare to net income of $43 million, or $0.04 per diluted share, on net sales of $2.3 billion for the third quarter of fiscal 2013, and a net loss of $243 million, or ($0.24) per diluted share, on net sales of $2.0 billion for the fourth quarter of fiscal 2012.

For the 2013 fiscal year, the company had net income attributable to Micron shareholders of $1.19 billion, or $1.13 per diluted share, on net sales of $9.1 billion. Cash flows from operations were $1.8 billion for fiscal 2013. The results for fiscal 2013 compare to a net loss of $1.03 billion, or ($1.04) per diluted share, on net sales of $8.2 billion for the 2012 fiscal year.

Intel to Demo SSD Overclocking at IDF 2013

It could soon become possible to overclock the controller and NAND flash of your SSD, if Intel has its way. The company is set to demonstrate how to overclock Intel-branded SSDs using its Xtreme Tuning Utility (XTU), at IDF 2013, which goes underway this September. The item on Intel's IDF itinerary marked "AIOS001" deals with seminars on overclocking Intel's next-generation HEDT (high-end desktop) platforms. X-bit Labs believes Intel could talk about SSD overclocking during that session.

Options to tweak SSDs were discovered when poking around the code of an unreleased XTU version. XTU is a unified software utility by Intel, which lets you tweak CPU, memory, and system cooling on systems running Intel Desktop Boards. Among the things end-users should be able to tweak, apart from the controller clock-speed, are the NAND flash bus-speed. Taking away interface overheads and other round-offs, 560 MB/s appears to be the practical maximum bandwidth SATA 6 Gb/s SSDs have been able to achieve. It could always be handy getting your SSD a few dozen more MB/s sequential speeds at the expense of stability.
Sources: MyCE, X-bit Labs

Samsung Introduces World's First 3D V-NAND Based SSD for Enterprise Applications

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced the first solid state drive (SSD) based on its industry-leading 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013 here.

"By applying our 3D V-NAND - which has overcome the formidable hurdle of scaling beyond the 10-nanometer (nm) class*, Samsung is providing its global customers with high density and exceptional reliability, as well as an over 20 percent performance increase and an over 40 percent improvement in power consumption," said E.S. Jung, executive vice president, semiconductor R&D center at Samsung Electronics and a keynote speaker at the Flash Memory Summit. "As we pioneer a new era of memory technology, we will continue to introduce differentiated green memory products and solutions for the server, mobile and PC markets to help reduce energy waste and to create greater shared value in the enterprise and for consumers."

Violin Memory Launches 6264 Next Generation Memory Array

Violin Memory, Inc., provider of memory-based storage systems, today announced the 6264 flash Memory Array, the next generation of flash memory storage that delivers 64 TB of capacity in a mere 3U footprint. Complementing the 6000 Series Arrays is the Violin Symphony Management System, enabling enterprise-wide management of Violin Memory Arrays through a single pane of glass view -- from any device, anytime.

With the 6264 flash Memory Array, Violin has once again set the bar for price-performance economics. By combining industry-leading flash controller technology with Toshiba's latest generation of 19 nm flash technology, the Violin 6264 delivers twice the density and three times the economics of its predecessor while significantly reducing power consumption. The Violin 6264 flash Memory Array incorporates several flash management innovations enabling disruptive economics for massively consolidated virtual infrastructures for enterprise customers.

MSI Also Rolls Out GP70 Gaming Series Notebook

In addition to the 15.6-inch GP60 Gaming Series, MSI rolled out the GP70 Gaming Series. This notebook features similar innards to the GP60, but with a larger 17.3-inch screen, which comes in 1600 x 900 and 1920 x 1080 options. Practically every other item on its specifications sheet, including a choice of Core "Haswell" processors, GeForce GT 740M graphics, up to 16 GB of RAM, hybrid drive with 24 GB NAND flash and 1 TB HDD, gaming-grade keyboard made by SteelSeries, connectivity that includes 802.11 b/g/n, gigabit Ethernet, Bluetooth 4.0, etc., are identical to that of the GP60. Measuring 418 x 269.3 x 39 mm, it weighs about 2.7 kg. Prices vary by configuration.

MSI Unveils GP60 Gaming Series Notebook

MSI rolled out its GP60 Gaming Series mid-range gaming notebook. It features the same styling as the rest of the Gaming Series, black with a dash of red. Its 15.6-inch screen comes in two variants, 1366 x 768 and 1920 x 1080 (options). A gaming-grade keyboard by SteelSeries decks up the bottom-half. On the left-hand side you'll find gold-plated headset jacks, with an audio device tuned for gaming headsets, and a pair of USB 3.0 ports; next to an air-vent. On the right-hand side, you get the gigabit Ethernet jack, D-Sub (VGA) and HDMI 1.4a connectors, next to a tray-loading optical drive, which can be either Blu-ray + DVDRW combo, or simply DVDRW. An SDIO slot supports SDXC cards.

Under the hood, the GP60 runs a 4th Generation Intel Core "Haswell" processor (options), up to 16 GB of DDR3-1600 MHz memory, and NVIDIA GeForce GT 740M graphics with 2 GB of DDR3 memory. MSI is deploying a hybrid drive, which combines 24 GB of NAND flash, with 1 TB of magnetic storage. Connectivity includes gigabit Ethernet, 802.11 b/g/n WLAN, and Bluetooth 4.0. A 6-cell 4,400 mAh battery powers the notebook. Measuring 383 x 249.5 x 32.3~37.6 mm, it tips the scales at around 2.4 kg. Prices vary by configuration.

Crossbar Unveils Resistive RAM Non-Volatile Memory Technology

Emerging from stealth-mode today, Crossbar, Inc., a start-up company pioneering a new category of very high capacity and high-performance non-volatile memory, unveiled its Crossbar Resistive RAM (RRAM) technology. This new generation of non-volatile memory will be capable of storing up to one terabyte (TB) of data on a single 200mm2 chip, enabling massive amounts of information, such as 250 hours of HD movies, to be stored and played back from an IC smaller than a postage stamp. Crossbar today also announced it has developed a working Crossbar memory array at a commercial fab, a major milestone in the development of new memory technology, signaling its readiness to begin the first phase of productization.

Due to its simple three-layer structure, Crossbar technology can be stacked in 3D, delivering multiple terabytes of storage on a single chip. Its simplicity, stackability and CMOS compatibility enable logic and memory to be easily integrated onto a single chip at the latest technology node, a capability not possible with other traditional or alternative non-volatile memory technologies.

Samsung Starts Mass Producing Industry's First 3D Vertical NAND Flash

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first three-dimensional (3D) Vertical NAND (V-NAND) flash memory, which breaks through the current scaling limit for existing NAND flash technology. Achieving gains in performance and area ratio, the new 3D V-NAND will be used for a wide range of consumer electronics and enterprise applications, including embedded NAND storage and solid state drives (SSDs).

Samsung's new V-NAND offers a 128 gigabit (Gb) density in a single chip, utilizing the company's proprietary vertical cell structure based on 3D Charge Trap Flash (CTF) technology and vertical interconnect process technology to link the 3D cell array. By applying both of these technologies, Samsung's 3D V-NAND is able to provide over twice the scaling of 20nm-class planar NAND flash.

Micron Announces The Finalization Of Elpida Takeover

Micron Technology, Inc. (Nasdaq:MU) ("Micron") and Elpida Memory, Inc. ("Elpida") trustees announced today the closing of Micron's acquisition of 100 percent of Elpida's equity, pursuant to a Sponsor Agreement entered into on July 2, 2012 in connection with Elpida's corporate reorganization proceedings conducted under the jurisdiction of the Tokyo District Court. In a related transaction, Micron also announced today the completion of its acquisition of a 24 percent share of Rexchip Electronics Corporation from Powerchip Technology Corporation and certain of its affiliates. The transactions will be recorded for accounting purposes as being effective at 11:59 p.m., Tokyo time, on July 31, 2013.

Elpida's assets include a 300 millimeter (mm) DRAM fabrication facility located in Hiroshima, Japan; an approximate 65 percent ownership interest in Rexchip, whose assets include a 300mm DRAM fabrication facility located in Taiwan; and a 100 percent ownership interest in Akita Elpida Memory, Inc., whose assets include an assembly and test facility located in Akita, Japan. Together with the Rexchip shares acquired from Powerchip, Micron will control approximately 89 percent of Rexchip's outstanding shares and 100 percent of Rexchip product supply. The manufacturing assets of Elpida and Rexchip together can produce more than 185,000 300mm wafers per month, which represents an approximate 45 percent increase in Micron's current manufacturing capacity.

Greenliant Introduces Industrial Grade mSATA ArmourDrive SSD

Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, has entered the removable solid state drive (SSD) market and is sampling its new mSATA ArmourDrive GLS86 product line. Based on SATA NANDrive, using Greenliant's internally developed NAND controller, mSATA ArmourDrive is designed for applications that require industrial temperature capability, high reliability and long-life data storage.

mSATA ArmourDrive operates at extreme temperatures between -40 to +85 degrees Celsius with 1-bit-per-cell (SLC) or 2-bits-per-cell (MLC) NAND flash memory, which gives customers a dependable, industrial temperature mSATA SSD using cost-effective MLC NAND. Addressing the needs of space-constrained embedded systems, mSATA ArmourDrive measures 29.85mm x 50.80mm x 4.80mm (JEDEC MO-300).

SK Hynix Memory Solutions Announces Dr. Khandker Nazrul Quader as CEO

SK hynix memory solutions (SKHMS) is pleased to announce that Dr. Khandker Nazrul Quader has joined SKHMS as President and CEO effective June 21, 2013. "It has been nearly one year since SK hynix acquired controller expertise through the acquisition of Link-A-Media Devices, now SK hynix memory solutions (SKHMS)," stated Dr. Park, President and CEO of SK hynix and Chairman of the Board of SKHMS. "The addition of Dr. Quader's leadership with his extensive background in NAND technology and design, Advanced Non-volatile memories and DRAM storage technologies and his extensive experience and expertise in Multi-level Flash memory management systems will further leverage the value of the SKHMS team, especially at this time of significant market growth in the areas of Flash memory based storage solutions. It is my pleasure to welcome Dr. Quader as part of SK family."

"I'm very excited to join and lead the SKHMS (formerly Link-A-Media) team at a time when the flash memory industry is poised for phenomenal growth in SSD and mobile markets," said Dr. Quader. "The integration of the controller solution know-how of SKHMS combined with the Advanced Non-volatile memories and DRAM technologies and the manufacturing capabilities of SK hynix is producing leading-edge products across multiple market segments. Full vertical integration of controller hardware, advanced flash memory systems architecture, firmware, NAND, other forms of non-volatile memory, and DRAM coupled with high volume memory manufacturing capability is quite rare in the industry and allows our customers to have a one-stop storage solution provider with the capacity, support and expertise the industry demands. The combined focus of SK hynix and SKHMS provides excellent opportunity to become a market leader in Enterprise, Client and Mobile storage."

Samsung Announces SSD 840 EVO Series Solid State Drives

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today held the 2013 Samsung SSD Global Summit at the Westin Chosun Seoul in celebration of the launch of its new solid state drive (SSD), the Samsung SSD 840 EVO. Along with the announcement of its latest SSD under the theme of "SSDs for everyone", the Samsung SSD Global Summit also explored the future of the global SSD market, which is quickly replacing the HDD market.

"After accelerating the growth of the SSD market by last year's launch of entry-level, high-performance SSDs we are introducing a much faster SSDs with up to 1 TB capacities offering consumers a wider range of choices," said Young-Hyun Jun, executive vice president, memory sales & marketing, Samsung Electronics. "Samsung continues to enhance its SSD brand image by delivering the industry's highest quality solutions and continuously increasing its SSD market share by expanding the adoption of higher density SSDs especially in client PC segments"

Micron Unveils 16-Nanometer Flash Memory Technology

Micron Technology, Inc., today announced that it is sampling next-generation, 16-nanometer (nm) process technology, enabling the industry's smallest 128-gigabit (Gb) multi-level cell (MLC) NAND Flash memory devices. The 16 nm node is not only the leading Flash process, but it is also the most advanced processing node for any sampling semiconductor device. It solidifies Micron's leadership position in storage technology development and delivers on the company's vision to provide the most advanced semiconductor solutions.

Micron's 128 Gb MLC NAND Flash memory devices are targeted at applications like consumer SSDs, removable storage (USB drives and Flash cards), tablets, ultrathin devices, mobile handsets and data center cloud storage. The new 128 Gb NAND Flash memory provides the greatest number of bits per square millimeter and lowest cost of any MLC device in existence. In fact, the new technology could create nearly 6 TB of storage on a single wafer.

OCZ Announces Preliminary 1Q14 Financials

OCZ Technology Group, Inc. (NASDAQ: OCZ), a leading provider of high-performance solid-state drives (SSDs) and power management solutions for computing devices and systems today announces selected preliminary financial results for the first quarter ended May 31, 2013, subject to customary closing and audit procedures.
Preliminary revenue for the first quarter of fiscal 2014 is estimated to be between $50 and $55 million. The sequential decrease in revenue was primarily due to the continued tight supply of NAND flash. The Company's revenue mix continued to shift towards the mainstream and higher-end client markets, as well as enterprise and OEM solutions as the Company continued to focus on these end markets. At the end of the quarter there was an additional $23 million of shippable backlog that was unrealized in the quarter due to supply constraints.

Gross margin continued to improve and is estimated to be between 17% and 20% for the first fiscal quarter as revenue generated from our Enterprise solutions increased sequentially. The Company continued to reduce its operating expenses by further reducing non critical spending. The Company's break-even level continues to improve due to these actions. Operating expenses for the first quarter are estimated to be between $20 and $22 million, which include restatement related expenses of approximately $1.5 million and stock compensation charges of approximately $2 million. Cash flow improved as we reduced our quarterly cash usage to approximately $6 million in the quarter. Cash ended the quarter between $6 and $7 million with total debt outstanding of $10 million. The Company expects that it will require access to additional capital which it is currently in the process of securing.

Toshiba Expands its Semiconductor Facility at Yokkaichi

Toshiba Corporation today announced that it will expand its state-of-art No. 5 semiconductor fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure manufacturing space for NAND flash memories fabricated with next generation process technology and for future 3D memories. Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

Yokkaichi Operations currently has three Fabs mass producing NAND flash memory, including Fab 5 phase 1. Fab 5's construction was planned around two phases, the first of which went into operation in July 2011. After giving careful consideration to the balance of product supply and demand, and noting a recovery driven by growing demand for smartphones, tablets, SSD for enterprise servers and other new applications, Toshiba now anticipates further medium- to long-term market expansion and recognizes that the time is right to expand Fab 5.

SanDisk Announces Construction of Second Phase of Next-Generation Fab 5

SanDisk Corporation, a global leader in flash memory storage solutions, today announced that the construction of the phase two shell of the Fab 5 joint venture wafer fabrication facility located in Yokkaichi, Japan, will begin in August 2013 with expected completion in mid-2014.

SanDisk expects to use phase two of Fab 5 primarily for technology transitions of existing Yokkaichi wafer capacity. The new cleanroom will provide the space needed for additional equipment required for transitioning the wafer capacity in Fab 3, Fab 4 and phase one of Fab 5, to next generation 2D NAND technologies and to early generations of 3D NAND technology. The Fab 5 plans are consistent with the company's strategy outlined during SanDisk's Investor Day May 8 and there are no changes to SanDisk's capital expenditure plans.

Samsung Now Mass Producing Industry's First PCI-Express SSD for Ultrabooks

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first PCI-Express (PCIe) solid state drive (SSD) for next-generation ultra-slim notebook PCs.

"With the Samsung XP941, we have become the first to provide the highest performance PCIe SSD to global PC makers so that they can launch leading-edge ultra-slim notebook PCs this year," said Young-Hyun Jun, executive vice president, memory sales & marketing, Samsung Electronics. "Samsung plans to continue timely delivery of the most advanced PCIe SSD solutions with higher density and performance, and support global IT companies providing an extremely robust computing environment to consumers." Samsung started providing the new SSD to major notebook PC makers earlier this quarter. The XP941 lineup consists of 512, 256 and 128GB SSDs.

BiWin Introduces Industrial-grade Disk-on-Modules

BIWIN, a world-leading expert in the development and manufacture of flash and advanced NAND flash memory, has introduced two Industrial Grade Disk-On-Modules (DOMs) with SATA interface, D5211 and D5212. They are well suited for installation needing long endurance parts with high reliability under rugged conditions.

D5211 and D5212, available in capacities of up to 16GB, are SLC NAND based modules with a PE Cycle as high as 100,000 times. The products complies with strict, industrial grade controllers to ensure a stable operating performance under extended temperature ranges between -40°C to 85°C.

Intel SSD Data Center S3500 Series Gives Cloud Computing Major Boost

Intel Corporation today announced the Intel Solid-State Drive DC S3500 Series, its latest solid-state drive (SSD) for data centers and cloud computing. Designed for read-intensive applications such as Web hosting, cloud computing and data center virtualization, the Intel DC S3500 Series is an ideal replacement for traditional hard disk drives (HDD), allowing data centers to save significant costs by moving toward an all-SSD storage model.

Intel SSDs, including the Intel SSD DC S3500 Series, enable transformational improvements in cloud infrastructure, fostering new and enriching Web experiences. End customers experience quicker Web page loads and improved response times as a result of dramatically improved data access times and reduced latency. IT managers and cloud developers are rewarded with improved total cost of ownership as a result of reduced power consumption, more consistent performance and smaller space requirements. More than half of U.S. businesses now employ cloud computing applications, and IDC predicts that worldwide spending on cloud services will reach $44.2 billion this year. Data centers powering these cloud applications need to quickly, efficiently and reliably scale to handle the tremendous growth of connected users and data traffic.

Team Unveils Dark L3 Line of Consumer SSDs

Team Group showed off its Dark L3 line of mainstream consumer SSDs. Based on the common SandForce SF-2281 platform, and built in the conventional 9.5 mm-thick 2.5 mm form-factor with SATA 6 Gb/s interface, these drives use 19 nm MLC NAND flash, and come in 60 GB, 120 GB, and 240 GB capacities. All three models offer up to 550 Mb/s reads, the 60 GB and 120 GB variants offers up to 450 MB/s writes, while the 240 GB variant offers up to 500 MB/s. All three models offer 35,000 IOPS 4K random reads, the 60 GB variant offers 25,000 IOPS 4K random writes; while the 120 GB and 240 GB variants offer up to 50,000 IOPS. Most common client SSD features such as TRIM, NCQ, and SMART, are standard issue.

ADATA Shows Off SX2000 and SX1000 Enterprise SSDs

ADATA showed off a new high-performance server-grade SSD, the SX2000. Built in the 2.5-inch form-factor, this drive features a PCI-Express 2.0 x4 interface (a cable runs to a PCIe riser card). It is driven by an LSI-SandForce SF-8639 controller, which is a single-chip solution that connects to the host over PCI-Express, and appears to the operating system as ATA AHCI controller, with one drive connected to it. The chip features nearly more than double the ONFI channels as an SF-2281, which reflects on the drive's advertise performance numbers: up to 1,800 MB/s reads with up to 1,800 MB/s writes; up to 200,000 IOPS 4K random reads. The controller supports all modern enterprise SSD features, including TRIM, DEVSLP support, and SMART. It ships in 100 GB, 200 GB, 400 GB, 800 GB, and 1,600 GB variants. The latter was up on display.

ADATA also showed off its SX1000 enterprise SSD, which features a more modest SATA 6 Gb/s interface, an LSI SandForce SF-2500 or SF-2600 series controller, sequential performance numbers of up to 550 MB/s reads with up to 500 MB/s writes, up to 75,000 IOPS 4K random reads/writes, can work as DAS, and most modern enterprise features. This drive will be available in 100 GB, 200 GB, and 400 GB capacities, the 200 GB variant was on display. It's unclear which kind of NAND flash the two drives use, but we're guessing it's high-endurance MLC NAND. Both offer 5-year warranties.
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