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Toshiba Introduces New Powerful and Efficient SSDs

Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., announced today two new internal solid-state drive (SSD) storage devices with up to 960 GB of capacity. The new SSDs include the Toshiba Q300 Pro Series Internal SSD Hard Drive, built for gaming and creative applications with high-end demand for performance and reliability and the Toshiba Q300 Series Internal SSD, offering a balance of high performance and value, ideal for PC upgrades from traditional hard drives. With Adaptive Size SLC Write cache technology to enable SLC-like performance, both models offer high processing speed and low power consumption and are compatible with Windows, Mac and Linux.

"Toshiba's announcement of the new Q300 Pro and Q300 internal SSDs demonstrates that Toshiba is continuously striving to bring the best storage solutions to the market," said Maciek Brzeski, Vice President of Branded Storage Products, Toshiba America Information Systems, Inc., Digital Products Division. "Today's announcement addresses increasing consumer demand for speed, performance, quality and reliability to improve their computing experience. As the inventor of flash memory, our new Q300 and Q300 Pro Internal SSD Series delivers leading-class performance and reliability to meet a wide variety of computing needs."

Intel Readies First Consumer SSD Based on 3D Xpoint Memory

Intel plans to launch the first consumer SSD based on its new 3D Xpoint memory technology, a successor to NAND flash which promises exponential gains in performance and capacity, some time in 2016. The Intel-branded drive will be called Intel Optane, will come in modern form-factors such as M.2/NGFF, SATA-Express, PCI-Express (add-on card), and will take advantage of the new NVMe protocol.

Early prototypes of Optane demoed at IDF already offer up to 5.5 times the throughput of NAND flash-based DC P3700 series SSDs, and we're only talking about single-queue performance. Compared to the queue depth of just 32 commands for AHCI, NVMe offers command queue depth of a staggering 65,535 commands. Since Micron Technology is the co-developer of 3D Xpoint, it's likely that we'll also see Micron/Crucial branded drives based on this tech.


Source: The TechReport

Samsung Shows Off its Biggest and Fastest SSDs at FMS 2015

At the 2015 Flash Memory Summit, Samsung announced the fruition of its swanky new 48-layer 3D V-NAND chips, the PM1633a. Built in the 2.5-inch form-factor, and featuring a SAS 12 Gb/s interface, this drive offers an unformatted capacity nearing 16 TB (15,360 GB to be precise). The drive relies on ten 48-layer stacks of 256 Gb 3-bit NAND flash dies, making up 15,360 GB of unformatted capacity. Samsung showed off a system with 48 of these drives, making up 720 TB of total storage.

Besides the largest SSD, Samsung also showed off the fastest. The PM1725 SSD, designed for servers with high-traffic databases, where throughput is the king, is built in the 2.5-inch form factor (up to 3.2 TB) and HHHL form-factor (up to 6.4 TB). It features a PCI-Express 3.0 host bus, and talks to the OS over the modern NVMe protocol. The two offer random access throughput of up to 1,000,000 IOPS.
Source: Golem.de 1 2

Silicon Motion Demonstrates its SSD Controller Leadership at 2015 FMS

Silicon Motion Technology Corporation, a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced it will be presenting at the upcoming Flash Memory Summit in Santa Clara, CA from August 11th to 13th and will be showcasing an array of SSD solutions at booth #313, including the award winning SM2246EN SATA 6Gb/s SSD solutions, the new products using SM2256, the world's first turnkey SSD controller supporting TLC NAND and the new SM2260 PCIe 3.0 SSD controller.

Toshiba Develops First 16-die Stacked NAND Flash Memory with TSV Technology

Toshiba Corporation today announced the development of the world's first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology. The prototype will be shown at Flash Memory Summit 2015, to be held from August 11 to 13 in Santa Clara, USA.

The prior art of stacked NAND flash memories are connected together with wire bonding in a package. TSV technology instead utilizes the vertical electrodes and vias to pass through the silicon dies for the connection. This enables high speed data input and output, and reduces power consumption.

Intel and Micron Produce Breakthrough Memory Technology

Intel Corporation and Micron Technology, Inc. today unveiled 3D XPoint technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989.

The explosion of connected devices and digital services is generating massive amounts of new data. To make this data useful, it must be stored and analyzed very quickly, creating challenges for service providers and system builders who must balance cost, power and performance trade-offs when they design memory and storage solutions. 3D XPoint technology combines the performance, density, power, non-volatility and cost advantages of all available memory technologies on the market today. The technology is up to 1,000 times faster and has up to 1,000 times greater endurance3 than NAND, and is 10 times denser than conventional memory.

Plextor M6V SSD Launch Date Revealed

Plextor is expected to launch its value SATA SSD line, the M6V, on 17th July, 2015. The drive combines a Silicon Motion SMI-2246 controller, with Toshiba A19 TLC NAND flash chips. The drive comes in capacities of 128 GB, 256 GB, and 512 GB, with DRAM cache sizes of 128 MB, 256 MB, and 512 MB, respectively. All three variants offer sequential read speeds of up to 535 MB/s, while their sequential write speeds are rated up to 170 MB/s, 335 MB/s, and 455 MB/s, respectively. Common features include NCQ, TRIM, and native 256-bit AES encryption. There's a likelihood of Plextor introducing a few new features, such as PlexVault, a software that encrypts and stores your data in hidden partitions, and PlexCompressor, which compresses the least accessed data on your drive.

Source: Hermitage Akihabara

SanDisk Announces High Capacity iNAND 7232 Storage

SanDisk Corporation, a global leader in flash storage solutions, today introduced the iNAND 7232 storage solution, a new, advanced embedded flash drive (EFD) optimized to deliver best-in-class imaging performance and superior storage capacity in flagship mobile devices. Available in capacities up to 128 GB, the iNAND 7232 storage solution enables original equipment manufacturers (OEMs) to introduce smartphones, tablets and other connected devices that feature ample storage to meet the needs of increasing consumer content while providing data-rich application experiences and next-generation digital photography capabilities.

"From North America to China, consumers are demanding higher and higher capacity storage," said Christopher Bergey, SanDisk's vice president and general manager of Mobile and Tablet Solutions. "Our iNAND 7232 storage solution not only enables mobile OEMs to cost-effectively deliver the robust storage mobile users want, it is also our most advanced embedded storage solution to date. It leverages new, innovative application-level storage architecture and SanDisk's latest 15 nanometer flash storage technology to enable outstanding application experiences, terrific 4K Ultra HD video capture and digital photography experiences never before possible in flagship smartphones."

OCZ Announces the Trion 100 Cost-effective SSD Line

OCZ announced the Trion 100, a new lineup of cost-effective SSD for first-time users graduating from HDDs, and for those who want fast read-intensive drives to replace storage HDDs in their systems. Some extremely low price-per-gigabyte figures build their case. The drive features 19 nm TLC NAND flash chips made by Toshiba, driven by a controller also made by Toshiba. This controller features an SLC-caching tech that deals with a small portion of the TLC NAND flash as SLC (by storing just one bit per cell), which has the maximum sequential transfer performance. The controller juggles hot-data in and out of this portion from the rest of the TLC area. Other controller features include DEVSLEEP mode support. In this mode, the drive draws just 6 mW of power. Other essentials such as TRIM and NCQ are also featured.

OCZ Trion 100 comes in four capacities - 120 GB, 240 GB, 480 GB, and 960 GB, priced at US $56.99, $87.99, $184.99, and $369.99, respectively. All four variants offer sequential read speeds of up to 550 MB/s, while the maximum sequential-write speeds are rated at 450 MB/s, 520 MB/s, 530 MB/s, and 530 MB/s, respectively. The maximum 4K random-read performance for the 120 GB variant is rated at 79,000 IOPS; while the other three offer up to 90,000 IOPS. Random-write performance figures for the four variants are 25,000 IOPS, 43,000 IOPS, 54,000 IOPS, and 64,000 IOPS, respectively. The drives are built in the 7 mm-thick 2.5-inch form-factor, with SATA 6 Gb/s interface. The drives ship with OCZ's SSDGuru software that lets you monitor the drive's health, update its firmware, and wipe it. OCZ is offering a 3-year warranty with these drives.



Read our review of the OCZ Trion 100 480GB.

Samsung Intros 2 TB Variants of 850 Pro and 850 EVO SSDs

Samsung Electronics Co., Ltd., a market leader in advanced memory technology and an innovator in consumer electronics, today introduced the 2-terabyte (TB) 850 PRO and 850 EVO solid state drives (SSDs). Samsung's 3D Vertical NAND (V-NAND) based retail SSD lineup now features 20 different products with a wide range of capacity options from 120 gigabyte (GB) to 2TB. Available in 50 countries, the launch of the 2TB drives addresses the ever-increasing consumer demand for high-performance and high-capacity memory solutions.

"Samsung experienced a surge in demand for 500 gigabyte (GB) and higher capacity SSDs with the introduction of our V-NAND SSDs. The release of the 2TB SSD is a strong driver into the era of multi-terabyte SSD solutions," said Un-Soo Kim, Senior Vice President of Branded Product Marketing, Memory Business at Samsung Electronics. "We will continue to expand our ultra-high performance and large density SSD product portfolio and provide a new computing experience to users around the globe."

Team Shows Off L3 EVO Line of Cost-effective SATA SSDs

Team Group unveiled its cost-effective L3 EVO line of SATA SSDs. Making use of TLC NAND flash chips, these drives come in capacities of 240 GB, 480 GB, and 960 GB (pictured below). The 240 GB and 480 GB variants offer sequential speeds of up to 560 MB/s, with up to 540 MB/s writes; with up to 85,000 IOPS reads and up to 90,000 IOPS writes, in 4K random access performance. The company didn't put out performance figures of the 960 GB variant. The drives feature SATA 6 Gb/s interface, are 7 mm-thick, and support all modern SATA SSD features, including TRIM, NCQ, native AES acceleration, and SMART.

Intel Unveils DC S3510 SSDs for the Data Center

Intel quietly announced availability of its DC S3510 SSDs for data centers. Built in the 2.5-inch form-factor, with SATA 6 Gb/s interface, these drives feature SET (standard-endurance technology) MLC NAND flash built by IMFlash Technology, on a 16 nanometer node, which can take in up to 880 TBW. Its controller offers native 256-bit AES encryption. The drive is available in capacities of 80 GB, 120 GB, 240 GB, 480 GB, 800 GB, 1.2 TB, and 1.6 TB. The table below shows sequential and 4K random access performance figures by the company for each model. The drives are backed by 5-year warranties, and are available in the OEM channel. Its target consumers are low-cost dedicated hosting providers.

Fixstars Unveils the Highest-Capacity 2.5-inch SSD

Fixstars unveiled the world's highest capacity SSD in the 2.5-inch form-factor, with a SATA 6 Gb/s interface, the Fixstars SSD-6000M. This drive offers 6,000 GB of unformatted space, and uses 15 nm MLC NAND flash chips. The underlying controller is unknown, but the drive offers reasonably high sequential transfer speeds of up to 540 MB/s read, with up to 520 MB/s writes. The drive supports modern SSD features, such as NCQ, TRIM, and SMART. The drive is 9.5 mm thick, and may not fit in certain kinds of notebooks. The company plans to launch the drive some time in July, 2015, backed by a 3-year warranty.

AMD to Skip 20 nm, Jump Straight to 14 nm with "Arctic Islands" GPU Family

AMD's next-generation GPU family, which it plans to launch some time in 2016, codenamed "Arctic Islands," will see the company skip the 20 nanometer silicon fab process from 28 nm, and jump straight to 14 nm FinFET. Whether the company will stick with TSMC, which is seeing crippling hurdles to implement its 20 nm node for GPU vendors; or hire a new fab, remains to be seen. Intel and Samsung are currently the only fabs with 14 nm nodes that have attained production capacity. Intel is manufacturing its Core "Broadwell" CPUs, while Samsung is manufacturing its Exynos 7 (refresh) SoCs. Intel's joint-venture with Micron Technology, IMFlash, is manufacturing NAND flash chips on 14 nm.

Named after islands in the Arctic circle, and a possible hint at the low TDP of the chips, benefiting from 14 nm, "Arctic Islands" will be led by "Greenland," a large GPU that will implement the company's most advanced stream processor design, and implement HBM2 memory, which offers 57% higher memory bandwidth at just 48% the power consumption of GDDR5. Korean memory manufacturer SK Hynix is ready with its HBM2 chip designs.Source: Expreview

Micron and Intel Unveil New 3D NAND Flash Memory

Micron Technology, Inc., and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Toshiba Develops World's First 48-Layer BiCS

Toshiba Corporation today announced development of the world's first 48-layer three dimensional stacked cell structure flash memory called BiCS, a 2-bit-per-cell 128-gigabit (16 gigabytes) device. Sample shipments of products using the new process technology start today. The BiCS is based on a leading-edge 48-layer stacking process, which enhances the reliability of write/erase endurance and boosts write speed, and is suited for use in diverse applications, primarily solid state drives (SSD).

Since making the world's first announcement of technology for 3D Flash memory, Toshiba has continued development towards optimizing mass production. To meet further market growth in 2016 and beyond, Toshiba is proactively promoting the migration to 3D Flash memory by rolling out a product portfolio that emphasizes large capacity applications, such as SSD.

OCZ Announces 2 TB (1920 GB) Variant of its Intrepid 3000 Enterprise SSD

OCZ Storage Solutions -- a Toshiba Group Company and leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced a new series of SATA III SSDs to add to its Intrepid 3000 enterprise portfolio. The new Intrepid 3700 SSD Series delivers superior performance and I/O latency responses that dramatically improve application performance and I/O efficiencies, and supports higher storage densities up to 2TB representing OCZ's largest capacity enterprise SATA SSDs to date.

"Datacenter customers have asked for larger solid state drives that do not make any sacrifices in performance or endurance to address the need to manage the ever growing amounts of data being generated by today's computing environments," said Daryl Lang, CTO at OCZ Storage Solutions. "Our new Intrepid 3700 Series is designed to meet these market requirements for an easy to deploy solid state solution that delivers the very best balance of features, endurance, and capacity."

Toshiba Unveils new e.MMC 5.1 Compliant NAND Flash Products

Toshiba Corporation's Semiconductor & Storage Products Company today announced the launch of JEDEC e∙MMC Version 5.1 compliant embedded NAND flash memory products supporting "command queuing" and "secure write protection". The new products integrate NAND chips fabricated with 15nm process technology and are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices. Sample shipment of the 16GB and 64GB products start today, with 32GB and 128GB products to follow.

The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15nm generation process technology with a controller to manage basic control functions for NAND applications in a single package. In October 2014, Toshiba launched the industry's first e∙MMC products supporting all mandatory features of JEDEC e∙MMC Version 5.1, which was officially issued by JEDEC on February 24, 2015. The new additions to the line-up support two optional features of e∙MMC Version 5.1, "command queuing" and "secure write protection."

ADATA Launches IHSS312 Industrial Half-Slim SSD

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launches the IHSS312, a high-performance SATA III 6Gbps 22-pin half-slim SSD of MO-297 form factor, which is available in 8/16/32/64/128/256GB capacities to meet the varying needs of IPC embedded systems, healthcare, medical devices, kiosk/POS and factory automation.

Utilizing high-speed MLC NAND flash, ADATA's IHSS312 provides excellent performance and reliability with a sequential read/write speed up to 500/125MB per second and MTBF of up to 1 million hours. Thanks to its industrial-grade operable temperature range of -40°C to +85°C, the IHSSS312 is ideal for harsh environments requiring long-term operation.

Micron Technology Breaks Ground on Expansion of Singapore NAND Flash Facility

Micron Technology, Inc., today hosted a groundbreaking ceremony with company and Singapore government officials to begin the expansion of its Singapore NAND flash memory fabrication facility.

Previously announced by the company in December, the approximate 255,000 square foot expansion will facilitate efficient implementation of 3D NAND production at the Singapore facility and give Micron the flexibility to gradually add incremental capacity in response to market requirements. In addition, the space will enable production of storage class and other memory technologies.

"Micron enjoys a strong relationship with Singapore where we employ more than 7,000 team members operating at four major facilities," said Micron President Mark Adams. "We're excited to expand our manufacturing footprint in Singapore, and we commend the government and Economic Development Board for fostering such a productive business environment."

SanDisk Announces iNAND 7132 e.MMC Storage with 1 Gbps Transfer Rates

SanDisk Corporation, a global leader in flash storage solutions, today introduced the iNAND 7132 storage solution, the most advanced embedded storage solution from SanDisk to date. Designed for use in flagship mobile devices, the iNAND 7132 storage solution features SanDisk's new iNAND Accelerator Architecture with SmartSLC technology, an innovative new storage architecture that quickly and intelligently responds on-demand to mobile users' needs and gives superior experiences to the most data-intensive applications. Available in capacities up to 64GB, iNAND 7132 storage solution enables original equipment manufacturers (OEMs) to introduce a new generation of high-capacity smartphones, tablets and connected devices that offer exceptional user experiences.

"iNAND 7132 is the perfect high capacity storage solution for the next generation of smartphones, tablets and smart devices," said Drew Henry, senior vice president and general manager for Mobile and Connected Solutions at SanDisk. "Featuring our new iNAND Accelerator Architecture with SmartSLC, our best-in-class iNAND 7132 storage solution delivers amazing performance for faster burst photography and 4K Ultra HD video capture, supports the newest 802.11 standards with ease, and enables blazingly fast data side-loading."

SanDisk Intros First Memory Cards Designed for Dashcams

SanDisk Corporation, a global leader in flash storage solutions, today introduced the company's first high endurance microSDXC memory card built to withstand up to 10,000 hours of Full HD Video recording.

Leveraging its deep expertise in NAND flash and systems technology capabilities, SanDisk developed a proprietary technology and process to enable high-intensity recording. Through rigorous testing, the new technology has proven itself to enable the company to reach a new milestone -- a 64GB microSDXC card that allows consumers to write and rewrite up to 10,000 hours of Full HD video recording.

Micron, Seagate Announce Strategic Alliance

Micron Technology, Inc., and Seagate Technology plc today announced a strategic agreement that establishes a framework for combining the innovation and expertise of both companies. The framework of the agreement will enable customers of the two companies to benefit from a focused approach to deliver industry-leading storage solutions, helping them innovate faster and more effectively

While initially focusing on next-generation SAS SSDs and strategic NAND supply, Micron and Seagate anticipate that this multi-year agreement will extend into future collaboration on enterprise storage solutions featuring Micron NAND flash memory. "As two of our key partners, we look forward to the benefits of this Micron and Seagate collaboration in future NAND flash-based storage technologies," said Mike Kerouac, President of Global Product Operations for EMC Corporation.

"The strategic agreement between Micron and Seagate promises to deliver new and innovative flash-based storage solutions," said Trevor Schick, Senior Vice President, EG Global Supply Chain, HP.

ATP to Present Its Industrial Grade M.2 and Embedded Modules at the EW2015

ATP, the leading industrial Flash storage and DRAM memory solution provider, will be showing its industrial-grade M.2 and the latest SATA III interface products (SlimSATA, mSATA, and CFast) and ATP Testing Capabilities at the upcoming Embedded World 2015 at the Messe Nuremberg International Center Germany from 24th to 26th of February. ATP will be located at Hall 1, Booth #651.

ATP's brand-new industrial-grade SATAIII M.2 type 2242 and 2260, targets industrial embedded applications, which demand Solid State Storage with high performance and proven reliability in thin/limited spaces and extreme temperature conditions. In addition to the built-in features, such as BCH ECC checking, S.M.A.R.T monitor, TRIM and Advanced Wear-Leveling, ATP M.2 has its Power Cycling Protection (PowerProtector) and Data Integrity Protection (AutoRefresh) to ensure it outperforms other similar solutions in the market.

SanDisk Introduces New Automotive Grade Flash Storage Solutions

SanDisk Corporation, a global leader in flash storage solutions, today introduced a new suite of robust, automotive grade NAND flash solutions designed for next-generation 'connected cars' and automotive infotainment systems. SanDisk Automotive storage solutions are optimized to bring reliable, high-performance storage to a wide range of in-vehicle applications, including 3D mapping and advanced augmented reality in navigation systems, entertainment systems, intuitive driver assist technology, data event recorders, and more. By providing the responsiveness and capacity of SanDisk flash storage technology, SanDisk Automotive solutions offer the potential for car manufacturers to continue to push the boundaries of connected car application experience.

Today's vehicles are rapidly becoming more technologically sophisticated, with many featuring advanced connected applications that were once only possible on a smartphone. A recent Gartner Research report forecasted that "about one in five vehicles on the road worldwide will have some form of wireless network connection by 2020, amounting to more than 250 million connected vehicles in service".
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