News Posts matching "Nehalem"

Return to Keyword Browsing

Intel Discontinues Xeon 5500 "Tylersburg" Platform

After last week's launch of the Xeon "Romley" platform, which replaces the Xeon 5500 "Tylersburg" platform, Intel has a retirement plan ready for the latter. Tylersburg was introduced in 2009, based on Intel's Nehalem architecture. Intel introduced product change notification (PCN) documents that detail these plans. The following models will be discontinued:
  • High-end: W5590, W5580, X5570, X5560 and X5550
  • Mid-tier versions: E5540, E5530, E5520, E5507, E5506, E5504, E5503 and E5502
  • Entry-level versions: L5530, L5520 and L5506
September 28, 2012 is set as the last date of orders for these chips. After this date, Intel will work to clear the last orders, and the products will attain end-of-life (EOL) status. Small stocks will still be held to honor any warranty claims.Source: CPU World

Intel Aims at 10 nm Processors by 2018

It's not just host nations of the Olympics that are decided almost decades in advance, but also Intel's silicon names and the fab process they're going to be built on. Intel has its plan for the greater part of this decade already charted out, well beyond the upcoming Ivy Bridge architecture. Intel follows the "tick-tock" product cycle, where every micro-architecture gets to be built on two succeeding fab processes, and every fab process getting to have two succeeding micro-architectures built on it, in succession. Westmere is an optical shrink of the Nehalem architecture, it was a "tick" for the 32 nm process, Sandy Bridge is its "tock", and a new architecture. Ivy Bridge is essentially an optical shrink of Sandy Bridge, it is the "tick" for 22 nm process.

Ivy Bridge will make its entry through the LGA1155 platform in 2012, it will make up the 2012 Core processor family. Haswell is the next-generation architecture that succeeds Sandy Bridge and IvyBridge, it will be built on the 22 nm process, and is expected to arrive in 2013. Roswell is its optical shrink to 14 nm, slated for 2014. Looking deep into the decade, there's Skylake architecture, that will span across 14 nm and 10 nm processes with Skymont. This model ensures that Intel has to upgrade its fabs every 2 or so years, an entirely new micro-architecture every 2 or so years as well, while providing optical shrinks every alternating year. Optical shrinks introduce new features, increased caches, and allow higher clock speeds. 10 nm for processors by 2018 sounds realistic looking at the advancement of NAND flash technologies that are pushing the boundaries of fab process development. NAND flash is much less complex than processor development, and hence serve as good precursors to a new process.

Source: ComputerBase.de

2011 Intel Core Processor Pricing and Launch Dates Surface

Back in August, a report with details sourced from ComputerBase.de was bang-on in tabling what the 2011 Intel Core processor lineup is going to look like. With a little over a month to go for the market release of these processors, fresh details emerged that reveal pricing and precise availability dates of each model. To begin with, 9th January is D-day for the socket LGA1155 platform, when one can expect a large wave of motherboards to reach stores, along with 10 new Core i5, Core i7 "Sandy Bridge" quad-core processors.

The quad-core lineup consists of 7 Core i5 models. Based on a Sandy Bridge derivative silicon, these processors differ from the Core i7 models in having no HyperThreading (4 cores/4 threads), and 25% of the L3 cache being disabled (set at 6 MB). The lineup overall is seeing a clock speed increase compared to current-generation "Lynnfield" processors. The Core i5 lineup also includes an overclocker-friendly "K" model, which features an unlocked BClk multipler. The fastest in the lineup is the Core i7 2600/2600K, which is clocked at 3.40 GHz. With the default BClk (base clock) of Sandy Bridge running at 100 MHz (compared to 133 MHz on Nehalem/Westmere), one can expect very high multiplier values. It should also be easier to calculate speeds and keep track of, for overclockers.

NVIDIA Names Fermi Architecture Successors

At the GPU Technology Conference (GTC), an annual event hosted by NVIDIA, the company named the next two succeeding GPU architectures to Fermi (the current generation architecture on which are based GeForce 400 series GPUs). NVIDIA's next major GPU design change will come in the form of "Kepler", probably named after the German mathematician Johannes Kepler. The only concrete details about this architecture is that chips will be built on the 28 nanometer silicon fabrication process, and that going by the architecture's double-precision GPU compute performance per Watt represented on a graph, NVIDIA expects Kepler to be 4~5 times faster than Tesla, and over twice as fast as Fermi, again, at double-precision GPU compute performance per Watt.

Kepler is slated for 2011, though which part of the year will it be out (since AMD's answer to Fermi isn't far away), wasn't revealed. Looking much further away into the future, much like Intel mentioned Sandy Bridge's successor (Gesher) way back when unveiling Nehalem, NVIDIA talked about Kepler's successor slated for 2013. This one is called Maxwell, probably in honour of Scottish mathematician James Maxwell, with expectations of no less than three times the double-precision computation power per Watt of Kepler. These chips will be built on the 22 nanometer process.

Source: PC Perspective

Intel Unveils New Product Plans for High-Performance Computing

During the International Supercomputing Conference (ISC), Intel Corporation announced plans to deliver new products based on the Intel Many Integrated Core (MIC) architecture that will create platforms running at trillions of calculations per second, while also retaining the benefits of standard Intel processors.

Targeting high-performance computing segments such as exploration, scientific research and financial or climate simulation, the first product, codenamed "Knights Corner," will be made on Intel's 22-nanometer manufacturing (nm) process – using transistor structures as small as 22 billionths of a meter – and will use Moore's Law to scale to more than 50 Intel processing cores on a single chip. While the vast majority of workloads will still run best on award-winning Intel Xeon processors, Intel MIC architecture will help accelerate select highly parallel applications.

Intel to Introduce 8-core Xeon Nehalem-EX, 6-core Westmere-EP Processors This Month

Intel is set to introduce a series of eight-core Xeon server processors later this month, that are capable of running in four-socket servers. With HyperThreading technology enabled, each core can handle two threads, taking the logical CPU count on such servers up to 64. Each Nehalem-EX chip has 8 CPU cores with dedicated L2 caches of 256 KB, a shared L3 cache of 24 MB, and Turbo Boost technology that helps conserve power while also stepping up performance when needed. The die also features a memory controller with four DDR3 memory channels. Being based on the Nehalem architecture, the chips are built on the 45 nm HKMG process.

In related news, Intel will also introduce Westmere-EP processors later this month. These chips will be based on the 32 nm Westmere architecture, and are likely to have 6 cores, up to 12 logical CPUs per chip, 12 MB of L3 cache and three DDR3 memory channels. These chips will be suited for two-socket servers and workstations.


Source: PC World

EVGA Names and Details its Dual-LGA1366 Enthusiast Motherboard

EVGA today named its dual-LGA1366 enthusiast-grade motherboard, so far known by the codename W555. After a short contest on the company's forums, the company came up with "EVGA Classified SR-2" for its name. SR stands for "super record" and 2 denoting the dual-socket design. The Classified SR-2 is a an entusiast-grade (read: overclocker friendly) implementation of the Tylersburg platform, supporting Intel socket LGA1366 processors with two QPI links (2P Xeon, etc.) As an addition, the board allows you to do something that's difficult on typical 2P server motherboards: it allows you to mix different models of Xeon processors, provided they're based on the same architecture, and series. For example, you can mix a Xeon 5520 with Xeon 5540. You can also mix a quad-core processor with a six-core processor, provided the quad-core part is based on the Westmere architecture (32 nm), not Nehalem (45 nm).

The board will also let you run a single 2P-capable processor in either sockets. DDR3 memory modules can be non-ECC or even ECC. 2P Xeon DRAM Multipliers / Uncore Multipliers are locked so you will only be able to use maximum 2:8 or 2:10 depending on segment of CPU. EVGA tells that the board supports 4-way SLI on its GTX 285 Classified VGA, but adds that a "future flagship GPU" also supports it. Could this be GeForce GTX 400 series having it as a standard feature? We have to wait and see. 4-way CrossFireX is supported.

Business PCs Arrive with New Intel Core vPro Processor Family

Intel Corporation today unveiled its 2010 Intel Core vPro processor family to meet the needs of businesses of all sizes for PCs with greater, more flexible performance, theft prevention and cost savings in a rapidly changing business computing environment. These and several other capabilities are at the heart of many new Intel-based business laptop and desktop computers beginning to roll out from computer manufacturers worldwide.

The Intel Core vPro processors arrive as business computing evolves with the emergence of video, Internet telephony, social networking and other heavyweight applications – in many cases running at the same time – making a computer's performance an even bigger priority.

Intel Unveils Core i5 6xx, 6x1 Series Dual-Core Processors

Intel today gave a go ahead for the media to publish reviews of its brand new dual-core processors under the Core i5 6xx and Core i5 6x1 series. The processors are based on the new "Clarkdale" processor die, and make use of the company's 32 nm next generation HKMG manufacturing process. Unlike conventional processor packages based on the Nehalem/Westmere architecture, the new processors move the northbridge component of the system onto the processor package, only that it is based on a separate 45 nm die within the package. The 32 nm processor die houses two processor cores along with up to 4 MB of L3 cache, while it is wired to a larger iGPU die which houses the dual-channel DDR3 memory controller, a graphics core, PCI-Express root complex, along with other components traditionally found on northbridge chips.

The first three models in the new Core i5 series are the 3.20 GHz Core i5 650, 3.33 GHz Core i5 660 and 661 (latter has a faster iGPU), and 3.46 GHz Core i5 670. These processors have the LGA-1156 package and are compatible with existing P55 Express chipset (albeit without the iGPU feature), along with the company's new H55 Express and H57 Express chipsets that support the Flexible Display Interface that provides connectivity to the processors' iGPUs. The new processors feature HyperThreading Technology, with which it provides the operating system with four logical CPUs (threads) to deal with, TurboBoost technology which powers down a core and overclocks the other when the task load is low. Pricing and availability will surface when the processors are formally announced, a little later this month. Meanwhile, motherboard manufacturers are ready with boatloads of new motherboard models based on Intel's two new chipsets. A compilation of links to major reviews on the internet can be found in the day's reviews list on the homepage.


Source: HotHardware

EVGA Prepares High-end Dual-LGA1366 Motherboard

EVGA is keeping up its streak of releasing high-end motherboards for processors based on the new Intel Nehalem architecture, with a new dual-socket monstrosity. Slated for CES 2010, not much about this high-end workstation motherboard has been revealed beyond the picture below. From the looks of it, probably EVGA is making a high-end, overclocker-friendly dual LGA-1366 motherboard based on the Intel 5500 "Tylersburg" chipset with the usual ICH10R southbridge. Existing LGA-1366 processors that support dual-socket operation which includes Xeon 5500 series may work on it. Probably, a future high-end Intel Core family CPU is released that is capable of dual-socket setups, too. The picture reveals two LGA-1366 sockets, each powered by an 8-phase digital PWM circuit. Each socket is wired to six DDR3 DIMM slots supporting triple-channel memory for that socket. More this CES.

Source: EVGA Forums

Transcend Ships 4GB aXeRam DDR3-2000 Memory Kits for Intel Core i5 Platforms

Transcend Information Inc., a worldwide leader in the manufacture of high-performance memory modules, today launched 4GB aXeRam DDR3-2000 memory kits for use with Intel’s LGA1156 Core i5 and Core i7 platforms. The XMP-ready DDR3 kits are designed to operate at a blazing-fast clock frequency of 2000 MHz with an exceptionally low voltage of just 1.65V.

Featuring memory bandwidth up to an incredible 32GB/s, Transcend’s new aXeRam dual-channel memory kit is rated at 2000MHz with timings of 9-9-9-24, allowing performance enthusiasts and gamers to take their Intel Core i5 platform to the next level of memory overclocking performance. The Core i5, based on Intel’s new Nehalem architecture, is the first Intel processor to integrate both a 16-lane PCI Express 2.0 graphics port and a two-channel DDR3 memory controller, enabling all input/output and manageability functions to be handled by the single-chip Intel P55 core-logic.

Gulftown Product Name and Tentative Price Surfaces

Contrary to older reports, Intel will stick to the Core i7 brand identifier to sell its first consumer (client) six-core processor based on the Nehalem architecture, codenamed "Gulftown". The first offering of these socket LGA-1366 processors, is the Core i7 980X Extreme Edition. Its positioning and pricing shows that Intel will replace its current flagship desktop processor, the Core i7 975 Extreme Edition with it, and at the very same price-point of US $999 (in 1000 unit tray quantities).

A future price list also shows that the Core i7 980X Extreme Edition is slated for March 2010. A month ahead of its launch, Intel will introduce the Core i7 930, which succeeds the Core i7 920 at its price-point of $284. The Gulftown core will be manufactured on Intel's brand new 32 nm HKMG process, it features 6 processing cores with 12 threads (HyperThreading Technology), triple-channel DDR3 memory with its integrated memory controller, 6.4 GT/s QPI link to the Intel X58 Express chipset, 12 MB of L3 cache, compatibility to platforms that support the Core i7 9xx processors, and 130W TDP. The Core i7 980X Extreme Edition comes with a clock speed of 3.33 GHz, The Core i7 930 on the other hand, is a quad-core processor which runs at 2.80 GHz.

Sources: PCOnline.com.cn, ZOL.com.cn

Intel Develops 'HPC-Optimized' 6-core Xeon Processors

Following AMD's recent success of its 6-core Opteron processor in the TOP500 supercomputer list, Intel has sensed a market for "HPC-optimized" processors, which the company expects will be out in the first half of 2010. These could be either variants of the Nehalem-EX multi-socket capable processors, or that by design, Nehalem-EX suits HPC (high-performance computing) applications better.

These 6-core processors will carry clock speeds higher than 8-core Xeon processors around that time. The processors will be able to work in systems with up to 256 processors (logical CPUs). In addition to these Intel also announced that it will be releasing a beta version of its Ct technology by the end of this year. Ct makes parallel programming in the C and C++ programming languages easier, by automatically optimizing code to exploit multi-core and many-core systems.Source: TechConnect Magazine

Intel Plans Core i7 and Core i5 Dual-Core Ultrathin Notebook Processors in 2010

Intel recently released quad-core notebook processors based on the Nehalem architecture. The company wants to further develop its ultrathin notebook processor portfolio with three new dual-core processors based on the "Arrandale" core, carrying the Core i7 and Core i5 brand identifiers. These models are slated for launch in the first half of 2010. Included, are the Core i7 640UM, Core i7 620UM, and Core i5 520UM. While the Core i7 640UM is clocked at 1.20 GHz, the Core i7 620UM and Core i5 520UM carry the same clock speeds of 1.06 GHz. We would imagine a feature such as HyperThreading Technology to differentiate the two.

While the clock speeds may seem low, it is important to note that these ultra low voltage processors succeed similarly clocked Core 2 Duo SU9000 and SU7000 series processors. Speaking of which, in the run up to the new chips, Intel will introduce six new models within Q4 2009, namely Core 2 Duo models SU9600, SU9400, SU7300, Pentium models SU4100, SU2300, and Celeron 743. The Core i7 640UM, 620UM, and Core i5 520UM are expected to be available to manufacturers at US $305, $278, and $241, respectively. All prices are in 1000-unit tray quantities.Source: DigiTimes

Transcend Introduces DDR3 1333MHz Memory Kit for Intel Core i5 Platforms

Transcend Information Inc., a leading global manufacturer of memory modules, today announced shipping of a new DDR3 1333MHz memory module kit designed for Intel’s latest LGA-1156 Core i5 and Core i7 platforms.

The DDR3 1333 MHz dual-channel memory kit is perfectly matched for use with Intel’s next-generation desktop PC platform, Core i5. The new Core i5, which is based on Intel’s new Nehalem architecture, is the first Intel processor to integrate both a 16-lane PCI Express 2.0 graphics port and a two-channel DDR3 memory controller, enabling all input/output and manageability functions to be handled by the single-chip Intel P55 core-logic.

Intel Introduces Xeon W3565 Workstation/Server Processor

Intel updated its socket LGA-1366 Xeon processor portfolio with the W3565. Based on the Nehalem architecture, this quad-core processor is made for single-socket servers and workstations. It has near-identical specifications to the consumer-grade Core i7 960, in having a clock speed of 3.20 GHz (24 x 133 MHz), 8 MB of L3 cache, and a QuickPath Interconnect (QPI) speed of 4.8 GT/s. The QPI speed is perhaps the only thing that differentiates it from the W3570, which has the same clock speed, albeit a QPI speed of 6.4 GT/s. This one specification makes for a large price difference. While the new W3565 is priced at $562, the W3570 is priced at $999. With the introduction of the new processor, Intel is set to retire the 2.93 GHz W3540, and 3.06 GHz W3550.Source: TechConnect Magazine

ASUS et. al. Introduce Tesla and Nehalem Xeon Powered Desktop Supercomputer

ASUS, in collaboration with NVIDIA and the National Chao Tung University of Taiwan, has introduced the ESC 1000 desktop-sized supercomputer, that harnesses the power of GPGPU, to give out 1.1 TFLOPs of computational power. Enclosed in a 445 x 217.5 x 545 mm chassis (the size of tower server/workstation chassis,) is a system powered by an Intel Xeon W3580 "Nehalem" 3.33 GHz processor, aided by 24 GB of system memory. As many as three NVIDIA Tesla c1060 GPGPU cards are installed, with an NVIDIA Quadro FX 5800 handing graphics. These emphasize that the system is meant for highly complex visual computing, such as in the fields of highly complex modeling, and scientific research. The pricing and availability of the ESC 1000 is not known as yet.

Source: PCAdvisor

Apacer Announces DDR3 Golden and Aeolus Overclocking Memory Modules

In response to Intel's recent official release of its latest quad-core processors Core i7-800 series and Core i5-700 series, Apacer Technology Inc., the leading memory module manufacturer, unveils two DDR3 dual-channel overclocking memory modules—Golden and Aeolus series. They target desktop and overclocking users to by delivering extreme performance and fully support Core i7 and Core i5 processors that use Intel's Nehalem microarchitecture for optimum platform compatibility for mainstream desktop computers. Excellent overclocking performance thus comes realized.

To support P55 chipset-based Intel Core i7 and Core i5 platforms, Apacer's new DDR3 overclocking memory modules can be powered by 1.65V low voltage supply. When running under the dual-channel mode, Golden series can achieve bandwidth up to 1800 MHz. Aeolus series featuring unique Dual-layer Heat Spreader can reduce the temperature by as much as 20°C and also support maximum frequency of 2200 MHz. Exclusively designed for hardcore gamers and overclocking users, the overclocking memory modules allow users to experience the extreme overclocking performance.

Intel Unveils Fastest Laptop Chips Ever With the New Intel Core i7 Mobile Processor

Intel Corporation introduced its revolutionary Intel Core i7 Mobile Processor and Intel Core i7 Mobile Processor Extreme Edition today, bringing Intel’s award-winning and super-fast Nehalem microarchitecture to the mobile market.

These processors in addition to the new Intel PM55 Express Chipset, provide the best laptop experience for intense gaming, digital media, photos, music, business applications and other multi-threaded software that hungers for faster processing speed. The chips also boost overall performance when using several of these applications simultaneously.

Eurocom Launches World's First i7 Clarksfield Based High-End Notebooks

Eurocom, the world's leading developer of highly personalized, high-performance notebook PCs and LCD PCs, plans to launch its new mobile notebook line-up based on Intel Calpella in early October. The Calpella platform is based on Clarksfield processors with four cores that will be marketed by Intel under Core i7 trademark as well code-named Ibex Peak-M core logic that will be branded as Intel PM55.

There will be two notebook models available: 15.6-inch HD EUROCOM W860CU Cougar and 17.3-inch W870CU Cheetah based on Intel i7 Mobile processors, Intel PM55 chipset, DDR3-1333 Memory, NVIDIA's GeForce GTX 2x0M or GTX 3x0M series upgradeable MXM 3.0 Type B VGA technology.

Intel Unveils Future Family of Low-Power Integrated Xeon Embedded Processors

Intel Corporation today disclosed new information about next-generation Intel Xeon processors – codenamed “Jasper Forest” – for communications and storage applications, due in early 2010. With Jasper Forest, Intel engineers have, for the first time, integrated PCI Express (PCIe) in a dual-processing Xeon processor, which greatly facilitates dense storage and communications solutions such as IPTV, VoIP, NAS, SAN and wireless radio network controllers.

Jasper Forest maintains the outstanding performance of Intel architecture (Nehalem), while lowering system power consumption by 27 watts when compared to the Intel Xeon 5500 series processors. The dual-processing solution integrates two Jasper Forest processors with 16 PCIe Generation 2.0 lanes each and is paired with the Intel 3420 chipset platform controller hub. This integration of the I/O hub via PCIe enables significant power and space savings, resulting in one of the highest performance-per-watt Intel Xeon chips ever.

Westmere a Fast 'Tick'?

Intel has already set foot on the 32 nm lithography, with first 32 nm based prcoessors expected to arrive in Q1 2010. These processors have already been extensively sampled, and tested by sections of the media. More importantly, 32 nm marks Intel's introduction of the Westmere architecture, which is a 32 nm optical shrink of Nehalem, with a slightly expanded feature-set making use of the possibly higher transistor loads. Starting with dual-core "Clarkale" processor, Intel plans to work out high-end six-core processors codenamed "Gulftown" within the first half of 2010. In addition to this, Intel is readying Westmere's successor, codenamed "Sandy Bridge".

While a vague die-shot of a supposedly mainstream quad-core processor based on Sandy Bridge surfaced last month, more information about it is coming to light from industry sources, according to DigiTimes. Intel will introduce the Sandy Bridge architecture in the fourth quarter of 2010. Considering the first Westmere CPUs are commercially launched ten months after its formal introduction (Westmere was unveiled in February,) the commercial launch of the first Sandy Bridge processors can't be too far away from Q4 2010. This in essence shows that Intel can afford to come up with a new flavour of CPUs every year. Nehalem will have served as a 1.25 year "tock" for the 45 nm process, while Westmere may serve as a "tick" of nearly the same length. For those of you unfamiliar with Intel's "tick-tock" model of product development cycle, The company uses a "tick-tock" model of process development, where each processor architecture gets to be made in two manufacturing processes, while each process gets to build two succeeding architectures.Source: DigiTimes

Intel Expands Xeon ''Nehalem'' Lineup with Four New Models

Intel expanded its portfolio of Xeon enterprise processors with four new models: the dual-socket W5590, L5530, and single-socket W3580 and W3550. With this batch of releases, Intel introduces 3.33 GHz Xeon models. To begin with, W5590 comes with a clock speed of 3.33 GHz, and Quickpath Interconnect speed of 6.4 GT/s. It features 8 MB of L3 cache to aid its four HyperThreading-enabled cores. This model is trailed by the single-socket W3580 that carries the same specs of 3.33 GHz core speed, 8 MB L3 cache, and HyperThreading enabled. Another single-socket model, W3550, is clocked at 3.06 GHz. It has a narrower 4.8 GT/s QPI speed, 8 MB L3 cache, HyperThreading enabled. All these chips have their TDP rated at 130W. Finally, there's the low-wattage L5530. This dual-socket chip is clocked at 2.40 GHz, QPI speed of 5.83 GT/s, 8 MB L3 cache, and TDP rating of a mere 60W.Source: Electronista

Intel Updates Mainstream, Performance, and Extreme CPU Roadmap

Intel issued a confidential roadmap for CPU product releases that looks as far as Q3 2010, leaked to sections of the Chinese media. The roadmap covers prominent Intel processors in their designated market segments drawn out by Intel, covering three grades of mainstream, one each of performance and extreme. The roadmap marks a definite transition of architectures from Intel's Core (penryn) to next-generation Nehalem, and the advent of Intel's first 32 nm based Westmere CPUs.

To begin with, there three models of Intel's first LGA-1156 processors scheduled for Q3 2009, the quad-core "Lynnfield" based Core i7 870 (2.93 GHz, HTT) in Performance, Core i7 860 (2.80 GHz, HTT) in MS3/upper-mainstream, and Core i5 750 (2.66 GHz, no HTT) in MS2/middle-mainstream. The HTT-enabled Core i7 800 processors were earlier believed to have been scheduled for Q1 2010, but are combined with the Core i5 750 for a grand platform launch. The Core i7 800 models will remain seated in their segments for the better part of 2010.

Clarkdale 3.06 GHz Faces a Preview, Series Pricing Surfaces

"Clarkdale" is the codename for Intel's upcoming dual-core processors derived from the Nehalem/Westmere architecture. The move marks a leap for Intel in two ways: introducting the first commercial-grade 32 nm microprocessor, and implementing a radical new design that involved relocating the platform's northbridge component entirely to the CPU package. Slated for Q1 2010, Clarkdale will go by three brand indentifiers to grade it according to a performance and feature scale. You have the Core i5 class that enables the entire feature-set of processor, there's the Core i3 class that offers some features, excluding Intel Turbo Boost technology for example, finally there's the sub-$100 Pentium part (yes, Pentium lives on), which offers a smaller feature-set. HyperThreading technology is disabled on this one.

Chinese tech-site IT168 published a comprehensive performance (p)review of the 3.06 GHz Clarkdale part. In the article, the 3.06 GHz Clarkdale was pitted against the 3.00 GHz "Wolfdale" Core 2 Duo processor. The memory (Dual-channel DDR3-1333, 4 GB) and graphics hardware (ATI Radeon HD 4870, 1 GB) were kept common between the two test-beds. Tests ranged from memory and CPU internal bandwidth tests, math-intensive tests, synthetic multimedia and 3D tests, and finally, modern 3D games.
Return to Keyword Browsing