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First Intel Clarkdale Core i3 Low-Voltage Overclocking Feat Yields 4 GHz at 0.832 V

Intel's upcoming dual-core derivatives of the Nehalem/Westmere architecture, codenamed "Clarkdale" seems to have some interesting electrical characteristics. The CPU component of the chip is built on Intel's brand new 32 nanometre process that facilitates higher transistor densities, and in the process, intends to bring down TDP. An overclocking feat by Coolaler.com seems to suggest one of two things: either these chips have naturally low vCore voltages, or that the overlocking headroom at low-voltages is exceptional. Coolaler used a pre-release engineering sample of the Core i3 Clarkdale processor on a compatible platform, and achieved 4 GHz of clock speed with the vCore at 0.832 V. The frequency multiplier of the CPU was set at 25.0x, and a bus speed of 160 MHz used. Intel will be ready with these processors by the end of this year.

Source: Coolaler.com

Intel 32 nm Clarkdale Chip Brought Forward to Q4 2009

While the bulk of Intel's upcoming Nehalem and Westmere derived products include quad-core processors, the company hasn't left out dual-core processors just as yet. The dual-core Core i5 desktop processor will be based on the new Clarkdale core, built on the 32 nm Westmere architecture. Originally slated for a Q1 2010 launch, the new chip seems to have been pulled into the Q4 2009 launch schedule, deep enough to make for a significant amount of projected sales, according to sources in the Taiwanese motherboard industry.

The sales projections for Q4 look particularly interesting. Core i5 "Clarkdale" dual-core is projected to amount for 10% of Intel's sales, while Core i7 "Bloomfield" at 1%, Core i5 "Lynnfield" at 2% (Core i7 "Lynnfield" is slated for Q1 2010), Core 2 Quad at 9%, Core 2 Duo E7000/E8000 at 35%, Pentium E5000/E6000 at 31%, Celeron E3000 and Atom together at 9%, Pentium E2000 and Celeron 400 together at 4%. In the following quarter, Clarkdale's sales share is expected to rise to 20%. The numbers prove just how large the market for dual-core processors is, even four years into the introduction of quad-core chips.Source: DigiTimes

Details on Intel's Core Brand Product Placement Emerge, Gulftown to be Named Core i9

Last week, Intel sketched out its strategy in dealing with its client processor brand Core, and placing its different kinds of processors in series of markers (such as "i3", "i5", and "i7"), on the merit of performance and features they offer, and not necessarily a segregation based on core type and socket type. This raised a big debate in our forums, on who is really going to benefit from this kind of branding.

Chinese website INPAI.com.cn sourced information which explains what factors go into determining which brand marker a processor gets. The table elaborates on how different kinds of Intel processors (determined by core and socket types) cross different lines, with a few features toggled or enhanced. It is sure to throw up some surprises.

ASUS Unveils an Impressive Line-up of Innovative Server and Workstation Solutions

ASUS, a leading producer of innovative server and workstation solutions, today announced three cutting-edge solutions designed to address the specific needs of SOHO and Business Enterprises. First in the line-up is the ASUS P6T7 WS SuperComputer motherboard, which provides users with sublime graphics capabilities and flexible high speed data input/output. Next is the ASUS RS700D-E6 Duo Nodes 1U Server, which features independent power supplies for superb reliability—giving business owners complete peace of mind—while offering exceptional space savings in the form of 4 + 4 hot-swappable 2.5-inch SATA/SAS hard disk drives. Finally, the ASUS Z8NA-D6 is the world's first slim dual processor server and workstation motherboard, making it the best workstation foundation for all forms of businesses.

Intel Previews Intel Xeon 'Nehalem-EX' Processor

Intel Corporation today previewed a new Intel Xeon processor codenamed "Nehalem-EX." The processor will be at the heart of the next generation of intelligent and expandable high-end Intel server platforms, which will deliver a number of new technical advancements and boost enterprise computing performance.

In production later this year, the Nehalem-EX processor will feature up to eight cores inside a single chip supporting 16 threads and 24MB of cache. Its performance increase will be dramatic, posting the highest-ever jump from a previous generation processor.

Intel Delays Launch of Core i5 Platform

Intel's Core i5 series marks the consumer mainstream entry of the Nehalem architecture, in a bid to propagate quad-core processors, at the same time letting the market digest existing inventories of dual-core processors, and making sure its foundries are well-oiled to cater to the 32 nm process, Intel is giving its "Lynnfield" quad-core processor a quarter's head-start. Taiwanese industry observer DigiTimes notes that the platform' debut may have been delayed by a little over a month.

Originally slated for July, the industry debut of Lynnfield and its launch companion, Intel P55 chipset, have been pushed to early September. Stocks of the processors and compatible motherboards however, will be in time for the launch. The processors may be available to retailers about a week ahead, in late August itself, while compatible motherboards even earlier, in mid-August.

Intel plans to start the lineup with three models (yet to be named), clocked at 2.66 GHz, 2.80 GHz, and 2.93 GHz, and priced at US $194, $284, and $562 respectively (in 1000-unit tray quantities). Major motherboard vendors such as ASUS, Gigabyte, and MSI have already displayed some of their first compatible motherboards. The P55 chipset itself is expected to be priced at $40.Source: DigiTimes

BIOSTAR TPower X58A Now on Sale

Although Intel X58 chipset based mother board is sold at a relatively higher price in the market, BIOSTAR still has an excellent reputation for TPOWER series, in which TPOWER X58 and TPOWER I45 are very popular with a lot of power users. TPOWER X58A, one of BIOSTAR's top X58 motherboards, is on sale now. It is coincident that the price of Core i7 processors are recently falling, so TPOWER X58A is also a top choice for power users to pursue ultimate performance.

With adoption of ATX-size board, TPOWER X58A, based on Intel X58 + ICH10R chipset, supports Socket 1366 interface and newest Core i7, the CPU that is brand new Nehalem architecture. The motherboard supports Triple Channel Mode 2000 / 1600 / 1333 memory module, with Max Memory Capacity 24GB. It provides three PCI-Express 2.0 x16 slots, supporting ATI Hybrid CrossFireX and nVIDIA SLI technology; one PCI-Express x1 slot and two PCI slots for expansion; Gigabit Ethernet and 7.1 Channels HD audio for high quality of networking and multimedia.

Intel to Detail 8-core Nehalem-EX Processor Next Week

Having successfully established the Nehalem architecture-derived Core i7 series as the industry's fastest consumer processors available, and recently propagating the architecture to two-socket Xeon series for servers and high-end workstations, Intel is set to push up parallelism two-fold with the Nehalem-EX 8-core enterprise processor. The company will detail this new line of chips next week, although a commercial-launch can be expected only in late 2009 or early 2010.

The new chip will succeed the company's own Xeon E7000 "Dunnington" series 6-core processors, for having the highest available parallelism per socket. The 8 physical x86-64 processing cores will further feature HyperThreading technology, sending the logical-processor count to 16 threads per socket. Each processor packs 2.3 billion transistors. The processor will further be designed for systems with more than two sockets per board. Currently although server-builders sell 1U and 2U servers with more than two Nehalem quad-core processors, the system is designed by using two (or more) two-socket mainboards interconnected using Infiniband. The announcement will be made on May 26, in an address headed by Boyd Davis, Intel's general manager of Server Platforms Marketing Group.Source: CNET

Intel Tables Plans to Tackle Notebook and Netbook Markets in H2 2009

Intel has everything going its way when it comes to mobile computing, and the processors it sells that power notebooks and netbooks across every segment of the market. Intel uses the common classification of portable computers (consumer segment), using sizes and form-factors to differentiate mainstream notebooks, performance notebooks, ultra-thin notebooks, "larger" sub-notebooks (netbooks), and common entry-level netbooks. To cater to each of these, Intel made things easier by coming up with platforms (sets of processor and chipset combinations), a market approach both Intel and AMD have been using recently.

Starting with mainstream, and performance notebooks (traditionally above 14-inches in size, above US $1200 in price), Intel has the Calpella platform, that marks the entry of Nehalem architecture to the mobile scene. This is slated for 3Q 2009. Intel will simultaneously lower the prices of its current Montevina platform, to let inventories digest. Major hardware manufacturers are preparing their "launch-vehicles" for the Calpella platform, which will make it in time for Q3 2009.

GeIL Launches a Wave of New 6-channel DDR3 Kits

GeIL wants to be the first manufacturer touting the term "hexa-channel" (6-channel) DDR3 memory. While machine architectures using 6-channels (384-bit wide) memory interfaces don't exist, dual-Nehalem Xeon machines use two triple-channel memory arrays. It's a play of the word "6-channels" there. In any case, GeIL is now selling DDR3 memory in kits of six modules. Its lineup spans across three of its main memory product-lines: Value, Ultra, and Gaming series. The kits are available in a variety of configurations that include specified DRAM speeds, and timings, as listed by the table below. The kits come backed by the company's lifetime warranty.

Sources: TechConnect Magazine, GeIL

''Real Men Use Real Cores'': AMD

AMD finally stepped out of its shell after Intel's launch of its newest line of Xeon processors based on the Nehalem architecture. In an interview with TechPulse 360, AMD's Pat Patla and John Fruehe took on Intel's recent marketing drive for Nehalem Xeon products. The conversation revolved mainly around the issues of platform costs, and the features the new Xeon processors introduce (or reintroduce) to the server/enterprise computing industry, namely the company's proprietary FSB-replacement, QuickPath Interconnect, and HyperThreading.

The two first took on Intel's marketing, particularly on its material that said that the slowest Nehalem Xeon chip was faster than the fastest Opteron chip, saying that Intel's statements weren't backed by real figures. The two also alleged that Intel's server platform was too expensive and delivered lesser value in an ailing state of the economy. Perhaps the most audacious statement from AMD since the somewhat famous "only real men have fabs" statement by Jerry Sanders III, came from this interview, where AMD responded to a question on HyperThreading saying that "real men use real cores". "We’ve got real cores across our products. HyperThreading is basically designed to act like a core except that it only gives 10 to 15 percent performance bump for real applications workload." they said. Is AMD making a real point, or fighting fire...erm marketing with marketing? Find out in this interview.

Photos Emerge of Intel's 32 nm Clarkdale Processor

Not long after Intel was said to have sent out samples of its new 32 nm mainstream processor based on Nehalem micro-architecture, someone over at XS forums, has posted photos of an as yet unnamed Clarkdale processor, running at 2.4 GHz, with 4 MB L3 Cache. The only official information from Intel we have about these processors is what we covered two months ago, when Intel spread open its plans to deal with the mainstream and value markets using its Nehalem micro-architecture.

Source: XtremeSystems Forums

Supermicro Sets New Performance-per-Watt and per-Dollar x86 Server Standard

Super Micro Computer, Inc., a leader in application-optimized, high-performance server solutions, today launched a comprehensive new line of server and workstation solutions specially designed to support the Intel Xeon Processor 5500 series (formerly codenamed Nehalem). Supermicro has started shipping its new 2U Twin2 (“Twin Squared” with four hot-pluggable DP nodes), newly invented Twin GPU 1U server/workstation, the award-winning 1U Twin, SuperBlade, flexible Universal I/O (UIO) server, SAS2 storage systems, as well as its strong line of traditional application-optimized server solutions. Featuring the highest efficiency in the industry power supplies (93%+), cooling subsystems and motherboard designs, Supermicro solutions set a new record for the best performance-per-watt (375 GFLOPS/kW) and also deliver the best performance-per-dollar and performance-per-square-foot.

Based on the company's latest application-optimized Server Building Block architectures, Supermicro maximizes the new Nehalem technology, which includes QPI (Intel QuickPath Interconnect) for up to 6.4GT/s, Integrated DDR3 Memory Controller, multiple power envelops, and Intel Turbo Boost Technology, to provide the industry’s highest performing and most optimized new generation server solutions.

Kingston Technology Ships 1333 and 1066 MHz Memory Supporting Intel Nehalem Server

Kingston Technology Company, Inc., the independent world leader in memory products, today announced it is shipping both 1333- and 1066MHz DDR3 server memory modules validated by Intel for use on its Xeon processor-based motherboards. Kingston’s registered ECC server DIMMs and unbuffered ECC DIMMs are optimized to take advantage of the triple-channel architecture for Intel’s newest server platforms using the new Nehalem-based Xeon processors.

The 1333- and 1066MHz DDR3 server modules are available immediately. Kingston server memory is backed by a lifetime warranty and free, 24/7 technical support. For more detailed information visit kingston.com. For Intel validation information visit this page.Source: Kingston

NVIDIA Files Countersuit Against Intel

NVIDIA Corporation today announced that it has filed a countersuit in the Court of Chancery in the State of Delaware against Intel Corporation for breach of contract. The action also seeks to terminate Intel's license to NVIDIA's valuable patent portfolio.
NVIDIA's countersuit was brought in response to a filing by Intel last month in the Delaware court, alleging that the four-year-old chipset license agreement does not extend to Intel's future generation CPUs with "integrated" memory controllers, such as its Nehalem processor.
"NVIDIA did not initiate this legal dispute," said Jen-Hsun Huang, president and CEO of NVIDIA. "But we must defend ourselves and the rights we negotiated for when we provided Intel access to our valuable patents. Intel's actions are intended to block us from making use of the very license rights that they agreed to provide."

Arctic Cooling Freezer XTREME Rev. 2 Pictured

PC component cooling major Arctic Cooling is readying a revision for the Freezer XTREME CPU cooler. The new cooler, simply called Freezer XTREME Rev. 2, retains the basic design, while having a reworked retention module. Due to the size and cooling efficiency of the cooler, it was found of it to be capable of supporting the entire range of desktop processors based on Intel's Nehalem architecture.

The new, reworked retention module provides support for Intel sockets LGA-1366 and LGA-1156. That aside, standard features and design of the cooler remain: copper CPU contact block, four copper heatpipes, large aluminum fin array, and a central 120 mm fan to circulate air. Arctic Cooling is expected to announce this cooler soon. Whether it comes up as a separate SKU or it replaces the existing Freezer Xtreme model from the lineup remains to be seen.

Source: ComputerBase

Intel Designing New Case-Badge Logos

A notable inclusion of perhaps every processor-in-box product, apart from the processor, cooler and documentation, is the case-badge for the processor. The case-badge is a small sticker that shows the company logo for the processor installed in the PC. Intel is reportedly designing new logos (in effect case-badges) for at least 14 of its products. The logos, most of which are rounded-rectangle shaped seem to have been designed to give the processor box a new look, also indicating perhaps that the company is designing new packaging material as well, that use the new logos.

Intel has large volumes of Core 2 Duo, Core 2 Quad and Xeon processors in the making, that Intel feels need new clothing. Core 2 Duo and Core 2 Quad, get the distinct chrome-blue colour that one can find in the Core i7 (non-XE) logo. Core 2 and Core i7 logos look similar at the first glance. Core 2 Extreme gets the chrome-black colour the Core i7 XE logo has. All Centrino series badges stick to the silver-white colour scheme. The logo designs have small inlets on the top-right corner that have small portions of the die-shot. Core 2 and Centrino logos have die-shots of a portion of the Penryn core, while the Core i7 logos use those of the Bloomfield core. Interestingly, Xeon keeps its current logo, as well as a new one with chrome-slate colour, and design of the current Core i7 logo, perhaps making it clear the Xeon processor is based on the Nehalem architecture. The new logos will be effective from Q2 2009.

Source: Fudzilla

Super Talent Launches DDR3 RDIMMs and ECC UDIMMs for Next Generation Servers

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced immediate availability of DDR3 Registered DIMMs (RDIMMs) and DDR3 ECC Unbuffered DIMMs (ECC UDIMMs).

Super Talent's 1GB and 2GB ECC UDIMMs are immediately available in production volumes and support speeds up to 1333MT/s for single DIMM per channel operation and 1066MT/s for two DIMM per channel operation. Super Talent's 1GB x8 RDIMM is also immediately available in production volumes and supports speeds up to 1333MT/s for single DIMM per channel operation, 1066MT/s for two DIMM per channel operation, and 800MT/s for three DIMM per channel operation. All these products are designed to be compatible with Intel's upcoming Nehalem EP Server Platform.

Intel Presents 32 nm Westmere Family of Processors

Intel today spread opens its plans to deal with the mainstream and value markets using its Nehalem micro-architecture. The company introduced to the media and analysts, its plans concerning the upcoming Westmere family of processors, a term used to describe Intel processors built using the company's 32 nm second-generation high-K silicon fabrication technology, while being based on the Nehalem micro-architecture. The presentation demystifies all confusion surrounding the company canning plans of dual-core 45 nm Nehalem-derivatives. The presentation also sheds light on what approach Intel plans to adopt with bringing the new architecture to the enterprise segment.

Intel Preparing Core i7 950, Expanding Lineup

Earlier this month, news surfaced of Intel working on a new Extreme Edition (XE) Core i7 chip, model 975, that displaces the existing Core i7 965 XE from its existing price-point to grab the $999 in 1,000 unit tray quantities price-point. The 975 XE is to be accompanied by another new SKU in the making: the Core i7 950.

The new chip is bound to displace the Core i7 940 from its existing price point of $562. It features higher clock speed, bus multiplier value and is built on the newer D0 revision of the Bloomfield core. The chip will feature a clock speed of 3.06 GHz. It achieves this speed using a multiplier value of 23X. The new chip is expected to be introduced sometime in Q2, 2009.Source: Donanim Haber

Intel Developing Clarkdale to Replace Havendale Desktop Dual-Core Chip

On the course of coming up with mainstream derivatives of the Nehalem architecture, for Intel, there seems to be a big deal of uncertainty surrounding the dual-core parts. Havendale (desktop) and Auburndale (notebook) were stated by initial company road-maps as the company's dual-core chips. Later, news emerged of Intel reportedly scrapping both chips to find a 32 nm replacement in another chip codenamed Arrandale. In the latest company-slide exposé by VR-Zone, details emerge of yet another iteration to Intel's plans: Clarkdale. Correct spelling is Clarkdale and Arrandale by the way (not Clarksdale or Arandale).

While it is unclear at this point, if this chip, like the Arrandale (32 nm CPU + 32 nm IGP), is built to be deployed on both desktop and mobile platforms, the reason behind its development gains clarity. The Ibex-Peak platform design by Intel, be it dual-core or quad-core, consists of a standard multi-chip module (MCM)-based design, where two dice populate a package: the central processor, and the northbridge. The design gives the company flexibility by introducing a degree of modularity. After scrapping plans of a full-on processor built on the 45 nm high-K manufacturing process, Intel seems to have realised that its foundries won't be able to cater to many designs based on the 32 nm process initially, at once. Taking advantage of the MCM design, Intel is working on this new chip: Clarkdale, which consists of the processor die built on the 32 nm second-generation high-K process, with the northbridge being built on the existing 45 nm process. This design helps evade the manufacturing constraints Intel might have initially. The northbridge die will feature an integrated graphics processor that connects to its output using the flexible-display interface. With this, Intel is looking to bring in immediate and cost-cutting to the extant feasible.

Source: VR-Zone

First Pictures of Intel Ibex-Peak Chip Packages Emerge

Intel's mainstream market implementation of the Nehalem architecture will come in the form of monolithic quad-core a dual-core chips that have northbridge machinery integrated. Based on the Lynnfield (quad-core) and Arandale (dual-core) designs, Intel will place the processors on a common system design dubbed the "Ibex-Peak". The processors are likely to be branded as Core i5, Core i4 or even Core i3 depending on a lot of factors. Additionally, Intel plans enterprise variants of the said chips.

To seat these chips, Intel is designing new sockets: LGA-1155, LGA-1156 the two can be classified into the sockets for the desktop variants, with another LGA-1167 socket most likely to be exclusive for the Xeon variants. PCGH sourced some images from Intel's Design Development Tools (DDT) portal (found here), which tell that Intel names its new series of sockets as "socket H". Pictured below is a processor package viewed from its business-end. The other three you can see, are interposer-boards. These are devices that resemble the actual product packages that sit on the sockets. You can see a grid of leads over the "IHS" of the package. The leads serve to help in the technical development of products based on the package design, hence it is found on the DDT portal. It should give you an idea of what an LGA-1155, LGA-1156 and LGA-1167 processor should look like, sans the leads on the IHS. The images below in the same order. Finally, pictured much earlier, is the Ibex-Peak platform motherboard that demonstrates the design.

Source: PCGH

Intel Devising Sub-10W Nehalem Derivatives

Intel pushed its performance supremacy lead further up with the introduction of the Nehalem micro-architecture. The introduction served as a milestone event in the company's history, where it sought to rearrange various components of the PC, by moving certain parts of the chipset to the processor package. In the months to come, with the introduction of the Ibex-Peak platform, the company hopes to migrate even more components from the system core-logic to the CPU package. A lot of engineering potential is unlocked due to the modularity of the various components of a Nehalem-derived CPU.

At the upcoming International Solid-State Circuits Conference (ISSCC) event, Intel plans a decent set of technology demonstrations and papers. The advance program information document shed some light on Intel's itinerary. In session 3 held on February 9, Intel will present papers on its 8-core Xeon processor, following which is a session on 45nm IA processors. The session is on processors built with features characteristic of the Nehalem micro-architecture, in having integrated memory controllers, a coherent point-to-point interconnect, and up to 8 processing cores. Interestingly, the description included a note on the power consumptions, ranging from "sub-10W to 130W", which leads us to believe Intel to have plans on making derivatives of the Nehalem micro-architecture with some very low energy footprints. Another interpretation would be that a new breed of processors could have idle power consumptions as low as <10W. Currently the most energy-efficient Nehalem-based processor known to be in the works is the Xeon L5520 that has identical features to those of the Core i7 series while having a clock speed of 2.23 GHz and a rated TDP of a mere 60W.Source: X-bit Labs

Leaked Slide Shows Official Information from Intel on the Upcoming 8 Core Xeon

Following the news which we covered here, Hexus.net has got hold of a slide which officially details Intel's new 8-core Enterprise Xeon processor. Codenamed Nehalem EX, it will feature 8 processing cores, with 2 threads per core, totaling 16 threads and as had been previously said, a transistor count of 2.3 Billion. This information was obtained as part of a pre-ISSCC conference call, but more information is expected to be officially announced at the start of the ISSCC on 8th February.


Source: Hexus.net

Intel Scraps 45 nm Nehalem Dual-Core Chips, Plans Replacement

Grappling with a deteriorating world economy, and overstocked inventories with current-generation Core 2 platforms, Intel seems to have had a change of plans with regards to its dual-core Nehalem-derivatives. Company roadmaps originally pointed at two chips, codenamed Havendale and Auburndale to be the dual-core MCM implementations of the Nehalem architecture, for desktops and notebooks respectively. The "MCM" (multi-chip module) part comes to light in the way the chips were originally conceived: two dice on a package, one holding the CPU complex and the other holding the northbridge, consisting of a memory controller, PCI-Express root complex, and a graphics controller.

Theo Valich, noted industry commentator, in his latest blog post in Theo's Bright Side of IT, mentions that Intel scrapped Havendale and Auburndale in its conceived form. The two were set to make possible Intel Core i4 and i3 SKUs. Instead, Intel is working to push forward the launch of their common successor by six months: the Arandale core. Arandale features in the future series of Nehalem-derived processors to be built on the 32nm high-K silicon process, slated for 2010. Arandale from all that is known thus far is the dual-core Nehalem implementation on 32nm lithography, apart from speculation of it holding a higher amount of L3 cache: possibly 6 MB against 4 MB on the Havendale/Auburndale. The Arandale core was originally slated for "back to school" season, 2010 (around September~October). After rescheduling the launch, it could arrive by March.

Source: Theo's Bright Side of IT
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