News Posts matching "Nehalem"

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Intel Scraps 45 nm Nehalem Dual-Core Chips, Plans Replacement

Grappling with a deteriorating world economy, and overstocked inventories with current-generation Core 2 platforms, Intel seems to have had a change of plans with regards to its dual-core Nehalem-derivatives. Company roadmaps originally pointed at two chips, codenamed Havendale and Auburndale to be the dual-core MCM implementations of the Nehalem architecture, for desktops and notebooks respectively. The "MCM" (multi-chip module) part comes to light in the way the chips were originally conceived: two dice on a package, one holding the CPU complex and the other holding the northbridge, consisting of a memory controller, PCI-Express root complex, and a graphics controller.

Theo Valich, noted industry commentator, in his latest blog post in Theo's Bright Side of IT, mentions that Intel scrapped Havendale and Auburndale in its conceived form. The two were set to make possible Intel Core i4 and i3 SKUs. Instead, Intel is working to push forward the launch of their common successor by six months: the Arandale core. Arandale features in the future series of Nehalem-derived processors to be built on the 32nm high-K silicon process, slated for 2010. Arandale from all that is known thus far is the dual-core Nehalem implementation on 32nm lithography, apart from speculation of it holding a higher amount of L3 cache: possibly 6 MB against 4 MB on the Havendale/Auburndale. The Arandale core was originally slated for "back to school" season, 2010 (around September~October). After rescheduling the launch, it could arrive by March.

Source: Theo's Bright Side of IT

Intel to Unveil Octo-Core Xeon Next Month

Sitting tight on the desktop and server performance thrones with the Core i7 and Xeon Dunnington series procesors, Intel is looking to carry on with its product launch-cycle with the introduction of octo-core (8 cores) enterprise processors later this year. The company is expected to detail the industry about this upcoming processor series as early as next month at the Solid State Circuits conference in San Fransisco between February 8 and 12.

The processor in question will be based on the Intel Nehalem architecture and will consist of eight x86 processing cores, a massive transistor-count of 2.3 billion, and will be built on the company's current 45nm manufacturing process. It will hold 24 MB of L3 cache, a quad-channel memory interface and QuickPath Interconnect system interface. Furthermore, it is aimed at quad-socket server platforms. Intel will keep this only upto a presentation level at the conference and not a launch. It is expected to start off with quad-core Xeon processors based on the new architecture later in this quarter.Source: TechConnect Magazine

Intel Postpones the Launch Schedule of Lynnfield CPUs and P55 Chipset

I'm afraid that what's to be told here, is hard to be categorized as good news. Industry observer DigiTimes reports that Intel is about to postpone the initiation of Lynnfield processors and P55 chipset. Chips based on the quad-core Lynnfield design, are supposed to bring Nehalem to more people, because they'll represent the budget line of Core i7 processors.
Intel has recently decided to postpone its next-generation mainstream CPU Lynnfield along with the P55 chipset to the end of August or the beginning of September this year, and may postpone them to an even later time depending on the market situation, according to sources at motherboard makers. Both Lynnfield and P55 were originally scheduled to launch by the end of July. The economic decline which has caused motherboard makers to suffer overstocked chipset inventory is the major reason for the pull back, according to the sources. After the P55 launches, Intel plans to phase out non-IGP P45 and P43 chipsets and will transition its 4-series IGP chipsets to the entry-level.
Source: DigiTimes

Intel Launches Fastest Processor on the Planet - the Core i7

Intel Corporation introduced its most advanced desktop processor ever, the Intel Core i7 processor. The Core i7 processor is the first member of a new family of Nehalem processor designs and is the most sophisticated ever built, with new technologies that boost performance on demand and maximize data throughput. The Core i7 processor speeds video editing, immersive games and other popular Internet and computer activities by up to 40 percent without increasing power consumption.
Broadly heralded by the computing industry as a technical marvel, the Intel Core i7 processor holds a new world record of 117 for the SPECint_base_rate2006 benchmark test that measures the performance of a processor. This is the first time ever for any single processor to exceed a score of 100 points.

Bombs Away for Intel Core i7

Intel's eagerly anticipated Core i7 series of processors have hit retail channels today, with top online and ground stores in the United States, United Kingdom, and Europe listing the processors. This, a day in advance, with the company slating the launch for November 17 originally. The Core i7 is the poster-boy for Intel's Nehalem microprocessor architecture. It is a quad-core 8-threaded processor featuring 256 KB L2 caches per core, with shared 8 MB L3 cache. Some of the listings for the processors are as follows:

Overclockers UK (₤276 ~ ₤904) | Scan UK (₤259.87 ~ ₤892.02) | Newegg US (US $319.99 ~ $1069) | Micro Center US ($299.99 ~ $999.99) | HOH Deutschland (€283,90 ~ €989,90) | NCIX Canada (CA $388.99 ~ $1443.99) | TechBuy Australia (AU $676.35 ~ $2364.20)

For the motherboards:

Newegg US ($220.99 ~ $398.99) | Overclockers UK (₤223.24 ~ ₤340.74) | HOH Deutschland (€244,90 ~ €339,90) | NCIX Canada (CA $366.18 ~ $374.99) | TechBuy Australia (AU $503.90 ~ $635.70)

Intel Plans to Add More Nehalem Server Processors Next Year

Industry observer DigiTimes reports today that chip maker Intel is planning on launching new server Nehalem-EP and Nehalem-WS processors within the first quarter of 2009.
Intel is planning to launch Xeon 5500 (Nehalem-EP) and Xeon 3500 series (Nehalem-WS) server CPUs in the first quarter of 2009, according to sources at server makers. Intel will launch ten CPUs for the Xeon 5500 series: quad-core W5580 (3.2GHz), X5570 (2.93GHz), X5560 (2.8GHz), X5550 (2.66GHz), E5540 (2.53GHz), E5530 (2.4GHz), E5520 (2.26GHz), E5506 (2.13GHz), E5504 (2GHz) and dual-core E5502 with prices at US$1,600, US$1,386, US$1,172, US$958, US$744, US$530, US$373, US$266, US$224 and US$188 in thousand-unit tray quantities. For the Xeon 3500 series, Intel will launch three CPUs: quad-core W3570, W3540 and W3520 priced at US$999, US$562 and US$284.
In additional news, Intel is planning to phase out seven notebook CPUs including the Core 2 Extreme X7900 and X7800, and Core 2 Duo T7800 and L7700 in January next year.
Source: DigiTimes

Core i7 Retail Packaging Pictured

Intel will be releasing its newest processor: the Core i7, in the days to come. The first releases of the i7 are based on the Bloomfield core, which happens to be the poster-boy for the Intel Nehalem CPU architecture. The processor uses Intel's new LGA-1366 socket, it is a quad-core processor with HyperThreading enabled.

Expreview pictured the Core i7 (non Extreme) package, which reveals a largely standard pack that's seen on Intel's processors these days. Also pictured is Intel's stock cooler for the non-Extreme i7 processors, which largely resembles the stock-coolers of most Intel processors. It consists of a central block made of copper, which makes contact with the CPU. The thermal interface material is pre-applied to it. Aluminum fins project radially from the block, which fork into thinner fins, to increase surface-area. Also included in the package is the related documentation, warranty declaration and bezel sticker. The CPU pictured by Expreview is the i7 920, clocked at 2.66 GHz, with 8 MB L3 cache. The processor has a QuickPath Interconnect speed of 4800 MT/s.

Source: Expreview

Intel Core i7 Previews/Reviews Posted

Previews, reviews and all kind of write-ups about the new Intel Core i7/X58 platform flooded the network this morning. I'll use this post to add all the links I can find, you can also post your comments here until the official press release statement.

[H]ard|OCP1 | [H]ard|OCP2 | TweakTown | Guru3D | Techgage | Legion Hardware | Benchmark Reviews | HotHardware | PC Perspective | TechSpot | Neoseeker | t-break | OCAU | ExtremeTech | Lost Circuits

Intel Mobile Processor and Chipset Roadmap for 2008-09 Revealed

Intel has set concrete plans for the rest of 2008 and 2009, with its lineup of mobile processors, as in notebook, netbook, portable PC, and MID processors. Roadmaps available with TechARP also reveal Intel's plans for supportive chipsets. The roadmap, for now, shows that the laptop won't be running a Nehalem processor until Q3, 2009. The company still has several SKUs to pull off its hat till there's a need to bring in Nehalem architecture based processors.

Intel to Update Montevina Lineup, Mobile Nehalem Launch Speeds Up?

According to industry observer DigiTimes, Intel would be giving its Montevina mobile computing platform an update, with the introduction of new processors and core logic (chipsets). The update, for the most part, revolves around the mid/high range products. Intel would be introducing Core 2 Duo models T9900 and P8800. The T9900 would be Intel's flagship mobile dual-core chip, with the P8800 leading the performance mainstream range.

Intel also plans new chipsets. The Intel GM47 Express would be the company's next high-end mobile chipset, and is slated for Q1, 2009. Intel will also launch GM43 and GS43 Express chipsets for entry-level notebook and small form-factor (SFF) PCs. In other news, it is also expected that the company gets ready to launch the GM55 (Mobile Ibex-Peak) chipset between July and August, 2009. GM55 would be Intel's Nehalem processor supportive chipset for the Auburndale dual-core and Clarksfield quad-core processors, with the platform itself being codenamed Calpella.Source: DigiTimes

Intel Shows a New Jet Engine Style Notebook Cooling Technology

What with the likes of the Apple MacBook Air and similar ultrathin laptops in production, Intel is recognising that there will be an increasing problem with heat, especially with its new chips around the corner. Mooly Eden, general manager of Intel's Mobile Platforms Group was speaking at a keynote at the Intel Developer Forum in Taipei.
When you design a very thin system, cooling the skin is a very big challenge... If you put [a laptop] on your lap, it can feel very uncomfortable. Very hot.
Eden went on to say that if this problem is not addressed there will be a limit as to how thin a laptop can me made. They used the example of a jet engine explaining that the high temperatures inside the engine (up to 1000 degrees centigrade) must not be transfered to the plane's wing, as that is where the fuel is stored. The technology used on aircraft to accomplish this is called laminar airflow cooling, which is what Intel plans license to manufacturers for use in cooling its products, it is a system in which a fluid flows in layers.
Fortunately this is not the only trick up Intel's sleeve, Eden also explained that laptop platform for Intel's Nehalem architecture will have the memory controller, IGP and CPU all on one die and that the native power saving features will allow processor cores to turn on and off without the use of software.
[It is done] automatically on the fly. It is transparent to the operating system

Source: CNET

Patriot Announces Viper Series Tri-Channel Memory Kits for Intel's X58 Chipset

Patriot Memory, a global provider of premium quality memory module and flash memory solutions, today announced the release of their Viper series Tri-Channel memory kits designed for the forthcoming Intel Core i7/Intel X58 Express Chipset. Available in both 3GB and 6GB kits, these newly engineered memory kits come with the award winning Viper series heat shields and are the perfect balance of speed and latency while achieving lower voltage requirements.

"Intel's Nehalem architecture shows significant improvements over previous platforms," says Les Henry, Technical Director for Patriot Memory.

"High performance DDR3 DIMMs from Patriot Memory, combined with the phenomenal memory bandwidth & processing capability of Intel's upcoming Core i7 microprocessors, will deliver exciting levels of performance to PC enthusiasts worldwide," said, Steve R. Peterson, Intel's Director of Chipset & Graphics Marketing.

Mobile Nehalem Chips Not Expected Until Late 2009?

Intel Clarksfield, the company's Nehalem based mobile platform, was reported on Monday to begin production in the second half of 2009. Although mass production of the first Core i7 processors is scheduled for next month, on the mobile front Intel users will have to wait until late next year. Clarksfield will be produced using the same 45-nanometer production process that's used to make Intel's current chip lineup. The upcoming chip will be the heart of a new Intel Centrino platform, codenamed Calpella. As its desktop variant, Clarksfield CPUs will have all the enhancements Nehalem offers, as well as the brand new integrated memory controller all in one package. Clarksfield is also expected to include more advanced power-management features than Intel's current mobile chips.Source: PC World

Core i7 940 Review Shows SMT and Tri-Channel Memory Let-down

As the computer enthusiast community gears up for Nehalem November, with reports suggesting a series of product launches for both Intel's Core i7 processors and compatible motherboards, Industry observer PC Online.cn have already published an in-depth review of the Core i7 940 2.93 GHz processor. The processor is based on the Bloomfield core, and essentially the Nehalem architecture that has been making news for over an year now. PC Online went right to the heart of the matter, evaluating the 192-bit wide (tri-channel) memory interface, and the advantage of HyperThreading on four physical cores. In the tests, the 2.93 GHz Bloomfield chip was pitted against a Core 2 Extreme QX9770 operating at both its reference speed of 3.20 GHz, and underclocked to 2.93 GHz, so a clock to clock comparison could be brought about.

The evaluation found that the performance increments tri-channel offers over dual-channel memory, in real world applications and games, are just about insignificant. Super Pi Mod 1.4 shows only a fractional lead for tri-channel over dual-channel, and the trend continued with Everest Memory Benchmark. On the brighter side, the integrated memory controller does offer improvements over the previous generation setup, with the northbridge handling memory. Even in games such as Call of Duty 4 and Crysis, tri-channel memory did not shine.

ASUS Ready with Workstation-class X58 Motherboards

After flaunting the P6T Series motherboards, and the monstrous Rampage II Extreme, ASUS decided to expand its Bloomfield CPU-supportive motherboard lineup with its workstation-class offerings. ASUS is known for bringing in workstation boards on desktop platforms. They have had Intel 975P based workstation boards, just as they had nForce 590 SLI boards. These desktop-thru-worksation platforms are usually single CPU socket platforms, with certain workstation features, such as PCI-X interface, enterprise-grade storage controllers, among other features that make them durable and suitable for mission-critical environments. They don't sport enterprise chipsets, and hence carry batch-leading desktop chipsets.

With Nehalem and the new Socket 1366, ASUS did just that, with the inclusion of two single-socket workstation boards. These motherboards, at the outset support the upcoming Core i7 processors, and have the potential to support Xeon processors that use the same socket, or even the same core. There are two models lined-up: P6T6 WS Revolution and P6T6 WS Pro. The P6T6 WS Revolution is the flagship board. It features six full-length PCI-Express slots, which might have variable number of available PCI-Express lanes, depending on the number of PCI-E cards connected. It features a 16+2 phase CPU power circuit. The board features the Tylersburg X58 chipset, along with an ICH10 series southbridge. There is passive cooling for the VRM area, northbridge, and a large southbridge block, that could be possibly cooling a supplementary PCI-Express switch chip. Storage options include Serial-attached SCSI (SAS), SATA II and e-SATA ports.

A-DATA and ASUS Demonstrate Intel Nehalem's DDR3 Performance

Remember the A-DATA DDR3 triple channel memory and the ASUS P6T Deluxe motherboard? They are both detailed on our page, but this story aims to show how both parts perform when working coupled with a quad-core Core i7 engineering sample CPU. The results you're about to see below are achieved by three 1600MHz A-DATAs overclocked to over 2000MHz. The result is system memory read/write speeds of up to the incredible 20515/16946 MB/s. The latency time is also worth mentioning - 22.9ns.

Source: HEXUS.net

Lynnfield the Mainstream Nehalem CPU Pictures Emerge

Pictures of the mainstream Nehalem chips otherwise known as Lynnfield have emerged in the asian forum XFastest. Unlike the Bloomfield that has 1366 pins, Lynnfield has only 1160 pins and lacks the QPI link that the Bloomfield uses for triple channel DDR3. Instead Lynnfield uses DMI which only supports dual channel DDR3. Check out the link below for even more comparison images.

Source: XFastest via Expreview

Biostar T-Power X58 Mainboard Spotted

During the final weeks before Intel's Nehalem release date, we have covered almost any motherboard that will be simultaneously available as the platform launches. Today we'll accentuate on Biostar's T-Power X58, yet another LGA1366 mainboard that will help Core i7 buyers. The board is pretty much standard, it has a 12-phase power design, 6x DDR3 1333/1600/2000 slots, 3x PCI-E 16x SLI and CrossFireX capable slots, and 6x SATA + 2x eSATA + 1 IDE ports. The T-Power X58 also features a heat-pipe cooling system, on-the-fly power/reset buttons, and a LED POST code display. There's also a 7.1 integrated audio, two 10/100/1000 LANs, and two FireWire ports.

Source: Matbe.com

ASUS Rampage II Extreme LGA 1366 Motherboard in Pretty Pixels

After yesterday's ASUS P6T Deluxe quick introduction, today is time for the heavy artilery to come by and stop at our front door. For sure ASUS, one of the biggest brands in the computer industry is not going to have only one or two motherboards to support Nehalem. Although the platform is not yet officially introduced, ASUS is ready with its Rampage II Extreme motherboard. As the name suggests this will be the enthusiast range of motherboard offerings support for LGA 1366 processors, triple-channel DDR3 memory and up to three PCI-Express x16 graphics cards. The new Republic of Gamers machinery might not have a fancy heat pipe cooling (it might not need one) but it has a few other tricks, such as a special VTT CPU power card that provides a 16-phase CPU and 3-phase memory power design. The board also features a number of strange buttons that will help experts overclock their hardware. The Rampage II Extreme also has six SATA 3.0 Gbps connectors, dual Gigabit Ethernets, FireWire, eSATA ports and most likely support for both ATI CrossFire X and NVIDIA triple SLI technology. Let the pictures finish this post:

Source: Muropaketti - Plaza

MSI X58 Tylersburg Motherboard Lineup Surfaces

Following the launch of Nehalem architecture based CPUs from Intel, motherboard vendors would introduce their fleets of motherboards into the market, all of which are based on the new extreme performance chipset from Intel, the X58. MSI on its part, has three models lined-up. There is a performance segment X58 Platinum, followed by an enthusiast-grade X58 Eclipse. There's an even higher model, whose name is under the wraps for now. This model would cater to the market of super-overclockers.

A company slide showing model-specific features has surfaced. It can be seen that all motherboards MSI has to offer, support both ATI Crossfire and NVIDIA SLI multi-GPU technologies. X58 Platinum and Eclipse offer SLI support without the presence of the nForce 200 chipset, while the super-overclocker board uses it. X58 Eclipse sports 3 PCI-Express x16 slots, making it 3-way SLI capable. X58 comes with two such slots. The highest offering, however, has four slots. Perhaps it helps set-up 3-way SLI for graphics plus one card dedicated to handle PhysX calculations, and of-course, 4-way ATI Crossfire X.

Source: TweakTown

Core i7 965 XE Unboxed, Stock Cooler and Processor Exposed

Intel would be rolling out an elite fleet of desktop processors based on the new Nehalem architecture soon. The first derivative, the Bloomfield core, is supposed to be the architecture's flagship for the desktop PC market. And for it, Core i7 Extreme 965 is supposed to be the leading processor. Priced at US $999, the processor is clocked at 3.20 GHz and features four cores and eight logical processors thanks to HyperThreading Technology (encore). Details of it are covered here.

Mobile01, unboxed the i7 965 before launch. The contents show a massive stock cooler and the processor itself. The stock cooler is composed of the same fins projecting radially, just that they are much thinner, and more in number (to boost surface area of dissipation). The cooler uses 50% of fins made of copper and the rest 50% made of aluminum. The large CPU contact base is made of copper and pre-applied TIM. The box pictured is the "white-box" part, expect the retail box to be of that exact size.


Source: Mobile01

Intel Decides to Unlock the Memory Multiplier of its Core i7-920 and Core i7-940 CPUs

Thanks to some inside information that was published today by various hardware portals, now we know that Intel has decided to enhance the overclocking capabilities of two of its still to be released non-Extreme Core i7 processors. Intel's LGA 1366 Core i7-940 and Core i7-920, which are clocked at 2.93GHz and 2.66GHz respectively will now boast unlocked memory controlers, meaning that users will be able to change the memory multiplier and thus the memory frequency beyond the stock DDR3 800/1066MHz speed. The unlocked memory multiplier will also allow the QPI speed to be changed. The Quick Path Interconnect (QPI) bus resembles AMD's Hypertransport bus. A slide change in the memory frequency will result in higher QPI bus speed, just like in the current AMD processor family. Previously, we knew that only the Core i7 Extreme processors like the 3.2GHz Core i7-965 Extreme Edition will have these overclocking features. I sincerely hope that with this last minute change Intel will make us overclockers really happy.Source: Expreview

Core i7 Model Names and Details Surface

Later this year, Intel will launch three models of processors based on a newer socket, a newer architecture. The processors are based on the Nehalem-derived Bloomfield core, and require a compatible motherboard with the 1366-pin land grid array (LGA) socket. There are three models lined up, one in each category of extreme, performance and mainstream. They carry the Core i7 brand name and here are its model numbers:
  • Core i7 Extreme 965 (PIB model: BX80601965)
  • Core i7 940 (PIB model: BX80601940)
  • Core i7 920 (PIB model: BX80601920)
The 965 is a Extreme series product that sits on the top of the pile, it should be the fastest desktop processor ever made. The 940 falls into the performance category, given its price. It is trailed by the 920 which seems to have the best price to clock speed, it falls into the mainstream category. A table explaining parameters in detail and model prices is provided.

Source: Expreview

Memory Overclocking Could Pose Risks and Limits on Nehalem

Intel's upcoming Nehalem architecture brings in a host of changes. One of the most important of them is that the processors now carry memory controllers. From what is known so far, the upcoming Nehalem processors come with official support for DDR3 800 MHz and DDR3 1066 MHz though talk is that it just could slip in DDR3 1333 MHz support on an official scale. Here's a complication: Some of the computer enthusiasts with plans of retaining their current DDR3 1800/2000/beyond may have severe problems running the memory at their rated frequencies on a Nehalem chip. They might not work on their rated frequencies at all.

The reason behind this is that Nehalem has processor and memory voltages synchronized. Fresh studies suggest that a voltage of 2.0 V can fry a Nehalem processor. It was earlier noted that this voltage limit was 1.60 V to 1.70 V. It would need extreme caution for you to set the core to run at even 1.8 V since at that voltage the processor could start degrading and finally cease to work. The conclusion is that the Nehalem platform, with its synchronized CPU and memory voltages, will be limited by the DDR3 modules ability to reach high frequencies at lower voltages. This could have implications on the kind of memory kits that come out in the near future. Manufacturers could offer high-end kits that function well within 1.6 V with the supposedly high frequencies albeit loose timings, just to keep the memory and processor operating safely.Source: NordicHardware
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