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TSMC 16FinFET Plus Process Achieves Risk Production Milestone

TSMC today announced its 16-nanometer FinFET Plus (16FF+) process is now in risk production. This enhanced version of TSMC's 16FF process operates 40% faster than the company's planar 20-nanometer system-on-chip (20SoC) process, or consumes 50% less power at the same speed. It offers customers a new level of performance and power optimization targeted at the next generation of high-end mobile, computing, networking, and consumer applications.

TSMC's 16nm process offers an extended scaling of advanced SoC designs and is verified to reach speeds of 2.3GHz with ARM's "big" Cortex-A57 in high-speed applications while consuming as little as 75mW with the "LITTLE" Cortex-A53 in low-power applications. It is making excellent progress in yield learning, and has achieved the best technology maturity at the same corresponding stage as compared to all TSMC's previous nodes.

Renesas Electronics Announces New USB Power Delivery Controller

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced its new Universal Serial Bus (USB) Power Delivery (PD) controller (part number µPD720250) that is based on the USB PD Specification to deliver up to 100W (5 A at 20 V) power over a USB PD cable. Renesas will exhibit its new USB PD controller at Computex Taipei from June 3 to June 7, 2014 at booth # N0608, 4th floor of the Nangang exhibition hall in Taipei, Taiwan.

By combining the new USB PD controller with an optimal power supply circuit, designers will be able to rapidly implement USB-based solutions that provide higher power to notebook PCs and also can reduce the battery charging time for smartphones and tablets. Furthermore, by standardizing the AC adapters provided with notebook PCs and other equipment, both development costs and design challenges can be reduced.

Renesas Electronics Collaborates with Diodes Incorporated on USB Power

Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, today announced its collaboration with Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, to deliver optimized charging solutions for USB Power Delivery (PD). Based on a Renesas USB Power Delivery Controller (PDC) and Diodes multi-mode active rectifier (AR), the companies' reference design provides turnkey solutions for AC adapters and PD-capable chargers compliant with the USB PD open standard. The AC adapter solution will be exhibited at the Computex Taipei from June 3 to June 7, 2014 at booth # N0608, 4th floor of the Nangang exhibition hall in Taipei.

Charging mobile phones through USB connections has become the norm and demand for higher power charging has increased exponentially due to the mass adoption of tablets and ultrabook computers. In July 2012, the USB Implementers Forum (USB-IF) released the USB Power Delivery Specification to enhance power supply capability through USB cables up to 100W, providing a common standard for faster and safer charging of mobile devices. Renesas has been a strong promoter of USB-IF since 1996. The company not only provides many USB silicon devices, but also dedicates its USB expertise to successfully launching "building block" solutions for numerous USB standards. Today, there are billions of USB devices in the world and the USB PD technology is anticipated to be an open industry standard that addresses the future charging needs and additional interface features required for next-generation mobile computing.

Renesas Electronics Announces a New USB 3.0 Hub Controller

Renesas Electronics, a premier provider of advanced semiconductor solutions, today announced a new Universal Serial Bus 3.0 (USB 3.0) hub controller (part number ?PD720211) with dual downstream ports, extending more flexibility to implement USB 3.0 connections of digital devices such as PCs, tablets, and digital TVs to other USB 3.0-compatible peripheral devices.

Adding a new two-port hub controller to the lineup alongside Renesas' world's-first certified USB 3.0 four-port hub controller (part number ?PD720210) increases system designers' options for USB 3.0 hub expansion with products such as PCs, tablets, display monitors, docking stations (function expansion units that connect to notebook PCs), and digital TVs. The addition of the two-port hub controller (uPD720211) supports designs with tighter space and cost budgets, while expanding the USB 3.0 connectivity to utilize the increasing number and performance of USB 3.0 peripherals devices available in the market.

Latest Renesas Electronics USB 3.0 Hub Controller Gets USB-IF Certified

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced that its latest Universal Serial Bus 3.0 (USB 3.0) hub controller (part number uPD720210) has passed USB 3.0 compliance and certification testing by the USB Implementers Forum (USB-IF). It is one of the world's first USB 3.0 hub controllers to achieve this recognition, following Renesas' world's first USB 3.0 host controller certification in 2009.

The "Certified SuperSpeed USB (USB 3.0)" certification from the USB-IF offers manufacturers and consumers the assurance that the device will function in accordance with the specification and will interoperate with the billions of USB-enabled devices that exist in the market today.

USB 3.0 Hub Controller Business Could Heat Up in 2013: Analysts

Following entry of USB 3.0 SuperSpeed specification, chip-makers such as Renesas, ASMedia, Etron, and VIA made a killing selling third-party USB 3.0 host controllers to motherboard, desktop, and notebook vendors, which ended after Intel launched its 7-series chipset featuring an integrated 4-port USB 3.0 host controller, resulting in drop in demand for third-party chips. These companies each have USB 3.0 hub controllers, and could help drive growth of the specification with USB 3.0 hubs, devices which multiply the number of USB ports available. USB 3.0 hub controllers have been slow in receiving USB-IF certification due to difficulties in conducting compatibility tests, which could ease out by 2013, since Renesas' chip already passed certification. Most peripherals and flash drive manufacturers could have USB 3.0 hubs among their product lineups.

Source: DigiTimes

AREA Announces New USB 3.0 and SATA 6 Gb/s Add-on Cards

Japanese peripherals retailer AREA announced three USB 3.0 and one SATA 6 Gb/s add-on card models. The PE4U3E-3E1 "Sport Quattro" is a 4-port USB 3.0 card that uses a Etron EJ188 host controller, which connects to the machine over PCI-Express 2.0 x2 (physical PCI-Express 2.0 x4), resulting in higher downstream bandwidth when using multiple ports. The card features three external and one internal USB 3.0 type A ports, it draws auxiliary power from a SATA power connector. It is priced at 2,480¥ (US $30).

Next up is the SD-PEU3R-2E2IL, another 4-port PCI-Express add-on card, driven by Renesas D720201 4-port USB 3.0 host controller. The card features PCI-Express 2.0 x1 bus interface, and unlike the PE4U3E-3E1, features two type A ports on the rear panel, and two ports via standard USB 3.0 front-panel header. It is priced at 2,680¥ (US $33.5). The last of the three USB 3.0 cards is the D-EP34U3R-S3, which ships in ExpressCard-34 form-factor, is driven by Renesas D720202 host controller, and features just one USB 3.0 type A port. It is priced at 1,980¥ (US $24.7). Lastly, the company launched the SD-PESA3ES2L, a 2-port SATA 6 Gb/s add-on card, which lets you choose between using the two ports as internal or eSATA ports, using jumpers. It goes for 2,980¥ (US $37).

Source: Hermitage Akihabara 1, 2

Renesas Electronics Introduces New, Low Power USB 3.0 Hub Controller

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced the availability of its SuperSpeed USB (USB 3.0) hub controller system-on-chip (SoC), the µPD720210, for use in hubs that enable connection of multiple devices supporting the USB 3.0 standard, such as PC peripherals and digital TVs.

The USB interface standard has been widely adopted worldwide. The recent proliferation of video content and large-capacity recording media has increased demand for interfaces capable of handling higher data transfer rates. In response, new products are coming to market with support for USB 3.0, which delivers speeds 10 times faster than the 480 megabits per second of USB 2.0 speeds. Adoption of USB 3.0 in non-PC products, such as digital consumer electronics, is growing due to factors such as the appearance of solid state drives (SSDs), which allow reading and writing of data at faster speeds than conventional hard disk drives (HDDs), and chipsets with a built-in USB 3.0 host controller.

PowerColor HD 7970 X2 Devil 13 Taken Apart

Here are the first pictures of PowerColor's ambitious Radeon HD 7970 X2 Devil 13 dual-GPU graphics card taken apart. The pictures reveal a PCB that's both longer and taller than that of the HD 7970, to create room for two 28 nm "Tahiti" GPUs, a total of 24 GDDR5 memory chips (12 on each side), a PLX PEX8747 PCIe 3.0 bridge chip, and a VRM that consists of 5+2+1 phases per GPU system. The card draws power from three 8-pin PCIe power connectors. The VRM consists of solid-state chokes and Renesas Driver-MOSFETs. Display outputs include two each of DVI and mini-DP, and an HDMI. Each GPU system has a pair of BIOS'es (performance and failsafe).

WD Appoints Kensuke Oka And Masahiro Yamamura To Its Board Of Directors

Western Digital Corp. today announced that it has appointed Kensuke Oka and Masahiro Yamamura to its board of directors, effective May 17, 2012. Mr. Oka is president and CEO of Hitachi America, Ltd., and Mr. Yamamura is corporate officer, general manager of the Semiconductor Business Division of Hitachi, Ltd.

"The additions of Mr. Oka and Mr. Yamamura offer our leadership team vital insight as we operate WD and HGST as independent subsidiaries in the competitive hard drive industry," said Thomas Pardun, WD chairman of the board. "Both have deep executive management experience leading operations in the electronics and industrial systems industries, primarily for Hitachi, providing new perspectives to WD as we continue our focus on sustained profitable growth."

Worldwide Semiconductor Market Grew 3.7% in 2011 to $301 Billion

Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the latest version of the International Data Corporation (IDC) Worldwide Semiconductor Applications Forecaster (SAF). The industry weathered the macroeconomic uncertainties in the U.S and Europe, the earthquake and tsunami in Japan, China's slow down in the second half of the year, and floods in Thailand. Meanwhile, device applications, such as smartphones, media tablets and e-readers, automotive infotainment, notebook PCs, datacenter servers, and wireless and wired communication infrastructure drove robust consumption of semiconductors.

IDC's SAF tracks more than 100 semiconductor companies. Over 40 of these companies experienced year-over-year revenue growth greater than 5%, while about the same number of companies saw their revenue decline by more than 5%.

I-O Data Unveils USB 3.0 Host Card for Servers

I-O Data unveiled a new USB 3.0 host card (model: USB3-PEX2S), which is designed to be server-grade, with out of the box support for Windows Server, including USB 3.0 SuperSpeed support for Windows 2003, 2003 R2 64-bit/32-bit; Windows 2008, and 2008 R2 64-bit/32-bit. The low-profile capable card provides two USB 3.0 SuperSpeed ports, and appears to be driven by a Renesas-made chipset. It connects to the system bus over PCI-Express 2.0 x1, and draws auxiliary power from a SATA power connector. Slated for market launch in late-April, the USB3-PEX2S from I-O Data is priced at 3,885 JPY (US $48).

Source: Hermitage Akihabara

Intel's Semiconductor Market Share Surges to More Than 10-Year High in 2011

Fueled by strong sales growth in its core chip businesses—and boosted by a major acquisition—leading semiconductor supplier Intel Corp. in 2011 attained its highest annual market share in more than 10 years, according to the IHS iSuppli Competitive Landscape Tool from information and analytics provider IHS (NYSE: IHS). Intel in 2011 increased its overall semiconductor market share to 15.6 percent, up 2.5 percentage points from 13.1 percent in 2010, according to the final IHS semiconductor estimate for the year. This represents the highest market share for Intel going back to at least 2001, when it reached 14.9 percent. Over the last five years, Intel’s share of the market ranged from 11.9 percent to 13.9 percent.

“Intel in 2011 captured the headlines with its major surge in growth,” said Dale Ford, head of electronics and semiconductor research for IHS. “The company’s rise was spurred by soaring demand for its PC-oriented microprocessors, and for its NAND flash memory used in consumer and wireless products. Intel’s revenue also was boosted by its acquisition of Infineon’s wireless business unit. The company’s strong rise helped it to stave off the rising challenge mounted by No. 2 semiconductor supplier Samsung Electronics Co. Ltd., which had been whittling away at Intel’s lead in recent years.” The table below presents the final 2011 semiconductor market share ranking from the IHS.

ASRock X79 Extreme11 New Iteration Pictured, Packs Stronger VRM

At CeBIT, ASRock already grabbed a lot of attention with its unveiling of the X79 Extreme11 motherboard. The motherboard was detailed to great lengths then. It appears like the design was still a work-in-progress, and the company has an even newer iteration. Pictured below is this latest iteration. You will notice how ASRock redid the CPU VRM. While the one shown at CeBIT packed a 16-phase VRM, this one steps it up to 24. On the obverse side of the PCB, it squeezed in chokes for all 24-phases, and compact Driver-MOSFET (DrMOS) chips for 12 (probably the other 12 are located on the reverse side of the PCB). The first iteration shown at CeBIT used LFPAK MOSFET design. A DrMOS combines up/down FETs and driver IC into a single, space-efficient package. Companies like Renesas have held interest in innovating with DrMOS chips, even compacting them further. The rest of the board is identical to the one pictured at CeBIT, except that the Creative Sound Core3D chip has the signature plastic cover over it, which can be found on Creative's Sound Core3D discrete sound cards.

Source: TweakTown

USB3.0R-P4-PCIe 4-port USB 3.0 Add-on Card Goes on Sale

Japanese store Kuroutoshikou listed USB3.0R-P4-PCIe, a reference design USB 3.0 host add-on card. Driven by Renesas μPD720201 chipset, the card gives out four USB 3.0 SuperSpeed ports. Three of these ports are wired out on the rear expansion bracket, while the fourth one is an internal port (type-A plug, not header). The card draws auxiliary power from a SATA power connector, it talks to the rest of the system over PCI-Express 2.0 x1. A part of the reason why not all four ports are located on the bracket, is that the card is just about capable of being low-profile, due to its half-height PCB. USB3.0R-P4-PCIe could be re-branded and sold through various major brands. Slated for late-March, it is priced at 3,000 JPY (US $36).

Source: Hermitage Akihabara

RATOC Systems Intros USB 3.0 RAID Box

Japanese company RATOC Systems introduced a trio of products that lets users expand their data storage once they run out of drive bays and ports in their case. The first one is the RS-EC32PE-U3R, a bundle consisting of a 2-bay USB 3.0 to SATA 3 Gb/s RAID enclosure and a PCIe USB 3.0 addon card; the RS-EC32EX-U3R, which is a bundle including the same 2-bay RAID enclosure, but including a 2-port USB 3.0 expansion card in the ExpressCard34 form-factor; and REX-PEU3X, which is a standalone 2-port USB 3.0 expansion card in the PCIe form-factor.

The expansion cards in these bundles are based on new Renesas μPD720202 chipset. The RAID enclosure has two 3.5-inch SATA drive bays. Its controller provides a maximum data transfer performance of 372 MB/s. It supports disk organization modes of "single" (just a single disk connected), RAID JBOD, RAID 0, and RAID 1. Expected to launch mid-March, the RATOC RS-EC32PE-U3R and RS-EC32EX-U3R are priced at 11,130 JPY (US $138), the REX-PEU3X goes for 3,360 JPY (US $41.7).

Source: Hermitage Akihabara

OEMs Ready USB3.0R-P2-PCIe Add-On Card Based On New Renesas Chipset

OEMs are readying USB 3.0 PCIe add-on cards based on the reference design "USB3.0R-P2-PCIe", which will be sold through several vendors such as Buffalo. These cards take advantage of the new Renesas μPD720202 chipset, which is known to be more cost-effective, faster, and power-efficient than the μPD720200A, which it succeeds. The μPD720202 features a 40% performance boost over previous generation, the card has a redesigned circuit that reduces electrical leakage when in power-saving mode, when the chip consumes about 4.5 mW. The card gives out two USB 3.0 ports, and draws power from a 15-pin SATA power connector, instead of 4-pin Molex or Berg connectors. The PCB is compact, half-height, and hence low-profile capable. Cards should include low-profile brackets.


Source: PC Watch

PowerColor HD 7970 Vortex VRM: A Closer Look

On Thursday, we got to see the first images of PowerColor's new Radeon HD 7970 Vortex Edition graphics card. At CES we got to take a closer look at its VRM. PowerColor carried forward the VRM design of its Radeon HD 6970 Devil 13 graphics card. At the heart of the VRM is a CHiL CHL8228 VRM controller, which allows software volt-modding using most of the popular tools out there. The card uses an 8+1+1 phase VRM. It uses High Current Power Beat chokes which offers PWM frequency range of up to 3 MHz.

Interestingly, while the HD 6970 Devil 13 itself, like the Radeon HD 7970 AMD reference board, used expensive International Rectifier DirectFETs in typical configuration, the HD 7970 Votex uses cost-effective driver-MOSFET (DrMOS) chips that appear to be made by Renesas. Cost effective doesn't necessarily mean "cheap", these chips, according to PowerColor, offer 93% efficiency with up to 1 MHz switching frequency. On the reverse side of the PCB, we can find the power stage to be complemented with SP capacitors that offer 40% lower ESR with and support higher switching frequencies.

Giada Unveils Mini-ITX Z68 Motherboard

Chinese company JEHE is launching its latest compact mini-ITX motherboard in Europe under the Giada brand, the MI-Z68. As the name suggests, it is based on Intel Z68 chipset, and supports Core i3/i5/i7 processors in the LGA1155 package. There is no TDP restriction, as the board features a full-fledged CPU VRM that draws power from a 4-pin 12V connector apart from a 20-pin ATX connector (any of today's PSUs with 24-pin connector will support it). The board uses a 4+1 phase CPU VRM, with single phase memory. There are two DDR3 DIMM slots, supporting dual-channel memory. The lone expansion slot is a PCI-Express 2.0 x16.

There's impressive storage connectivity, this includes two mSATA 3 Gb/s (on on either side of the slot), two SATA 6 Gb/s (blue), and two SATA 3 Gb/s (black). There are just two USB 3.0 ports, both on the rear panel, and driven by a Renesas-made controller. 8-channel HD audio with optical SPDIF output, one gigabit Ethernet connection (driven by Realtek-made PHY), display outputs that include DVI and HDMI, a number of USB 2.0 ports and PS/2 keyboard, make for the rest of the rear panel. The Giada MI-Z68 will be priced at €88.

Source: TechConnect Magazine

MSI Micro-ATX LGA2011 X79MA-GD45 Motherboard Pictured

Here are the first pictures of MSI's socket LGA2011 motherboard in the micro-ATX form-factor. Earlier this week, we got to see through ASRock's X79 Extreme4-M that LGA2011 micro-ATX boards were indeed possible. Called the MSI X79MA-GD45 (MS-7738 V1.1), this board offers all the connectivity possible on a board with such a tight footprint. The LGA2011 socket is powered by a 9-phase VRM. It is wired to four DDR3 DIMM slots, two on either sides of the socket, powered by 2-phase VRM. Expansion slots include two each of PCI-Express 3.0 x16 and PCI-Express 2.0 x1. 2-way SLI and CrossFire are supported.

SATA connectivity includes two SATA 6 Gb/s (white), four SATA 3 Gb/s (black). There are no eSATA ports, but four USB 3.0, two on the rear panel, two by internal header, driven by Renesas-made controllers. The rest of the connectivity is fairly standard: 8+2 channel HD audio driven by Realtek ALC892 CODEC with optical and coaxial SPDIF outputs, single gigabit Ethernet driven by Realtek 8111E, and a number of USB 2.0 ports. One of the front-panel USB 2.0 headers is designed for charging portable devices even with the system shut down (yet plugged in). The board will be driven by UEFI firmware, we're getting to see some nifty features for overclockers such as voltage measurement points across a wide range of voltage domains.

Foxconn Quantum Force X79 Final Version Pictured

Foxconn's latest premium gamer-overclocker segment motherboard, the Quantum Force X79, has finally taken shape. Foxconn's Quantum Force motherboards are designed to offer good overclocking features at a great value. The Quantum Force X79 uses a 14-phase VRM to power the LGA2011 "Sandy Bridge-E" processor, plus a 2-phase VRM for the memory. There are four DDR3 DIMM slots, one per memory channel. Expansion slots include three PCI-Express 3.0 x16 (PCI-E1_x16, PCI-E3_x16, and PCI-E4_x16. The second black slot (PCI-E2_x16) is electrical PCI-Express 2.0 x8.

The board is packed with features that help overclockers, starting with triple redundant BIOS, voltage measurement points for manual voltage measurements (with a wide range of voltage domains), manual overclocking buttons on board, power, reset, clear-CMOS buttons, POST speaker, and plenty of fan headers.

ASUS Unveils Trio of PCI-Express 3.0 Motherboards Based on Intel Z68 Chipset

ASUS unveiled a trio of socket LGA1155 motherboards based on the Intel Z68 chipset, which feature PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated). The new motherboards are PCI-Express Gen 3.0 specifications compliant, complete with switches and electrical components. Leading the pack is the P8Z68 DELUXE/Gen3 in the $250-segement, followed by the P8Z68-V PRO/Gen3 in the $200-segment, and the P8Z68-V/Gen3 in the sub-$200 segment.

All three feature 16-phase Digi+ CPU VRM, an Intel-made gigabit Ethernet controller, and Lucid Virtu support. All three feature the same expansion slot loadout, with two PCI-Express 3.0 x16 (x16/NC or x8/x8), one PCI-Express 2.0 x16 (electrical 2.0 x4), and two each of PCI-Express 2.0 x1 and legacy PCI wired to an ASMedia-made bridge chip.

Renesas Announces the World's First USB 3.0 to SATA 6 Gb/s Bridge SoC

Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions, today announced the availability of its new SuperSpeed Universal Serial Bus (USB 3.0) SATA3 bridge system-on-chip ([SoC], part number, µPD720230) that enables data transfer between a USB3.0 host system and a Serial ATA (SATA) device in external USB storage equipment. The new SoC is the world's first USB 3.0 Bridge SoC that supports the UASP (USB Attached SCSI Protocol) protocol that significantly speeds up data throughput for large volumes of data.

USB 3.0 achieves data transfer speeds more than 10 times faster than the previous version of the standard, USB 2.0 (currently the mainstream data transfer technology) and therefore easily supports the growing need for increased data-recording media capacities. Renesas has led the industry by releasing the µPD720200 USB 3.0 host controller in May 2009 and began mass production in June that same year. Since then, the company's lineup of USB 3.0 host controllers has been widely adopted by customers worldwide. Total shipments of these products have already exceeded 40 million units since May 2010, and Renesas has ramped up production of its USB 3.0 host controllers to 6 million units per month. During this period, the company also released in December 2009 a UASP driver that achieves high-speed data transfers for storage devices by improving the performance limit of the BOT (Bulk-Only Transfer) standard used by USB 2.0, making it possible for external storage devices to take advantage of the increased speed offered by the new USB 3.0 standard.

Renesas to Revise µPD72020x USB 3.0 Controller Unit Price

Since neither Intel nor AMD have concrete plans in place to fully integrate USB 3.0 SuperSpeed controllers into their motherboard chipsets, at least not beyond a couple of ports, the market for third-party controllers is intact. Renesas is planning to make its 2-port PCI-Express 2.0 x1 controllers even more competitive in a market that is now seeing competition, a market which its controllers pioneered. Renesas acquired the USB 3.0 controller IP from NEC. By early 2012, Renesas will be in a position to price its controllers as low as US $1.20 per unit. Compare that to the $5 these controllers cost when they entered the market.

Renesas' mainstream USB 3.0 controllers, the µPD72020x series, are sold in the upstream supplier market for $2 per unit, as competitors' controllers are going for US$1.50-1.70. The company is facing competition from a number of new and established manufacturers, including VIA Labs (VLI), ASMedia, and Etron Technology. While most motherboard manufacturers have, at some point, used NEC/Renesas controllers, the major ones are beginning to move to its competitors. For instance, ASMedia controllers can be seen on newer motherboard models from ASRock and ASUS, Etron can be seen on Gigabyte ones. VLI is emerging as a favorite of USB 3.0 add-on cards.Source: DigiTimes

Having Sold 30 Million Units, Renesas To Double Production of USB 3.0 Chips

Renesas Electronics today announced that the cumulative total shipment of the company's SuperSpeed Universal Serial Bus (USB 3.0) host controllers has reached 30 million units worldwide as of 19 May 2011. This achievement comes a year and a half after starting mass production of the world's first USB host controller (µPD720200) in September 2009. The company also announced that to further address increasing orders from customers, it plans to double production of USB 3.0 host controllers to a monthly production of six million units starting this June.

In May 2009, Renesas Electronics (then NEC Electronics) introduced the industry's first USB 3.0 xHCI host controller and, after four months of its release, the company became the world's first to earn the “Certified SuperSpeed USB (USB 3.0)” certification from the USB-IF, and also started mass production of the µPD720200 host controller. In the following year, the company released its second USB 3.0 xHCI host controller (µPD720200A) and passed the compliance and certification testing in only two months. These host controllers have become the de facto USB 3.0 host controller standard realising the best interoperability between PCs and PC peripherals that support USB 3.0.
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