News Posts matching "SOI"

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Cadence Announces Tapeout of 14 nm Test-Chip

Cadence Design Systems, Inc., a leader in global electronic design innovation, announced today the tapeout of a 14-nanometer test-chip featuring an ARM Cortex-M0 processor implemented using IBM's FinFET process technology. The successful tapeout is the result of close collaboration between the three technology leaders as they teamed to build an ecosystem to address the new challenges from design through manufacturing inherent in a 14-nanometer FinFET-based design flow.

The 14-nanometer ecosystem and chip are significant milestones of a multi-year agreement between ARM, Cadence and IBM to develop systems-on-chip (SoCs) at the advanced process nodes of 14 nanometers and beyond. SoCs designed at 14 nanometers with FinFET technology offer the promise of a significant reduction in power consumption.

Common Platform Transitions to Adopt FinFET 3D Transistor with 14 nm Fab Process

Common Platform, a consortium of three major silicon fabrication companies: IBM, Samsung, and GlobalFoundries, met at their 2012 Technology Forum, where they announced their intention to transition to FinFET 3D transistor technology, but only with the 14 nanometer (nm) silicon fabrication process. Chips on this process will be built in the 2014~2015 time-frame. 3D transistors is a technology pioneered by Intel, which provides space-optimized, energy-efficient transistors on a nano-scale.

FinFET transistors will be combined with Fully Depleted Silicon-On-Insulator (FD-SOI) to offer extremely high transistor densities, with lower chip power. FD-SOI overcomes the limitation of current partially-depleted SOI (PD-SOI) technology, of lower-yields due to the pressure required for SOI insulation, which nears the breaking-point of strained silicon transistors. FinFET tech will be combined with chip-stacking technology, which helps make devices with better use of available PCB footprint.

Source: Bright Side of News

IBM Microprocessors to Power the New Wii U System from Nintendo

IBM today announced that it will provide the microprocessors that will serve as the heart of the new Wii U system from Nintendo. Unveiled today at the E3 trade show, Nintendo plans for its new console to hit store shelves in 2012.

The all-new, Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will power Nintendo's brand new entertainment experience for consumers worldwide. IBM's unique embedded DRAM, for example, is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience.

New Intel Atom Processor Platform Significantly Lowers Power for Tablet and Handheld

Benefitting from the company's power-saving architecture, transistor and circuit design expertise, plus unique manufacturing process techniques, Intel Corporation today unveiled its newest Intel Atom processor-based platform (formerly "Moorestown").

The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other mobile handheld products. The chips bring Intel's classic product strengths – outstanding performance to run a comprehensive and growing number of rich media and Internet applications, a choice of software, and the ability to easily multitask – across a number of applications, including HD video and multi-point videoconferencing.

GLOBALFOUNDRIES To Highlight 32nm/28nm Technology Leadership at GSA Expo

As the semiconductor industry begins its transition to the next technology node, GLOBALFOUNDRIES is on track to take its position as the foundry technology leader. On October 1 at the Global Semiconductor Alliance Emerging Opportunities Expo & Conference in Santa Clara, Calif., GLOBALFOUNDRIES (Booth 321) will provide the latest details on its technology roadmap for the 32nm/28nm generations and its innovative “Gate First” approach to building transistors based on High-K Metal Gate (HKMG) technology.

“With each new technology generation, semiconductor foundries are increasingly challenged with the economics to sustain R&D and the know-how to bring these technologies to market in high-volume,” said Len Jelinek, director and chief analyst, iSuppli. “With a heritage of rapidly ramping leading-edge technologies to high volumes at mature yields, combined with aggressive investments in capacity and technology, GLOBALFOUNDRIES is uniquely-positioned to challenge for next-generation foundry leadership.”

AMD Demos 48-core ''Magny-Cours'' System, Details Architecture

Earlier slated coarsely for 2010, AMD fine-tuned the expected release time-frame of its 12-core "Magny-Cours" Opteron processors to be within Q1 2010. The company seems to be ready with the processors, and has demonstrated a 4 socket, 48 core machine based on these processors. Magny Cours holds symbolism in being one of the last processor designs by AMD before it moves over to "Bulldozer", the next processor design by AMD built from ground-up. Its release will provide competition to Intel's multi-core processors available at that point.

AMD's Pat Conway at the IEEE Hot Chips 21 conference presented the Magny-Cours design that include several key design changes that boost parallelism and efficiency in a high-density computing environment. Key features include: Move to socket G34 (from socket-F), 12-cores, use of a multi-chip module (MCM) package to house two 6-core dies (nodes), quad-channel DDR3 memory interface, and HyperTransport 3 6.4 GT/s with redesigned multi-node topologies. Let's put some of these under the watch-glass.

Power-Shift in Fab 36 Dresden, New Fab to Take Third-Party Orders

After a successful shareholder approval AMD received for spinning-off its manufacturing division to form The Foundry Company (TFC) with a majority stake holding by Advanced Technology Investment Company (ATIC), top-brass of the Fab subsidiary in Dresden, German saw a power-shift. Long-standing general manager Hans Deppe left the company, to be succeeded by Jim Doran.

Doran's experience with the subsidiary covering Fab 36 (65 nm SOI capable) and Fab 38 (45 nm SOI capable) includes being its general manager in the past, which made with a contender to the post. The Dresden facilities will officially come under TFC from March 2. While as part of AMD the facilities were dedicated to manufacturing AMD microprocessor parts, under TFC, not only will they serve as foundry-partner for AMD, but also accept designs from other companies seeking manufacture on the facilities TFC offers.Source: EETimes

NVIDIA Joins SOI Consortium

The SOI Industry Consortium has announced that NVIDIA has joined the organization. NVIDIA now joins a league of companies such as AMD, Applied Materials, ARM, Cadence Design Systems, CEA-Léti, Chartered Semiconductor Manufacturing, Freescale Semiconductor, IBM, Innovative Silicon, KLA-Tencor, Lam Research, Magma Design, Samsung, Semico, Soitec, SEH Europe, STMicroelectronics, Synopsys, Taiwan Semiconductor Manufacturing Company (TSMC), Tyndall Institute, UCL and United Microelectronics Corporation (UMC).

So what is SOI? Silicon on Insulator technology involves use of variable layered silicon-insulator-silicon substratum, used to minimize parasitic device capacitance and thereby improve performance.Source: CIOL
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