News Posts matching "STMicroelectronics"

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IBM, STMicroelectronics and Shaspa Advance Smarter Home Initiative

IBM, STMicroelectronics and Shaspa today announced a collaboration to tap cloud and mobile computing for manufacturers and service providers to provide innovative ways for consumers to manage and interact with their homes' functions and entertainment systems using multiple user interfaces such as voice recognition and physical gestures for a smarter home.

A "smart home" brings networking functions together, creating a gateway that connects a television, computer or mobile device with smart meters, lights, appliances, plugs and sensors within the home as well as services from outside. Parks Associates forecasts that more than 8 billion devices will be connected on the home network by year-end 2015.

STMicroelectronics First to Simplify Complex Routing With New DisplayPort 1.2 Device

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top player in ICs for home multimedia, today added the STDP43 series of products to its innovative DisplayPort portfolio. These Systems-on-Chips (SoCs) are the world's first high-speed active-protocol bi-directional media-routing devices that manage audio and video data from various sources and send this data to multiple displays. The devices support DisplayPort 1.2 and HDMI 1.4, the latest versions of the two most common digital-display interface technologies used in computer and consumer electronics. The STDP43 SoCs are catalytic in the rapidly expanding markets for next-generation digital signage, universal docking stations and video hubs required by the new generation of notebooks and PCs based on the latest Intel and AMD CPUs that support the multi-stream features of DisplayPort 1.2.

Samsung and STMicroelectronics Enter Strategic Relationship for 32 nm and 28 nm Tech

Samsung Electronics, Co., Ltd., a world leader in advanced semiconductor technology solutions, announced foundry production of STMicroelectronics’ leading products using 32/28nm High-K Metal Gate (HKMG) process technology. Samsung Electronics’ foundry business has been selected by STMicroelectronics to provide it with products at the 32/28nm process node. The relationship has already resulted in taping-out of a dozen ST advanced system-on-chip (SoC) devices for mobile, consumer and network applications.

“We have successfully started production of STMicroelectronics’ new-generation 32/28nm SoC products,” said Kwang-Hyun Kim, executive vice president of Foundry business, Device Solutions, Samsung Electronics. “A foundry relationship with ST demonstrates our commitment to advanced process technology and our 32/28nm HKMG process-technology leadership. We have aggressively ramped 32/28nm capacity and will continue to deliver the most advanced process solutions to our customers.”

VESA Announces New Mobility DisplayPort Standard

The Video Electronics Standards Association (VESA) today announced the release of the Mobility DisplayPort (MyDP) Standard. MyDP is an extension of the DisplayPort connectivity standard that enables mobile devices to share high-definition video, audio, and 3D content with the broad universe of larger external displays through common, widely adopted connectors. Offering the industry’s highest mobile-to-display image resolution, MyDP allows consumers to experience their mobile content in full, uncompressed 1080p (HDTV).

“Today’s mobile devices with powerful processors and mass storage capacities have become the new hub of media content,” said Soumendra Mohanty, senior director of marketing for Analogix. “However, consumers wish to experience their mobile content in a more diverse manner, beyond what a four-inch screen can offer. MyDP gives the industry a standard interface to break down screen size limitations, and Analogix is ready today with its compatible SlimPort products.”

Rambus Files ITC Complaint Against Broadcom, NVIDIA, LSI, STM, Freescale, etc.

Rambus Inc., one of the world's premier technology licensing companies, today announced it has filed a complaint with the United States International Trade Commission (ITC) requesting the commencement of an investigation pertaining to products from Broadcom Corporation, Freescale Semiconductor, Inc., LSI Corporation, MediaTek Inc., NVIDIA Corporation and STMicroelectronics N. V. The complaint seeks an exclusion order barring the importation, sale for importation, or sale after importation of products from Broadcom, Freescale, LSI, NVIDIA and STMicroelectronics that infringe certain patents from the Dally1 family of patents, and of products from Broadcom, Freescale, LSI, MediaTek and STMicroelectronics that infringe certain patents from the Barth family of patents. In an earlier investigation requested by Rambus, the ITC found that these same Barth patents were valid and infringed by NVIDIA products, and issued an exclusion order in July of this year.

“We have been attempting to license these companies for some time to no avail. One of the respondents frankly told us that the only way they would get serious is if we sued them. Others pursued a strategy of delay rather than negotiate a reasonable resolution,” said Harold Hughes, president and chief executive officer at Rambus. “Rambus has invested hundreds of millions of dollars developing a portfolio of technologies that are foundational for many digital electronics. There is widespread knowledge within the industry about our patents including their use in standards-compatible products accused in these actions. In fairness to our shareholders and to our paying licensees, we take these steps to protect our patented innovations and pursue fair compensation for their use.”

PGI to Develop Compiler Based on NVIDIA CUDA C Architecture for x86 Platforms

The Portland Group, a wholly-owned subsidiary of STMicroelectronics and a leading supplier of compilers for high-performance computing (HPC), today announced it is developing a CUDA C compiler targeting systems based on the industry-standard general-purpose 64- and 32-bit x86 architectures. The new PGI CUDA C compiler for x86 platforms will be demonstrated at the SC10 Supercomputing conference taking place in New Orleans, LA, November 13-15, 2010.

The NVIDIA CUDA architecture was developed to enable offloading computationally intensive kernels to massively parallel GPUs. Through function calls and language extensions, CUDA gives developers explicit control over the mapping of general-purpose computational kernels to GPUs, as well as the placement and movement of data between an x86 processor and the GPU.

Intel Opens Software App Store, Offers New Intel Atom Chips

During keynote presentations today at the Intel Developer Forum, Intel Corporation executives outlined several software- and hardware-related efforts as the company intensifies its System-on-a-Chip (SoC) product plans based on the Intel Atom processor family.

Amid predictions of billions of additional Internet-connected devices going online, Renée James, senior vice president and general manager, Intel Software and Services Group, and Doug Davis, vice president and general manager, Embedded and Communications Group, discussed the expansion of these processors into high-growth areas including netbooks, tablets, CE, embedded, and smart phones.

GLOBALFOUNDRIES Announces Strategic Customer Engagement with STMicroelectronics

GLOBALFOUNDRIES today announced a strategic customer relationship with STMicroelectronics. One of the world's leading suppliers of semiconductor solutions, ST will partner with GLOBALFOUNDRIES to produce products based on 40nm Low Power (LP) bulk silicon technology. The 40nm LP process is ideal for the next generation of wireless applications, handheld devices, and consumer electronics, which require excellent performance and long battery life. First tape out and production of ST products by GLOBALFOUNDRIES is planned to start in 2010.

"When we launched GLOBALFOUNDRIES, our long-term vision was to bring a new business model to the foundry market and to become the partner of choice for the largest and most innovative semiconductor design and manufacturing companies," said Doug Grose, Chief Executive Officer, GLOBALFOUNDRIES. "With the addition of an industry-leader in low-power technology like STMicroelectronics we now begin to deliver on this vision. We look forward to harnessing our full capabilities for ST to provide best-in-class service in bringing their 40nm design innovation to life in high volumes and at mature yields."

IBM Announces Availability of 28 nm Semiconductor Technology

In a move that signals a firm and ongoing commitment to advanced semiconductor technology leadership, IBM, Chartered Semiconductor Manufacturing Ltd., GLOBALFOUNDRIES, Infineon Technologies, Samsung Electronics, Co., Ltd., and STMicroelectronics have defined and are jointly developing a 28-nanometer, high-k metal gate (HKMG), low-power bulk complementary metal oxide semiconductor (CMOS) process technology.

The low-power, 28nm technology platform can provide power-performance and time-to-market advantages for producers of a broad range of power-sensitive mobile and consumer electronics applications, including the fast-growing mobile Internet device market segment. The favorable leakage characteristics of the HKMG technology result in optimized battery life for the next generation of mobile products.

IBM and AMD First to Reach the 22 nm Silicon Fabrication Mark

IBM and its chip development partners announced today that they've developed the first functional 22nm silicon fabricated SRAM cell. This puts them ahead of Intel, which had announced its technological entry into the 32 nm domain in September, 2007. SRAM is usually the first semiconductor device a chip-maker tests a new fabrication-process on, before working on microprocessors. These devices were developed and manufactured by AMD, Freescale, IBM STMicroelectronics, Toshiba and the College of Nanoscale Science and Engineering (CNSE). They were built in the conventional 6-transistor design and on a 300 mm wafer. This level of miniaturization made the SRAM cell shrink to a mere 0.1 sq. μm, compare this to the SRAM cells that go into making caches on the 45 nm Intel processors, 0.346 sq. μm.

Intel, STMicroelectronics and Francisco Partners Close Transaction to Create Numonyx

Intel Corporation today announced that the company has finalized and closed its transaction with STMicroelectronics and Francisco Partners to create a new independent semiconductor company Numonyx B.V. that will design, develop and manufacture NOR and NAND flash memory products. As part of the transaction, Intel has transferred the assets associated with its NOR flash memory business and certain assets related to the company's phase change memory initiatives to Numonyx in exchange for 45.1 percent ownership in Numonyx. ST Microelectronics acquired a 48.6 percent ownership interest in Numonyx. Francisco Partners acquired a 6.3 percent ownership interest in exchange for a cash investment of $150 million.
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