News Posts matching "Semiconductor"

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Vivante to Highlight Cutting-Edge GraphiVisor Virtualization Technology

Vivante Corporation today announces that its GPU GraphiVisor solution will be featured in a white paper and sponsorship at the Jon Peddie Research Virtualize Conference. GraphiVisor is at the heart of solutions that must be both high-performance and secure, such as in Automotive applications, where feature-rich user experiences must exist in the same system as safety-critical functions with no tolerance for error or tampering. GraphiVisor will work alongside traditional security measures such as 2-step authentication, encryption and network security for truly secure systems in applications where some systems must be designed to have uninhibited, immediate access to the GPU and even a small error-margin is unacceptable, and a new level of hardware isolation is necessary. Vivante IP provides that option with two GPUs that can operate in isolation on one system.

Vivante is excited to be a part of the 2015 Virtualize Conference, with a best practices panel on virtualization options that will include Rick Tewell of Freescale Semiconductor, who heads the Graphics Architecture team for the i.MX product lines. Freescale has adopted Vivante's dual-GPU isolation technology in the i.MX6 Quad to allow one Microcontroller solution for multiple graphics applications that have varying requirements for safety and real-time performance.

TSMC to Commence 10 nm Volume Production by Q4-2016

Semiconductor foundry TSMC assured its clients that the company will be ready with a 10 nanometer manufacturing node for volume production, by the 4th quarter of 2016. Company president and joint-CEO Mark Liu made this announcement during the company's recent Q2-2015 earnings call. "The recent progress of our 10 nanometer technology development is very encouraging and on track with our plan," he said. With volume production of chips commencing in Q4, some of the first products based on them should begin appearing in early-2017. "We ramp up 10 nm in the Q4 2016 next year, but the real product shipment will be in Q1 2017," said C.C. Wei, co-CEO.

Source: Kitguru

New Micron "Ultra" Memory Products Enable Next-Generation Automotive Systems

Micron Technology, Inc., today announced the availability of ultra reliable, ultra high-speed and ultra high-temperature parallel NOR Flash and low-power DDR4 (LPDDR4) DRAM to meet the increasing memory requirements for the automotive market segment. Micron's G18 NOR family offers the industry's highest-performance parallel NOR, while Micron's automotive-grade LPDDR4 solutions are an industry-first.

These new products meet the needs of automotive applications that require ultra high speed. The G18 family's high performance (266 MB/s)enables faster boot and code execution for higher-density applications, while LPDDR4 enables 33 percent higher peak bandwidth than DDR4. Additionally, Micron's new solutions deliver long-lasting reliability and meet ISO/TS certification requirements-with the G18 family enabling three times faster throughput over quad SPI NOR, and the LPDDR4 products undergoing additional package-level burn-in testing. Furthermore, Micron's G18 NOR products have options that meet the industrial temperature (IT) range of -40 to 85°C and the automotive-grade automotive temperature (AAT) range of -40 to 105°C. The LPDDR4 products have options that meet the automotive-grade industrial temperature (AIT) range of -40 to 95°C, as well as some future options that will meet the automotive-grade ultra temperature (AUT) range of -40C to 125°C, which is the highest operating temperature range in the industry, expected to be available in 2016.

Toshiba and SanDisk Celebrate the Opening of the Second Phase of Fab 5

Toshiba Corporation and SanDisk Corporation today celebrated the opening of the second phase of the No. 5 semiconductor fabrication facility (Fab 5) and the start of construction of the new No. 2 fabrication facility (Fab 2) at Yokkaichi Operations, Toshiba's NAND Flash memory plant in Mie prefecture, Japan.

Toshiba started construction of the second phase of Fab 5 in August 2013, and Toshiba and SanDisk have overseen installation of production equipment in the expanded facility since July this year. Production in phase 2 began at the start of this month, with 15 nm NAND flash memory process technology, the world's smallest and most advanced node. Toshiba and SanDisk announced deployment of this jointly developed 15 nm NAND flash process in April this year, with initial production in part of Fab 5 phase 1, and now target conversion of the remaining capacity in phase 1 to the new process technology.

GLOBALFOUNDRIES Names Tom Caulfield as GM of its New York Fab

GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today appointed Dr. Thomas Caulfield as senior vice president and general manager of the company's latest leading-edge 300mm semiconductor wafer manufacturing facility (Fab 8), located in Saratoga County, NY. Caulfield, an accomplished industry leader with more than 20 years of technical and global executive experience, will lead the operations, expansion and ramp of semiconductor manufacturing production at Fab 8, where GLOBALFOUNDRIES supports customers on the world's most advanced semiconductor manufacturing technology platforms including 28 nanometer (nm), 20 nm, and the recently announced 14 nm FinFET platform.

"We are expanding our Fab 8 manufacturing campus, strengthening strategic partnerships, and deepening customer relationships so we can offer our customers leading-edge technology and a more flexible and cost-effective way of doing business," said GLOBALFOUNDRIES CEO Sanjay Jha. "Tom is a proven and respected industry leader with more than two decades of semiconductor technology and manufacturing experience and we are excited to have him join our team to drive the next phase of growth at Fab 8."

Toshiba Joins GLOBALSOLUTIONS Ecosystem as Worldwide ASIC Partner

GLOBALFOUNDRIES today announced that Toshiba Corporation will join the company's GLOBALSOLUTIONS ecosystem of partners. As a worldwide ASIC partner, Toshiba will enable its Fit Fast Structured Array (FFSA) and ASIC solutions based upon GLOBALFOUNDRIES' technologies and services for customers across the globe. The agreement includes participation on multi-project wafer (MPW) runs and production wafers covering the whole portfolio of GLOBALFOUNDRIES technologies, including leading-edge process nodes.

Initially, the partnership will focus on implementations of Toshiba's FFSAs manufactured with GLOBALFOUNDRIES' 65nm and 40nm low-power process technologies, with 28nm arrays to follow. Toshiba's FFSA products-including libraries and intellectual property (IP)-allow customers to reduce development time and costs by customizing existing base wafers, choosing from a number of design platforms at GLOBALFOUNDRIES. For higher-volume applications, customers can work with Toshiba's libraries to develop fully custom system-on-chips (SoCs). With an initial product completed, customers can then leverage the embedded FFSA technology to provide quick-turn derivative products, with much lower development costs.

Toshiba to Collaborate with GLOBALFOUNDRIES on FFSA Manufacturing

Toshiba Corporation today announced that the company will collaborate with GLOBALFOUNDRIES in the manufacture of Toshiba's FFSA (Fit Fast Structured Array) products. Toshiba will expand its FFSA business through production at GLOBALFOUNDRIES's fabs. Initial products will be manufactured using GLOBALFOUNDRIES 65nm-LPe and 40nm-LP processes, with plans to extend the collaboration to the company's 28nm High-K Metal Gate (HKMG) technology.

Toshiba's FFSA products, developed in collaboration with BaySand Inc. of the U.S., can be configured simply by customizing the design of a few metal layers. This customization process secures a much shorter development turn-around-time than with conventional ASIC devices, and satisfies increasing market needs for high performance, high specifications and low power technologies. At a time of ever-shorter product life cycles, time available for development is at a premium, and solutions that meet demand and allow tweaking of the specifications until just before the start of trial production increase the freedom and flexibility of developers.

Micron Technology Appoints Rajan Rajgopal as Vice President of Quality

Micron Technology, Inc. (Nasdaq:MU), today announced that the company has named Rajan Rajgopal, vice president of Quality. Rajgopal will be responsible for overseeing all aspects of Micron's quality systems including manufacturing, customer program management and product ramps. He brings more than 25 years of experience to Micron and most recently served as the vice president of Global Quality and Customer Enablement for GLOBALFOUNDRIES in Singapore.

"Micron continues to evolve as a memory business driven by systems-level solutions, and quality plays a heightened role in serving our valued customers," said Micron President Mark Adams. "We are excited to have Rajan join our team and leverage his experience in serving our customers in an increasingly diversified set of application segments."

Toshiba Expands its Semiconductor Facility at Yokkaichi

Toshiba Corporation today announced that it will expand its state-of-art No. 5 semiconductor fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure manufacturing space for NAND flash memories fabricated with next generation process technology and for future 3D memories. Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

Yokkaichi Operations currently has three Fabs mass producing NAND flash memory, including Fab 5 phase 1. Fab 5's construction was planned around two phases, the first of which went into operation in July 2011. After giving careful consideration to the balance of product supply and demand, and noting a recovery driven by growing demand for smartphones, tablets, SSD for enterprise servers and other new applications, Toshiba now anticipates further medium- to long-term market expansion and recognizes that the time is right to expand Fab 5.

UMC joins IBM chip alliance for 10 nm process development

IBM (NYSE: IBM) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.

"Established over a decade ago, the IBM alliance allows the partners to leverage our combined expertise and collaborative research and innovative technology development to address the demanding needs for advanced semiconductor applications," said Gary Patton, VP, IBM Semiconductor Research & Development. "UMC is a strong addition to the alliance."

AMD Bolsters Engineering Talent With Appointment of Two Technology Experts

AMD today announced that Charles Matar and Wayne Meretsky have joined the company to assume critical new engineering leadership roles driving hardware and software intellectual property (IP) development for AMD's system-on-chip (SoC) solutions. Matar will draw upon his expertise in SoC and processor design to lead AMD's SoC methodology and client SoC execution. Meretsky will lead the company's software development, ensuring tools will be in place that will enable developers to take advantage of the compute power in AMD's SoC designs.

"Charles and Wayne will serve as key members of our engineering brain trust, bringing with them years of expertise in SoC design and developing 64-bit software ecosystems, respectively," said Mark Papermaster, AMD Chief Technology Officer. "The fact that these computing experts have returned to the company underscores AMD's unique position and opportunity, based on differentiated IP, to take a leadership position in low-power clients and dense cloud servers."

Marvell Technology Group Seeks to Overturn Jury's Patent Infringement Findings

Marvell (NASDAQ: MRVL), a global leader in integrated silicon solutions, announced that on December 26, 2012, a jury in Pittsburgh delivered a verdict in a lawsuit brought by Carnegie Mellon University ("CMU") against Marvell and Marvell Semiconductor, Inc. ("MSI"), Marvell's U.S. operating subsidiary, in the United States District Court for the Western District of Pennsylvania. In the lawsuit, CMU asserted that Marvell infringed two CMU patents claiming a specific technique related to read channel detector technology that is not practiced by any Marvell chips.

Specifically, the patents at issue are U.S. Patent Nos. 6,201,839 and 6,438,180. Marvell and MSI strongly believe the theoretical methods described in these patents cannot practically be built in silicon even using the most advanced techniques available today, let alone with the technology available a decade ago. Rather, Marvell and MSI use their own patented read channel technology developed in house. Nevertheless, the jury disagreed with Marvell and MSI's position and found that the patents were literally and willfully infringed and valid, and awarded damages in the amount of $1.17 billion.

Samsung Continues to Expand Operations in the Bay Area

Samsung Electronics Co., Ltd, a global leader in digital media, digital convergence technologies and advanced semiconductor solutions, continues to expand its operations in Silicon Valley by investing more resources in its existing R&D centers and establishing new innovation centers.

Samsung Semiconductor, Inc. (SSI) announced plans to build a 1.1 million square foot sales and R&D headquarters on the current site of its semiconductor and display panel businesses, north of downtown San Jose. The building, designed by global architecture firm NBBJ, will be comprised of a 10-story tower, an amenity pavilion and parking garage. The design seeks to encourage interaction among staff, foster connections with the community and provide a space to attract employment in the highly competitive tech market, which is growing at a faster pace than overall employment.

IDC Forecasts Worldwide Semiconductor Revenues Will Reach $319 Billion in 2013

Semiconductor revenues worldwide will see nominal growth this year at less than 1% reaching $304 billion according to the year-end 2012 update of the International Data Corporation (IDC) Semiconductor Applications Forecaster (SAF). The SAF also forecasts that semiconductor revenues will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016, reaching $368 billion in 2016.

Weakness in PC demand, DRAM and overall memory price deterioration, and semiconductor inventory rationalization, coupled with continued global macroeconomic uncertainty from lower global GDP growth, a slowdown in China, the Eurozone debt crisis and recession, Japan's recession, and ongoing fear of fiscal cliff negotiations' impact on IT spending by corporations have all been levers affecting global semiconductor demand this year. Bright spots for the semiconductor market include smartphones, tablets, set-top boxes, and automotive electronics, which IDC expects will continue to be key drivers of growth over the coming years.

Major Semiconductor Investment to Continue at Samsung's Austin Facility

Samsung Austin Semiconductor LLC today announced that a $4 billion investment at its Austin, Texas, site is on schedule for production of state-of-the-art mobile application processors within the second half of 2013.

The remodeled fabrication line will produce state-of-the-art mobile application processors on 300 mm wafers at the 28 nanometer process node. The new boost in production will occur within the second half of 2013 and is expected to alleviate the rapidly growing demand for application processors for mobile devices.

Global Semiconductor Sales Increase in October, Remain Above Seasonal Rate

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.22 billion for the month of October 2012, a 1.7 percent increase from the prior month when sales were $24.79 billion. Monthly sales topped $25 billion for the first time in 2012 and remained above the seasonal growth rate in October.

Total year-to-date sales in 2012 were down 3.7 percent compared to the same time last year, but the deficit was smaller than it has been all year. Regionally, sales increased in the Americas by 8.1 percent, marking the region's largest sequential monthly upsurge in the last decade. All monthly sales numbers represent a three-month moving average.

TSMC Looking to Build Fabs in the US

Global Foundries could soon howdy-neighbor TSMC in upstate New York, with the Taiwanese semiconductor giant looking to set up a fab there. According to an X-bit Labs report, TSMC began groundwork on its US venture by consulting with Deloitte, to look for viable sites in Rensselaer, Saratoga and Oneida counties, that have abundant water, power, and gas to operate 3.2 million square feet buildings with 1,000 employees, 40 percent of which are college-graduated engineers.

Deloitte also took a look around Luther Forest Technology Campus, where Global Foundries' Fab 8 is located. A little earlier this week, Bill Owens, a Congressman from upstate New York flew to Taiwan, to meet with TSMC CFO Lora Ho to pitch upstate a little more. TSMC is a principal foundry partner of companies such as Qualcomm, NVIDIA, and AMD.

Source: X-bit Labs

Toshiba Temporarily Reopens Semiconductor Facility in Thailand

Toshiba Corporation today announced that it has resumed manufacturing at the Toshiba Semiconductor Thailand Co., Ltd. (TST) facility in Pathumthani, Thailand, in order to meet healthy demand for discrete products for smart phones and tablet PCs. Production resumed earlier this month and shipments will start today. Production will continue until TST opens its new facility in Purachinburi.

TST's facility in the Bangkadi Industrial Park, Pathunthani, was completely inundated in last year's floods, forcing suspension of operations. Assembly and packaging of the small signal devices and photocouplers the facility handled was transferred to other Toshiba facilities in Japan and Malaysia, and also outsourced as a means to respond to changes in demand. In April this year, TST decided to relocate its operations to the 304 Industrial Park in Purachinburi, which is outside of Thailand's major flood plain, leaving the now cleaned up Bangkadi facility vacant and available.

Global Semiconductor Sales Up Slightly in September

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $24.79 billion for the month of September 2012, a 2 percent increase from the prior month when sales were $24.30 billion. Sales from the third quarter of 2012 totaled $74.4 billion – a 1.8 percent jump compared to the previous quarter – but total 2012 sales were down 4.7 percent compared to the same time last year. All monthly sales numbers represent a three-month moving average.

Intel Capital Acquisition Signals Opportunity in Semiconductor Investments

Intel Capital portfolio company Crossing Automation announced today that it is being acquired by Brooks Automation (NASDAQ: BRKS) for $63 million. Intel Capital invested in Crossing in 2005 and provided financial support and strategic and operational planning guidance to the company, which manufactures fab and tool automation equipment for the semiconductor market, enabling Crossing to achieve significant revenue and operating income growth.

The deal follows on the heels of FormFactor's (NASDAQ: FORM) $117 million acquisition of Intel Capital portfolio company MicroProbe, which provides advanced wafer test solutions to global semiconductor manufacturers. These successful exits signal a revival of opportunities in the semiconductor investment sector where Intel Capital is well positioned to add value to these companies.

GLOBALFOUNDRIES, IBM, Intermolecular Collaborate to Speed Advanced Logic Development

Intermolecular, Inc. today announced that GLOBALFOUNDRIES and IBM will leverage Intermolecular's High Productivity Combinatorial (HPC) technology, as the companies work to speed development of manufacturing technologies down to the 10 nm node.

Intermolecular's combinatorial technology allows many more tests to be done using a single wafer. This enables experimental data to be generated and analyzed with significantly greater speed and efficiency than a traditional development line, accelerating innovation in materials, processes, and device architectures.

Rambus and Fujitsu Semiconductor Sign Patent License Agreement

Rambus Inc., one of the world’s premier technology licensing companies, announced today it has signed a patent license agreement with Fujitsu Semiconductor Limited. This six-year agreement covers the use of Rambus patented innovations implemented in a broad range of integrated circuit (IC) products offered by Fujitsu Semiconductor. Financial terms of the agreement are confidential.

“As a global leader in the semiconductor market, Fujitsu Semiconductor is an important customer and this agreement validates the continued strength of our portfolio,” said Dr. Ronald Black, chief executive officer of Rambus. "We look forward to the opportunity to expand our customer relationships beyond patent license agreements to showcase our technical contributions and system know-how with our customers."

AMD Appoints Jack Harding to Board of Directors

AMD announced today that Jack Harding has been appointed to the company’s board of directors. Harding currently serves as president and chief executive officer and a member of the board of directors of eSilicon Corporation, a privately-held semiconductor design and manufacturing services provider he co-founded. eSilicon designs and manufactures complex, custom chips for a broad and growing portfolio of large and small firms. Harding brings more than 25 years of management experience in the semiconductor industry to the board, especially in the area of ASIC and system on a chip (SoC) design, productization and manufacturing.

“Jack’s wealth of industry experience and familiarity with evolving industry trends make him a perfect choice to join the AMD board,” said Bruce Claflin, chairman, AMD Board of Directors. “As AMD establishes itself as a more nimble, flexible semiconductor design innovator, Jack’s operational experience, strategic expertise and business acumen for bringing SoC and custom integrated circuit solutions to market should add tremendous value for AMD’s future business.”

PLX Expands PCI Express Gen3 Portfolio, Adds Versatile 96-, 80-, 64-Lane Switches

PLX Technology, Inc., a leading global supplier of high-speed connectivity solutions enabling emerging data center architectures, today announced a new trio of ultra-high lane count PCI Express (PCIe) Gen3 switches developed for cutting-edge markets like storage systems, high-end graphics, and communications platforms. The high-performance ExpressLane PCIe Gen3 switches include the PEX8796 (96 lanes, 24 ports), PEX8780 (80 lanes, 20 ports) and PEX8764 (64 lanes, 16 ports), which expand the PLX portfolio to 14 PCIe Gen3 devices. Designers choosing the PEX8796 switch -- touting bandwidth of 8 Gigatransfers per second, per lane, in full duplex mode -- are rewarded with amazing throughput of 1,536 gigabits per second (192 gigabytes/s), delivering performance that challenges all other interconnect technologies.

GLOBALFOUNDRIES Improves IC Reliability with Customized Circuit Checks

Mentor Graphics Corp. today announced that GLOBALFOUNDRIES is helping its customers improve reliability checking by adding Calibre PERC to select 28nm bulk CMOS design enablement flows. Calibre PERC will give designers access to the new reliability verification rules developed by the IBM Semiconductor Development Alliance (ISDA), augmented with GLOBALFOUNDRIES specific checks to help prevent external latch-up. Using Calibre PERC’s unique architecture, complex reliability rules that require the integration of logical (net list) and layout (GDS) information can be fully automated, eliminating manual spreadsheet-based efforts and reducing the chances of design errors.

“In the past, verification of latch-up immunity depended on manual layout checks and rough approximations of device and interconnect resistance using traditional mechanisms,” said Bill Liu, vice president of design enablement at GLOBALFOUNDRIES. “Now our customers can perform accurate measurements and analysis automatically using Calibre PERC’s data integration capability. For example, some of our customers are currently using PERC to accurately determine the resistance of the paths in complex output driver arrays as a function of device spacing. This allows them to easily and accurately detect points in the circuit where latch-up could be an issue and to make appropriate improvements.”
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