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SMART Modular Announces Sample Shipments of DDR4 Memory Modules

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today that it has begun shipments in sample quantities of DDR4 memory modules. These samples are for qualification in next generation server, storage and networking applications which are expected to launch later in 2014 through 2015.

Currently, SMART's lineup of available DDR4-2133 1.2V modules includes VLP (Very Low Profile) and standard height RDIMMs up to 16 GB, and ECC SO-DIMMs up to 8 GB. These modules include improved capacity and performance scalability, improved power efficiency, and enhanced system reliability, which are all benefits driving the transition to DDR4.

SMART Modular Introduces DDR3 8 GB Ultra Low Profile "Planar" Mini-UDIMM

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, today announced it has expanded its wide lineup of DDR3 small modules with a cost-effective 8 GB ULP Planar Mini-UDIMM.

With its innovative design, SMART has doubled the number of DRAM placements to 18 on its ULP Planar Mini-DIMM which allows the use of mainstream cost-effective 4 Gb DRAMs. The result is a high density solution contained in a small package effectively lowering the overall cost per module GB.

SMART Modular Announces High Performance DDR4 DRAM Module

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, has been actively involved in developing and standardizing DDR4 module technology and today announced the first products in its DDR4 DRAM module portfolio.

SMART's initial lineup of DDR4-2133 modules are loaded with technology advancements inherent to the DDR4 platform. Those advancements include power efficiencies, faster speeds and higher densities, all key benefits for next generation server, storage and networking applications.

SMART Modular Unveils XR-DIMM Small Form Factor DDR3 Module

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced its new XR-DIMM small form factor DDR3 module, specifically designed for ruggedized single board computing (SBC) applications requiring high reliability, density and performance attributes.

SMART's XR-DIMM solves the traditional space-constraint issue for Advanced Memory Card (AMC) form factor SBC's, where the clips from the horizontally mounted SO-DIMM's socket violate the "keep-out" areas of the card and interfere with the system chassis when the AMC card is removed. The XR-DIMM solves this issue by using a low profile, snap-down mezzanine connector with no clips. In addition, SMART's XR-DIMM form factor provides a ruggedized attach method and features improved signal integrity ideal for AMC cards, as well as ATCA, PCIe, and COMe embedded computing applications.

SMART Introduces New Memory Module Form Factor

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced MIP, the industry's first module-in-a-package memory form factor. SMART's innovative tiny form factor design is targeted for broadcast video, mobile router, high-end video/graphics cards and embedded computing applications where power consumption, performance and space limitations are of principle concern.

While SMART's MIP occupies just one-fifth the area of an SO-DIMM, it offers higher performance and consumes less power. Key improvements with MIP include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. Being a "soldered down" module, unlike an SO-DIMM, the need for a mating connector is eliminated with MIP. SMART's MIP supports both, applications requiring ECC and the ones that do not. These are key benefits for applications where memory capacity in a small space is critical. And unlike other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.

SMART Modular Technology Announces 24GB CoolFlex DDR3 RDIMM

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced the addition of a 24GB CoolFlex RDIMM to its product lineup. The 24GB DDR3-1333 1.35V RDIMM helps solve unique memory capacity constraints in servers. SMART's CoolFlex module product family uses state-of-the-art flexible substrate technology to increase system memory capacity.

Servers configured with two processors and sixteen registered DIMMs are generally limited to a maximum memory capacity of 256GB. When using 16GB DDR3-1333 RDIMMs these systems can be fully populated. However, when switching to 32GB four-rank RDIMMs, the maximum number of DIMMs per Channel (DPC) drops down to one. A system configured with two channels per processor and four DIMMs per channel can only be populated with one 32GB RDIMM per channel for a total memory capacity of 128GB. SMART's new 24GB Coolflex RDIMM solves this constraint by allowing these systems to be fully populated with sixteen 24GB RDIMMs totaling 384GB and representing a 50% increase in memory capacity.

SMART Modular Technologies Announces 64GB DDR3 Load-Reduced DIMM

SMART Modular Technologies ("SMART Modular"), a leading independent manufacturer of memory modules and embedded flash products announces its 64GB DDR3 load-reduced DIMM (LRDIMM). SMART Modular's 64GB LRDIMM is optimized for high-end servers and will be launching in Q2'12 to serve scientific, engineering, and financial computing applications that require high memory capacity and performance. Specifically, this product targets next-generation Intel Sandy Bridge and Ivy Bridge server platforms for high-performance computing applications.

The new LRDIMM combines innovative module packaging technology leveraging off-the-shelf commodity DRAMs to provide the industry's highest density LRDIMM at the lowest possible cost. Highlighting SMART Modular's design expertise, the new 64GB LRDIMM utilizes a single JEDEC-compliant memory buffer chip, a dual PCB structure and a leading edge interconnect technology to provide maximum performance and density while achieving server-grade quality and reliability.
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