News Posts matching "SoC"

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Jim Keller to Lead Autopilot Hardware Team at Tesla Motors

Elon Musk handed over the reins of one of Tesla Motors' most important research and development divisions, autopilot, to chip whiz Jim Keller. Keller joined Tesla Motors as Vice President of Autopilot Hardware Engineering. With Tesla being at the very frontier of automobile development, and self-driving cars being the next big thing for the industry, Keller holds an enviable, albeit challenging position.

Jim Keller led teams that designed some of AMD's most commercially successful processors, before a stint at Apple, where he helped it gain hardware self-reliance with the company's Ax series SoCs; and returning to AMD, and leading the team that designed the company's upcoming "Zen" and K-12 micro-architectures. Tesla cars are currently driven by electronics powered by NVIDIA Tegra SoCs. With NVIDIA's immeasurable investments in deep-learning tech that forms the foundation of self-driving car hardware, and Tesla Motors yet choosing a CPU designer to lead its autopilot division, it's easy to speculate that Musk's company is seeking the same kind of hardware self-reliance that Apple did, as its iOS devices were taking off.


Source: Electrek

No Enterprise Support for Older Windows Versions on the Latest Processors: Microsoft

Microsoft, in a tactfully-worded blog post by Exec VP for its Windows and Devices Group, Terry Myerson, announced that it won't support older versions of Windows (eg: Windows 7 and Windows 8.1) on the latest/upcoming processors. The software might run on the new hardware, but the company won't provide enterprise support for such platforms. This could include software updates, as the platform won't technically meet the software's requirements.

In the post, Microsoft named upcoming platforms from the big three CPU makers - Intel, AMD, and Qualcomm, to which the company will provide enterprise support only for Windows 10. These include the 7th generation Core "Kaby Lake" processors from Intel, "Bristol Ridge" processors from AMD, and the "8996" SoC from Qualcomm. Machines running a select few models of Core "Skylake" processors will receive enterprise support, but only till 17th July, 2017. After this date, only the most critical security updates will be released for the OS running on those platforms.Sources: Microsoft, Engadget

AMD Announces Opteron A1100 Series 64-bit ARM Processors for the Datacenter

AMD marks a major step towards delivering choice and innovation in the data center with the launch of the AMD Opteron A1100 System-on-Chip (SoC), formerly codenamed "Seattle". Jointly with its software and hardware partners, AMD is accelerating time-to-deployment of ARM-based systems and driving forward ecosystem support for ARM in the data center.

"The ecosystem for ARM in the data center is approaching an inflection point and the addition of AMD's high-performance processor is another strong step forward for customers looking for a data center-class ARM solution," said Scott Aylor, corporate vice president and general manager, Enterprise Solutions, AMD. "The macro trend of convergence between networking, storage and servers is an important catalyst in this evolution. Customers now have access to 64-bit ARM processors from the only silicon provider that also has decades of experience delivering professional enterprise and embedded products."

Intel Completes Acquisition of Altera

Intel Corporation today announced that it has completed the acquisition of Altera Corporation ("Altera"), a leading provider of field-programmable gate array (FPGA) technology. The acquisition complements Intel's leading-edge product portfolio and enables new classes of products in the high-growth data center and Internet of Things (IoT) market segments.

"Altera is now part of Intel, and together we will make the next generation of semiconductors not only better but able to do more," said Brian Krzanich, Intel CEO. "We will apply Moore's Law to grow today's FPGA business, and we'll invent new products that make amazing experiences of the future possible - experiences like autonomous driving and machine learning."

Altera will operate as a new Intel business unit called the Programmable Solutions Group (PSG), led by Altera veteran Dan McNamara. Intel is committed to a smooth transition for Altera customers and will continue the support and future product development of Altera's many products, including FPGA, ARM-based SoC and power products. In addition to strengthening the existing FPGA business, PSG will work closely with Intel's Data Center Group and IoT Group to deliver the next generation of highly customized, integrated products and solutions.

NVIDIA Stares at Sales Ban as US-ITC Rules in Samsung's Favor in Patent Dispute

The ongoing patent dispute between NVIDIA and Samsung over mobile SoC patents, in which NVIDIA fired the first shot, is not going to well for team-green. With Samsung counter-suing NVIDIA over infringing its own bouquet of patents, NVIDIA is staring at a possible sales ban. A United States International Trade Commission (US-ITC) judge held that NVIDIA is violating at least three Samsung patents.

This decision is due for review in a few months from now. If upheld, NVIDIA is staring at a sales-ban on all products violating the three Samsung patents. Luckily for NVIDIA, one of the three patents expires in 2016, and the sales-ban could last a few months, at best. NVIDIA predictably stated that it is disappointed in the decision. Samsung hasn't commented.

Source: Bloomberg

HSA Announces Publication of New Guide to Heterogeneous System Architecture

The Heterogeneous System Architecture (HSA) Foundation today announced publication of Heterogeneous System Architecture: A New Compute Platform Infrastructure (1st Edition), edited by Dr. Wen-Mei Hwu. The book, published by Elsevier Publishing (found here: here), offers a practical guide to understanding HSA, a standardized platform design that unlocks the performance and power efficiency of parallel computing engines found in most modern electronic devices.

"Heterogeneous computing is a key enabler of the next generation of compute environments, wherein entire systems will interconnect autonomously and in real time," said HSA Foundation President Dr. John Glossner. "Developers who are skilled in the use of this platform will have the upper hand in terms of design time, IP portability, power efficiency and performance."

To support these developers, the HSA Foundation working groups are rapidly standardizing tools and APIs for debug and profiling, creating guidelines for incorporating IP from multiple vendors into the same SoC, and much more. The Foundation released the v1.0 specification in March, and soon thereafter, companies including AMD, ARM, Imagination Technologies and MediaTek previewed their plans for rolling out the world's first products based on HSA.

Micron XTRMFlash Memory Breaks Through NOR Flash Speed Limits

Micron Technology, Inc., today announced XTRMFlash memory, a faster NOR flash solution designed to revolutionize the way the electronics industry develops systems to meet the demand for "instant-on" performance and fast system responsiveness in automotive, industrial and consumer applications. Utilizing its new, low pin count interface that uses as little as 11 active signals, Micron's XTRMFlash memory outperforms other industry NOR Flash while also significantly reducing pin counts by as much as 75 percent from those found in Parallel NOR flash available in the market today. XTRMFlash memory provides system designers the ideal and fastest possible direct code execution NOR flash memory solution available to enable high-performance, yet small form-factor designs.

"Micron is committed to continued innovation in NOR flash memory," said Richard De Caro, director of NOR Flash for Micron's Embedded Business Unit. "We worked closely with our ecosystem partners and customers to understand their next-generation requirements for high-performance memory, and we have developed XTRMFlash memory as a result. XTRMFlash memory and the XTRMFlash interface have the potential to dramatically change the paradigm of the existing memory landscape by enabling a new category of high-performance and low pin count memory devices that can also extend beyond NOR Flash."

AMD Reports 2015 Third Quarter Results

AMD today announced revenue for the third quarter of 2015 of $1.06 billion, operating loss of $158 million, and net loss of $197 million, or $0.25 per share. Non-GAAP operating loss was $97 million and non-GAAP net loss was $136 million, or $0.17 per share. GAAP and non-GAAP results include a $65 million inventory write-down and the impact of this charge to loss per share was $0.08.

"AMD delivered double-digit percentage sequential revenue growth in both of our segments in the third quarter," said Dr. Lisa Su, AMD president and CEO. "We continue to take targeted actions to improve long-term financial performance, build great products and simplify our business model. The formation of a joint venture of our back-end manufacturing assets is a significant step towards achieving these goals and strengthening our balance sheet."

Qualcomm Announces its First Socketed Enterprise CPU

Qualcomm, which holds a ton of ARM SoC patents, and put them to good use with its Snapdragon line of SoCs for smartphones, tablets, and convertible notebooks, is foraying into enterprise computing market. The company is ready with its first prototype of a 24-core high-performance CPU based on the 64-bit ARM machine architecture. ARM-based processors are picking up momentum in the server and micro-server markets owning to their low cost, low cooling requirements, and high energy-efficiency; and Qualcomm wants a slice of that pie. Most enterprise Linux and FreeBSD distributors have versions of their server operating systems for the 64-bit ARM architecture, as do most popular server software providers.

The prototype 24-core CPU is socketed, and ships in a large land-grid array (LGA) package, much like Intel's Xeon chips. The first production chips will have a lot more than 24 CPU cores, said Qualcomm senior vice president Anand Chandrasekhar. As a proof of concept, Qualcomm assembled three server blades using these chips, which were running Linux with a KVM hypervisor, streaming HD video to a PC using a LAMP stack (Linux + Apache + MySQL + PHP) built with OpenStack. Qualcomm's target consumers are big Internet companies like Google and Facebook, which purchase hundreds of thousands of CPUs each year to cope with growing user- and content-traffic.


Source: PC World

NVIDIA Loses Patent Infringement Claim Lawsuit to Samsung

The United States Federal Trade Commission (US-FTC) has found that Samsung Electronics did not infringe upon patents held by NVIDIA. In a ruling made by Judge Thomas Pender on Friday (09/10), it's held that Samsung did not infringe two out of three NVIDIA-claimed patents, it did infringe upon a third one, but that patent is invalid because it's not a new invention compared to previously known patents.

Samsung manufactures the Exynos brand ARM SoCs for its own smartphones, which embed a graphics core that NVIDIA claims is based on patent infringing technology. NVIDIA, which claims that it invented the first GPU and released it in 1999, accused Samsung and Qualcomm of using its patents on graphics chip technology without permission. The company claims that both Samsung Exynos and Qualcomm Snapdragon (which make up a majority of Android device chips), breach its IPR. Its claims don't seem to hold water with the US-FTC. "We remain confident in our case," commented NVIDIA spokesperson Robert Sherbin to Reuters. The ruling will be reviewed by the full bench of the commission in February 2016.Source: Reuters

AMD Announces PRO A-Series Processors for Business

AMD today introduced its most powerful line of AMD PRO A-Series mobile and desktop processors (formerly codenamed "Carrizo PRO" and "Godavari PRO") to deliver exceptional value and performance for today's challenging workloads. The new line of AMD PRO A-Series processors offer enhanced performance, reliability and opportunity to business users and IT decision makers and are designed for the future with Microsoft Windows 10. With its AMD PRO mobile processors, AMD powers some of the first-to-market Windows 10-enabled commercial notebook systems for those looking to upgrade.

"The innovative architecture of new AMD PRO processors delivers compelling performance to stay ahead of the evolving demands of business today," said Jim Anderson, senior vice president and general manager, computing and graphics, AMD. "Going PRO with AMD means unmatched dependability with platform stability, processor longevity and an opportunity for richer system configurations. AMD gives its customers choice and affordability to meet specific business needs, without compromising the ability to manage and maintain a secure, stable, and reliable environment."

QNAP Launches AMD-powered, Quad-core 2.0GHz, 10GbE TS-x63U Series NAS

QNAP Systems, Inc. today announced the new business-class AMD-powered quad-core TS-x63U series NAS; available in 4, 8 and 12-bay models with single and redundant power supply options. The TS-x63U series provides 10GbE network connectivity with its single-port SFP+ network adapter, and supports bridging 1GbE devices to a 10GbE network with its four built-in GbE interfaces. Coupled with an AES-NI hardware-accelerated encryption engine, SSD cache support, and flexible scalability; the TS-x63U series is ideal for SMBs looking for backup, restoration, virtualization storage, private cloud, and to future-proof their IT infrastructure for 10GbE networks.

The TS-x63U series is powered by an advanced 64-bit AMD Embedded G-Series quad-core 2.0GHz SoC processor with 4GB DDR3L RAM (upgradable to 16GB) and features four 1GbE LAN ports, delivering high speeds of up to 1,090 MB/s sequential read throughput with10GbE configuration for multi-tasking business applications. The AES-NI hardware encryption engine allows unmatched sequential read performance exceeding 780 MB/s with AES 256-bit full NAS volume encryption, with the new shared folder encryption supported, accelerating system performance and security while ensuring the safety of sensitive data.

GIGABYTE Unveils BRIX Mini-PC Powered by Celeron N3000 "Braswell" SoC

GIGABYTE unveiled its first BRIX mini-PC that's powered by Intel Celeron N3000 "Braswell" SoC. The 14 nm chip embeds a dual-core CPU based on the "Airmont" micro-architecture, clocked at 1.04 GHz, with a Turbo Boost frequency of 2.08 GHz; and featuring HyperThreading. Also embedded are 1 MB of cache, an 8th generation Intel IGP with 12 execution units, and a dual-channel DDR3L-1600 IMC.

The BRIX measures 56.1 mm x 107.6 mm x 114.4 mm, and is a barebones unit, you'll have to add your own memory and storage. Despite the chip's dual-channel memory interface, BRIX only offers one DDR3L SO-DIMM slot (max 8 GB). Storage connectivity includes an M.2 slot with both PCIe 2.0 x2 and SATA 6 Gb/s wiring, and a 9 mm thick 2.5-inch drive bay with SATA 6 Gb/s. A micro-SD slot is also offered. Network connectivity includes gigabit Ethernet. Display outputs include HDMI and D-Sub. 2-channel HD audio, and four USB 3.0 ports make for the rest of it.

Source: FanlessTech

ASUS Intros N3150-C and N3050-C Celeron "Braswell" Mini-ITX Motherboards

ASUS introduced the N3150-C and N3050-C, two mini-ITX motherboards based on the Intel Celeron quad-core N3150 and N3050 SoCs, respectively. The two SoCs are based on the "Braswell" silicon, embedding quad-core or dual-core CPUs based on the 64-bit x86 "Airmont" CPU micro-architecture. The dual-core N3050 features HyperThreading, enabling four logical CPUs, while the quad-core N3150 lacks it. Both chips also embed dual-channel DDR3L IMCs, supporting up to 8 GB of memory; 8th generation Intel graphics with 12 execution units, and TDPs under 6W.

The N3150-C and N3050-C from ASUS feature a common PCB design, with 24+4 pin power inputs, two full-size DDR3 DIMM slots, a single open-ended PCI-Express 2.0 x4 expansion slot, an mPCIe slot, two each of SATA 6 Gb/s, USB 3.0, and USB 2.0 ports, 6-channel HD audio, gigabit Ethernet, HDMI and D-Sub display outputs; and legacy connectivity that includes two PS/2 ports, and a serial (RS-232) port.

Source: FanlessTech

AMD Embedded G-Series SoC Powers New Line of Samsung All-in-One Thin Client

AMD today announced that Samsung Electronics Co., Ltd. selected the AMD Embedded G-Series SoC (system on chip) for a new line of all-in-one cloud monitors featuring integrated thin client technology. The Samsung 21.5-inch TC222W and 23.6-inch TC242W are powered by AMD Embedded G-Series SoCs that couple high-performance compute and graphics capability in a highly integrated, low power design. The AMD SoC improves data transfer rates and saves space on the motherboard, which makes it a perfect fit for the compact form factors required by thin clients.

"Thin client is a key market for AMD Embedded Solutions and we're thrilled that Samsung has chosen to partner with us for their newest line of products," said Scott Aylor, vice president and general manager, Embedded Solutions, AMD. "The collaboration with Samsung builds on the number one position AMD holds in a market that continues to grow, becoming more and more prevalent in commercial installations that serve a broad range of markets."

Planned availability starting in Q3 2015, the Windows-supported Samsung cloud monitors will provide customers with expanded choice, capability and configuration flexibility. Complete with Samsung's professional-grade display panel, the cloud monitors will create a superior user experience through easy connectivity and high-quality reliability. As a superior option for effective desktop virtualization, Samsung's thin-client monitors will also enable improved productivity and optimized end-to-end performance.

ASUS Unveils N3150M-E Motherboard with Celeron "Braswell" SoC

ASUS unveiled a value micro-ATX motherboard based on the new Intel Celeron N3150 SoC "Braswell." This 14 nanometer chip embeds a quad-core CPU based on the "Airmont" architecture, an integrated GPU with 12 execution units, and a dual-channel DDR3L-1600 memory controller, apart from platform core-logic. The board draws power from a 24-pin ATX and 4-pin CPU power connectors.

The SoC, with its 6W rated TDP, is cooled by a fan-less heatsink. The SoC is wired to two DDR3 DIMM slots, a PCI-Express 2.0 x16 slot, and two PCI-Express 2.0 x1 slots, apart from the board's I/O. Storage connectivity includes two SATA 6 Gb/s ports. Display outputs include HDMI and D-Sub. Gigabit Ethernet, four USB 3.0 ports, and onboard audio with audio-grade capacitors and ground-layer isolation; make for the rest of its modern connectivity.

AMD to Skip 20 nm, Jump Straight to 14 nm with "Arctic Islands" GPU Family

AMD's next-generation GPU family, which it plans to launch some time in 2016, codenamed "Arctic Islands," will see the company skip the 20 nanometer silicon fab process from 28 nm, and jump straight to 14 nm FinFET. Whether the company will stick with TSMC, which is seeing crippling hurdles to implement its 20 nm node for GPU vendors; or hire a new fab, remains to be seen. Intel and Samsung are currently the only fabs with 14 nm nodes that have attained production capacity. Intel is manufacturing its Core "Broadwell" CPUs, while Samsung is manufacturing its Exynos 7 (refresh) SoCs. Intel's joint-venture with Micron Technology, IMFlash, is manufacturing NAND flash chips on 14 nm.

Named after islands in the Arctic circle, and a possible hint at the low TDP of the chips, benefiting from 14 nm, "Arctic Islands" will be led by "Greenland," a large GPU that will implement the company's most advanced stream processor design, and implement HBM2 memory, which offers 57% higher memory bandwidth at just 48% the power consumption of GDDR5. Korean memory manufacturer SK Hynix is ready with its HBM2 chip designs.Source: Expreview

Thecus Announces New Zero-Crash 5-Bay NAS, the N5810PRO

Thecus today announced its new zero-crash 5-bay NAS, the N5810PRO. Embedded with an Intel Celeron processor J1900 Quad Core 2.0 GHz SoC and Mini-UPS battery, the Thecus N5810PRO empowers users with lightning fast performance while providing impenetrable data integrity.

"In today's ever-evolving digital environment, businesses require robust storage solutions that provide premium performance with piece of mind that their data will always be secure," said Florence Shih, CEO of Thecus Technology. "The N5810PRO is designed to equip users with a comprehensive set of applications that will optimize their business environment while addressing the needs for performance and security."

SUPoX Outs N2940-MX7 Motherboard

SUPoX (formerly known as EPoX) is still alive and kicking in the Chinese domestic market. The company came up with an unusual new silent motherboard based on the Intel Celeron N2940 "Bay Trail" SoC, the N2940-MX7. Built in the small Micro-ATX form-factor, this board integrates the Celeron N2940 single-chip solution from Intel, featuring 4 CPU cores running at up to 2.24 GHz, and cools the 7.5W TDP chip with a passive heatsink.

The N2940 chip is wired to two full-size DDR3 DIMM slots, supporting up to 8 GB of dual-channel DDR3L-1333 memory. Expansion includes two PCI-Express 2.0 x1, and one PCI-Express 2.0 x16. Storage connectivity includes two SATA 3 Gb/s ports. Display connectivity includes one each of DVI and D-Sub. Other connectivity includes one USB 3.0 port, six USB 2.0 ports (two on the rear panel, four by headers), six channel HD audio with ground-layer isolation, gigabit Ethernet, and legacy PS/2 connectors. You get LPT (parallel) and COM (serial) ports by headers.


Source: FanlessTech

MSI Launches New All-in-One PCs based on AMD Beema Platform

MSI is excited to announce the launch of three new All-in-One PC's equipped with AMD's latest energy efficient Beema APU platform. The Adora20 5M and AE200 5M include a 19.5" anti-glare display featuring MSI Anti-Flicker & Less Blue Light Technology, to effectively reduce eyestrain and eye fatigue during long working hours. The new AE220 5M features a similar display with a 21.5" size and a compact design which blends seamlessly into modern interiors. With an ultra-slim casing (only 23mm at its thinnest point), the MSI Adora20 5M brings a new level of perfect home PC experience.

The new All-in-One PC's feature the latest E2-6110 and A4-6210 Quad Core APUs of AMD's Beema platform with a 28nm production process and SoC (System on Chip) APU processor technology. Evolved from AMD's previous Kabini platform design, the latest AMD Beema platform provides higher performance while power consumption is reduced up to 20%. The AMD Beema APUs are fitted with new AMD Radeon R2 and R3 built-in graphics, increasing exceptional rendering performance by 10% for a big boost in multimedia and 3D performance compared to previous generations. Users can now enjoy high performance and quality from a discrete graphics card without the need for a dedicated graphics solution.

AMD to Power Next-Generation NES

Nintendo is working on a next-generation gaming console to succeed even the fairly recent Wii U. The company is reacting to the plummeting competitiveness of its current console to the likes of PlayStation 4 and the Xbox One. Reports suggest that Nintendo would make a course-correction on the direction in which it took its game console business with the Wii, and could come up with a system that's focused on serious gaming, as much as it retains its original "fun" quotient. In that manner, the console could be more NES-like, than Wii-like.

Nintendo could ring up AMD for the chip that will drive its next console. It's not clear if AMD will supply a fully-integrated SoC that combines its own x86 CPU cores with its GCN graphics processor; or simply supply the GPU component for an SoC that combines components from various other manufacturers. The Wii U uses IBM's CPU cores, with AMD's GPU, combined onto a single chip. There's no word on when Nintendo plans to announce the new console, but one can expect a lot more news in 2015-16.Source: Expreview

AMD Mobile "Carrizo" Family of APUs Arrive in 2015

AMD (NYSE: AMD) today at its Future of Compute event announced the addition of its first high performance system-on-a-chip (SoC), codenamed "Carrizo", and a mainstream SoC codenamed "Carrizo-L" as part of the company's 2015 AMD Mobile APU family roadmap. In collaboration with hardware and software partners, these new 2015 AMD Mobile APUs are designed as complete solutions for gaming, productivity applications, and ultra high-definition 4K experiences. With support for Microsoft DirectX 12, OpenCL 2.0, AMD's Mantle API, AMD FreeSync and support for Microsoft's upcoming Windows 10 operating system, the 2015 AMD Mobile APU family enables the experiences consumers expect.

"We continue to innovate and build upon our existing IP to deliver great products for our customers," said John Byrne, senior vice president and general manager, Computing and Graphics business group, AMD. "AMD's commitment to graphics and compute performance, as expressed by our goal to improve APU energy efficiency 25x by 2020, combines with the latest industry standards and fresh innovation to drive the design of the 2015 AMD Mobile APU family. We are excited about the experiences these new APUs will bring and look forward to sharing more details in the first half of next year."

AMD Announces Major Technology Partnerships at Future of Compute Event

AMD today at its Future of Compute event announced the introduction of the consumer electronic industry's first-ever ultra high-definition (UHD) monitors to feature its innovative, open-standards based FreeSync technology. Samsung Electronics Co., Ltd., plans to launch the screen synching technology around the world in March 2015, starting with the Samsung UD590 (23.6-inch and 28-inch models) and UE850 (23.6-inch, 27-inch and 31.5-inch models), and eventually across all of Samsung's UHD lineups. FreeSync will enable dynamic refresh rates synchronized to the frame rate of AMD Radeon graphics cards and APUs to maximally reduce input latency and reduce or fully eliminate visual defects during gaming and video playback.

"We are very pleased to adopt AMD FreeSync technology to our 2015 Samsung Electronics Visual Display division's UHD monitor roadmap, which fully supports open standards," said Joe Chan, Vice President of Samsung Electronics Southeast Asia Headquarters. "With this technology, we believe users including gamers will be able to enjoy their videos and games to be played with smoother frame display without stuttering or tearing on their monitors."

TSMC 16FinFET Plus Process Achieves Risk Production Milestone

TSMC today announced its 16-nanometer FinFET Plus (16FF+) process is now in risk production. This enhanced version of TSMC's 16FF process operates 40% faster than the company's planar 20-nanometer system-on-chip (20SoC) process, or consumes 50% less power at the same speed. It offers customers a new level of performance and power optimization targeted at the next generation of high-end mobile, computing, networking, and consumer applications.

TSMC's 16nm process offers an extended scaling of advanced SoC designs and is verified to reach speeds of 2.3GHz with ARM's "big" Cortex-A57 in high-speed applications while consuming as little as 75mW with the "LITTLE" Cortex-A53 in low-power applications. It is making excellent progress in yield learning, and has achieved the best technology maturity at the same corresponding stage as compared to all TSMC's previous nodes.

TSMC and ARM Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process

ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early pathfinding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.

"ARM and TSMC are industry leaders in our respective fields and collectively ensure the availability of leading-edge solutions for ARM-based SoCs through our deep and long-term collaboration," said Pete Hutton, executive vice president and president, product groups, ARM. "Our mutual commitment to providing industry leading solutions drives us to work together early in the development cycle to optimize both the processor and the process node. This joint optimization enables ARM silicon partners to design, tape-out and bring their products to market faster."
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