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GIGABYTE Unveils BRIX Mini-PC Powered by Celeron N3000 "Braswell" SoC

GIGABYTE unveiled its first BRIX mini-PC that's powered by Intel Celeron N3000 "Braswell" SoC. The 14 nm chip embeds a dual-core CPU based on the "Airmont" micro-architecture, clocked at 1.04 GHz, with a Turbo Boost frequency of 2.08 GHz; and featuring HyperThreading. Also embedded are 1 MB of cache, an 8th generation Intel IGP with 12 execution units, and a dual-channel DDR3L-1600 IMC.

The BRIX measures 56.1 mm x 107.6 mm x 114.4 mm, and is a barebones unit, you'll have to add your own memory and storage. Despite the chip's dual-channel memory interface, BRIX only offers one DDR3L SO-DIMM slot (max 8 GB). Storage connectivity includes an M.2 slot with both PCIe 2.0 x2 and SATA 6 Gb/s wiring, and a 9 mm thick 2.5-inch drive bay with SATA 6 Gb/s. A micro-SD slot is also offered. Network connectivity includes gigabit Ethernet. Display outputs include HDMI and D-Sub. 2-channel HD audio, and four USB 3.0 ports make for the rest of it.

Source: FanlessTech

ASUS Intros N3150-C and N3050-C Celeron "Braswell" Mini-ITX Motherboards

ASUS introduced the N3150-C and N3050-C, two mini-ITX motherboards based on the Intel Celeron quad-core N3150 and N3050 SoCs, respectively. The two SoCs are based on the "Braswell" silicon, embedding quad-core or dual-core CPUs based on the 64-bit x86 "Airmont" CPU micro-architecture. The dual-core N3050 features HyperThreading, enabling four logical CPUs, while the quad-core N3150 lacks it. Both chips also embed dual-channel DDR3L IMCs, supporting up to 8 GB of memory; 8th generation Intel graphics with 12 execution units, and TDPs under 6W.

The N3150-C and N3050-C from ASUS feature a common PCB design, with 24+4 pin power inputs, two full-size DDR3 DIMM slots, a single open-ended PCI-Express 2.0 x4 expansion slot, an mPCIe slot, two each of SATA 6 Gb/s, USB 3.0, and USB 2.0 ports, 6-channel HD audio, gigabit Ethernet, HDMI and D-Sub display outputs; and legacy connectivity that includes two PS/2 ports, and a serial (RS-232) port.

Source: FanlessTech

AMD Embedded G-Series SoC Powers New Line of Samsung All-in-One Thin Client

AMD today announced that Samsung Electronics Co., Ltd. selected the AMD Embedded G-Series SoC (system on chip) for a new line of all-in-one cloud monitors featuring integrated thin client technology. The Samsung 21.5-inch TC222W and 23.6-inch TC242W are powered by AMD Embedded G-Series SoCs that couple high-performance compute and graphics capability in a highly integrated, low power design. The AMD SoC improves data transfer rates and saves space on the motherboard, which makes it a perfect fit for the compact form factors required by thin clients.

"Thin client is a key market for AMD Embedded Solutions and we're thrilled that Samsung has chosen to partner with us for their newest line of products," said Scott Aylor, vice president and general manager, Embedded Solutions, AMD. "The collaboration with Samsung builds on the number one position AMD holds in a market that continues to grow, becoming more and more prevalent in commercial installations that serve a broad range of markets."

Planned availability starting in Q3 2015, the Windows-supported Samsung cloud monitors will provide customers with expanded choice, capability and configuration flexibility. Complete with Samsung's professional-grade display panel, the cloud monitors will create a superior user experience through easy connectivity and high-quality reliability. As a superior option for effective desktop virtualization, Samsung's thin-client monitors will also enable improved productivity and optimized end-to-end performance.

ASUS Unveils N3150M-E Motherboard with Celeron "Braswell" SoC

ASUS unveiled a value micro-ATX motherboard based on the new Intel Celeron N3150 SoC "Braswell." This 14 nanometer chip embeds a quad-core CPU based on the "Airmont" architecture, an integrated GPU with 12 execution units, and a dual-channel DDR3L-1600 memory controller, apart from platform core-logic. The board draws power from a 24-pin ATX and 4-pin CPU power connectors.

The SoC, with its 6W rated TDP, is cooled by a fan-less heatsink. The SoC is wired to two DDR3 DIMM slots, a PCI-Express 2.0 x16 slot, and two PCI-Express 2.0 x1 slots, apart from the board's I/O. Storage connectivity includes two SATA 6 Gb/s ports. Display outputs include HDMI and D-Sub. Gigabit Ethernet, four USB 3.0 ports, and onboard audio with audio-grade capacitors and ground-layer isolation; make for the rest of its modern connectivity.

AMD to Skip 20 nm, Jump Straight to 14 nm with "Arctic Islands" GPU Family

AMD's next-generation GPU family, which it plans to launch some time in 2016, codenamed "Arctic Islands," will see the company skip the 20 nanometer silicon fab process from 28 nm, and jump straight to 14 nm FinFET. Whether the company will stick with TSMC, which is seeing crippling hurdles to implement its 20 nm node for GPU vendors; or hire a new fab, remains to be seen. Intel and Samsung are currently the only fabs with 14 nm nodes that have attained production capacity. Intel is manufacturing its Core "Broadwell" CPUs, while Samsung is manufacturing its Exynos 7 (refresh) SoCs. Intel's joint-venture with Micron Technology, IMFlash, is manufacturing NAND flash chips on 14 nm.

Named after islands in the Arctic circle, and a possible hint at the low TDP of the chips, benefiting from 14 nm, "Arctic Islands" will be led by "Greenland," a large GPU that will implement the company's most advanced stream processor design, and implement HBM2 memory, which offers 57% higher memory bandwidth at just 48% the power consumption of GDDR5. Korean memory manufacturer SK Hynix is ready with its HBM2 chip designs.Source: Expreview

Thecus Announces New Zero-Crash 5-Bay NAS, the N5810PRO

Thecus today announced its new zero-crash 5-bay NAS, the N5810PRO. Embedded with an Intel Celeron processor J1900 Quad Core 2.0 GHz SoC and Mini-UPS battery, the Thecus N5810PRO empowers users with lightning fast performance while providing impenetrable data integrity.

"In today's ever-evolving digital environment, businesses require robust storage solutions that provide premium performance with piece of mind that their data will always be secure," said Florence Shih, CEO of Thecus Technology. "The N5810PRO is designed to equip users with a comprehensive set of applications that will optimize their business environment while addressing the needs for performance and security."

SUPoX Outs N2940-MX7 Motherboard

SUPoX (formerly known as EPoX) is still alive and kicking in the Chinese domestic market. The company came up with an unusual new silent motherboard based on the Intel Celeron N2940 "Bay Trail" SoC, the N2940-MX7. Built in the small Micro-ATX form-factor, this board integrates the Celeron N2940 single-chip solution from Intel, featuring 4 CPU cores running at up to 2.24 GHz, and cools the 7.5W TDP chip with a passive heatsink.

The N2940 chip is wired to two full-size DDR3 DIMM slots, supporting up to 8 GB of dual-channel DDR3L-1333 memory. Expansion includes two PCI-Express 2.0 x1, and one PCI-Express 2.0 x16. Storage connectivity includes two SATA 3 Gb/s ports. Display connectivity includes one each of DVI and D-Sub. Other connectivity includes one USB 3.0 port, six USB 2.0 ports (two on the rear panel, four by headers), six channel HD audio with ground-layer isolation, gigabit Ethernet, and legacy PS/2 connectors. You get LPT (parallel) and COM (serial) ports by headers.


Source: FanlessTech

MSI Launches New All-in-One PCs based on AMD Beema Platform

MSI is excited to announce the launch of three new All-in-One PC's equipped with AMD's latest energy efficient Beema APU platform. The Adora20 5M and AE200 5M include a 19.5" anti-glare display featuring MSI Anti-Flicker & Less Blue Light Technology, to effectively reduce eyestrain and eye fatigue during long working hours. The new AE220 5M features a similar display with a 21.5" size and a compact design which blends seamlessly into modern interiors. With an ultra-slim casing (only 23mm at its thinnest point), the MSI Adora20 5M brings a new level of perfect home PC experience.

The new All-in-One PC's feature the latest E2-6110 and A4-6210 Quad Core APUs of AMD's Beema platform with a 28nm production process and SoC (System on Chip) APU processor technology. Evolved from AMD's previous Kabini platform design, the latest AMD Beema platform provides higher performance while power consumption is reduced up to 20%. The AMD Beema APUs are fitted with new AMD Radeon R2 and R3 built-in graphics, increasing exceptional rendering performance by 10% for a big boost in multimedia and 3D performance compared to previous generations. Users can now enjoy high performance and quality from a discrete graphics card without the need for a dedicated graphics solution.

AMD to Power Next-Generation NES

Nintendo is working on a next-generation gaming console to succeed even the fairly recent Wii U. The company is reacting to the plummeting competitiveness of its current console to the likes of PlayStation 4 and the Xbox One. Reports suggest that Nintendo would make a course-correction on the direction in which it took its game console business with the Wii, and could come up with a system that's focused on serious gaming, as much as it retains its original "fun" quotient. In that manner, the console could be more NES-like, than Wii-like.

Nintendo could ring up AMD for the chip that will drive its next console. It's not clear if AMD will supply a fully-integrated SoC that combines its own x86 CPU cores with its GCN graphics processor; or simply supply the GPU component for an SoC that combines components from various other manufacturers. The Wii U uses IBM's CPU cores, with AMD's GPU, combined onto a single chip. There's no word on when Nintendo plans to announce the new console, but one can expect a lot more news in 2015-16.Source: Expreview

AMD Mobile "Carrizo" Family of APUs Arrive in 2015

AMD (NYSE: AMD) today at its Future of Compute event announced the addition of its first high performance system-on-a-chip (SoC), codenamed "Carrizo", and a mainstream SoC codenamed "Carrizo-L" as part of the company's 2015 AMD Mobile APU family roadmap. In collaboration with hardware and software partners, these new 2015 AMD Mobile APUs are designed as complete solutions for gaming, productivity applications, and ultra high-definition 4K experiences. With support for Microsoft DirectX 12, OpenCL 2.0, AMD's Mantle API, AMD FreeSync and support for Microsoft's upcoming Windows 10 operating system, the 2015 AMD Mobile APU family enables the experiences consumers expect.

"We continue to innovate and build upon our existing IP to deliver great products for our customers," said John Byrne, senior vice president and general manager, Computing and Graphics business group, AMD. "AMD's commitment to graphics and compute performance, as expressed by our goal to improve APU energy efficiency 25x by 2020, combines with the latest industry standards and fresh innovation to drive the design of the 2015 AMD Mobile APU family. We are excited about the experiences these new APUs will bring and look forward to sharing more details in the first half of next year."

AMD Announces Major Technology Partnerships at Future of Compute Event

AMD today at its Future of Compute event announced the introduction of the consumer electronic industry's first-ever ultra high-definition (UHD) monitors to feature its innovative, open-standards based FreeSync technology. Samsung Electronics Co., Ltd., plans to launch the screen synching technology around the world in March 2015, starting with the Samsung UD590 (23.6-inch and 28-inch models) and UE850 (23.6-inch, 27-inch and 31.5-inch models), and eventually across all of Samsung's UHD lineups. FreeSync will enable dynamic refresh rates synchronized to the frame rate of AMD Radeon graphics cards and APUs to maximally reduce input latency and reduce or fully eliminate visual defects during gaming and video playback.

"We are very pleased to adopt AMD FreeSync technology to our 2015 Samsung Electronics Visual Display division's UHD monitor roadmap, which fully supports open standards," said Joe Chan, Vice President of Samsung Electronics Southeast Asia Headquarters. "With this technology, we believe users including gamers will be able to enjoy their videos and games to be played with smoother frame display without stuttering or tearing on their monitors."

TSMC 16FinFET Plus Process Achieves Risk Production Milestone

TSMC today announced its 16-nanometer FinFET Plus (16FF+) process is now in risk production. This enhanced version of TSMC's 16FF process operates 40% faster than the company's planar 20-nanometer system-on-chip (20SoC) process, or consumes 50% less power at the same speed. It offers customers a new level of performance and power optimization targeted at the next generation of high-end mobile, computing, networking, and consumer applications.

TSMC's 16nm process offers an extended scaling of advanced SoC designs and is verified to reach speeds of 2.3GHz with ARM's "big" Cortex-A57 in high-speed applications while consuming as little as 75mW with the "LITTLE" Cortex-A53 in low-power applications. It is making excellent progress in yield learning, and has achieved the best technology maturity at the same corresponding stage as compared to all TSMC's previous nodes.

TSMC and ARM Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process

ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early pathfinding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.

"ARM and TSMC are industry leaders in our respective fields and collectively ensure the availability of leading-edge solutions for ARM-based SoCs through our deep and long-term collaboration," said Pete Hutton, executive vice president and president, product groups, ARM. "Our mutual commitment to providing industry leading solutions drives us to work together early in the development cycle to optimize both the processor and the process node. This joint optimization enables ARM silicon partners to design, tape-out and bring their products to market faster."

AMD Demos First Network Function Virtualization on 64-Bit AMD and ARM Technology

AMD today demonstrated the first network function virtualization (NFV) solution on AMD's 64-bit ARM-based SoC and announced that it is now sampling to AMD's embedded customers. The NFV demonstration is powered by a 64-bit ARM-based AMD Embedded R-Series SoC, codenamed "Hierofalcon," supported with technology from two key ecosystem partners -- Aricent for the networking software stack and Mentor Graphics for embedded Linux and tools. NFV is an innovative solution that simplifies deployment and management for network and telecommunications service providers with a fully virtualized communications infrastructure that helps maximize performance, while working to reduce costs.

At ARM TechCon, AMD specifically showcased the capabilities of an ARM-based NFV solution, virtualizing the functionality of a packet data network gateway, serving gateway, and a mobility management entity. In addition to virtualizing hardware components, AMD showcased a live traffic migration between the ARM-based AMD Embedded R-Series SoC and the x86-based second generation AMD R-Series APU. AMD's ARM-based NFV solution will be especially valuable for telecommunications network infrastructure providers interested in a flexible software-defined networking (SDN) implementation to manage networking services with configurable hardware to help reduce complexity and cost. NFV is the abstraction of numerous network devices such as routers and gateways, to enable relocation of network functions from dedicated hardware appliances to generic servers. With NFV, much of the intelligence currently built into proprietary, specialized hardware is accomplished with software running on general purpose hardware. The resulting solution is a fully virtualized communications infrastructure -- including virtual servers, storage and networks -- that simplifies deployment and management for network and telecommunications service providers. AMD is paving the way for both new and established service providers to design and deploy either x86 or ARM-based NFV infrastructure which meets their performance, cost and complexity requirements.

TSMC Delivers First Fully Functional 16FinFET Networking Processor

TSMC today announced that its collaboration with HiSilicon Technologies Co, Ltd. has successfully produced the foundry segment's first fully functional ARM-based networking processor withFinFET technology. This milestone is a strong testimonial to deep collaboration between the two companies and TSMC's commitment to providing industry-leading technology to meet the increasing customer demand for the next generation of high-performance, energy-efficient devices.

TSMC's 16FinFET process promises impressive speed and power improvements as well as leakage reduction. All of these advantages overcome challenges that have become critical barriers to further scaling of advanced SoC technology. It has twice the gate density of TSMC's 28HPM process, and operates more than 40% faster at the same total power, or reduces total power over 60% at the same speed.

BIOSTAR Announces the J1800TH Mini ITX System-On-Chip Solution

BIOSTAR has announced the J1800TH, a mini ITX mainboard with CPU on board, (known as System on a Chip or SoC). These boards are centered around being small and efficient using a small form factor with an embedded CPU, having low power consumption, and being fan-less. They are perfect for all sorts of various industrial applications.

The BIOSTAR J1800TH is the latest in all-in-one board that takes advantage of the optimized performance of Intel's Bay Trail chipset by delivering a new generation of technology with value-added features and easy integration.

TSMC May Lose 16 nm and 14 nm Market Share to Competitors in 2015: Chairman

TSMC may lose out on orders to competing fabs on the 16 nanometer (nm) and 14 nm nodes, in terms of market share, in 2015, according to company chairman Morris Chang. Chips built on the 16 nm node will amount to single-digit percentages of the company's output in the year. Samsung Electronics is expected to take the lead on these processes, as it just netted orders from Qualcomm, a major mobile baseband chip and SoC designer.

Chang stressed that 20 nm and 16 nm will drive revenue for the next three years for major fabs. 20 nm products will account for 10 percent of TSMC's revenues in Q3 2014, will expand to 20 percent in Q4, and contribute over 20 percent of TSMC's revenues in 2015. TSMC's 16 nm node will be competitive for products such as mobile baseband chips, ICs, GPUs, NICs, and server chips. Despite these setbacks in the company's competitive outlook, it expects its revenues to grow by 12.6 to 14.2 percent sequentially in Q3 2014, year over year.Source: DigiTimes

BIOSTAR Presents Its System-On-Chip Solutions

BIOSTAR has announced the series of mini ITX with CPUs on board, (known as System on a Chip or SoC). These boards are centered on being small and efficient using a small form factor with an embedded CPU, having low power consumption, and fan-less. They are perfect for all sorts of various industrial applications.

The BIOSTAR mini-ITX SoC series is the latest all-in-one boards that optimized the performance of Intel's Bay Trail and AMD's Kabini SoC products by delivering a new generation of technology with value-added features and easy integration. The boards in this series are suitable for ultra-small form factor builds or all-in-one systems that require dual display capabilities in a fan-less PC.

Intel to Manufacture Panasonic System-on-Chips Using 14 nm Process

Intel Corporation today announced that it has entered into a manufacturing agreement with Panasonic Corporation's System LSI Business Division. Intel's custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel's 14 nm low-power manufacturing process.

Panasonic's next-generation SoCs will target audio visual-based equipment markets, and will enable higher levels of performance, power and viewing experience for consumers.

ASRock Releases the Q1900TM-ITX Bay Trail-Powered Mini-ITX Motherboard

ASrock has this week rolled out a new board equipped with Intel's Celeron J1900 (Bay Trail-D) quad-core SoC, a thin Mini-ITX model named Q1900TM-ITX. This mini PC/all-in-one motherboard has a fanless design and features two DDR3/DDR3L memory slots (for up to 16 GB of RAM), dual SATA 3.0 Gbps ports, one PCIe x1 and one mini PCIe slot, Qualcomm Atheros Gigabit Ethernet, one USB 3.0 and three USB 2.0 ports, one LVDS connector, and D-Sub and HDMI video outputs.

ASRock's Q1900TM-ITX can be found on sale for as low as €111.55.

Intel Enters into Strategic Agreement with Rockchip

Intel Corporation today announced it has entered into a strategic agreement with Rockchip to expand the breadth of and accelerate the rate at which it brings its Intel architecture and communications-based solutions to market for a range of entry-level Android* tablets worldwide. Under the terms of the agreement, the two companies will deliver an Intel-branded mobile SoC platform. The quad-core platform will be based on an Intel Atom processor core integrated with Intel's 3G modem technology.

Expanding the offerings in Intel's SoFIA family of integrated mobile SoC platforms for entry and value Android mobile devices, the new quad-core SoFIA 3G part is expected to be available in the first half of 2015. It will be targeted primarily at entry and value tablets. The Intel SoFIA family was added to Intel's mobile product roadmap late last year and includes Intel's first integrated applications processor and communications platform. As the tablet market continues to expand with greater choice of screen size, form factor and price, the strategic agreement with Rockchip also enables Intel to ramp new customers with a broader portfolio of products faster.

Gigabyte Unveils GA-9SISL Micro-Server Board

Gigabyte launched the GA-9SISL, a unique micro-server board in the mini-ITX form-factor. At its center is an Intel Atom C2750 "Avoton" processor. This chip embeds an eight-core "Silvermont" x86-64 CPU clocked at 2.40 GHz, with 2.60 GHz Turbo Boost, a dual-channel memory controller that supports up to 64 GB of memory, 4 MB of L2 cache, and a 6-port SATA AHCI/RAID controller with two 6 Gb/s and four 3 Gb/s ports. Its TDP is rated at just 20W, and so a tiny fan-heatsink is deployed to handle it.

The GA-9SISL from Gigabyte draws power from a combination of 24-pin ATX and 8-pin EPS connectors. The Atom C2750 SoC is wired to four DDR3 DIMM slots, supporting up to 32 GB of DDR3-1600 memory. Its lone expansion slot is a PCI-Express 2.0 x16. Storage connectivity includes four SATA 3 Gb/s and two SATA 6 Gb/s ports. An ASPEED AST2400 chip provides remote management capabilities, and its integrated video, over a D-Sub connector. An Intel N354 network controller offers four 1000 Mbit Ethernet connectors, while a 5th one is wired to the management chip. Gigabyte didn't announce pricing, but given that the SoC itself is priced at US $170 a piece in 1000-unit quantities, home NAS builders may not get excited.

ASRock Intros Celeron J1900-based Q1900DC-ITX Motherboard

ASRock rolled out the Q1900DC-ITX, a low-power computing motherboard based on Intel Celeron J1900 "Bay Trail" SoC. The chip embeds a quad-core x86-64 CPU clocked at 2.00 GHz, with Turbo Boost speeds of up to 2.42 GHz. The board is designed to draw power from an external power brick, over 2-pin DC-in. It uses a chunky fan-less heatsink to cool the SoC, which is wired to two DDR3L SO-DIMM slots. Expansion includes one PCI-Express 2.0 x1, and an mPCIe. Storage connectivity doesn't let down, and includes two each of SATA 6 Gb/s and SATA 3 Gb/s. The board offers legacy connectivity such as LPT and COM over headers. Display outputs include DVI, HDMI, and D-Sub. 8-channel HD audio, gigabit Ethernet, two each of USB 3.0 and USB 2.0/1.1, and PS/2 mouse/keyboard connectors make for the rest of it.

Source: FanlessTech

AMD Announces Ambidextrous Computing Roadmap

AMD today announced a roadmap of near- and mid-term computing solutions that harness the best characteristics of both the x86 and ARM ecosystems, called "ambidextrous computing." The cornerstone of this roadmap is the announcement of AMD's 64-bit ARM architecture license for the development of custom high-performance cores for high-growth markets. Today's announcement also provides a forward-looking glimpse into AMD's development plans to deliver truly unmatched ambidextrous computing and graphics performance using a shared, flexible infrastructure to enable its customers to blaze new paths of innovation for the embedded, server and client markets as well as semi-custom solutions.

"Before today, AMD was the only company in the world to deliver high performance and low-power x86 with leadership graphics. AMD now takes a bold step forward and has become the only company that can provide high-performance 64-bit ARM and x86 CPU cores paired with world-class graphics," said Rory Read, AMD president and CEO. "Our innovative ambidextrous design capability, combined with our portfolio of IP and expertise with high-performance SoCs, means that AMD is set to deliver ambidextrous solutions that enable our customers to change the world in more efficient and powerful ways."

Next-Generation Mobile APUs Extend AMD Performance Leadership

Designed to enable the best user experience on today's most popular and innovative PCs, AMD (NYSE: AMD) today announced its 3rd-generation Mainstream and Low-Power Mobile Accelerated Processing Units (APUs). Combining category-leading compute performance with unique features and rich user interactions, the 2014 AMD Mainstream and Low-Power Mobile APUs (formerly codenamed "Beema" and "Mullins," respectively) are the ideal choice for consumer and commercial client devices alike.

These new mobile APUs feature up to four newly-designed x86 CPU cores with updated, industry-leading AMD Radeon graphics and a hardware-level data security solution based on the ARM Cortex-A5, all on a single, power-sipping system-on-chip (SoC). Products based on these new APUs are already announced by Lenovo and Samsung, with many more expected on-shelf in time for the 2014 back-to-school shopping season.
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