News Posts matching "SoC"

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AMD to Power Next-Generation NES

Nintendo is working on a next-generation gaming console to succeed even the fairly recent Wii U. The company is reacting to the plummeting competitiveness of its current console to the likes of PlayStation 4 and the Xbox One. Reports suggest that Nintendo would make a course-correction on the direction in which it took its game console business with the Wii, and could come up with a system that's focused on serious gaming, as much as it retains its original "fun" quotient. In that manner, the console could be more NES-like, than Wii-like.

Nintendo could ring up AMD for the chip that will drive its next console. It's not clear if AMD will supply a fully-integrated SoC that combines its own x86 CPU cores with its GCN graphics processor; or simply supply the GPU component for an SoC that combines components from various other manufacturers. The Wii U uses IBM's CPU cores, with AMD's GPU, combined onto a single chip. There's no word on when Nintendo plans to announce the new console, but one can expect a lot more news in 2015-16.Source: Expreview

AMD Mobile "Carrizo" Family of APUs Arrive in 2015

AMD (NYSE: AMD) today at its Future of Compute event announced the addition of its first high performance system-on-a-chip (SoC), codenamed "Carrizo", and a mainstream SoC codenamed "Carrizo-L" as part of the company's 2015 AMD Mobile APU family roadmap. In collaboration with hardware and software partners, these new 2015 AMD Mobile APUs are designed as complete solutions for gaming, productivity applications, and ultra high-definition 4K experiences. With support for Microsoft DirectX 12, OpenCL 2.0, AMD's Mantle API, AMD FreeSync and support for Microsoft's upcoming Windows 10 operating system, the 2015 AMD Mobile APU family enables the experiences consumers expect.

"We continue to innovate and build upon our existing IP to deliver great products for our customers," said John Byrne, senior vice president and general manager, Computing and Graphics business group, AMD. "AMD's commitment to graphics and compute performance, as expressed by our goal to improve APU energy efficiency 25x by 2020, combines with the latest industry standards and fresh innovation to drive the design of the 2015 AMD Mobile APU family. We are excited about the experiences these new APUs will bring and look forward to sharing more details in the first half of next year."

AMD Announces Major Technology Partnerships at Future of Compute Event

AMD today at its Future of Compute event announced the introduction of the consumer electronic industry's first-ever ultra high-definition (UHD) monitors to feature its innovative, open-standards based FreeSync technology. Samsung Electronics Co., Ltd., plans to launch the screen synching technology around the world in March 2015, starting with the Samsung UD590 (23.6-inch and 28-inch models) and UE850 (23.6-inch, 27-inch and 31.5-inch models), and eventually across all of Samsung's UHD lineups. FreeSync will enable dynamic refresh rates synchronized to the frame rate of AMD Radeon graphics cards and APUs to maximally reduce input latency and reduce or fully eliminate visual defects during gaming and video playback.

"We are very pleased to adopt AMD FreeSync technology to our 2015 Samsung Electronics Visual Display division's UHD monitor roadmap, which fully supports open standards," said Joe Chan, Vice President of Samsung Electronics Southeast Asia Headquarters. "With this technology, we believe users including gamers will be able to enjoy their videos and games to be played with smoother frame display without stuttering or tearing on their monitors."

TSMC 16FinFET Plus Process Achieves Risk Production Milestone

TSMC today announced its 16-nanometer FinFET Plus (16FF+) process is now in risk production. This enhanced version of TSMC's 16FF process operates 40% faster than the company's planar 20-nanometer system-on-chip (20SoC) process, or consumes 50% less power at the same speed. It offers customers a new level of performance and power optimization targeted at the next generation of high-end mobile, computing, networking, and consumer applications.

TSMC's 16nm process offers an extended scaling of advanced SoC designs and is verified to reach speeds of 2.3GHz with ARM's "big" Cortex-A57 in high-speed applications while consuming as little as 75mW with the "LITTLE" Cortex-A53 in low-power applications. It is making excellent progress in yield learning, and has achieved the best technology maturity at the same corresponding stage as compared to all TSMC's previous nodes.

TSMC and ARM Unveil Roadmap for 64-bit ARM-based Processors on 10FinFET Process

ARM and TSMC today announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early pathfinding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.

"ARM and TSMC are industry leaders in our respective fields and collectively ensure the availability of leading-edge solutions for ARM-based SoCs through our deep and long-term collaboration," said Pete Hutton, executive vice president and president, product groups, ARM. "Our mutual commitment to providing industry leading solutions drives us to work together early in the development cycle to optimize both the processor and the process node. This joint optimization enables ARM silicon partners to design, tape-out and bring their products to market faster."

AMD Demos First Network Function Virtualization on 64-Bit AMD and ARM Technology

AMD today demonstrated the first network function virtualization (NFV) solution on AMD's 64-bit ARM-based SoC and announced that it is now sampling to AMD's embedded customers. The NFV demonstration is powered by a 64-bit ARM-based AMD Embedded R-Series SoC, codenamed "Hierofalcon," supported with technology from two key ecosystem partners -- Aricent for the networking software stack and Mentor Graphics for embedded Linux and tools. NFV is an innovative solution that simplifies deployment and management for network and telecommunications service providers with a fully virtualized communications infrastructure that helps maximize performance, while working to reduce costs.

At ARM TechCon, AMD specifically showcased the capabilities of an ARM-based NFV solution, virtualizing the functionality of a packet data network gateway, serving gateway, and a mobility management entity. In addition to virtualizing hardware components, AMD showcased a live traffic migration between the ARM-based AMD Embedded R-Series SoC and the x86-based second generation AMD R-Series APU. AMD's ARM-based NFV solution will be especially valuable for telecommunications network infrastructure providers interested in a flexible software-defined networking (SDN) implementation to manage networking services with configurable hardware to help reduce complexity and cost. NFV is the abstraction of numerous network devices such as routers and gateways, to enable relocation of network functions from dedicated hardware appliances to generic servers. With NFV, much of the intelligence currently built into proprietary, specialized hardware is accomplished with software running on general purpose hardware. The resulting solution is a fully virtualized communications infrastructure -- including virtual servers, storage and networks -- that simplifies deployment and management for network and telecommunications service providers. AMD is paving the way for both new and established service providers to design and deploy either x86 or ARM-based NFV infrastructure which meets their performance, cost and complexity requirements.

TSMC Delivers First Fully Functional 16FinFET Networking Processor

TSMC today announced that its collaboration with HiSilicon Technologies Co, Ltd. has successfully produced the foundry segment's first fully functional ARM-based networking processor withFinFET technology. This milestone is a strong testimonial to deep collaboration between the two companies and TSMC's commitment to providing industry-leading technology to meet the increasing customer demand for the next generation of high-performance, energy-efficient devices.

TSMC's 16FinFET process promises impressive speed and power improvements as well as leakage reduction. All of these advantages overcome challenges that have become critical barriers to further scaling of advanced SoC technology. It has twice the gate density of TSMC's 28HPM process, and operates more than 40% faster at the same total power, or reduces total power over 60% at the same speed.

BIOSTAR Announces the J1800TH Mini ITX System-On-Chip Solution

BIOSTAR has announced the J1800TH, a mini ITX mainboard with CPU on board, (known as System on a Chip or SoC). These boards are centered around being small and efficient using a small form factor with an embedded CPU, having low power consumption, and being fan-less. They are perfect for all sorts of various industrial applications.

The BIOSTAR J1800TH is the latest in all-in-one board that takes advantage of the optimized performance of Intel's Bay Trail chipset by delivering a new generation of technology with value-added features and easy integration.

TSMC May Lose 16 nm and 14 nm Market Share to Competitors in 2015: Chairman

TSMC may lose out on orders to competing fabs on the 16 nanometer (nm) and 14 nm nodes, in terms of market share, in 2015, according to company chairman Morris Chang. Chips built on the 16 nm node will amount to single-digit percentages of the company's output in the year. Samsung Electronics is expected to take the lead on these processes, as it just netted orders from Qualcomm, a major mobile baseband chip and SoC designer.

Chang stressed that 20 nm and 16 nm will drive revenue for the next three years for major fabs. 20 nm products will account for 10 percent of TSMC's revenues in Q3 2014, will expand to 20 percent in Q4, and contribute over 20 percent of TSMC's revenues in 2015. TSMC's 16 nm node will be competitive for products such as mobile baseband chips, ICs, GPUs, NICs, and server chips. Despite these setbacks in the company's competitive outlook, it expects its revenues to grow by 12.6 to 14.2 percent sequentially in Q3 2014, year over year.Source: DigiTimes

BIOSTAR Presents Its System-On-Chip Solutions

BIOSTAR has announced the series of mini ITX with CPUs on board, (known as System on a Chip or SoC). These boards are centered on being small and efficient using a small form factor with an embedded CPU, having low power consumption, and fan-less. They are perfect for all sorts of various industrial applications.

The BIOSTAR mini-ITX SoC series is the latest all-in-one boards that optimized the performance of Intel's Bay Trail and AMD's Kabini SoC products by delivering a new generation of technology with value-added features and easy integration. The boards in this series are suitable for ultra-small form factor builds or all-in-one systems that require dual display capabilities in a fan-less PC.

Intel to Manufacture Panasonic System-on-Chips Using 14 nm Process

Intel Corporation today announced that it has entered into a manufacturing agreement with Panasonic Corporation's System LSI Business Division. Intel's custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel's 14 nm low-power manufacturing process.

Panasonic's next-generation SoCs will target audio visual-based equipment markets, and will enable higher levels of performance, power and viewing experience for consumers.

ASRock Releases the Q1900TM-ITX Bay Trail-Powered Mini-ITX Motherboard

ASrock has this week rolled out a new board equipped with Intel's Celeron J1900 (Bay Trail-D) quad-core SoC, a thin Mini-ITX model named Q1900TM-ITX. This mini PC/all-in-one motherboard has a fanless design and features two DDR3/DDR3L memory slots (for up to 16 GB of RAM), dual SATA 3.0 Gbps ports, one PCIe x1 and one mini PCIe slot, Qualcomm Atheros Gigabit Ethernet, one USB 3.0 and three USB 2.0 ports, one LVDS connector, and D-Sub and HDMI video outputs.

ASRock's Q1900TM-ITX can be found on sale for as low as €111.55.

Intel Enters into Strategic Agreement with Rockchip

Intel Corporation today announced it has entered into a strategic agreement with Rockchip to expand the breadth of and accelerate the rate at which it brings its Intel architecture and communications-based solutions to market for a range of entry-level Android* tablets worldwide. Under the terms of the agreement, the two companies will deliver an Intel-branded mobile SoC platform. The quad-core platform will be based on an Intel Atom processor core integrated with Intel's 3G modem technology.

Expanding the offerings in Intel's SoFIA family of integrated mobile SoC platforms for entry and value Android mobile devices, the new quad-core SoFIA 3G part is expected to be available in the first half of 2015. It will be targeted primarily at entry and value tablets. The Intel SoFIA family was added to Intel's mobile product roadmap late last year and includes Intel's first integrated applications processor and communications platform. As the tablet market continues to expand with greater choice of screen size, form factor and price, the strategic agreement with Rockchip also enables Intel to ramp new customers with a broader portfolio of products faster.

Gigabyte Unveils GA-9SISL Micro-Server Board

Gigabyte launched the GA-9SISL, a unique micro-server board in the mini-ITX form-factor. At its center is an Intel Atom C2750 "Avoton" processor. This chip embeds an eight-core "Silvermont" x86-64 CPU clocked at 2.40 GHz, with 2.60 GHz Turbo Boost, a dual-channel memory controller that supports up to 64 GB of memory, 4 MB of L2 cache, and a 6-port SATA AHCI/RAID controller with two 6 Gb/s and four 3 Gb/s ports. Its TDP is rated at just 20W, and so a tiny fan-heatsink is deployed to handle it.

The GA-9SISL from Gigabyte draws power from a combination of 24-pin ATX and 8-pin EPS connectors. The Atom C2750 SoC is wired to four DDR3 DIMM slots, supporting up to 32 GB of DDR3-1600 memory. Its lone expansion slot is a PCI-Express 2.0 x16. Storage connectivity includes four SATA 3 Gb/s and two SATA 6 Gb/s ports. An ASPEED AST2400 chip provides remote management capabilities, and its integrated video, over a D-Sub connector. An Intel N354 network controller offers four 1000 Mbit Ethernet connectors, while a 5th one is wired to the management chip. Gigabyte didn't announce pricing, but given that the SoC itself is priced at US $170 a piece in 1000-unit quantities, home NAS builders may not get excited.

ASRock Intros Celeron J1900-based Q1900DC-ITX Motherboard

ASRock rolled out the Q1900DC-ITX, a low-power computing motherboard based on Intel Celeron J1900 "Bay Trail" SoC. The chip embeds a quad-core x86-64 CPU clocked at 2.00 GHz, with Turbo Boost speeds of up to 2.42 GHz. The board is designed to draw power from an external power brick, over 2-pin DC-in. It uses a chunky fan-less heatsink to cool the SoC, which is wired to two DDR3L SO-DIMM slots. Expansion includes one PCI-Express 2.0 x1, and an mPCIe. Storage connectivity doesn't let down, and includes two each of SATA 6 Gb/s and SATA 3 Gb/s. The board offers legacy connectivity such as LPT and COM over headers. Display outputs include DVI, HDMI, and D-Sub. 8-channel HD audio, gigabit Ethernet, two each of USB 3.0 and USB 2.0/1.1, and PS/2 mouse/keyboard connectors make for the rest of it.

Source: FanlessTech

AMD Announces Ambidextrous Computing Roadmap

AMD today announced a roadmap of near- and mid-term computing solutions that harness the best characteristics of both the x86 and ARM ecosystems, called "ambidextrous computing." The cornerstone of this roadmap is the announcement of AMD's 64-bit ARM architecture license for the development of custom high-performance cores for high-growth markets. Today's announcement also provides a forward-looking glimpse into AMD's development plans to deliver truly unmatched ambidextrous computing and graphics performance using a shared, flexible infrastructure to enable its customers to blaze new paths of innovation for the embedded, server and client markets as well as semi-custom solutions.

"Before today, AMD was the only company in the world to deliver high performance and low-power x86 with leadership graphics. AMD now takes a bold step forward and has become the only company that can provide high-performance 64-bit ARM and x86 CPU cores paired with world-class graphics," said Rory Read, AMD president and CEO. "Our innovative ambidextrous design capability, combined with our portfolio of IP and expertise with high-performance SoCs, means that AMD is set to deliver ambidextrous solutions that enable our customers to change the world in more efficient and powerful ways."

Next-Generation Mobile APUs Extend AMD Performance Leadership

Designed to enable the best user experience on today's most popular and innovative PCs, AMD (NYSE: AMD) today announced its 3rd-generation Mainstream and Low-Power Mobile Accelerated Processing Units (APUs). Combining category-leading compute performance with unique features and rich user interactions, the 2014 AMD Mainstream and Low-Power Mobile APUs (formerly codenamed "Beema" and "Mullins," respectively) are the ideal choice for consumer and commercial client devices alike.

These new mobile APUs feature up to four newly-designed x86 CPU cores with updated, industry-leading AMD Radeon graphics and a hardware-level data security solution based on the ARM Cortex-A5, all on a single, power-sipping system-on-chip (SoC). Products based on these new APUs are already announced by Lenovo and Samsung, with many more expected on-shelf in time for the 2014 back-to-school shopping season.

Toshiba Joins GLOBALSOLUTIONS Ecosystem as Worldwide ASIC Partner

GLOBALFOUNDRIES today announced that Toshiba Corporation will join the company's GLOBALSOLUTIONS ecosystem of partners. As a worldwide ASIC partner, Toshiba will enable its Fit Fast Structured Array (FFSA) and ASIC solutions based upon GLOBALFOUNDRIES' technologies and services for customers across the globe. The agreement includes participation on multi-project wafer (MPW) runs and production wafers covering the whole portfolio of GLOBALFOUNDRIES technologies, including leading-edge process nodes.

Initially, the partnership will focus on implementations of Toshiba's FFSAs manufactured with GLOBALFOUNDRIES' 65nm and 40nm low-power process technologies, with 28nm arrays to follow. Toshiba's FFSA products-including libraries and intellectual property (IP)-allow customers to reduce development time and costs by customizing existing base wafers, choosing from a number of design platforms at GLOBALFOUNDRIES. For higher-volume applications, customers can work with Toshiba's libraries to develop fully custom system-on-chips (SoCs). With an initial product completed, customers can then leverage the embedded FFSA technology to provide quick-turn derivative products, with much lower development costs.

MSI Releases AM1 Socketed Kabini Mini-ITX AM1I motherboard

MSI, world leader in motherboards, debuts its first AMD AM1 Socketed Kabini Mini-ITX motherboard, the MSI AM1I. With Kabini being sold separately, the MSI AM1I is fully upgradable and gives the user flexibility when looking for a ultra-low power dual or quad core solution. With MSI AM1I's rich feature set and support for the powerful power efficient Kabini APU, packed with high performance DirectX 11.2-support, it is the ideal motherboard to use in a compact desktop, HTPC or other multimedia solutions.

Kabini is the first x86 quad-core System on a Chip solution for mainstream use with improved performance per watt and best-in-class graphics. Now being sold separately, instead of soldered to a motherboard, the AM1 platform offers a complete, customizable package together with the MSI AM1I motherboard.

Altera and Intel Extend Manufacturing Partnership

Altera Corporation and Intel Corporation today announced their collaboration on the development of multi-die devices that leverage Intel's world-class package and assembly capabilities and Altera's leading-edge programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera's Stratix 10 FPGAs and SoCs using the 14 nm Tri-Gate process.

Altera's work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera's heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics. The devices will address the performance, memory bandwidth and thermal challenges impacting high-end applications in the communications, high-performance computing, broadcast and military segments.

Biostar Announces AM1M Series Socket AM1 Motherboards

Biostar introduced a trio of socket AM1 (FS1b) motherboards for AMD "Kabini" SoCs, the micro-ATX AM1MHP, AM1MH and AM1ML (pictured in that order). The AM1MHP features a narrow micro-ATX PCB, which draws power from a combination of 24-pin ATX and 4-pin CPU power connectors, and uses a 2+1 phase VRM to condition power. The AM1 socket is wired to two DDR3 DIMM slots, a PCI-Express 2.0 x16 slot, a PCIe 2.0 x1 slot, and a legacy PCI. A couple of SATA 6 Gb/s ports make for the storage connectivity. Display outputs include D-Sub and HDMI. Also included are legacy ports, such as COM and LPT, through headers.

Next up, are the AM1MH and AM1ML. The two are based on an identical PCB that's a variation of the the mini-ITX standard, in that it features a second add-on card slot, and differ only with the AM1ML lacking an HDMI port. Drawing power from 24-pin ATX and 4-pin CPU power connectors, the two offer PCI-Express 2.0 x16 and PCIe 2.0 x1 slots, and an otherwise identical feature-set to that of the AM1MHP.

Intel To Retire Some Bay Trail and Ivy Bridge Processors

Intel Corp. has kicked off February by informing partners (and anyone interested) about the discontinuance schedule of nine products including two Ivy Bridge mobile processors - the Core i7-3840QM (2.8 GHz) and i7-3740QM (2.7 GHz), and seven Bay Trail-based SoCs - the Pentium N3510 (2.0 GHz) and J2850 (2.41 GHz) and the Celeron N2910 (1.6 GHz), N2810 (2.0 GHz), N2805 (1.46 GHz), J1850 (2.0 GHz) and J1750 (2.41 GHz).

The Pentium N3510, J2850 and Celeron N2910 are the first to go as they will only be available for orders until February 21st and will continue shipping until April 25th. The rest are set to survive quite a bit longer, their last order date being August 22nd, while shipments won't end until February 6th, 2015.

Gigabyte Outs the J1800N-D2H Mini-ITX Motherboard

Joining Biostar with its Celeron J1800-based motherboard is Gigabyte, with the J1800N-D2H. The SoC features a dual-core 64-bit x86 CPU clocked up to 2.53 GHz, wired to a pair of DDR3 SO-DIMM slots, a PCI-Express 2.0 x1 slot, and a mini PCI-Express card slot. Display connectivity includes HDMI and D-Sub. Two SATA 3 Gb/s ports, a USB 3.0 port, four USB 2.0 ports, gigabit Ethernet, and PS/2 mouse/keyboard ports make for the rest of the connectivity. Gigabyte didn't reveal pricing details.


Source: FanlessTech

BIOSTAR Rolls Out the J1800NH Mini-ITX Motherboard

Biostar rolled out its first motherboard based on the low-power Celeron J1800 SoC, the J1800NH. This mini-ITX motherboard offers enough power to run basic desktops. The Celeron J1800 tucks in a dual-core x86-64 CPU clocked at 2.40 GHz, featuring Turbo Boost, that spools it up to 2.53 GHz. The board features a single DDR3 SO-DIMM slot, and a PCI-Express 2.0 x1 is its sole expansion slot. Storage connectivity includes two SATA 3 Gb/s ports. A USB 3.0 port, four USB 2.0 ports, HDMI and D-Sub display outputs, stereo HD audio, and gigabit Ethernet make for the rest of its connectivity. Biostar didn't announce pricing.

Source: FanlessTech

LSI Reports Fourth Quarter and Full Year 2013 Results

LSI Corporation (NASDAQ: LSI) today reported results for its fourth quarter ended December 31, 2013. On December 15, 2013, LSI entered into a definitive agreement with Avago Technologies Limited (NASDAQ: AVGO) under which Avago has agreed to acquire LSI for $11.15 per share in an all-cash transaction valued at approximately $6.6 billion. In anticipation of this transaction, which is expected to close in the first half of 2014, LSI will not issue financial guidance for the upcoming quarter or conduct a fourth quarter results conference call. LSI has also discontinued its quarterly dividend and stock repurchases.

"We ended the year on a strong note, with solid quarterly results and the announcement of Avago's proposed acquisition of LSI," said Abhi Talwalkar, LSI's president and CEO. "Our employees did a great job in the quarter and in the year, bringing several exciting new products to market and expanding our capabilities to better serve our growing customer base in flash storage, datacenters and mobile networks."
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