News Posts matching "SoC"

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Intel "Rosepoint" Atom Combines x86 Cores with WiFi Transceiver

At IDF 2012, Intel showed off an experimental SoC codenamed "Rosepoint," targeted at low power mobile consumer devices. Built on the 32 nm process, the tiny chip combines a full-featured dual-core Atom processor with a WiFi transceiver. This could eliminate the need for external transceivers on Atom-powered devices, reducing the platform's board footprint, and of course, power draw.

The current chip comes with its share of limitations. It supports just 2.4 GHz radio band. According to Intel's Justin Rattner, the chip should scale with Moore's Law, and future versions could have greater capabilities, including cellular data, and built-in antennae. Production versions of the chip aren't due for another two years, so it's safe to assume that Rosepoint is just a development milestone.

Source: Guru3D

Despite Estimates Cuts, Analyst Bets on Haswell Success

Following last Friday's Q3 outlook lowering by Intel, market punters such as Merrill Lynch cut estimates. Vivek Arya, an analyst with the firm, cut its Q3 and Q4 estimates for Intel, while remaining optimistic about upcoming processes in the company's pitched battle with ARM in the lightweight SoC segment. Arya believes that with upcoming technologies, Intel has a fighting chance against ARM heavyweights. Said Arya in his report:
Next-gen chip manufacturing has become a 3-horse race between Intel, TSMC and Samsung, with Intel holding a 1 to 4 year lead, in our view. As we saw in 1H12, foundries were unable to ramp 28nm capacity, leading to product delays. Rising costs/ complexity (tri-gate) could further widen this gap. We believe this could enable Intel to gain a foothold (vs. zero today) in mobile over the next 2 years, as smartphone/tablet vendors look to Intel as a second or even primary source […] We firmly believe in Intel’s ability to reliably produce the lowest cost and highest performance silicon can help it maintain a dominant position in servers/data centers (20% of sales, 10-15% CAGR), and transition from legacy PCs to next-gen smartphones, tablets, Ultrabooks and other converged devices in the next 1-2 years. Investors, meanwhile, benefit from a 3.6% div yield, $7.5bn in available buybacks (6% of mkt cap) and <10x PE.

HSA Foundation Announces Six New Members

Today the Heterogeneous System Architecture (HSA) Foundation announced six new members. The HSA Foundation is pleased to welcome Apical, Arteris Inc., MulticoreWare Inc., Sonics, Symbio and Vivante Corporation to the membership roster. Each company adds expertise to the HSA ecosystem by assisting with research, development, production, manufacture, use, and the sale of HSA IP and heterogeneous computing software and solutions.

These new members have joined at different levels including: supporter, contributor and associate. Working closely with the founder members of AMD, ARM, Imagination Technologies, MediaTek Inc., Samsung Electronics and Texas Instruments (TI), the new members will contribute to the growing adoption of HSA in heterogeneous computing.

ARM and GLOBALFOUNDRIES Collaborate to Enable Devices on 20 nm and FinFET

GLOBALFOUNDRIES and ARM today announced a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM processor designs on GLOBALFOUNDRIES’ 20-nanometer (nm) and FinFET process technologies. The new agreement also extends the long-standing collaboration to include graphics processors, which are becoming an increasingly critical component in mobile devices. As part of the agreement, ARM will develop a full platform of ARM Artisan Physical IP, including standard cell libraries, memory compilers and POP IP solutions. The results will help enable a new level of system performance and power-efficiency for a range of mobile applications, from smartphones to tablets to ultra-thin notebooks.

The companies have been collaborating for several years to jointly optimize ARM Cortex-A series processors, including multiple demonstrations of performance and power-efficiency benefits on 28nm as well as a 20nm test-chip implementation currently running through GLOBALFOUNDRIES fab in Malta, N.Y. This agreement extends the prior efforts by driving production IP platforms that will enable customer designs on 20nm and promote rapid migration to three-dimensional FinFET transistor technology. This joint development will enable a faster time to delivering SoC solutions for customers using next-generation ARM CPUs and GPUs in mobile devices.

Intel Reveals 22nm "Avoton" SoC for Micro Servers in 2013

Today during the Structure Conference in San Francisco, Jason Waxman, GM of the Cloud Infrastructure Group outlined Intel’s vision and roadmap for microservers and discussed how they best suited to handle emerging “scale-out” applications. Waxman provided an update on Intel's roadmap for microservers including new generations of Intel Xeon processors and Intel Atom architecture based 22nm SoC chips codenamed "Avoton", both scheduled for 2013. In his blog Jason also talks about why within the new segment of servers it is the application that will decide which core – Intel Atom or Xeon - will be the optimal solution. Waxman's presentation can be found here.

SK Hynix to Acquire Link_A_Media Devices

SK hynix Inc. (‘SK hynix’ or ‘the Company’) announced that it has entered into an agreement to acquire California-based storage solution company Link_A_Media Devices Corporation (‘LAMD’). LAMD, founded in 2004, is a leader in the development of semiconductor system-on-chip (SoC) solutions for the data storage market. These SoC solutions, also called controllers, interface with processors to significantly increase the speed and reliability of Flash memory. Upon completion of the acquisition, LAMD will join SK hynix as a business unit focused on customized NAND based solutions.

As various mobile applications such as smartphones and tablet PCs are being rapidly adopted and cloud computing grows in popularity, the NAND Flash market has been evolving from raw NAND memory solutions for USB and memory cards to value-added products equipped with controllers. The role of the NAND controller in premium products such as e-MMC (embedded Multi Media Card) and SSDs (Solid State Drives) has become increasingly important to meet the high memory densities and improved interface speeds required by end users.

AMD Strengthens Security Solutions through Technology Partnership with ARM

AMD today announced it will integrate a new security solution into its future products to meet the increasing need to provide consumers and businesses with secure access to their content and worry-free online transactions. Through a strategic technology partnership with ARM, AMD will integrate the established ARM TrustZone technology into future Accelerated Processing Units (APUs) via a system-on-a-chip (SoC) design methodology. This industry-first collaboration will help accelerate broader ecosystem support by aligning x86 hardware with the world's most broadly-adopted mobile security ecosystem.

By adopting the industry-standard approach to security that TrustZone technology embodies, AMD and ARM will provide a consistent approach to security spanning billions of Internet-connected mobile devices, tablets, PCs and servers − whether they are powered by ARM processor-based solutions or AMD x86 APUs. AMD plans to provide development platforms that have TrustZone security features on select APUs in 2013, expanding further across its product portfolio in 2014. In a presentation this week at the AMD Fusion Developer Summit 2012 (AFDS), AMD Senior Vice President and Chief Information Officer Mike Wolfe described AMD's vision to advance computing security by enhancing AMD's existing security technologies. This is expected to include developing a platform security processor using an ARM CortexTM-A5 CPU that features TrustZone technology, to monitor and help protect against malicious access to sensitive data and operations at the hardware level.

AMD, ARM, Imagination, MediaTek and TI Unleash Next Era of Computing Innovation

Today at the AMD Fusion Developer Summit (AFDS), global technology leaders came together to announce the formation of the Heterogeneous System Architecture (HSA) Foundation. The HSA Foundation is a non-profit consortium established to define and promote an open, standards-based approach to heterogeneous computing that will provide a common hardware specification and broad support ecosystem to make it easier for software developers to deliver innovative applications that can take greater advantage of today’s modern processors.

AMD, ARM, Imagination Technologies, MediaTek Inc., and Texas Instruments (TI) are the initial founding members of the HSA Foundation. The companies will work together to drive a single architecture specification and simplify the programming model to help software developers take greater advantage of the capabilities found in modern central processing units (CPUs) and graphics processing units (GPUs), and unlock the performance and power efficiency of the parallel computing engines found in heterogeneous processors.

VIA's $49 APC Listed for Pre-Order, Sells Out

VIA listed the US $49 Android mini-PC (APC) system board for pre-order. The product sold out in a few hours following staggering demand. VIA announced that all pre-orders will be shipped starting early-July, and the company is working hard to make the product available through local distributors around the world, to eliminate shipping costs to the end-users. Announced the APC back in May, the APC is a neo-ITX system board that can fit into most ITX and ATX chassis, and can be powered both by external 2-pin DC input, and internal 4-pin ATX input. The board seats an ARM-based SoC, which drives Google's Android 2.3 operating system, modified for conventional PC interfaces.

FXI Cottoncandy Faces Real Competition in $74 MK802 ICS PC on Stick

For those waiting for the $200 FXI Cottoncandy Android-driven PC on stick with no concrete availability in sight, its competitor already took shape. Discovered on trading and B2B portal AliExpress (from Alibaba), the MK802 is an Android 4.0 PC on a stick, which is priced at US $74 a pop ($70 a piece in >5 quantities). Measuring 88 x 35 x 12 mm, and weighing less than 200 g, the device is powered by a 1.50 GHz AllWinner single-core ARM SoC.

Compared to the Cottoncandy, there are a few things you'd have to do without. To begin with, the MK802 doesn't have an HDMI standard connector sticking out, which lets you plug it directly to TVs, instead it has a mini-HDMI port, so you'd need an HDMI cable. The device packs 4 GB of storage, which can be expanded by a microSD. Connectivity includes one full-size USB 2.0 ports, a mini-USB, with USB host support; and 802.11 b/g WLAN, which makes it an ideal internet-TV device.

Sources: CNX Software, Liliputing
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