Texas Instruments (TI) today broke ground on its new 300-mm semiconductor wafer fabrication plant (or "fab") in Lehi, Utah. Joined by Utah Governor Spencer Cox, state and local elected officials, as well as community leaders, TI President and Chief Executive Officer Haviv Ilan celebrated the first steps toward construction of the new fab, LFAB2, which will connect to the company's existing 300-mm wafer fab in Lehi. Once completed, TI's two Utah fabs will manufacture tens of millions of analog and embedded processing chips every day at full production.

"Today we take an important step in our company's journey to expand our manufacturing footprint in Utah. This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come," said Ilan. "At TI, our passion is to create a better world by making electronics more affordable through semiconductors. We are proud to be a growing member of the Utah community, and to manufacture analog and embedded processing semiconductors that are vital for nearly every type of electronic system today."

The BeagleBoard.org Foundation today announces the global availability of BeaglePlay, the most adaptable open-source performance platform available. Built on our proven open source Linux approach, BeaglePlay has a feature set that includes built-in wired and wireless connectivity and ability to connect to a wide selection of sensor and prototyping systems with thousands of options, as well as interfaces and processing performance to support them.

Leveraging the Texas Instruments AM625 processor with quad 64-bit Arm Cortex -A53 cores, low-latency microcontroller subsystems, a dedicated Texas Instruments SimpleLink CC1352P7 sub-1 GHz and 2.4-GHz wireless MCU, and a Texas Instruments WiLink WL1807MOD Wi-Fi module, new and experienced users can use a wide variety of application libraries and examples from Linux, Zephyr, MicroPython and numerous other open source frameworks to add an endless array of sensors, actuators, indicators and new connectivity options.

Hsinchu, Taiwan-based global semiconductor silicon wafer company, GlobalWafers, announced today that it plans to build a state-of-the-art 300-millimeter silicon wafer factory in Sherman, Texas, which is the first of its kind in the USA over twenty (20) years. Construction is expected to commence later this year. This 300-millimeter greenfield investment is consistent with the Company's announcement on February 6th of this year of brownfield and greenfield expansions totaling NTD 100 bn. This new Texas investment could also support as many as 1,500 jobs with production volumes ultimately reaching 1.2 mn wafers per month after multiple stages of equipment installation, in alignment with market demand.

300-millimeter silicon wafers are the starting material for all advanced semiconductor fabrication sites (or fabs), including recently announced United States (US) expansions by GlobalFoundries, Intel, Samsung, Texas Instruments and TSMC. Most of these wafers are currently manufactured in Asia, forcing the US semiconductor industry to highly rely on imported silicon wafers. This investment will represent the first new silicon wafer facility in the US in over two decades and close a critical semiconductor supply chain gap.

According to TrendForce, market conditions in 1H22 were chaotic and there was disparate demand for chips of varying functionality. Given the global development of electronic devices and power systems, overall demand for power management ICs (PMIC) is still relatively good. PMICs are used in consumer electronics, communications, computing, industrial control, automotive and other fields. In 2H22, supply and demand gradually diverged and demand for automotive Switching Regulators, Multi Channel PMICs was strongest.

According to TrendForce, there are various specifications and types of PMICs, including Linear Regulators, etc. Even usage scenario dependent products such as Battery Charging & Management, Voltage References, and USB Power Delivery ICs all fall into this category.

Micron Technology, Inc. announced today that it has entered into a definitive agreement to sell its Lehi, Utah, fab to Texas Instruments. The economic value for Micron from the sale is $1.5 billion, comprised of $900 million in cash from TI from the sales transaction, and approximately $600 million in value from select tools and other assets. Micron has sold some of these assets and will retain the remainder to redeploy to its other manufacturing sites or sell to other buyers.

Micron's Lehi, Utah, facility has been home to a highly skilled team with expertise in all aspects of advanced semiconductor manufacturing. TI will offer all Lehi site team members the opportunity to become employees upon the closing of the sale and intends to deploy its own technologies at the site. The sale is anticipated to close later this calendar year.

"Micron's Lehi, Utah, facility has a strong history of technology innovation and leading-edge semiconductor manufacturing," said Micron President and CEO, Sanjay Mehrotra. "We are pleased to have reached an agreement with Texas Instruments as it is an industry leader and truly values the talented Lehi team and the capabilities this site offers to deploy its technology effectively. We are greatly appreciative of the contributions that the Lehi team has made to Micron, as well as the collaboration and engagement Micron has had with the local community."

When Intel launched its Tiger Lake processors for laptops, the company has foreseen a smooth integration by OEMs and plenty of design wins. While that has turned out to be true, there seems to be a big problem lurking in the OEM component supply chain. In the new Tiger Lake systems, the CPU carries support for Thunderbolt 4 and USB 4 technologies. However, these protocols can not work on their own, as they require external power delivery controllers (PDC) to function. These PDCs are used to regulate and control all of the power circulating in the USB specification, and they come in a form of a separate chip. This chip is later integrated into PCBs of various systems implementing these technologies.

Today, we have a report coming from Igor's LAB, in which we are told that the availability of these chips could be very bad. Intel's OEMs are using Texas Instruments (TI) 994AD PDC, however, as the supply of these chips becomes scarce, OEMs are turning to TI 993AC/994AC chips. Intel advises OEMs, carrying these chips in their systems, to only communicate benefits of Thunderbolt 4 and exclude USB 4 mentions, or to communicate benefits of Thunderbolt 4 and reference USB 4 "compatibility." This means that every OEM using the alternative chips will get Intel's Thunderbolt 4 certifications, as the company plans to temporarily issue certifications with these chips included, while the supply chain regulates. TI's 993AC/994AC are assumed to not have the power and regulation capability of the USB 4 as the 994AD PDC can.

What's this? A new high-end internal sound-card launch? From EVGA? We must be dreaming! The NU-Audio internal sound card is the most unexpected product from our visit to EVGA's suite on Monday. Developed in partnership with British audiophile hardware maker Audio Note and sold under the EVGA badge, the NU-Audio is a full-height internal sound card with PCI-Express 2.0 x1 bus interface. At its heart is an XMOS xCORE 200 PCIe audio processor with an Azalia-like pipeline. The main DAC is an Asahi Kasei AK4493, fronted by an Analog Devices OP275 OPAMP for the main headphones channel, and AD8056 for the line-out channel.

The card has some serious input chops as output, with the main line-in powered by an Asahi Kasei AK5572, and a Cirrus Logic CS53456 for the microphone-in channel. As an analog sound card, you only get 2 channels. You'll need optical TOSLINK for 5.1 channels. A combination of WIMA and Audio Note electrolytic capacitors are used across the card. The electrical area is ground-layer isolated, draws power from a SATA power input, and uses a Texas Instruments TPS7A47 voltage regulator. All connections between the electrical and audio areas are filtered, and copper EMI shielding covers vital audio components, in addition to the outer shroud. The PCB itself is chunky (possibly 4-layer with 2 oz copper layers).

Global Semiconductor Alliance (GSA) will honor industry visionary and innovator Dr. Lisa Su, President and CEO, Advanced Micro Devices (AMD), with the prestigious Dr. Morris Chang Exemplary Leadership Award at its highly-anticipated Annual Awards Dinner to be held in Santa Clara, California, on December 6, 2018.

Established in 1999, the Dr. Morris Chang Exemplary Leadership Award recognizes individuals for their exceptional contributions, exemplifying how their vision and global leadership have transformed and elevated the entire semiconductor industry. The selection of Dr. Su is based on her ongoing technological contributions, exceptional business acumen, status as a positive and inspiring role model, and wide ranging respect among the technology industry and business community.

Texas Instruments today announced the resignation of Brian Crutcher as president, CEO and a member of the TI board. The board has named Rich Templeton, the company's chairman, to reassume the roles of president and CEO on an ongoing, indefinite basis, in addition to continuing as chairman. Templeton's appointment is not temporary, and the board is not searching for a replacement.

Crutcher resigned due to violations of the company's code of conduct. The violations are related to personal behavior that is not consistent with our ethics and core values, but not related to company strategy, operations or financial reporting.

BIOSTAR is proud to announce its latest product series targeted for power users and gamers looking for high-performance storage: BIOSTAR announces the debut their G300 series of solid-state drives (SSD). With the current trend of enthusiasts switching to SSDs for faster storage performance especially for eSports and the gaming market where performance is a key consideration, SSDs are the top choice for gamers versus traditional hard disk drives. With SSDs, games and level load faster, the system is more responsive and you spend more time gaming.

With SSDs growing in popularity as the preferred storage for gaming PCs due to their faster performance, gamers are becoming more and more stringent in their buying decisions because of the large selection of SSDs in the market. All SSDs offer better performance than conventional mechanical hard disk drives but not all SSDs are the same.

ASUS Republic of Gamers (ROG) today announced Maximus VIII Extreme/Assembly and Matrix GTX 980 Ti, our flagship Z170 gaming motherboard primed for epic gaming performance and overclocking, and the enthusiast graphics card that delivers record-breaking performance and extreme overclocking potential - both finessed with ROG's all-new futuristic Plasma Copper scheme for color-matched extreme gaming and overclocking rigs.

Introducing the stunning Plasma Copper color scheme, ASUS ROG's Global Marketing Director, Derek Yu, said: "To be ROG is to be the rebel. To be ROG is to break every rule. We are rebellious ROG, breaking our own rules to envision a new future. A future forged with striking distinction. ROG is red. ROG is black. And now ROG is also Plasma Copper: elite assemblies for elite gamers. This is our mark of invincibility - and the new emblem of dominance for the world's best gamers."

Creative Technology Ltd today unveiled a limited edition of its latest Sound Blaster X7 at CES 2015. Recently named a double 2015 CES Innovations Awards Honoree in both the 'Home Audio/Video Components and Accessories' and 'Computer Hardware and Components' categories, the feature-packed Sound Blaster X7 which is an ultra high-resolution external USB DAC and powerful audio amplifier now comes in an exclusive pearl white color, includes a 144W power adapter that is capable of delivering up to 100W output to passive speakers, and has a very low headphone amplifier output impedance of 1 ohm to effortlessly drive even the more sensitive in-ear monitors (IEMs) on the market.

The Sound Blaster X7, showcasing at the 2015 International CES, is designed to connect with a range of gaming and entertainment systems as an ultra high-end external Sound Blaster audio solution with an impressive 24-bit/192kHz high-resolution 127dB digital-to-analog converter (DAC) and a powerful 100W audio amplifier. It provides a superior, pure and lossless listening experience for games, music and movies -- meeting the most discerning demands of audiophile listeners and enthusiast gamers alike.

The Video Electronics Standards Association (VESA) today announced the release of the DockPort standard. Developed by several VESA member companies, DockPort is an optional extension of the DisplayPort standard that will allow USB 3.1 data and DC power for battery charging to be carried over a single DisplayPort connector and cable that also carries high-resolution audio/video (A/V) data. This new extension of the DisplayPort standard is fully backward compatible with all existing DisplayPort devices. When a DockPort-enabled DisplayPort source-such as a computer or tablet-is connected with a DockPort-enabled DisplayPort sink-such as a display monitor or docking station-A/V plus USB data and power will be transferred over a common cable through a single connector. If either the source or sink device is not a DockPort-enabled, then source and sink will recognize only the DisplayPort A/V data stream.

Taiwanese PC audio hardware manufacturer Aim launched its flagship consumer sound card, the SC808. This full-height dual-slot (with daughterboard) sound card features PCI-Express x1 bus interface, and offers 7.1-channel analog and digital outputs. At its heart is C-Media's CMI8888, which is a native PCIe HDA controller, giving external DACs the task of handling analog outputs. The primary 2-channel headphones output is driven by a Wolfson WM8741 DAC, which offers a stellar SNR of 128 dBA. Other analog channels (center/sub, rear, sides), are handled by a C-Media CMI9882A CODEC, which offers a reasonable 100 dBA.

At the downstream of the WM8741 is the card's headphones amp circuit, featuring socketed Texas Instruments LM4562 OPAMP chips, metalized polypropylene capacitors, and a swappable pre-amp stage. The main PCB of the card holds a 6.3 mm stereo headphones jack, left and right RCA line-outs, 7.1-channel coaxial, and optical/TOSLINK SPDIF outputs. The other multi-channel analog outs are wired out by a header and ribbon cable to the daughterboard, which holds color-coded 3.5 mm jacks to all the channels. All audio portions of the card feature electrolytic capacitors (except the OPAMP stages, which feature MP caps), only the electrical/VRM portion of the card features conductive polymer (solid-state) capacitors. The card draws power from a 4-pin Molex power connector. On the software side of things, the driver provider is C-Media, with its reference Xear3D control panel. The card supports Windows 8. Slated for an April 24th launch in Japan, it's expected to be priced at 12,000¥ (US $112). Given its hardware, that's a reasonable price.

The Video Electronics Standards Association (VESA) announced today that DockPort will be added as an official extension to the existing DisplayPort standard. DockPort is an emerging technology that enables high-speed USB 3.0 data over the existing DisplayPort connector. Originally developed by AMD, Texas Instruments, and other VESA member companies, the DockPort extension will allow notebooks, tablets and other small form factor computers to aggregate the display, data and power interfaces into a single convenient connector.

Computers and other smart devices require high-speed I/O ports to share high-resolution video with external displays, high-bandwidth data with external storage and other peripherals, and power for battery charging. As notebooks and tablets become thinner and more portable, consumers want to combine these three common interfaces into a single port on their mobile device. With a single DisplayPort connection using the new DockPort extension and enhanced power capabilities under development, consumers will be able to attach their computers or tablets to a docking station and have instant, hassle-free access to a wide array of external resources.

Micron Technology, Inc. (Nasdaq:MU), today announced that the company has named Rajan Rajgopal, vice president of Quality. Rajgopal will be responsible for overseeing all aspects of Micron's quality systems including manufacturing, customer program management and product ramps. He brings more than 25 years of experience to Micron and most recently served as the vice president of Global Quality and Customer Enablement for GLOBALFOUNDRIES in Singapore.

"Micron continues to evolve as a memory business driven by systems-level solutions, and quality plays a heightened role in serving our valued customers," said Micron President Mark Adams. "We are excited to have Rajan join our team and leverage his experience in serving our customers in an increasingly diversified set of application segments."

On the 17th of July, Micron Technology announced the appointment of Warren East to the company's Board of Directors, effective immediately. East served as CEO of ARM Holdings PLC from October 2001 to July 1, 2013. "We are extremely pleased to welcome Warren to our Board of Directors," said Micron CEO Mark Durcan. "Warren transformed ARM during his tenure as CEO, and we are confident his contributions will strengthen our board."

East, who also serves as director of De La Rule PLC, joined ARM in 1994 and later became Vice President of Business Operations. Within three years, he was appointed to the Board as Chief Operating Officer. Prior to ARM, East was with Texas Instruments. "I appreciate the opportunity to serve with the Micron team," said East. "With the acquisition of Elpida, Micron is well-positioned to be a growing, dynamic leader in semiconductor memory and a critical contributor to the success of customers in the storage, mobile and computing markets." East is a chartered engineer, Distinguished Fellow of the British Computer Society, Fellow of the Institution of Engineering and Technology, Fellow of the Royal Academy of Engineering and a Companion of the Chartered Management Institute. He earned bachelor and master degrees in Engineering Science from Oxford University and an MBA and honorary doctorate from Cranfield University.

ASUS today announced the Xonar Essence STU USB external digital-to-analog converter (DAC) and headphone amplifier, based on the acclaimed design and quality of Xonar Essence ST/STX internal sound cards and going beyond their already high standards. Offering audiophile-grade performance, Xonar Essence STU delivers USB connectivity and accessible external controls.

It offers clear sound with a 120dB signal to noise ratio (SNR), strong 600ohm headphone amplifier, asynchronous USB audio and swappable Op-Amps for DIY sound modification. Precision clock tuning technology further enhances audio fidelity, making Xonar Essence STU a great choice for discerning music lovers who need a quality DAC and headphone amplifier to drive the full capabilities of high-end headphones.

Texas Instruments Incorporated (TI) today announced it has joined the Alliance for Wireless Power (A4WP). TI will continue to develop new bqTESLA wireless power receiver and transmitter integrated circuits that comply with existing and future versions of the Wireless Power Consortium (WPC) Qi standard, and also create products that support the A4WP magnetic resonance specification.

"TI is actively bringing advanced wireless power capabilities to the market," said Sami Kiriaki, senior vice president of TI Power Management. "The WPC Qi specification is clearly the standard for wireless power today, and there is an emerging trend toward loosely coupled technologies - something both WPC and A4WP are exploring. We believe that working closely with both initiatives will help us continue to lead in wireless power."

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated mobile devices graphics chip shipments for the first half of 2012. Mobile devices include smartphones, tablets, and game consoles.

The market for portable devices (mobile devices that we can carry) continues to soar in spite of economic difficulties and general uncertainty. Although portable devices are not necessarily replacing the PC, they are outselling the PC. All of these devices have a graphics processor (GPU) integrated in the device's system on a chip (SoC) application processor.

LG Electronics (LG) today unveiled its new T-Series zero client in Barcelona at Citrix Synergy, a global conference focusing on cloud computing, virtualization and networking. LG Cloud T-Series is the company's next-generation zero client available as either a monitor (CAT42K) or a standalone box (CBT42) to connect to an existing screen. Running independently, both versions employ the Citrix HDX technology and a next-generation Texas Instruments (TI) system on a chip (SoC) offering high performance with greater security through zero client.

"With the LG Cloud T-Series, we're expanding our reach into the zero client market while widening its range of VDI offerings," said J.J. Lee, Executive Vice President and Head of the IT Business Unit of LG Home Entertainment Company. "Citrix HDX Ready verified LG Cloud T-Series will be of great value to any sized enterprise as it reduces the workload of IT management and overall cost while providing full HDX capabilities for outstanding performance."

The Heterogeneous System Architecture (HSA) Foundation today announced that Qualcomm Incorporated has joined as a Founder Member. Qualcomm's commitment reinforces HSA as the next technological underpinning in computing for a broad range of platforms and devices. Since its formation in June, the HSA Foundation has more than doubled its membership with new Founder, Supporter, Contributor and Associate members that have joined the consortium.

Qualcomm joins AMD, ARM, Imagination Technologies, MediaTek Inc., Samsung Electronics Ltd. and Texas Instruments as founder members of the HSA Foundation. The companies are working together to drive a single architecture specification, which simplifies the programming model for software developers on modern platforms and devices. The HSA Foundation will unlock the performance and power efficiency of the parallel computing engines found in heterogeneous processors.

ViewSonic Corp., a leading global provider of computing, consumer electronics and communications solutions, today announced its innovative new Smart Display, aimed at changing the way people think about computing. The 22" (21.5" Vis.) VSD220 Smart Display pairs a 1920x1080 full-HD resolution monitor with the dual-core, ARM-based OMAP 4 processor from Texas Instruments Incorporated (TI) and an Android 4.0 "Ice Cream Sandwich" operating system, resulting in a whole new way to experience the web.

"The VSD220 Smart Display is engineered for today's cloud connected world," said Jeff Volpe, president of ViewSonic Americas. "ViewSonic is embracing the post-PC transition with what will be a full range of connected display solutions. For consumers, the VSD220 is perfect for surfing the web, engaging on social networks and enjoying a world of Android apps. For commercial opportunities, the VSD220 serves as a flexible solution that can address the needs of Android compatible vertical market applications such as signage, hospitality, point of information, and kiosk. Whatever the need, our new Smart Displays are the future of connected computing."

Today the Heterogeneous System Architecture (HSA) Foundation announced six new members. The HSA Foundation is pleased to welcome Apical, Arteris Inc., MulticoreWare Inc., Sonics, Symbio and Vivante Corporation to the membership roster. Each company adds expertise to the HSA ecosystem by assisting with research, development, production, manufacture, use, and the sale of HSA IP and heterogeneous computing software and solutions.

These new members have joined at different levels including: supporter, contributor and associate. Working closely with the founder members of AMD, ARM, Imagination Technologies, MediaTek Inc., Samsung Electronics and Texas Instruments (TI), the new members will contribute to the growing adoption of HSA in heterogeneous computing.

Acer America today announced its entry into the thin client market with a new commercial offering, the Acer Veriton N Series. The new thin and rich clients provide simplified manageability and energy-efficiency in a secure, space-saving form factor for virtual environments. These practical systems are designed for small and medium businesses, call centres and customers in education, financial services, healthcare and government wanting to tightly manage data, while reducing overall costs.

By increasing hardware utilization and consolidation, the Acer Veriton N Series provides superb performance while keeping operational costs and power consumption low. Centralized processing makes it easy to manage data and hardware assets, monitor system access and enforce security policies and procedures, significantly increasing internal data security.
"Our new thin client line will help organizations meet today's reality of ever shrinking budgets by simplifying IT without compromising on business deliverables," said Michael O'Beirne, Acer senior director, commercial product marketing. "The Acer N Series are easy to configure, maintain and manage, while reducing the overall cost of ownership."