News Posts matching "VIA"

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AMD Fails to Halt S3 Graphics Patent Lawsuit Against Apple

In late September, S3 Graphics, still a subsidiary of VIA Technology and soon to be transferred to HTC, dragged Apple Inc. to court over charges of patent infringement related to graphics component IP of nearly all Apple products, including iPhone, iPad, iPod touch, and iMac. Last month, AMD, now a main supplier of graphics processors for Apple's Mac products, intervened with a counter lawsuit claiming it owned the patents that S3 has asserted against Apple, and sought an immediate halt to S3's patent case against Apple.

In an October 28 filing with the ITC, S3 says that a federal judge struck down a request for an immediate halt into S3's case, but the Commission is scheduled to release its final decision on November 15. The case struck down is (rather was) Advanced Micro Devices Inc. v. S3 Graphics Co., 11cv965, U.S. District Court for the District of Delaware (Wilmington).Source: Bloomberg

ZOTAC Announces ZBOX Nano VD01

ZOTAC International, a leading innovator and channel manufacturer of graphics cards, motherboards and mini-PCs, today launches the latest addition to the ZBOX nano product lineup with the new ZBOX nano VD01 series – an affordable palm-sized mini-PC powered by a VIA Nano X2 processor.

The ZOTAC ZBOX nano VD01 series combines the latest VIA Nano X2 U4025 CPU and VX900H media system processor for outstanding energy-efficiency and performance. VIA Chrome9 graphics with ChromotionHD 2.0 processing enables the ZOTAC ZBOX nano VD01 series to deliver silky-smooth playback of popular high-definition video formats, including Blu-ray, MPEG2, H.264, VC-1 and streaming Internet video.

Now, S3 Graphics Slaps Apple with Two Patent Infringement Charges

Soon to be subsidiary of HTC, currently held by VIA Technologies, S3 Graphics, fired off two more patent infringement charges against Apple Inc. Last week, VIA Technologies had sued Apple for alleged infringement of two of its CPU-related patents. These fresh charges by S3 Graphics, like those by VIA, seek sales ban on iPhone, iPad, iPod Touch, as well as Mac in the United States. The complaints were filed with the US ITC (United States International Trade Commission), and a district court in Delaware.

S3 Graphics patents that the company claims Apple infringed are: #5945997 "block- and band-oriented traversal in three-dimensional triangle rendering," and #5581279 "VGA controller circuitry". If S3 Graphics pulls it off, it could inflict significant damage on Apple's sales, as the company heads towards the winter shopping season.Sources: FOSS Patents, TechConnect Magazine

VIA Seeks US Ban of iPhone, iPad Over Patent Infringements

Taiwan-based low-power computing technology company VIA sought a sales ban of Apple's iPhone and iPad, for what it alleges to be patent infringements of its microprocessor intellectual property. VIA sought a jury trial along with a sales ban on Apple products containing the inventions in the U.S., according to a complaint filed yesterday in federal court in Wilmington, Delaware.

In its complaint VIA says “The products at issue generally concern microprocessors included in a variety of electronic products such as certain smartphones, tablet computers, portable media players and other computing devices.” This specifically impinges upon Apple's cash-cow products, the iPhone and iPad, and it isn't coming at a good time because Apple, according to market analyst Gartner Inc., will dominate tablet sales this holiday season. The case is Via Technologies v. Apple Inc. (AAPL), U.S. District Court, District of Delaware (Wilmington).Source: Bloomberg

ZOTAC ZBox Mini PC to Get VIA Nano X2 Power

ZOTAC is readying a new ZBox mini-PC model that makes use of VIA Nano X2 ultra-low power x86 platform. Nano X2-powered ZBox models have been already spotted in the Japanese market. The new ZBox model will make use of Nano X2 U4025, which is a dual-core processor clocked at 1.20 GHz. While VIA is the smallest x86 processor vendor, in the ULV category, the company does tend to punch above its weight, competing with low-wattage Intel Atom processors.

The Nano X2 U4025 processor will be backed by VIA VX900H chipset, with integrated S3 Graphics. The VIA-powered ZBox will be available in two SKUs: a complete product, and a barebones package to which you have to add some of your own compatible components. Both will support up to 4 GB of DDR3 memory, a 2.5-inch SATA bay will be provided to install a hard drive or SSD. Most other features will be consistent with other ZBox models: 6-in-1 card reader, Gigabit Ethernet, 802.11 b/g/n WiFi, Bluetooth 3.0, USB 3.0 connectivity, as well as HDMI and DisplayPort outputs. Originally based on the Intel Atom platform, ZOTAC's ZBox is available in AMD Fusion "Zacate" platform apart from the new VIA-powered one. The new ZBox models will be available worldwide by the end of this month.

Source: TechConnect Magazine

VIA Labs Launches New Second-Generation USB 3.0 Hub Controller

VIA Labs, Inc., a leading supplier of SuperSpeed USB (USB 3.0) integrated chip controllers, today unveiled the VIA Labs VL811 4-port SuperSpeed Hub Controller. The VL811 is VIA Labs' second-generation USB 3.0 Hub product, and adds support for USB Battery Charging Spec. 1.2. Beyond transfer rates of up to 5Gbps, the VL811 features improved performance for new and existing devices with host controllers, and adds rapid-charging capabilities.

"VIA Labs VL811 builds on the success of the VL810, the world’s first 4-port USB 3.0 Hub controller," said Terrance Shih, Project Manager of VIA Labs, Inc USB 3.0 Hubs. "It adds exciting new features, such as the rapid charging function and improved performance."

VIA Labs Launches VL751, the Next-Generation USB 3.0 to NAND Flash Controller

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced its latest USB 3.0 device controller, the VIA Labs VL751 SuperSpeed USB to NAND flash controller. The VL751 is VIA Labs' second-generation single-chip solution for USB 3.0 flash drives, and offers enhanced performance using today's popular flash memories. The VIA Labs VL751 has been certified by the USB Implementers Forum (USB-IF) for SuperSpeed operation, ensuring high quality, seamless interoperability, and effortless backwards compatibility.

The VIA Labs VL751 features a four-channel NAND interface, doubling or even quadrupling maximum throughput over single or dual-channel designs. The second generation VIA Labs VL751 offers improved parallelization and higher efficiency through integrated pre-read and pre-write buffers, better support for popular flash memories, and a pipelined ECC engine. Cumulatively, these enhancements translate into a nearly 100% performance boost over the VIA Labs VL750 with no increase in power consumption.

VIA Technologies Announces Sale of Stake in S3 Graphics

VIA Technologies, Inc. ("VIA") today announced the signing of definitive agreement to sell all of its shareholding in S3 Graphics Co., Ltd. ("S3 Graphics") to HTC Corporation ("HTC"). S3 Graphics is a leading provider of innovative graphics visualization technologies used in PCs, game consoles and, more recently, mobile devices.

VIA acquired S3 Graphics in 2001 with the intention to accelerate integration of graphics capabilities with its processor and chipset products. S3 Graphics became undercapitalized in 2005, and VIA introduced WTI Investment International, Ltd. ("WTI") as a new investor to help fund the operations and R&D initiatives. WTI is a private investment company, in which Cher Wang, Chairman of VIA, is a significant shareholder.

VIA QuadCore Processor Revealed

VIA Technologies revealed its upcoming 4-core processor, simply called "QuadCore". The chip comes in BGA packages, and is simply a multi-chip module (MCM) of two Nano X2 dies built on the 40 nm process. One of the first models is the QuadCore L4700, which is clocked at 1.20 GHz with a BClk of 266 MHz. Using the Adaptive Overclocking feature, the processor can bump clock speeds up to 1.46 GHz provided the thermal solution by the manufacturer can keep up, while keeping the chip within its thermal constraint of 27.5W TDP. Each of the two dies can independently up speeds based on their individual loads and temperatures.

The VIA QuadCore L4700 features four x86-64 cores split between two dual-core dies that share a V4 front-side bus clocked at 1333 MHz. The processor has a total L2 cache of 4 MB, also split between the two dies. On the feature-set front, SIMD extensions up to SSE3 are available, so is VIA Virtualization Technology, and Padlock Security Engine, which is a fast hardware random number generator that speeds up AES encryption. The processor itself doesn't feature on-die memory controller or integrated graphics, and continues to rely on the chipset for memory and graphics. VIA's QuadCore L4700 is expected to be released in Q3, 2011, at least one can expect VIA-made demo platforms to be shown at Computex.

Source: The Tech Report

VIA Launches VIA ART-5450 for In-Vehicle and Fleet Management Applications

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of its VIA ART-5450 embedded box PC system, designed to offer embedded developers the ideal system platform for today’s sophisticated logistics and fleet management applications.

Based on a uniquely compact, fanless and rugged design, the VIA ART-5450 offers a full feature set that includes a range of wireless 3G communications, dual display and advanced power management support, creating a flexible and stable platform for in-vehicle systems that control, monitor and manage commercial vehicles.

VIA Eden X2 Unveiled at Embedded World 2011

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the new VIA Eden X2 processor, the industry’s lowest power dual-core processor, optimized for fanless implementation in a broad range of industrial and commercial embedded systems. VIA Eden X2 will debut at Embedded World 2011, Nuremberg, Hall 12, Booth No. 574

VIA Eden X2 processors combine VIA's signature 'Eden' fanless design principles, in a highly optimized, power-efficient dual-core architecture. This guarantees rock-solid stability for mission critical embedded systems without compromising on performance or features. With a component longevity guarantee of 7 years, VIA Eden X2 processors are guaranteed to extend the reach of fanless system design for years to come.

Q4 PC Graphics Shipments in a Slump, Competitors Eat into Intel's Lead

Market research firm Jon Peddie Research gave out PC graphics shipments figures for Q4 2010. PC and related products sales overall were lower than usual in 2010 as the industry saw propagation of ULPCs, netbooks, and tablets propagate, hence PC graphics sales, too, were lower by as much as 7.8% down compared to the same period in 2009. Sales of GPUs and processor-embedded GPUs in Q4 stood at 113 million units, 432.2 million in all of 2010. Intel continues to be the dominant player, though its market share was lowered by competitors AMD and NVIDIA. Intel's market share was lowered in 2010, to 52.5%, from 55.2% in Q3 2010. AMD/ATI is at the second spot with a market share of 24.2% (up, from 23% in Q3); and NVIDIA at the third spot at 22.5% (21% in Q3). Other smaller GPU vendors, VIA and Matrox, stood at 0.8%, and 0.1%, respectively.Source: TechConnect Magazine

VIA Announces VIA Nano X2 Dual-Core Processor

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest VIA Nano X2 processor for mainstream PC markets. Based on a 40 nanometer fabrication process, the VIA Nano X2 delivers better computational performance and improved multi-tasking ability without consuming more power.

"The VIA Nano X2 processor arrives at a time when software architectures are now optimized to for multi-thread computing," commented Richard Brown, VP International Marketing, VIA Technologies, Inc. "Improvements in semi-conductor fabrication means we can now double the number of processor cores while maintaining the same low energy consumption levels that our customers are used to."

VIA Launches VIA eH1, Embedded Industry's First Dedicated Graphics Card

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the world's first graphics card designed specifically for the embedded market with the VIA eH1, a DX10.1 compliant, multi-display card that thrusts any system with a PCI Express slot into a new realm of graphics and video capability.

The VIA eH1 comes with a three year product longevity guarantee and is the most power-efficient discrete graphics and video solution on the market today. The VIA eH1 AIB features an advanced DirectX 10.1, OpenGL 3.1, OpenGL ES 2.0 compatible 64-bit architecture and offers multi-stream 1080p HD video decoding and Stereoscopic 3D rendering capability. This makes it the ideal solution for a range of embedded applications that require advanced graphics and video on multiple displays.

VIA Announces EPIA-P830 Pico-ITX Embedded Platform

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P830 Pico-ITX board for advanced portable and network connected embedded applications. The VIA EPIA-P830 features the VIA Nano E-Series processor and the latest VIA VX900 media system processor with additional support for dual Mini-PCIe modules, bringing a wealth of 3G and wireless connectivity options.

"Modern enterprise environments in healthcare, logistics and fleet management require more connected and portable devices that don't hold back on multimedia ability," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA EPIA-P830 addresses these needs, creating the most complete Pico-ITX board on the market with great HD video performance and a variety of display and network connectivity options."

VLI Designs New Performance USB 3.0 Flash Drive Controller

VIA's subsidiary that deals with cutting-edge technology devices (while its parent company works on proven/stable technologies) VLI, is out with a new SuperSpeed USB 3.0 flash drive controller, the VLI VL750, that lets manufacturers design flash drives with transfer speeds of over 100 MB/s at cost-effective price points. The controller connects USB 3.0 to a 30 nm class or 20 nm class NAND flash chip. In USB 2.0 mode, the controller still supports transfer rates of up to 35 MB/s. Other notable features of this controller include support for USB-attached SCSI Protocol (UASP), Bulk-only Transport (BOT), wear-leveling that minimizes reduction in stability over time, and ECC to minimize data errors caused by hardware faults. The new chip is currently sampling, with the company designing a reference-design flash drive driven by it. Flash drives based on this shouldn't be too far away.

VIA Introduces EPIA-M850 Mini-ITX Board, Packs Multimedia Muscle

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M850 Mini-ITX board, the first board to feature the latest VIA VX900 media system processor, creating the ideal solution for today’s HD-intensive, commercial multimedia-centric devices.

The VIA EPIA-M850 is targeted at OEM and ODM manufacturers of commercial multimedia embedded devices. Featuring a 64-bit, high performance VIA Nano E-Series processor and the VIA VX900 unified all-in-one media system processor, the VIA EPIA-M850 delivers a highly optimized platform that boasts comprehensive HD video performance, HD audio and HDMI support in a compact, power-efficient package.

VIA Developing DirectX 11 IGP Chipset, Quad-Core x86 Processor for 2011

VIA, in its recent announcement about posting a net loss of US $45 million for 1H 2010, revealed plans about future products and manufacturing process transitions with which it hopes to return to profits. These include release of dual-core VIA Nano processors based on a new manufacturing process due for released later this year, the new VN11 chipset that will embed DirectX 11 compliant integrated graphics, which it will released next year. The company also announced that it will release a new quad-core CPU in 2011, which is the company's first. VIA is only the third company that is an active license-holder of the x86 instruction set. Even as much larger x86 manufacturers such as Intel and AMD battle it out, VIA designs processors for low-power applications such as embedded industrial computers, and netbook/ULPC processors such as the VIA Nano and VIA C3.

Source: DigiTimes

Worldwide PC Microprocessor Unit Shipments and Revenues Rise in the 2Q, 2010

Worldwide PC microprocessor unit shipments and revenues in the second calendar quarter of 2010 (2Q10) increased 3.6% and 6.2%, respectively, compared to the first quarter of 2010, according to the latest PC processor study from International Data Corporation (IDC).

The average sequential change in unit shipments between a calendar year's first quarter and its second quarter is an increase of 1.6%. For revenues, the average sequential change is a decrease of -2.8%. So, these increases represent better performance than usual for a second calendar quarter.

"Such a sequential increase in PC processor shipments alone would have been enough to conclude that the first half was strong for the market," said Shane Rau director of Semiconductors: Personal Computing research at IDC. "However, a modest rise in revenues, too, points directly to a rise in average selling prices. System makers bought more and higher-priced PC processors in 2Q10 than in 1Q10. Digging a little deeper into the numbers shows that they bought more mobile processors and more server processors, while desktop processors remained flat."

VIA Nano E-Series Processor Powers COM Express Module

VIA Technologies, Inc, a leading innovator and developer of embedded silicon and platform technologies, today announced the addition of the VIA COME8X80 module to its COM Express™ portfolio; the world's first COM Express type product to take advantage of the high performance, 64-bit VIA Nano E-Series processor.

"The VIA COME8X80 module harnesses the power of VIA Nano platform to offer a uniquely integrated and performance-optimized COM Express product," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies, Inc. "The VIA COME8X80 also demonstrates our long-term commitment to bringing our leading processor technologies to the COM Express form factor."

VIA Launches AMOS-5000 Series Device Development Kits

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced device development kits for the VIA AMOS-5000 series, facilitating a more rational design infrastructure for a broad range of application-specific and fanless Em-ITX-based devices.

VIA AMOS-5000 series development kits combine application specific VIA EM-IO expansion modules with specially designed extendable aluminum chassis kits. This allows embedded OEM and ODM customers to easily and quickly develop a variety of fanless embedded box systems suited to for a range of applications.

VIA Takes Advanced 64-Bit Computing to the Factory Floor

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced it latest Mini-ITX board, the VIA EPIA-M840, designed for a range of embedded device designs including advanced industrial and factory management applications.

The VIA EPIA-M840 packs the latest 64-bit VIA Nano E-Series processor, dual Gigabit LAN, eight COM ports and support for two dual channel 24-bit LVDS displays, creating the ideal backbone for a range of embedded applications including intelligent industrial automation applications that integrate remote network access, network management and other advanced application management scenarios.

VIA Announces EITX-3001 Slim-line Em-ITX Board Featuring VIA Nano Processor

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EITX-3001, its latest Em-ITX form factor board and the ideal solution for a range of durable and fanless next generation devices in kiosk, HMI, POI and POS embedded applications.

Combining the latest VIA Nano E-Series processor and the VIA VX855 media system processor, the VIA EITX-3001 offers a full featured I/O specification on a specially developed slim-line board. Fanless devices based on the VIA EITX-3001 can enjoy absolute stability within a wide temperature range in a low profile system of less than 35mm high.

VIA Demos Dual-Core Nano Processor

VIA demonstrated a dual-core variant of its Nano processor. With tiny board and power footprints, Nano is designed to be a competitive processor to Intel's Atom. The processor was displayed on a working demo platform. Although the chip in the demo system was built on the 65 nm manufacturing node, the final product will be built on 45 nm. The dual-core Nano runs at 1.60 GHz, with an FSB of 800 MHz. It is paired with the VIA VN1000 Digital Media chipset, that has a dual-channel DDR3 memory controller which supports DDR3 1066 MHz memory, and S3 Chrome 520 graphics that is DirectX 10.1 compliant. The Chrome 520 claims to pack enough power for 1080p Blu ray playback, and the Aero UI, while giving multiple connectivity options that include DVI, HDMI, and DisplayPort.

Also located in the VN1000 is the PCI-Express 2.0 root complex, which gives out one PCI-Express 2.0 x8 and four PCI-E 2.0 x1 links. The southbridge packs all the bare essentials, including a 4-port SATA 3 Gb/s and IDE storage controller. Gigabit Ethernet and HD audio will also be part of the package. VIA expects the Nano dual-core to feature in nettops, netbooks, and ULPCs, especially for cloud computing.

Source: Engadget

VLI Starts Sampling First 4-port USB 3.0 Host Controller

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced the VIA Labs VL800 USB 3.0 Host Controller. Adding to the industry's leading line-up of USB 3.0 products, the VL800 is a single chip solution that allows a PCI Express-equipped platform to interface with up to four SuperSpeed USB peripheral devices simultaneously - double the capability of any currently available USB 3.0 host controller.

USB 3.0 (also known as SuperSpeed USB) allows for a maximum data transfer rate of up to 5Gbps, or ten times the throughput available to USB 2.0 based devices. Other enhancements provide for improved interaction between device and host controller, including important advancements in power management. The tremendous increase in throughput allows for the quick and easy transfer of large-volume data and will hasten the development of a new generation of high-performance consumer electronic products.
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